阅读说明：本技术 指纹识别模组及其制作方法和电子装置 (Fingerprint identification module, manufacturing method thereof and electronic device ) 是由 刘文渠 李秀锋 姚琪 张锋 董立文 崔钊 徐传祥 孟德天 宋晓欣 王利波 岳阳 于 2020-01-17 设计创作，主要内容包括：一种指纹识别模组及其制作方法和电子装置。该指纹识别模组包括基板、压电材料层、辅助结构和多个第一驱动电极；压电材料层位于基板上,辅助结构至少部分位于基板上,多个第一驱动电极位于压电材料和辅助结构远离基板的一侧；各第一驱动电极沿第一方向延伸并超过压电材料层在第一方向上的第一边缘,多个第一驱动电极沿第二方向间隔设置,辅助结构至少与第一边缘接触设置,辅助结构包括斜坡部,在从第一边缘到远离压电材料层的中心的方向上,斜坡部在垂直于功能基板的方向上的厚度逐渐减小。该指纹识别模组在压电材料层上形成多个第一驱动电极的过程中可避免产生断线和导电材料残留等问题,从而可提高产品的良率。(A fingerprint identification module, a manufacturing method thereof and an electronic device are provided. The fingerprint identification module comprises a substrate, a piezoelectric material layer, an auxiliary structure and a plurality of first driving electrodes; the piezoelectric material layer is positioned on the substrate, the auxiliary structure is at least partially positioned on the substrate, and the plurality of first driving electrodes are positioned on one sides of the piezoelectric material layer and the auxiliary structure, which are far away from the substrate; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction, the plurality of first driving electrodes are arranged at intervals along a second direction, the auxiliary structure is at least arranged in contact with the first edge, and the auxiliary structure comprises a slope part, wherein the thickness of the slope part in the direction perpendicular to the functional substrate is gradually reduced in the direction from the first edge to the direction far away from the center of the piezoelectric material layer. The fingerprint identification module can avoid the problems of broken wires, residual conductive materials and the like in the process of forming a plurality of first driving electrodes on the piezoelectric material layer, so that the yield of products can be improved.)

A fingerprint identification module, comprising:

a functional substrate;

a piezoelectric material layer on the functional substrate;

an auxiliary structure at least partially located on the functional substrate; and

a plurality of first driving electrodes on a side of the piezoelectric material layer and the auxiliary structure away from the functional substrate,

the first driving electrodes extend along a first direction and exceed a first edge of the piezoelectric material layer in the first direction, the first driving electrodes are arranged at intervals along a second direction, the auxiliary structure is at least arranged in contact with the first edge, the auxiliary structure comprises a slope part, the thickness of the slope part in the direction perpendicular to the functional substrate is gradually reduced in the direction from the first edge to the direction far away from the center of the piezoelectric material layer, and the second direction intersects with the first direction.

The fingerprint identification module of claim 1, wherein a slope angle of the ramp portion is less than 60 degrees.

The fingerprint identification module of claim 1, wherein said auxiliary structure comprises:

the main body part is positioned on the functional substrate and arranged on the same layer with the piezoelectric material layer; and

and an overlapping portion connected to the main body portion and located on a side of the first edge of the piezoelectric material layer away from the functional substrate.

The fingerprint identification module of claim 3, wherein a dimension of said overlap in said first direction is greater than 200 microns.

The fingerprint identification module of any one of claims 1-4, wherein the material of said secondary structure comprises a cured glue.

The fingerprint identification module of any one of claims 1-5, wherein the material of said secondary structure comprises an optically cured glue.

The fingerprint identification module of any one of claims 1-6, wherein the material of the piezoelectric material layer comprises polyvinylidene fluoride.

The fingerprint identification module of any one of claims 1-7, wherein said auxiliary structure is disposed along an edge of said piezoelectric material, said auxiliary structure being disposed in contact with a second edge of said piezoelectric material layer in said second direction.

The fingerprint identification module of any one of claims 1-8, wherein each of said first driving electrodes comprises a metal layer and a transparent metal oxide layer sequentially stacked in a direction perpendicular to the functional substrate.

The fingerprint identification module of any one of claims 1-9, further comprising:

the first insulating layer is positioned on one side, away from the functional substrate, of the first driving electrodes; and

an acoustic wave reflective layer on a side of the first insulating layer away from the plurality of first drive electrodes,

wherein an orthographic projection of the acoustic wave reflective layer on the functional substrate overlaps with an orthographic projection of the piezoelectric material layer on the functional substrate.

The fingerprint identification module of any one of claims 1-10, wherein said functional substrate comprises:

a substrate;

the receiving electrode layer is positioned on one side, close to the substrate, of the piezoelectric material layer and comprises a plurality of receiving electrodes; and

a driving circuit layer located on one side of the receiving electrode close to the substrate and including a plurality of driving units,

wherein orthographic projections of the plurality of receiving electrodes on the substrate at least partially overlap with orthographic projections of the piezoelectric material layer on the substrate, and orthographic projections of the plurality of receiving electrodes on the substrate at least partially overlap with orthographic projections of the plurality of first driving electrodes on the substrate.

The fingerprint identification module of claim 11, wherein said functional substrate further comprises:

a second insulating layer between the receiving electrode layer and the piezoelectric material layer.

The fingerprint identification module of claim 11, wherein said functional substrate further comprises:

a plurality of second driving electrodes between the receiving electrode layer and the driving circuit layer,

wherein the plurality of first drive electrodes and the plurality of second drive electrodes form a plurality of drive electrode pairs, and orthographic projections of the first drive electrodes and the second drive electrodes in each drive electrode pair on the piezoelectric material layer at least partially overlap.

An electronic device comprising the fingerprint identification module according to any one of claims 1-13.

A manufacturing method of a fingerprint identification module comprises the following steps:

providing a functional substrate;

forming a piezoelectric material layer on the functional substrate;

forming an auxiliary structure on the functional substrate on which the piezoelectric material layer is formed; and

forming a plurality of first drive electrodes on the piezoelectric material layer and the side of the auxiliary structure away from the functional substrate,

the first driving electrodes extend along a first direction and exceed a first edge of the piezoelectric material layer in the first direction, the first driving electrodes are arranged at intervals along a second direction, the auxiliary structure is at least arranged in contact with the first edge, the auxiliary structure comprises a slope part, the thickness of the slope part is gradually reduced in the direction from the first edge to the direction far away from the center of the piezoelectric material layer, the thickness of the slope part is gradually reduced in the direction perpendicular to the functional substrate, and the second direction intersects with the first direction.

The method for manufacturing a fingerprint identification module of claim 15, wherein the forming of the auxiliary structure on the functional substrate formed with the piezoelectric material layer comprises:

coating liquid curing glue on the functional substrate on which the piezoelectric material layer is formed;

patterning the liquid curing glue to expose at least a portion of the piezoelectric material layer; and

curing the liquid curing adhesive to obtain the cured liquid adhesive,

wherein the liquid curing glue is subjected to leveling and curing to form the slope portion.

The method for manufacturing a fingerprint identification module of claim 16, wherein the forming of the auxiliary structure on the functional substrate formed with the piezoelectric material layer comprises:

and patterning the liquid curing adhesive to expose at least part of the piezoelectric material layer to form a main body part which is positioned on the functional substrate and is arranged on the same layer with the piezoelectric material layer and an overlapping part which is connected with the main body part and is positioned on one side of the first edge of the piezoelectric material layer, which is far away from the functional substrate.

The method of claim 17, wherein the overlap portion has a dimension in the first direction greater than 200 microns.

The method for manufacturing a fingerprint identification module according to any one of claims 15-18 wherein forming a plurality of first driving electrodes on the piezoelectric material layer and the side of said auxiliary structure away from said functional substrate comprises:

forming a metal layer on the piezoelectric material layer and one side of the auxiliary structure far away from the functional substrate;

forming a transparent metal oxide layer on one side of the metal layer far away from the piezoelectric material layer;

patterning the transparent metal oxide layer to form a plurality of strip-shaped transparent metal oxides; and

and etching the metal layer by taking the strip-shaped transparent metal oxides as masks to form the first driving electrodes.

The method for manufacturing a fingerprint identification module according to any one of claims 15-18 wherein said forming a piezoelectric material layer on said functional substrate comprises:

coating a piezoelectric material on the functional substrate and crystallizing;

forming a hard mask on the crystallized piezoelectric material; and

etching the crystallized piezoelectric material by using the hard mask as a mask to form the piezoelectric material layer,

wherein the hard mask is made of one or more of molybdenum, aluminum, titanium, niobium and indium tin oxide.