阅读说明：本技术 构造体的制造方法 (Method for manufacturing structure ) 是由 江原宜伸 于 2019-03-08 设计创作，主要内容包括：提供抑制线膨胀的影响并且兼备低成本、高功能以及高生产率的构造体的制造方法。一种构造体(100)的制造方法,该构造体层叠有作为第一部件的基板(10)和作为第二部件的透镜阵列(21、22)而成,该基板(10)作为基材；该透镜阵列(21、22)与基板(10)对置,由与基板(10)不同的树脂材料形成,且在表面具有形状；所述构造体(100)的制造方法具备：进行使基板(10)的表面以及透镜阵列(21、22)的表面中的至少一方成为活性化状态的活性化处理的表面活性化工序；在从透镜阵列(21、22)的树脂材料的负荷挠曲温度减去30℃而得的基准温度以上且玻璃化转变温度以下的温度下至少对透镜阵列(21、22)加压并将其贴紧接合于基板(10)的接合工序。(Provided is a method for manufacturing a structure, which suppresses the influence of linear expansion and has low cost, high functionality, and high productivity. A method for manufacturing a structure (100) in which a substrate (10) as a first member and lens arrays (21, 22) as second members are laminated, the substrate (10) being a base material; the lens arrays (21, 22) are opposed to the substrate (10), are formed of a resin material different from that of the substrate (10), and have a shape on the surface; the method for manufacturing the structure (100) comprises: a surface activation step of performing an activation treatment for activating at least one of the surface of the substrate (10) and the surfaces of the lens arrays (21, 22); and a bonding step in which at least the lens arrays (21, 22) are pressed and bonded to the substrate (10) in close contact therewith at a temperature not lower than a reference temperature and not higher than a glass transition temperature, which is obtained by subtracting 30 ℃ from the deflection temperature under load of the resin material of the lens arrays (21, 22).)

1. A method of manufacturing a structure in which a first member and a second member are laminated, the first member being a base material; a second member that faces the first member, is formed of a resin material different from that of the first member, and has a shape on a surface thereof; the method for manufacturing a structure is characterized by comprising:

a surface activation step of performing an activation treatment for activating at least one of a surface of the first member and a surface of the second member;

and a bonding step of bonding the second member to the first member by pressing at least the second member at a temperature not lower than a reference temperature and not higher than a glass transition temperature, the reference temperature being a temperature obtained by subtracting 30 ℃ from a deflection temperature under load of a resin material of the second member.

2. The structure manufacturing method according to claim 1, wherein,

the bonding step is followed by a heating step of heating at a temperature higher than the glass transition temperature.

3. The structure manufacturing method according to claim 1 or 2, wherein,

the resin material forming the second member is a thermoplastic resin.

4. The structure manufacturing method according to any one of claims 1 to 3, wherein,

the material forming the first member is an inorganic material.

5. The structure manufacturing method according to claim 2, wherein,

the method further includes a transfer step of transferring the three-dimensional shape to the second member simultaneously with the heating step.

6. The structure manufacturing method according to any one of claims 1 to 4, wherein,

after the bonding step, a transfer step of transferring the three-dimensional shape to the second member is provided.

7. The structure manufacturing method according to any one of claims 1 to 4, wherein,

the method further includes a transfer step of transferring the three-dimensional shape to the second member before the joining step.

8. The structure manufacturing method according to any one of claims 1 to 7, wherein,

the second member is joined to both sides of the first member.

9. The structure manufacturing method according to claim 8, wherein,

after the bonding step, or simultaneously with the heating step performed after the bonding step, a transfer step of transferring the three-dimensional shape to the second member on both sides of the first member is performed.

10. The structure manufacturing method according to any one of claims 2, 5 and 9, wherein,

the heating step is performed at 170 ℃ or higher.

11. The structure manufacturing method according to any one of claims 5 to 7 and 9, wherein,

in the transfer step, the pressure is applied at a pressure of 10MPa or less.

12. The structure manufacturing method according to any one of claims 1 to 11, wherein,

in the bonding step, the pressure is applied at a pressure of 10MPa or less.

13. The structure manufacturing method according to any one of claims 1 to 12, wherein,

before the surface activation step, an adhesive layer having a silane coupling agent is formed on the surface of the first member facing the second member.

14. The structure manufacturing method according to any one of claims 1 to 13, wherein,

in the surface activation step, a surface of at least one of the first member and the second member is activated by using any one of ultraviolet irradiation, plasma treatment, corona treatment, and ozone treatment.

Technical Field

The present invention relates to a method for manufacturing a structure in which a plurality of members are joined.

Background

When a device having a relatively long shape, which requires high accuracy in dimension precision, is manufactured, the influence of linear expansion due to ambient temperature becomes a large problem. On the other hand, although it is conceivable to manufacture a device as described above by processing a material having a low linear expansion coefficient, it is difficult to realize all of low cost, high functionality, and high productivity. As a method for solving the problem, there is a method of suppressing the influence of linear expansion by bonding a material having a low linear expansion coefficient to a resin material having excellent processability. As a method for joining different members, for example, a method described in patent document 1 is known.

In the method of patent document 1, a plasma polymer (organic material) is formed on one of the members to be bonded, and both surfaces of the members to be bonded are hydrophilized and then pressurized and heated, thereby performing bonding with high accuracy. However, in the method of patent document 1, in order to bring the two members into close contact, it is necessary to take measures such as making the surface activated by forming the plasma polymer film mirror, making the plasma polymer film thick about 10nm to 10 μm, or making one member soft. When the surface of the member is made into a mirror surface, the cost increases. Further, when the plasma polymerized film is thickened or the members are made of a soft material, the following to the one member is alleviated, and therefore, it is difficult to suppress the influence of the linear expansion.

Another method for joining two members is a member assembly method in which a DNA single-stranded structure is supported on the surface of a substrate and the surface of a member, thereby joining the two members by hydrogen bonding (see, for example, patent document 2). However, in the method of patent document 2, since the hydrogen bond bonding monomer is bonded, the bonding may be weakened by moisture or the like, and it is difficult to perform stable bonding.

As another method for joining two members, there is a joining method in which: the bonding surfaces of the objects to be bonded are hydrophilized by changing the strength of the chemical treatment between the first half of the plasma treatment and the second half of the plasma treatment, and the surfaces of the objects to be bonded are hydrogen-bonded to each other, followed by annealing at room temperature to about 200 ℃ (see, for example, patent document 3). However, in the method of patent document 3, since bonding of wafers formed of a material having high surface accuracy and high hardness is assumed, the wafers can be temporarily bonded with a certain degree of bonding force by hydrogen bonding even without pressurization, but when the surface accuracy is poor, the bonding at the time of temporary bonding becomes weak, and there is a possibility that a positional deviation occurs before annealing is performed.

Disclosure of Invention

The purpose of the present invention is to provide a method for manufacturing a laminated structure that suppresses the effect of linear expansion and has low cost, high functionality, and high productivity.

In order to achieve at least one of the above objects, a method for manufacturing a structure reflecting one aspect of the present invention is a method for manufacturing a structure in which a first member as a base material and a second member are laminated; a second member that faces the first member, is formed of a resin material different from that of the first member, and has a shape on a surface thereof; the method for manufacturing a structure includes: a surface activation step of performing an activation treatment for activating at least one of the surface of the first member and the surface of the second member; and a bonding step of bonding the second member to the first member by pressing at least the second member at a temperature not lower than a reference temperature and not higher than a glass transition temperature, the reference temperature being a temperature obtained by subtracting 30 ℃ from a deflection temperature under load of a resin material of the second member. Therefore, the surface shape of the second member may be a planar shape or a three-dimensional shape.

Drawings

Fig. 1A is a plan view of a structure manufactured by the method for manufacturing a structure according to the first embodiment, and fig. 1B is a side sectional view of the structure shown in fig. 1A.

Fig. 2A to 2D are diagrams illustrating a method of manufacturing the structure according to the first embodiment.

Fig. 3A and 3B are diagrams illustrating a method of manufacturing a structure according to the first embodiment, and fig. 3C is a diagram illustrating a modification of the structure.

Fig. 4 is a flowchart illustrating a method for manufacturing the structure according to the first embodiment.

Fig. 5A is a plan view of the light source unit including the structure, and fig. 5B is a side sectional view of the light source unit shown in fig. 5A.

Fig. 6A to 6D are views for explaining a method of manufacturing a structure according to the second embodiment.

Fig. 7A to 7C are views for explaining a method of manufacturing a structure according to the second embodiment.

Fig. 8 is a flowchart illustrating a method for manufacturing a structure according to the second embodiment.

Fig. 9A to 9F are views for explaining a method of manufacturing a structure according to a third embodiment.

Fig. 10 is a flowchart illustrating a method for manufacturing a structure according to the third embodiment.

Detailed Description

[ first embodiment ]

Hereinafter, a structure manufactured by the structure manufacturing method according to the first embodiment of the present invention will be described with reference to the drawings. As shown in fig. 1A and 1B, the structure 100 includes a substrate 10 as a base material, which is a first member, a first lens array 21 as a second member, and a second lens array 22 as a second member. The substrate 10, the first lens array 21, and the second lens array 22 are laminated and bonded in a Z-axis direction perpendicular to an XY plane in which the substrate 10 extends. The first and second lens arrays 21 and 22 are arranged to face each other with the substrate 10 interposed therebetween. That is, the structure 100 is a laminated structure in which the lens arrays are provided on both surfaces of the substrate 10 and the substrate 10 has a three-dimensional shape on both surfaces. The structure 100 has a quadrangular contour when viewed from the optical axis OA direction. Although described in detail later, the structure 100 can be used as a light source unit, for example (see fig. 5B and the like).

The first and second lens arrays 21 and 22 are members having optical transparency for allowing light in a desired wavelength range to pass therethrough, and are transparent when light having a wavelength in the visible light range is passed therethrough, for example. The first and second lens arrays 21 and 22 are formed of a resin material. As the resin material, for example, a thermoplastic resin can be used. As the thermoplastic resin, for example, COP (cyclic olefin polymer), COC (cyclic olefin copolymer), PMMA (acrylic acid), PC (polycarbonate), or the like can be used. By using a thermoplastic resin as the resin material, the surface activation by plasma treatment of the first and second lens arrays 21 and 22 can be facilitated. In addition, the three-dimensional shapes of the first and second lens arrays 21 and 22 can be easily transferred by a molding method such as hot pressing.

The first lens array 21 includes a plurality of first lens elements 21a and a first support portion 21b that supports the first lens elements 21a from the periphery. The first lens element 21a is, for example, a convex aspherical lens, and has a first optical surface 21 c. The first lens elements 21a are two-dimensionally arranged on the substrate 10. The second lens array 22 includes a plurality of second lens elements 22a and a second support portion 22b that supports the second lens elements 22a from the periphery. The second lens element 21a is, for example, a convex aspherical lens, and has a second optical surface 22 c. The second lens elements 22a are two-dimensionally arranged on the substrate 10. The first lens element 21a and the second lens element 22a form a pair, and the optical axes OA of the opposing first and second lens elements 21a and 22a coincide with each other. As will be described in detail later, the first and second lens arrays 21 and 22 are firmly bonded to the substrate 10 by being temporarily fixed and then permanently fixed by a heating process at the time of positioning in the bonding process. The first lens array 21 and the second lens array 22 are used together as, for example, a condenser lens. In the drawings, an example of arranging 3 × 3 lens elements is shown, but the number of lens elements can be changed as appropriate depending on the application.

The substrate 10 is, for example, a plate-like member having translucency in the visible region, and is a glass substrate formed of glass as an inorganic material. Since the linear expansion of the inorganic material is relatively small, the change in the three-dimensional shape of the first and second lens arrays 21 and 22 due to the linear expansion can be further suppressed. In addition, even a material such as glass, which is difficult to process, can be handled in a simple shape such as a cylinder or a flat plate. As the inorganic material, a ceramic material, a metal, or the like may be used in addition to glass.

A first lens array 21 is bonded to a first surface 10a which is one surface of the substrate 10. A second lens array 22 is bonded to the second surface 10b, which is the other surface of the substrate 10.

An adhesive layer 30 having a silane coupling agent (or a silicone adhesive) is provided between a first bonding surface 21d of the first lens array 21 facing the substrate 10 and a second bonding surface 10d of the substrate 10 facing the first lens array 21. An adhesive layer 30 having a silane coupling agent (or a silanol-containing adhesive) is provided between a first bonding surface 22d of the second lens array 22 facing the substrate 10 and a second bonding surface 10e of the substrate 10 facing the second lens array 22. By providing the adhesive layer 30, even a material whose surface is difficult to activate can be easily activated. The adhesive layer is a thin layer of about 300.1nm to 1 μm, preferably about 0.1nm to 10nm, and does not adversely affect the direct bonding of the first and second lens arrays 21 and 22 to the substrate 10.

Before the structure 100 is bonded, the surface roughness of at least one of the first bonding surfaces 21d and 22d and the second bonding surfaces 10d and 10e is larger than 1 nm.

Hereinafter, a method for manufacturing the structure 100 will be described with reference to fig. 2A to 2D, fig. 3A and 3B, and fig. 4. In the manufacture of the structure 100, a surface activation step, a bonding step, a transfer step, and a heating step are performed. In the present embodiment, the heating step and the transfer step are performed simultaneously. Here, the heating step also includes a case where the heating step and the transfer step are performed while changing the temperature.

[ preparation of first and second Components ]

First, the substrate 10 as the first member and the lens member 20 as the second member which is the base material of the first and second lens arrays 21 and 22 are prepared (step S11 in fig. 4). The lens member 20 is not a plate-like member formed with a desired three-dimensional shape (see fig. 2B).

[ formation of adhesive layer ]

As shown in fig. 2A, the adhesive layer 30 having a silane coupling agent (or a silanol-containing adhesive) is provided on the second bonding surfaces 10d and 10e of the substrate 10 (step S12 in fig. 4). Thus, the bonding method described later can be applied to a ceramic material such as glass, which is difficult to exhibit hydrogen bonding, such as the substrate 10.

[ surface activation ]

As shown in fig. 2B and 2C, an activation process is performed to activate at least one of the first and second bonding surfaces 21d, 22d, 10d, and 10e (the surface thereof when the adhesive layer 30 is provided) (step S13 in fig. 4). The activated state refers to, for example, a state in which a methyl group or a phenyl group of the resin is cleaved, and also refers to a state in which a polar group such as an OH group (hydroxyl group) or a CHO group (aldehyde group) is bonded to the dangling bond or an element on the material surface of the member. Specifically, the activation treatment is performed by applying energy to the material by corona treatment, plasma treatment, ozone treatment, Ultraviolet (UV) treatment, or the like, thereby bringing the material into the activated state. As shown in fig. 2B and 2C, the activation treatment is performed on the second bonding surfaces 10d and 10e of the substrate 10 and a part or the whole of the first bonding surfaces 21d and 22d of the lens member 20. Thereby, the first bonding surfaces 21d and 22d of the lens member 20 and the second bonding surfaces 10d and 10e of the substrate 10 are activated, respectively. The activation treatment is preferably carried out at normal temperature in the air. Here, the normal temperature means 20 ℃. + -. 15 ℃.

Since the lens member 20 is formed of a resin material, the resin material can easily exhibit hydrogen bond bonding by plasma treatment or the like, and the bonding can be maintained. The hydrogen bonding is a weak bonding in which polar groups represented by OH groups attract each other.

[ Joint ]

Next, a bonding step of positioning and temporarily fixing the lens member 20 and the substrate 10 by hydrogen bonding is performed by applying pressure in a state where the first and second bonding surfaces 21d, 22d, 10d, and 10e are aligned (step S14 in fig. 4). The ambient temperature in the bonding step is a temperature that does not hinder the surface activation state, in other words, a temperature that is not lower than the reference temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin material of the lens member 20, which is the second member, and not higher than the glass transition temperature (for example, not lower than 90 ℃ and not higher than 140 ℃). Here, the deflection temperature under load is a temperature at which the material deforms when a certain pressure is applied. In addition, when a general COP material is used, the glass transition temperature may reach 120 to 160 ℃. In the bonding step, the lens member 20 as the second member is bonded to the substrate 10 as the first member by pressing at the temperature. This makes it possible to perform temporary fixation without causing dehydration condensation at the time of positioning. In addition, in the joining step, it is desirable to set a time period during which dehydration condensation does not occur during the operation.

Specifically, first, the first bonding surface 21d on the lens member 20 side, on which the first lens array 21 is formed, is opposed to the second bonding surface 10d on the substrate 10 side, and the lens member 20 and the substrate 10 are arranged at the bonding position with a gap therebetween, while the surfaces of the first and second bonding surfaces 21d, 10d are kept activated. The first bonding surface 22d on the lens member 20 side, on which the second lens array 22 is formed, is opposed to the second bonding surface 10e on the substrate 10 side, and the lens member 20 and the substrate 10 are arranged at the bonding position with a gap therebetween, while the surfaces of the first and second bonding surfaces 22d, 10e are kept activated. Although not shown, the distance between the lens member 20 and the substrate 10 at the time of positioning is preferably 100nm or more. In the positioning, either one of the lens member 20 and the substrate 10 may be moved, or both may be moved relatively. The lens member 20 and the substrate 10 are provided with, for example, positioning marks, and the positioning is performed by aligning the positions of the marks. In addition, if a contact portion serving as a reference for positioning is provided between the lens member 20 and the substrate 10, the lens member may be positioned by contacting the contact portion.

As shown in fig. 2D, after the positioning, the lens member 20 forming the first lens array 21 is brought into contact with and bonded to the substrate 10 in a state where the first and second bonding surfaces 21D, 10D are activated. In addition, the lens member 20 forming the second lens array 22 is brought into contact with the substrate 10 and bonded thereto in a state where the first and second bonding surfaces 22d, 10e are activated. Further, at the time of contact, the first and second joint surfaces 21d, 22d, 10d, and 10e are brought into close contact by applying pressure at a predetermined pressure or more. In the present embodiment, since the transfer step and the heating step are continuously performed after the target bonding step, the lens member 20 is pressed by the mold 40.

Regarding pressurization at the time of bonding, it is desirable to vary the pressure according to the elastic modulus of the material of the lens member 20 and the substrate 10. The pressure for pressurization is, for example, 10MPa or less, preferably 0.005MPa or more and 10MPa or less. The optimum value of the pressure for pressurizing the material to be used may be different depending on the material and the temperature within the above range, and the pressure may be decreased as the material becomes softer. This allows the substrate 10 to be bonded to the lens member 20 as the second member without breaking the substrate 10 as the first member.

In the above bonding step, it is necessary to bring the surfaces of the objects to be bonded into contact with each other in a state where at least the surfaces of the lens members 20 made of resin are activated. When the temperature exceeds the upper limit (for example, 140 ℃) before the substrate 10 and the lens component 20 come into contact, the activated state of the surface changes (inactivated state) due to the physical properties of the resin of the lens component 20. In this case, the contact in the activated state, which is a necessary element for bonding the substrate 10 and the lens member 20, is no longer possible, and thus bonding is no longer possible.

In addition, the joined state is a state in which the lens member 20 and the substrate 10 are temporarily fixed by hydrogen bonding. In this temporary fixation, the lens member 20 and the substrate 10 are temporarily fixed at a predetermined place, and are in a state of being freely removable by being immersed in water or the like.

[ heating and transfer ]

As shown in fig. 2D and 3A, the lens part 20 is molded using a mold 40. The mold 40 is disposed outside the lens part 20. The mold 40 includes a first mold 41 for molding the first lens array 21 and a second mold 42 for molding the second lens array 22. The first mold 41 has a first lens transfer surface 41a for transferring the first lens elements 21a of the first lens array 21 and a first support transfer portion 41b for transferring the first support portion 21 b. The second mold 42 has a second lens transfer surface 42a for transferring the second lens elements 22a of the second lens array 22 and a second support transfer portion 42b for transferring the second support portion 22 b. A heater 43 is provided in addition to each of the first and second molds 41 and 42. The heater 43 maintains the temperature range of not lower than the reference temperature and not higher than the glass transition temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin material of the lens member 20 in the molds 41 and 42 in the bonding step. The heater 43 maintains the same temperature as that in the heating step, in other words, a temperature higher than the glass transition temperature, specifically, a temperature of 170 ℃.

As shown in fig. 3A, a transfer step of transferring the three-dimensional shape to the lens member 20 as the second member is performed simultaneously with the heating step (step S15 of fig. 4). Specifically, the lens member 20 and the substrate 10 are bonded by a predetermined pressure in a temperature environment in the bonding step, and the three-dimensional shape is transferred to the lens member 20 by a predetermined pressure in a temperature environment in the transfer step in which the temperature is continuously increased from the temperature at the time of bonding. The pressing force in the transfer step is set in a relationship between the temperature at the time of pressing and the molding accuracy of the second member. In addition, the pressing force may also depend on the self weight of the lens member 20 according to the shape of the second member. By such a transfer step, the three-dimensional shape of the lens member 20 can be stored in a state at the time of molding. Specifically, the three-dimensional shape of the first lens element 21a and the three-dimensional shape of the first support portion 21b of the first lens array 21 are transferred to the upper lens member 20, and the three-dimensional shape of the second lens element 22a and the three-dimensional shape of the second support portion 22b of the second lens array 22 are transferred to the lower lens member 20. In addition, the lens member 20 can be prevented from being positionally displaced with respect to the substrate 10 at the time of bonding. Moreover, the manufacturing process can be simplified, and the running cost can be reduced. In addition, since the three-dimensional shape is transferred to the lens member 20 on both surfaces of the substrate 10 simultaneously with the bonding step, the alignment of the three-dimensional shape of the lens member 20, and thus the first and second lens arrays 21 and 22, can be adjusted on both sides of the substrate 10 according to the molding accuracy.

Regarding the pressurization at the time of transfer, it is desirable to change the pressure in accordance with the elastic modulus of the material of the lens member 20 and the substrate 10, as in the case of bonding. The pressure for pressurization is, for example, 10MPa or less, preferably 0.05MPa or more and 10MPa or less. The optimum value of the pressure for pressurizing the material to be used may be different depending on the material and the temperature within the above range, and the pressure may be smaller as the material is softer. This allows the lens member 20 as the second member to be transferred without damaging the substrate 10 as the first member.

Simultaneously with the transfer, a heating step of bonding the first and second bonding surfaces 21d, 22d, 10d, and 10e by a bonding process stronger than hydrogen bonding in the bonding step is performed (step S15 in fig. 4). Specifically, dehydration condensation by heating is performed using the heater 43 attached to the mold 40. Accordingly, in the heating step, since the main fixing can be performed by applying an external pressure, higher dimensional accuracy can be obtained. In the heating step, the temperature is increased as compared with the bonding step, and the bonded body of the lens member 20 and the substrate 10 is heated at a temperature higher than the glass transition temperature. In the present embodiment, the heating step is performed in a state where the joined body is held by the mold 40. In the transfer step, after the transfer is once completed, the pressurization may be terminated in the heating step. In the heating step, since firm bonding by the dehydration condensation reaction is performed, a treatment for physical fastening such as surface roughening is not required, and firm bonding can be achieved. The heating temperature is desirably 170 ℃ or higher than the glass transition temperature. This enables stable bonding to be performed in a shorter time. The dehydration condensation reaction is carried out at 100 ℃ or higher, and the reaction time tends to be shorter as the temperature is higher. Further, since the temperature at which the permanent fixation (no detachment due to moisture) is completed in the same time as the time required for the temporary fixation or temporary bonding is 170 ℃ or more, if the temperature is less than 170 ℃, the permanent fixation is generally not completed. The heating process may be performed by using a heating device including a heater.

By the above-described main fixing by the heating step, the first and second lens arrays 21 and 22 and the substrate 10 are completely fixed to a predetermined position with a desired accuracy.

Although the method of manufacturing the structure 100 having the first and second lens arrays 21 and 22 on both surfaces of the substrate 10 has been described above, the structure 100 having the lens arrays (the first lens array 21 in fig. 3C) only on one side of the substrate 10 can be manufactured by the same method as shown in fig. 3C.

Hereinafter, a use example of the structure 100 manufactured by the above-described method will be described. As shown in fig. 5A and 5B, the lens array laminate 200 can be produced by laminating the multilayer structure 100. The lens array laminate 200 includes a light source substrate 50, a first structure 100A, and a second structure 100B. The members 50, 100A, 100B are stacked in the Z-axis direction, i.e., the optical axis OA direction, with the spacer 60 interposed therebetween. The lens array laminate 200 is a light source unit that condenses light from the light source 50a constituted by a group of dots provided on the light source substrate 50.

The light source substrate 50 is a rectangular flat plate member and is formed of glass. The light source substrate 50 is provided with a plurality of light sources 50A on the side opposite to the surface to which the first structures 100A are bonded. The light sources 50A are two-dimensionally arranged at positions corresponding to the positions of the lens elements included in the first and second structures 100A and 100B. As the light source 50a, for example, an organic EL element, an LED element, or the like can be used.

The first structure 100A has the first and second lens arrays 21 and 22 formed on both surfaces of the substrate 10. In the first structure 100A, the diaphragm 70 is provided in the first support portion 21b, which is a portion of the upper first lens array 21 excluding the first lens elements 21 a.

The second structure 100B has the first lens array 21 formed on one surface of the substrate 10. The second structure 100B is arranged such that the first lens array 21 of the second structure 100B faces the first lens array 21 of the first structure 100A.

The light source substrate 50, the first structure 100A, and the second structure 100B may be fixed by an adhesive or may be fixed by hydrogen bonding as in the above-described manufacturing method.

According to the above-described method for manufacturing a structure, the substrate 10 as the first member and the first and second lens arrays 21 and 22 as the second members are directly bonded in a surface-activated state, whereby the second member having a surface shape can have the same linear expansion characteristic as the first member even if the first member and the second member are formed of different materials. In the joining step, since a high close contact state can be maintained in a state where the surface-activated state is maintained at a temperature that does not interfere with the surface-activated state, the first and second members can be joined more strongly without being restricted by the surface accuracy and the surface state of the material. Since the first member can have a simple structure such as a cylinder or a flat plate as a base material, a material that is difficult to process can be selected. In addition, the first and second members can be bonded to each other without limitation in material by the surface activation step. In the joining step, the second member is set to a softening temperature that is a temperature equal to or higher than a reference temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin material and equal to or lower than the glass transition temperature, whereby the first and second members can be joined at a lower pressure, and the internal stress caused by the shape of the second member can be relaxed to improve the shape accuracy of the second member.

Further, according to the above method, it is not necessary to take measures to improve the adhesion of the joining surfaces of the members by mirror finishing or the like in advance, and the structure 100 can be manufactured to be firmly joined while suppressing linear expansion. By pressure-bonding a resin material such as a thermoplastic resin, which is relatively inexpensive and easily molded into a three-dimensional shape, and one of the materials to be laminated and bonded together in an environment at a temperature as high as possible, which is not higher than the glass transition temperature, the surfaces of the members can be brought into close contact with each other and hydrogen-bonded. In addition, in the transfer step performed simultaneously with the heating step, the resin is structured so as not to be displaced and the heating treatment is performed, whereby stable bonding can be performed.

(examples)

Hereinafter, examples of the present embodiment will be described. As the first member, alkali-free glass (AN 100: Asahi glass) was used. Further, as the second member, cycloolefin polymer (COP: ZEONEX (registered trademark) E48R) was used. In the bonding step in the production process, the bonding is performed at a temperature ranging from 92 to 139 ℃ which is a reference temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin of the example to the glass transition temperature. The pressure applied during bonding is 3MPa or less, and the pressure application time is 1 second or more and 5 minutes or less. Hereinafter, for reference, the results of the bonding state of the first and second members in 25 ℃ and 160 ℃ are shown in table 1 as a comparative example of the above temperature range of the present embodiment. In the evaluation of the joined state, the reference symbol "o" indicates a state in which the joining was not naturally peeled or maintained, and the reference symbol "x" indicates a state in which the joining was naturally peeled or not maintained. Here, in the case of 160 ℃ bonding, which is a state of 140 ℃ exceeding the glass transition temperature, the surface state of the activated resin second member is largely changed, and the second member returns to the state before activation, and bonding is not performed.

[ Table 1 ]

Temperature under pressure (. degree. C.)	Engaged state
		25	×
92	○
		100	○
130	○
		139	○
160	×

Then, the temperature of the heater is raised, and the transfer step and the heating step for transferring the three-dimensional shape of the second member are performed simultaneously with the heating step. In the transfer step, the resin temperature is set to 170 ℃ or higher. The pressure applied during transfer is 2MPa to 10 MPa. The pressing time at the time of transfer is set to 5 seconds or more. In the heating step, the joined body of the first and second members is heated at 170 ℃ or higher, which is a temperature higher than the glass transition temperature. The structure obtained after the heating step is not separated even when immersed in water, and is reliably fixed.

[ second embodiment ]

Hereinafter, a method for manufacturing a structure according to a second embodiment will be described. The method for manufacturing a structure according to the second embodiment is partially changed from the method for manufacturing a structure according to the first embodiment, and the method is the same as the first embodiment except for the fact that it is not particularly described.

A method for manufacturing the structure 100 according to the second embodiment will be described with reference to fig. 6A to 6D, fig. 7A to 7C, and fig. 8. In the present embodiment, after the bonding step, a transfer step of transferring the three-dimensional shape to the second member is performed.

[ preparation of first and second Components ]

First, the substrate 10 as the first member and the lens member 20 as the second member which is the base material of the first and second lens arrays 21 and 22 are prepared (step S11 of fig. 8).

[ formation of adhesive layer ]

As shown in fig. 6A, the adhesive layer 30 having the silane coupling agent is provided on the second bonding surfaces 10d and 10e of the substrate 10 (step S12 in fig. 8).

[ surface activation ]

As shown in fig. 6B and 6C, an activation process is performed to activate at least one of the first and second bonding surfaces 21d, 22d, 10d, and 10e (step S13 in fig. 8).

[ Joint ]

Next, a bonding step of positioning and temporarily fixing the lens member 20 and the substrate 10 by hydrogen bonding is performed by applying pressure in a state where the first and second bonding surfaces 21d, 22d, 10d, and 10e are aligned (step S14 in fig. 8). The ambient temperature in the bonding step is a temperature (for example, 90 ℃ to 140 ℃) which is not lower than the reference temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin material of the lens member 20 as the second member and is not lower than the glass transition temperature. In the bonding step, the lens member 20 as the second member is bonded to the substrate 10 as the first member by pressing at the temperature.

First, the first bonding surface 21d on the lens member 20 side, on which the first lens array 21 is formed, is opposed to the second bonding surface 10d on the substrate 10 side, and the lens member 20 and the substrate 10 are arranged at the bonding position with a gap therebetween, while the surfaces of the first and second bonding surfaces 21d, 10d are kept activated. The first bonding surface 22d on the lens member 20 side, on which the second lens array 22 is formed, is opposed to the second bonding surface 10e on the substrate 10 side, and the lens member 20 and the substrate 10 are arranged at the bonding position with a gap therebetween, while the surfaces of the first and second bonding surfaces 22d, 10e are kept activated.

As shown in fig. 6D, after the positioning, the lens member 20 forming the first lens array 21 is brought into contact with and bonded to the substrate 10 in a state where the first and second bonding surfaces 21D, 10D are activated. In addition, the lens member 20 forming the second lens array 22 is brought into contact with the substrate 10 and bonded thereto in a state where the first and second bonding surfaces 22d, 10e are activated. Further, at the time of contact, the first and second joint surfaces 21d, 22d, 10d, and 10e are brought into close contact by applying pressure at a predetermined pressure or more. At this time, the lens member 20 is pressed from the outside using a flat plate-shaped pressing member 80. The surface shape of the lens member 20 after the bonding step becomes a planar shape.

In the above bonding step, the lens member 20 and the substrate 10 are temporarily fixed by hydrogen bonding.

[ transfer printing ]

As shown in fig. 7A and 7B, after the bonding step, a transfer step of transferring the three-dimensional shape to the lens member 20 as the second member is performed (step S115 in fig. 8). The pressing member 80 used in the bonding step is replaced with the molding die 40, and the three-dimensional shape is transferred to the lens member 20. The ambient temperature in the transfer step is higher than the glass transition temperature, specifically 170 ℃ or higher. The three-dimensional shape of the lens member 20 can be stored in a state at the time of molding by the transfer step. In addition, the lens member 20 can be prevented from being positionally displaced with respect to the substrate 10 at the time of bonding. In addition, since the three-dimensional shape is transferred to the lens member 20 on both surfaces of the substrate 10 after the bonding step, the alignment of the three-dimensional shape of the lens member 20, and thus the first and second lens arrays 21 and 22, can be adjusted on both sides of the substrate 10 according to the molding accuracy. In addition, although the heating temperature is continuously raised in the transfer step after the bonding step as described above, the bonded body of the lens member 20 and the substrate 10 may be returned to room temperature after the bonding step, and then heated again in the transfer step.

[ heating ]

Next, a heating step of bonding the first and second bonding surfaces 21d, 22d, 10d, and 10e by a bonding treatment stronger than hydrogen bonding in the bonding step is performed (step S116 in fig. 8).

By the above-described main fixing by the heating step, the first and second lens arrays 21 and 22 and the substrate 10 are completely fixed to a predetermined position with a desired accuracy. In addition, the transfer step and the heating step can be performed simultaneously or continuously. The transfer step may be performed after the heating step. In the case where the heating step is performed using a heating device, the structure 100 may be heated while remaining in the mold 40, or the structure 100 may be heated after being released from the mold 40.

In the method for manufacturing a structure according to the second embodiment described above, the three-dimensional shape of the second member can be stored in a state during molding by performing the transfer step after the joining step. In addition, the second member can be prevented from being displaced relative to the first member at the time of engagement.

(examples)

Hereinafter, examples of the present embodiment will be described. As the first member, alkali-free glass (AN 100: Asahi glass) was used. Further, as the second member, cycloolefin polymer (COP: ZEONEX (registered trademark) E48R) was used. In the bonding step in the manufacturing step, the bonding is performed at a temperature ranging from 92 to 139 ℃, which is a reference temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin, to the glass transition temperature. The pressure applied during bonding is 3MPa or less, and the pressure application time is 1 second to 5 minutes. Then, the temperature of the heater was increased to about 170 ℃ and the heating time was set to 350 seconds to 42 seconds. At the time of temperature rise, pressurization was not performed. After the joining step, a transfer step of transferring the three-dimensional shape of the second member is performed. In the transfer step, the resin temperature is set to 170 ℃ or higher. The pressure applied during transfer is 2MPa to 10 MPa. The pressing time at the time of transfer is set to 5 seconds or more. Then, in the heating step, the joined body of the first and second members is heated at 170 ℃ or higher, which is a temperature higher than the glass transition temperature. The structure obtained after the heating step is not separated even when immersed in water, and is reliably fixed.

[ third embodiment ]

Hereinafter, a method for manufacturing a structure according to a third embodiment will be described. The method for manufacturing a structure according to the third embodiment is partially changed from the method for manufacturing a structure according to the first embodiment, and the method is the same as the first embodiment except for the fact that it is not described in particular.

A method for manufacturing the structure 100 according to the third embodiment will be described with reference to fig. 9A to 9F and fig. 10. In the present embodiment, the bonding step is preceded by a transfer step of transferring the three-dimensional shape to the second member.

[ preparation of first and second Components ]

First, the substrate 10 as the first member and the lens member 20 as the second member which is the base material of the first and second lens arrays 21 and 22 are prepared (step S11 of fig. 10). In the present embodiment, as the resin material of the first and second lens arrays 21 and 22, an energy curable resin (an ultraviolet curable resin, a thermosetting resin, or the like), a 2-liquid curable resin, or the like can be used in addition to the thermoplastic resin.

[ formation of adhesive layer ]

As shown in fig. 9A, the adhesive layer 30 having the silane coupling agent is provided on the second bonding surfaces 10d and 10e of the substrate 10 (step S12 of fig. 10).

[ transfer printing ]

As shown in fig. 9B, a transfer step of transferring the three-dimensional shape to the lens member 20 as the second member is performed before the activation treatment step and before the bonding step (step S215 in fig. 10). The lens member 20 is placed on the support substrate SS, and the mold 40 is pressed toward the support substrate SS side in a temperature environment higher than the glass transition temperature, specifically 170 ℃ or higher, thereby forming the first lens array 21. After molding, the first lens array 21 is released from the support substrate SS and the mold 40. The second lens array 22 is also formed in the same manner as the first lens array 21.

[ surface activation ]

As shown in fig. 9C and 9D, an activation process is performed to activate at least one of the first and second bonding surfaces 21D, 22D, 10D, and 10e (step S13 in fig. 10).

[ Joint ]

Next, a bonding step is performed in which the lens member 20 and the substrate 10 are positioned and temporarily fixed by hydrogen bonding by applying pressure in a state where the first and second bonding surfaces 21d, 22d, 10d, and 10e are aligned (step S214 in fig. 10). The ambient temperature in the bonding step is a temperature (for example, 90 ℃ to 140 ℃) which is not lower than the reference temperature obtained by subtracting 30 ℃ from the load deflection temperature of the resin material of the lens member 20 as the second member and is not lower than the glass transition temperature. In the bonding step, the substrate 10 as the first member is pressed and bonded to the substrate at the temperature. In the bonding step, the first and second lens arrays 21 and 22 as the lens member 20 are preferably performed in a state where the molding surfaces are maintained, for example, in a state where they are fitted in the first and second molds 41 and 42, respectively. For example, marks are formed on the surfaces of the molds 41 and 42, respectively, and the mold 40 is positioned and joined by aligning the marks.

First, the first bonding surface 21d on the lens member 20 side, on which the first lens array 21 is formed, is opposed to the second bonding surface 10d on the substrate 10 side, and the lens member 20 and the substrate 10 are arranged at the bonding position with a gap therebetween, while the surfaces of the first and second bonding surfaces 21d, 10d are kept activated. The first bonding surface 22d on the lens member 20 side, on which the second lens array 22 is formed, is opposed to the second bonding surface 10e on the substrate 10 side, and the lens member 20 and the substrate 10 are arranged at the bonding position with a gap therebetween, while the surfaces of the first and second bonding surfaces 22d, 10e are kept activated.

As shown in fig. 9E, after the positioning, the lens member 20 forming the first lens array 21 is brought into contact with and bonded to the substrate 10 in a state where the first and second bonding surfaces 21d, 10d are activated. In addition, the lens member 20 forming the second lens array 22 is brought into contact with the substrate 10 and bonded thereto in a state where the first and second bonding surfaces 22d, 10e are activated. Further, at the time of contact, the first and second joint surfaces 21d, 22d, 10d, and 10e are brought into close contact by applying pressure at a predetermined pressure or more.

In the above bonding step, the lens member 20 and the substrate 10 are temporarily fixed by hydrogen bonding.

[ heating ]

Next, a heating step of bonding the first and second bonding surfaces 21d, 22d, 10d, and 10e by a bonding treatment stronger than hydrogen bonding in the bonding step is performed (step S216 in fig. 10).

By the above-described main fixing by the heating step, the first and second lens arrays 21 and 22 and the substrate 10 are completely fixed to a predetermined position with a desired accuracy.

In the method for manufacturing a structure according to the third embodiment described above, the three-dimensional shape can be transferred without considering the destruction of the first member due to the pressure condition at the time of shape transfer by performing the transfer step before the joining step.

Although the method for manufacturing a structure according to the present embodiment has been described above, the method for manufacturing a structure according to the present invention is not limited to the above. For example, in the above embodiment, the shapes and sizes of the first and second lens arrays 21 and 22 (or the lens member 20) and the substrate 10 constituting the structure 100 can be changed as appropriate depending on the application and function. For example, the lens member 20 can be formed with a convex portion, a concave portion, or the like for positioning.

In the above embodiment, the thicknesses of the first and second members may be changed as appropriate, and may be thick or thin.

In the above embodiment, the first and second members are not limited to the substrate 10 and the lens arrays 21 and 22, and may be appropriately modified according to the application. The bonded body may be, for example, an electronic component, an inspection device, a semiconductor device, a micro component, or the like, in addition to the optical unit.

In the above embodiment, the structure 100 may be cut and singulated into optical elements each including a lens element.

In the above embodiment, the adhesive layer 30 may not be provided.

In the above embodiment, the heating step can be omitted.