阅读说明：本技术 湿度计测试模块及其测试系统 (Hygrometer test module and test system thereof ) 是由 丁伟修 刘光祥 李明宪 于 2019-04-17 设计创作，主要内容包括：本发明提供了一种湿度计测试模块及其测试系统,该湿度计测试模块包括一腔体、一测试载盘以及一测试针测座。腔体具有一湿度腔体空间以及一温度水路,该湿度腔体空间具有一进气端及一排气端,并容设有一鳍片,温度水路环绕湿度腔体空间设置。测试载盘承载于腔体上,用以放置至少一个半导体元件,所述鳍片可将湿度气体由进气端引导至测试载盘上的至少一个半导体元件。从而,本发明可通过简易的结构设计,有效维持测试环境湿度、温度及压力的恒定性,同时可搭配既有的压力计测试分类机来使用,减少开发成本及提高互用性。(The invention provides a hygrometer test module and a test system thereof. The cavity is provided with a humidity cavity space and a temperature waterway, the humidity cavity space is provided with an air inlet end and an air outlet end and is provided with a fin, and the temperature waterway is arranged around the humidity cavity space. The test carrying disc is carried on the cavity and used for placing at least one semiconductor element, and the fins can guide the humidity gas to the at least one semiconductor element on the test carrying disc from the air inlet end. Therefore, the invention can effectively maintain the constancy of the humidity, the temperature and the pressure of the testing environment through a simple structural design, and can be used by matching with the existing pressure gauge testing classifier, thereby reducing the development cost and improving the interoperability.)

1. A hygrometer test module comprising:

the temperature water path is arranged around the humidity cavity space;

a test tray carried on the cavity for accommodating at least one semiconductor element; and

a test probe seat, including a test carrier plate and a plurality of probes connected with the test carrier plate, for obtaining the test information of the semiconductor element;

the fins can guide the humidity gas from the gas inlet end to the at least one semiconductor element on the test carrying disc.

2. A hygrometer test module comprising:

the heat exchanger comprises a plurality of cavities, a heat exchanger and a heat exchanger, wherein each cavity is respectively provided with a humidity cavity space and a temperature water path, the humidity cavity space is provided with an air inlet end and an air outlet end and is provided with a fin, and the temperature water path is arranged around the humidity cavity space;

the test carrying disc is carried on the plurality of cavities and used for placing at least one semiconductor element; and

a test probe seat, including a test carrier plate and a plurality of probes connected with the test carrier plate, for obtaining the test information of the semiconductor element;

the fins can guide the humidity gas from the gas inlet end to the at least one semiconductor element on the test carrying disc.

3. The hygrometer test module according to claim 1 or 2, wherein the fin is a curved fin having a circular arc shape.

4. The hygrometer test module according to claim 1 or 2, wherein the fin is a curved angled fin.

5. The hygrometer test module according to claim 1 or 2, wherein the outside of the cavity further includes a cover for protecting the cavity from the external ambient temperature.

6. The hygrometer test module according to claim 1 or 2, wherein the chamber further comprises a heating element or a cooling chip for maintaining the temperature of the humidity chamber space constant.

7. The hygrometer test module according to claim 1 or 2, wherein the temperature waterway is disposed at a side wall and a bottom of the cavity.

8. A hygrometer test system comprising:

the hygrometer test module comprises a cavity, a test carrying disc and a test probe test seat, wherein the cavity is provided with a humidity cavity space and a temperature water path, the humidity cavity space is provided with an air inlet end and an air outlet end and is provided with a fin, and the temperature water path is arranged around the humidity cavity space; the test carrying disc is carried on the cavity and used for placing at least one semiconductor element; the test needle test base comprises a test carrier plate and a plurality of probes connected with the test carrier plate and is used for obtaining the test information of the semiconductor element;

a circulating water temperature controller connected with the temperature waterway and used for maintaining the constancy of the circulating water temperature;

a humidity control module, which is connected with the air inlet end by a conveying pipeline and comprises a humidity generator and a pipeline temperature controller, and is used for controlling the humidity value and the temperature value of the gas conveyed to the hygrometer test module; and

and the dew point hygrometer is connected with the air outlet end and is used for accurately measuring the moisture content in the air in the humidity cavity space.

9. A hygrometer test system comprising:

the hygrometer test module comprises a plurality of cavities, a test carrying disc and a test probe test seat, wherein each cavity is respectively provided with a humidity cavity space and a temperature water path, the humidity cavity space is provided with an air inlet end and an air outlet end and is provided with a fin, and the temperature water path is arranged around the humidity cavity space; the test carrying disc is carried on the plurality of cavities and used for placing at least one semiconductor element; the test needle test base comprises a test carrier plate and a plurality of probes connected with the test carrier plate and is used for obtaining the test information of the semiconductor element;

a circulating water temperature controller connected with the temperature waterway and used for maintaining the constancy of the circulating water temperature;

a humidity control module, which is connected with the air inlet end by a conveying pipeline and comprises a humidity generator and a pipeline temperature controller, and is used for controlling the humidity value and the temperature value of the gas conveyed to the hygrometer test module; and a dew point hygrometer connected to the air outlet end for accurately measuring the moisture content in the air in the humidity cavity space.

10. The hygrometer test system according to claim 8 or 9, further comprising a pressure gauge or a temperature gauge connected to the chamber for accurately measuring the pressure and temperature of the humidity chamber.

11. The hygrometer test system according to claim 8 or 9, further comprising an air pressure adjusting valve disposed in the transportation pipeline for adjusting the flow of air sent by the humidity control module.

12. The hygrometer test system according to claim 8 or 9, further comprising an air pressure monitor connected to the delivery line for monitoring the pressure of the air delivered by the humidity control module.

13. The hygrometer test system according to claim 8 or 9, wherein the delivery line is a temperature controlled thermal insulating tube.

Technical Field

The present invention relates to a hygrometer test module and a test system thereof, and more particularly, to a hygrometer test module and a test system thereof suitable for testing a chip to be tested.

Background

In the prior art, the test environment during the pressure test process of the semiconductor device can generally adjust and control the temperature and pressure, but the design of a hygrometer test module which is simple and can perform batch test for the part of the environmental humidity has not been developed in the past.

In the past, a small cavity design for communicating an air passage and an air duct in series flow is tried to be carried out on each position point for placing the semiconductor element of the test carrying disc, but because each test position point needs to be constructed and arranged with a serial line, the whole development cost is high, the temperature and the humidity of each test position point are not easy to be in a control range, full control cannot be carried out, slight errors exist in the test environment of each semiconductor element, and accurate test data cannot be obtained.

Therefore, the inventor of the present invention has earnestly studied and tested a hygrometer test module and a test system thereof to solve the above problems, and finally completed the present invention.

Disclosure of Invention

The invention provides a hygrometer test module, which can maintain the constancy of humidity modulating gas contacted with a test carrying disc or humidity, temperature and pressure values in a cavity by the integrated cavity design and the arrangement of a fin structure with a special geometric shape, provide an accurate humidity test environment and avoid influencing a test result.

The invention provides a hygrometer test module which comprises a cavity, a test carrying disc and a test needle test seat. The cavity is provided with a humidity cavity space and a temperature water path, the humidity cavity space is provided with an air inlet end and an air outlet end, the humidity gas after modulation is guided to enter and exhaust, and the humidity cavity space is provided with a fin which can directly blow the humidity gas to a semiconductor element on the test carrying disc, so that the humidity gas is reduced to enter the bottom of the humidity cavity space, and the humidity value of the cavity environment is maintained. The temperature waterway is arranged around the humidity cavity space, so that the temperature value of the cavity environment is further maintained, the humidity value of the humidity cavity space is ensured not to fluctuate due to the change of the temperature, and the constancy of the humidity is effectively maintained.

The test carrying disc is carried on the cavity and used for placing at least one semiconductor element, so that the at least one semiconductor element can contact the modulated humidity gas. The test pin base comprises a test carrier plate and a plurality of probes connected with the test carrier plate and is used for obtaining the test information of the semiconductor element. The fins can guide the humidity gas from the gas inlet end to the semiconductor element on the test carrying disc. Through the design, the invention can effectively maintain the constancy of the humidity, the temperature and the pressure of the testing environment through the simple structural design, and can be used by being matched with the existing pressure gauge testing classifier, thereby reducing the development cost and improving the interoperability.

The fin can be an arc-shaped bent fin or a curve-shaped oblique fin. Therefore, through the appearance modeling of the fins, the humidity gas can be directly blown to the semiconductor element on the test carrying disc, the disturbance of air flow caused by the humidity gas entering the bottom of the humidity cavity space is reduced, and the humidity value of the cavity environment is maintained.

The outer side of the cavity can comprise an outer cover used for avoiding the cavity from being interfered by the external environment temperature. Therefore, the thick outer cover isolates the connection between the cavity and the external environment, the degree of external influence is reduced to the minimum, the humidity cavity space can be maintained in a constant temperature environment, and the test accuracy is improved.

The chamber may include a heating element or a cooling chip to maintain the temperature of the humidity chamber constant. Therefore, the temperature keeping effect can be achieved through the temperature water path, and the temperature parameter of the humidity cavity space can be actively adjusted through the heating element or the refrigeration chip, so that the constancy of the temperature is enhanced.

The temperature waterway can be arranged on the side wall and the bottom of the cavity. Therefore, the temperature waterway is arranged in multiple ways, so that the heat energy can be effectively prevented from being dissipated, and the integral constant temperature effect is effectively improved.

Another objective of the present invention is to provide a hygrometer test system, which includes a hygrometer test module, a circulating water temperature controller, a humidity control module, and a dew point hygrometer. The hygrometer test module comprises a cavity, a test carrier disc and a test probe test seat, wherein the cavity is provided with a humidity cavity space and a temperature water path, the humidity cavity space is provided with an air inlet end and an air outlet end and is provided with a fin, and the temperature water path is arranged around the humidity cavity space; the test carrying disc is carried on the cavity and used for placing at least one semiconductor element; the test pin testing seat comprises a test carrier plate and a plurality of probes connected with the test carrier plate and is used for obtaining the test information of the semiconductor element.

The circulating water temperature controller is connected with the temperature waterway and used for maintaining the constancy of the circulating water temperature; the humidity control module is connected with the air inlet end by a conveying pipeline and comprises a humidity generator and a pipeline temperature controller, and the humidity controller is used for controlling the humidity value and the temperature value of the gas conveyed to the hygrometer test module; the dew point hygrometer is connected with the air outlet end and used for accurately measuring the moisture content in the air in the humidity cavity space.

Through the design, besides the hygrometer test module, the temperature water path and the humidity gas can be conveyed into the system through the matching of other sensors and the controller, and after the pressure value and the temperature value of the hygrometer test module are maintained, the humidity value in the humidity cavity space can be maintained in a constant state to test the semiconductor element. Therefore, the modularized system architecture constructs a complete control system, ensures that all external factors are eliminated, enables the temperature, the pressure and the humidity to reach the required states, and maintains the accuracy in testing.

The hygrometer test system can comprise a pressure gauge or a thermometer, is connected with the cavity, and can accurately measure the pressure value and the temperature value of the humidity cavity space. Therefore, through the arrangement of the pressure gauge or the thermometer, the internal state of the humidity cavity space is effectively monitored, and the moisture composition of the humidity gas is prevented from changing.

The hygrometer test system can comprise an air pressure regulating valve which is arranged in the conveying pipeline and can regulate the flow of the air sent out by the humidity control module. Therefore, the air pressure regulating valve manages the air inflow of the hygrometer test module, can be used as a valve to regulate the required air inflow, meets the test requirement, and maintains the pressure value and the temperature value required by the cavity.

The hygrometer test system may include an air pressure monitor connected to the delivery line for monitoring the air pressure delivered by the humidity control module. Therefore, if the variation of the pressure value in and out of the cavity exceeds the critical value, the air pressure monitor can give out a warning to avoid the influence of excessive pressure variation on the humidity value.

The conveying pipeline can be a temperature control heat preservation pipe, so that in order to avoid the influence of external environment temperature on the temperature in the conveying pipeline to cause the humidity change of the cavity, the temperature control heat preservation pipe with the heat insulation material can reduce the temperature loss and the humidity change, and the humidity precision during testing is improved.

Both the foregoing general description and the following detailed description are exemplary and explanatory in nature to further illustrate the claimed invention. Other objects and advantages of the present invention will become apparent from the following description and drawings.

Drawings

Fig. 1 is a sectional view of a hygrometer test module according to a first embodiment of the present invention.

FIG. 2 is an exploded view of a hygrometer test module according to a first embodiment of the present invention.

FIG. 3 is a cross-sectional view of a hygrometer test module according to a second embodiment of the present invention.

Fig. 4 is a cross-sectional view of a hygrometer test module according to a third embodiment of the present invention.

Fig. 5 is a cross-sectional view of a hygrometer test module according to a fourth embodiment of the present invention.

Fig. 6 is a cross-sectional view of a hygrometer test module according to a fifth embodiment of the present invention.

Fig. 7 is a sectional view of a hygrometer test module according to a sixth embodiment of the present invention.

Fig. 8 is a sectional view of a hygrometer test module according to a seventh embodiment of the present invention.

Fig. 9 is a sectional view showing a rising state of the hygrometer test module and the lifting mechanism according to the eighth embodiment of the invention.

Fig. 10 is a sectional view showing a lowered state of a hygrometer test module lifting mechanism according to an eighth embodiment of the present invention.

Fig. 11 is a sectional view of a hygrometer test module according to a ninth embodiment of the present invention.

Fig. 12 is a system architecture diagram of a hygrometer test system according to a first embodiment of the present invention.

[ notation ] to show

1, 1 a-1 h hygrometer test module 10 hygrometer test system

2, 2' Chamber 20 Placement area

21, 21 'humidity chamber space 211, 211' air inlet end

212, 212 'exhaust end 22a, 22 a' temperature water circuit

22b, 22b 'temperature water channel 23 a-23 g, 23 a' fin

24 outer cover 25, 25' refrigeration chip

26 lifting mechanism 261 slide shaft

262 casing 263 fixing bolt

3 test carrier disc 4 test probe seat

41, 41 'test carrier plate 42, 42' probe

5 semiconductor element 61 circulating water temperature controller

62 humidity control module 621 humidity generator

622 pipeline temperature controller 63 dew point hygrometer

641 pressure meter 642 thermometer

65, 65' air pressure regulating valve 66 air pressure monitor

7 conveying pipeline

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings. It should be noted that in the drawings or description, the same drawing reference numerals are used for similar or identical parts. Implementations not depicted or described in the drawings are of a form known to those of ordinary skill in the art. Additionally, while exemplifications of parameters including particular values may be provided herein, it is to be understood that the parameters need not be exactly equal to the respective values, but may be approximated to the respective values within acceptable error margins or design constraints. Directional phrases used in the embodiments, such as "upper," "lower," "front," "rear," "left," "right," and the like, refer only to the orientation of the figure. Accordingly, the directional terminology used is intended to be in the nature of words of description rather than of limitation.

Fig. 1 and 2 are a sectional view and an exploded view of a hygrometer test module according to a first embodiment of the present invention. There is shown a hygrometer test module 1, which includes a chamber 2, a test tray 3, and a test probe seat 4 for detecting the humidity environment of a semiconductor device.

As shown in the figure, in the embodiment, the chamber 2 has a humidity chamber space 21 and two temperature water paths 22a, 22b, and the humidity chamber space 21 has an air inlet 211 and an air outlet 212, so as to guide the modulated humidity gas to enter and exit the humidity chamber space 21, so that the humidity chamber space 21 has a to-be-detected environment with a specific humidity value, thereby facilitating the subsequent detection operation. The temperature water paths 22a and 22b are arranged around the humidity chamber space 21, wherein the temperature water path 22a is arranged in the side wall of the chamber 2, so that a water path with a specific temperature is covered on the periphery of the chamber 2, the influence of the external environment on the inside of the chamber 2 is reduced, and the constancy of the temperature value in the humidity chamber space 21 is maintained; the temperature water path 22b is disposed at the bottom of the cavity 2, and a water path with a specific temperature is covered at the bottom side of the cavity 2, in addition, in this embodiment, a refrigeration chip 25 is disposed between the temperature water path 22b and the cavity 2, the refrigeration chip 25 can actively adjust the temperature parameter of the humidity cavity space 21, so as to enhance the constancy of the temperature of the cavity 2, or the refrigeration chip 25 can be changed into other types of heating elements, which is not limited thereto.

In addition, the top of the chamber 2 is concavely provided with a placing area 20 for bearing a test carrying disc 3 containing at least one semiconductor element 5, so that the invention can contact the humidity gas in the humidity chamber space 21 with the semiconductor element 5 through the gap at the top of the chamber 2 to achieve the test purpose. In addition, a test probe seat 4 covers the test carrier 3, the test probe seat 4 includes a test carrier 41 and a plurality of probes 42 connected to the test carrier 41, the test probe seat 4 can seal the press-fit cavity 2 to perform a humidity test on the semiconductor device 5, and obtain test information of the semiconductor device 5. In this embodiment, the cavity 2 is further covered with a cover 24 to prevent the cavity 2 from being interfered by the external environment temperature. Therefore, the thick outer cover 24 isolates the connection between the cavity 2 and the external environment, so as to minimize the external influence, maintain the humidity cavity space 21 in a constant temperature environment, and improve the test accuracy.

Fig. 3 to 10 are cross-sectional views of hygrometer test modules according to second to eighth embodiments of the present invention, respectively. As shown in the drawings, the basic structure of the hygrometer test modules 1 a-1 g in the second to eighth embodiments of the present invention is the same as that in the first embodiment, the only difference is that a fin 23a is disposed in the humidity chamber space 21 in the second embodiment of fig. 3, and the fin 23a is a curved fin with a circular arc shape; in the third embodiment of fig. 4, a fin 23b is disposed in the humidity chamber 21, and the fin 23b is a curved oblique fin; in the fourth embodiment of fig. 5, a fin 23c is disposed in the humidity chamber 21, and the fin 23c is an M-shaped bent fin; in fig. 6, a fin 23d is disposed in the humidity chamber 21 of the fifth embodiment, and the fin 23d is a straight oblique fin; in fig. 7, a fin 23e is disposed in the humidity chamber 21 according to the sixth embodiment, and the fin 23e is a spherical curved fin; fig. 8 shows a humidity chamber 21 of the seventh embodiment, which has a plurality of fins 23f, in this embodiment, three fins 23f are provided, and each fin 23f is an oblique fin with a straight shape; the humidity chamber space 21 of the eighth embodiment of fig. 9 is provided with a fin 23g and a lifting mechanism 26, the lifting mechanism 26 includes a sliding shaft 261, a sleeve 262 and a fixing bolt 263, the fin 23g is an arc-shaped curved fin assembled at one end of the sliding shaft 261, the sliding shaft 261 is inserted into the sleeve 262, the lifting height of the fin 23g can be adjusted, and after being adjusted to a specific position, the fixing bolt 263 is used to press and fix the position of the sliding shaft 261. As shown in fig. 9, the lifting mechanism 26 is in a raised state, so that the fins 23g can be fixed at a higher position; in contrast, as shown in fig. 10, the elevating mechanism 26 is in a lowered state so that the fin 23g can be fixed at a lower position. Therefore, the lifting mechanism 26 facilitates the user to adjust the setting position of the fin 23g according to the test requirement.

The seven fins can directly guide the humidity gas to the semiconductor device 5 on the test tray 3, so as to reduce the disturbance of the gas flow caused by the humidity gas entering the bottom of the humidity chamber space 21 and maintain the stable humidity value of the chamber environment. In addition, according to experimental data, if the fins 23a to 23g are disposed in the humidity chamber 21, the relative humidity error can be greatly increased to 1%, and the effect of the inclined fins is better than that of the bent fins.

Fig. 11 is a sectional view of a hygrometer test module according to a ninth embodiment of the present invention. As shown in the figures, in addition to the structural design of the single cavity, the invention can also combine a plurality of cavities to form a multi-cavity structure, in this embodiment, the hygrometer test module 1h includes two cavities 2, 2 ', a test tray 3 supported on the two cavities 2, 2 ', and a test probe seat 4, each cavity 2, 2 ' has an independent humidity cavity space 21, 21 ", a temperature waterway 22a, 22a ', a temperature waterway 22b, 22b ', a fin 23a, 23a ', and a cooling chip 25, 25 ', and controls the semiconductor device 5 in a specific area on the test tray 3, respectively, so as to provide a more accurate humidity test environment. In the present embodiment, the testing probe socket 4 is provided with a testing carrier 41, 41 'and a plurality of probes 42, 42' connected to the testing carrier 41, 41 'corresponding to the respective cavities 2, 2' respectively for obtaining the testing information of the semiconductor device 5.

Under this structure, each chamber 2, 2 'has a branched inlet pipe and an exhaust pipe at the inlet end 211, 211' and the exhaust end 212, 212 ', and the independent air pressure adjusting valves 65, 65' are respectively disposed at the inlet end 211, 211 ', so as to control the inlet pressure value of each chamber 2, 2' and reduce the excessive humidity value difference caused by the deviation of the inlet pressure. To sum up, when the test tray 3 has a large area and carries a large number of semiconductor devices 5, in order to avoid the excessive difference in the humidity values of the semiconductor devices 5 at different test positions, the structure of the multiple cavities of the present invention can be used to solve the problem, so that the volume of each cavity is reduced, the local humidity value is more accurate, and the error is eliminated.

Through the design, the integrated cavity design is matched with the arrangement of the fin structure with a special geometric shape, so that the humidity modulating gas contacted with the test carrying disc or the humidity, temperature and pressure values in the cavity can be kept constant, an accurate humidity test environment is provided, and the test result is prevented from being influenced.

Fig. 12 is a system configuration diagram of a hygrometer test system according to a first embodiment of the present invention. A hygrometer test system 10 is shown in the drawings, which includes a hygrometer test module 1, a circulating water temperature controller 61, a humidity control module 62, a dew point hygrometer 63, a pressure gauge 641, a temperature gauge 642, an air pressure regulating valve 65, and an air pressure monitor 66, wherein technical features of the hygrometer test module 1 are described in detail in the foregoing description, and therefore are not described herein again.

In this embodiment, the humidity environment required for testing is provided by the humidity control module 62, the humidity control module 62 includes a humidity generator 621 and a pipeline temperature controller 622, the humidity generator 621 can generate humidity gas with specific moisture, and the pipeline temperature controller 622 controls the temperature level of the humidity gas to provide an air flow with specific temperature and humidity. The air flow is transmitted from the air outlet end 212 to the dew point hygrometer 63 after passing through the hygrometer test module 1 by connecting the humidity control module 62 to the air inlet end 211 through a transmission pipeline 7. in this embodiment, the transmission pipeline 7 is a temperature-controlled thermal insulation pipe, and the transmission pipeline 7 is made of a thermal insulation material, so that unnecessary temperature loss and humidity change can be reduced, and the humidity change of the cavity 2 caused by the influence of the external environment temperature on the transmission pipeline 7 can be effectively avoided, thereby improving the test precision.

In the process of conveying the humidity gas, the air inlet end 211 of the conveying pipeline 7 is connected with the air pressure regulating valve 65 to regulate the appropriate air pressure into the hygrometer test module 1, so as to limit the pressure value of the air flow. In addition to actively controlling the pressure level through the pressure regulating valve 65, the pressure monitoring instrument 66 can be disposed at the inlet end 211 and the outlet end 212, so that when the humidity gas enters or exits the hygrometer test module 1, if the variation of the pressure value of the cavity exceeds the predetermined range, the pressure monitoring instrument 66 will send out a warning to prevent the humidity value from being affected by excessive pressure variation.

In addition, the hygrometer test module 1 is also provided with a pressure meter 641 and a temperature meter 642 for detecting the humidity in the chamber 2, which are connected to the chamber 2, so as to accurately measure the pressure and temperature values of the humidity chamber 21, thereby ensuring the constancy of various environmental parameters during the test process. In addition, in the aspect of controlling the temperatures of the temperature water paths 22a and 22b, the present invention is provided with a circulating water temperature controller 61 for adjusting the temperatures of the temperature water paths 22a and 22b, and the circulating water temperature controller 61 is connected to the temperature water paths 22a and 22b so as to maintain the water flow temperature at a constant value. Finally, the present invention is provided with a dew point hygrometer 63 at the air outlet end 212 for accurately measuring the moisture content of the air in the humidity chamber space 21 and calculating the humidity value.

Through the design, in addition to the hygrometer test module 1, the temperature waterway and the humidity gas can be conveyed to the system through the cooperation of other sensors and the controller, and after the pressure value and the temperature value of the hygrometer test module are maintained, the humidity value in the humidity cavity space can be maintained in a constant state to test the semiconductor element. Therefore, the modularized system architecture constructs a complete control system, and ensures that all external factors are eliminated, so that the temperature, the pressure and the humidity reach the required states of the invention, and the test accuracy is maintained.

In addition, the hygrometer test system can be elastically connected to a classifier in an overlapping mode, so that the classifier can provide a temperature and pressure test scheme and can detect the humidity environment, the modularized design saves development cost, the complex framework of the classifier is simplified, and a practical multifunctional design is formed.

The above-mentioned embodiments are merely exemplary for convenience of description, and the claimed invention should not be limited to the above-mentioned embodiments, but should be limited only by the claims.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.