Flexible rigid PCB circuit board

文档序号:1060404 发布日期:2020-10-13 浏览:9次 中文

阅读说明:本技术 一种可弯曲硬性pcb电路板 (Flexible rigid PCB circuit board ) 是由 陈振刚 蔡莹 陈翔 王贤会 于 2020-07-02 设计创作,主要内容包括:本发明公开了一种可弯曲硬性PCB电路板,该PCB电路板包括玻璃纤维板和白色油墨层,所述白色油墨层涂覆于玻璃纤维板的上表面和下表面,所述玻璃纤维板的厚度尺寸为0.3-1mm,所述白色油墨层的厚度尺寸为0.05-0.1mm。本发明与现有的玻璃纤维板相比,既保证垂直角度的硬件,又在水平角度可以适当弯曲;与FPC板相比在保证弯曲角度的同时防止电子器件不易损伤,且成本较低,工艺简单。(The invention discloses a bendable hard PCB (printed circuit board), which comprises a glass fiber board and a white ink layer, wherein the white ink layer is coated on the upper surface and the lower surface of the glass fiber board, the thickness of the glass fiber board is 0.3-1mm, and the thickness of the white ink layer is 0.05-0.1 mm. Compared with the existing glass fiber board, the glass fiber board has the advantages that the hardware with a vertical angle is ensured, and the glass fiber board can be properly bent at a horizontal angle; compared with an FPC board, the bending angle is guaranteed, meanwhile, electronic devices are prevented from being damaged easily, cost is low, and the process is simple.)

1. The bendable hard PCB is characterized by comprising a glass fiber board (1) and a white ink layer (2), wherein the white ink layer (2) is coated on the upper surface and the lower surface of the glass fiber board (1), the thickness of the glass fiber board (1) is 0.3-1mm, and the thickness of the white ink layer (2) is 0.05-0.1 mm; the glass fiber plate (1) is of a strip-shaped structure, and LED mounting holes (3) are formed in the glass fiber plate (1) at intervals along the length direction of the glass fiber plate;

the glass fiber plate (1) is 4, be equipped with four groups of LED mounting holes (3) on glass fiber plate (1), glass fiber plate (1) parallel arrangement is on the coplanar and its length direction's both ends are fixed through wiring anchor clamps (5).

2. The bendable rigid PCB circuit board according to claim 1, wherein the LED mounting hole (3) is provided therein with a flexible heat conducting ring or flexible heat conducting strips distributed along a circumferential direction thereof.

3. The bendable hard PCB circuit board according to claim 1, wherein printed wiring circuits (4) are arranged at two ends of the glass fiber board (1) in the length direction, and the outer surfaces of the peripheries of the LED mounting holes (1) are provided with gold-sinking electric connection structures.

4. The bendable hard PCB circuit board according to claim 1, wherein the wiring clamp (5) comprises a clamp seat (6), a flexible insulating spacer (7) and two fastening screws (8), the clamp seat (6) is provided with a long groove along the length direction thereof for mounting the end of the glass fiber board, the flexible insulating spacer (7) is slidably arranged in the long groove along the length direction of the long groove, and the two fastening screws (8) are in threaded connection with two ends of the long groove along the length direction.

5. The bendable hard PCB circuit board according to claim 1, wherein the fixture base (6) is provided with heat dissipating fins on an upper surface and/or a lower surface thereof, and/or the fixture base (6) is further provided with heat dissipating through holes.

Technical Field

The invention belongs to the circuit electronic technology, and particularly relates to a bendable rigid PCB.

Background

FR-4 glass fiber boards are mostly adopted in common PCB boards in the market, the rigidity of the boards is higher, 2MM boards are generally used, the strength can be achieved by the method, but the PCB boards cannot be bent.

At present, a Flexible Printed Circuit (FPC) is a highly reliable and excellent Flexible Printed Circuit board made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. However, the circuit board has low strength, is not hard enough when needing to be vertically mounted, is easy to bend to cause damage to an IC device, and has high cost and complex processing technology.

Therefore, a flexible rigid PCB and a method for manufacturing the same are needed.

Disclosure of Invention

In order to solve the above technical problems, the present invention provides a bendable rigid PCB.

In order to achieve the purpose, the technical scheme of the invention is as follows:

the invention provides a bendable hard PCB (printed circuit board), which comprises a glass fiber board and a white ink layer, wherein the white ink layer is coated on the upper surface and the lower surface of the glass fiber board, the thickness of the glass fiber board is 0.3-1mm, and the thickness of the white ink layer is 0.05-0.1 mm; the glass fiber plate is of a strip-shaped structure, and LED mounting holes are formed in the glass fiber plate at intervals along the length direction of the glass fiber plate;

the glass fiber plate is 4, be equipped with four groups of LED mounting holes on the glass fiber plate, the glass fiber plate parallel arrangement is on the coplanar and its length direction's both ends are fixed through wiring anchor clamps.

Preferably, the LED mounting hole is provided with a flexible heat conducting ring or flexible heat conducting strips distributed along the circumferential direction of the LED mounting hole.

Preferably, printed wiring circuits are arranged at two ends of the glass fiber board in the length direction, and gold immersion electric connection structures are arranged on the outer surfaces of the periphery of the LED mounting holes.

Preferably, the wiring clamp comprises a clamp seat, a flexible insulating division bar and two fastening screws, wherein the clamp seat is provided with a long groove used for mounting the end part of the glass fiber plate along the length direction of the clamp seat, the flexible insulating division bar is arranged in the long groove in a sliding manner along the length direction of the long groove, and the two fastening screws are in threaded connection with the two ends of the long groove in the length direction.

Preferably, the upper surface and/or the lower surface of the clamp seat is/are provided with heat dissipation fins, and/or the clamp seat is further provided with heat dissipation through holes.

The invention has the following beneficial effects: compared with the existing glass fiber board, the glass fiber board has the advantages that the hardware with a vertical angle is ensured, and the glass fiber board can be properly bent at a horizontal angle; compared with an FPC board, the bending angle is guaranteed, meanwhile, electronic devices are prevented from being damaged easily, cost is low, and the process is simple.

Drawings

Fig. 1 is a schematic side view of a bendable rigid PCB of the present invention.

Fig. 2 is a schematic front structure of a bendable rigid PCB circuit board according to the present invention.

Fig. 3 is a schematic diagram of an overall structure of a bendable rigid PCB assembly of the present invention.

Fig. 4 is a structural schematic diagram of a wiring clamp in a bendable rigid PCB circuit board according to the present invention.

The LED lamp comprises a glass fiber board 1, a white ink layer 2, an LED mounting hole 3, a printed wiring board 4, a wiring clamp 5, a clamp seat 6, a flexible insulating partition bar 7 and a fastening screw 8.

Detailed Description

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

In order to achieve the object of the present invention, as shown in fig. 1, in one embodiment of the present invention, a bendable rigid PCB circuit board is provided, which includes a glass fiber board 1 and a white ink layer 2, wherein the white ink layer 2 is coated on an upper surface and a lower surface of the glass fiber board 1, a thickness of the glass fiber board 1 is 0.3-1mm, in this embodiment, 0.3mm, 0.4mm, 0.6mm, or 1mm, a thickness of the white ink layer 2 is 0.05-0.1mm, in this embodiment, 0.05mm, 0.06mm, 0.08mm, or 0.1 mm.

In order to further optimize the effect of the present invention, as shown in fig. 2, in another embodiment of the present invention, in addition to the above, the glass fiber plate 1 has a long structure, and the glass fiber plate 1 is provided with LED mounting holes 3 at intervals along the longitudinal direction thereof.

Specifically, the LED mounting hole 3 is provided with a flexible heat conducting ring or flexible heat conducting strips distributed along the circumferential direction thereof.

Specifically, printed wiring circuits 4 are arranged at two ends of the glass fiber plate 1 in the length direction, and gold immersion electric connection structures are arranged on the outer surfaces of the periphery of the LED mounting hole 1.

As shown in fig. 3, in order to further optimize the implementation effect of the present invention, in another embodiment of the present invention, based on the above, the number of the glass fiber plates 1 is 4, four sets of LED mounting holes 3 are provided on the glass fiber plates 1, and the glass fiber plates 1 are arranged in parallel on the same plane and both ends in the length direction thereof are fixed by a wire connecting clamp 5.

Specifically, as shown in fig. 4, the wiring clamp 5 includes a clamp seat 6, a flexible insulating division bar 7 and two fastening screws 8, the clamp seat 6 is provided with a long groove along a length direction thereof for mounting an end portion of the glass fiber plate, the flexible insulating division bar 7 is slidably disposed in the long groove along the length direction of the long groove, and the two fastening screws 8 are threadedly connected to two ends of the long groove in the length direction.

Specifically, the upper surface and/or the lower surface of the clamp seat 6 is/are provided with heat dissipation fins, and/or the clamp seat 6 is further provided with heat dissipation through holes.

In order to further optimize the implementation effect of the present invention, in another embodiment of the present invention, based on the foregoing, the present invention further provides a method for manufacturing a bendable hard PCB, including the steps of:

s1, preparing a glass fiber board 1;

and S2, spraying the white ink layer 2 on the upper surface and the lower surface of the glass fiber board 1 to prepare the strip-shaped PCB unit.

In order to further optimize the implementation effect of the present invention, in another embodiment of the present invention, based on the foregoing, the present invention further provides a method for manufacturing a bendable hard PCB, including the steps of:

s1, preparing a glass fiber board 1;

s2, spraying the white ink layer 2 on the upper surface and the lower surface of the glass fiber board 1 to prepare a strip-shaped PCB unit;

s3, preparing four strip-shaped PCB circuit board units according to the above steps S1 and S2;

and S4, arranging the four strip-shaped PCB circuit board units on the same plane in parallel and fixing the four strip-shaped PCB circuit board units at two ends in the length direction by using the wiring clamp 5.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are all within the scope of the present invention.

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