阅读说明：本技术 密封剂 (Sealing agent ) 是由 富田裕介 山本祐五 于 2019-08-05 设计创作，主要内容包括：本发明的课题为提供一种具有适合于利用喷墨法进行的涂布的粘度、且抑制对喷墨装置的喷墨头部的损伤、并且固化物的介电常数低的密封剂。通过包含(A)具有两个以上的乙基己基的脂环式环氧化合物、(B)多官能氧杂环丁烷化合物、以及(C)单官能缩水甘油醚的密封剂,来解决所述课题。(The invention provides a sealant which has viscosity suitable for coating by an ink jet method, inhibits damage to an ink jet head of an ink jet device and has low dielectric constant of a cured product. The problem is solved by a sealant containing (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) a monofunctional glycidyl ether.)

1. A sealant, comprising:

(A) an alicyclic epoxy compound having two or more ethylhexyl groups,

(B) A polyfunctional oxetane compound, and

(C) a monofunctional glycidyl ether.

2. The sealing agent according to claim 1, wherein the viscosity is 8 to 40 mPas as measured by an E-type viscometer at 25 ℃ and 20 rpm.

3. The sealing agent according to claim 1 or 2, wherein the alicyclic epoxy compound (A) having two or more ethylhexyl groups is bis (2-ethylhexyl) epoxyhexahydrophthalate represented by the following formula (I),

4. a sealant according to any one of claims 1 to 3, wherein the (C) monofunctional glycidyl ether is a phenyl glycidyl ether derivative.

5. The sealing agent according to any one of claims 1 to 4, wherein a swelling ratio A of the ethylene-propylene-diene rubber is 5% or less, and the swelling ratio A is represented by a weight change ratio before and after immersion of an ethylene-propylene-diene rubber test piece, which is generated when the test piece is immersed in the (C) monofunctional glycidyl ether at 25 ℃ for one week.

6. The sealing agent according to any one of claims 1 to 5, wherein the monofunctional glycidyl ether (C) has a viscosity of 35 mPas or less as measured with an E-type viscometer at 25 ℃ and 20 rpm.

7. The sealing agent according to any one of claims 1 to 6, wherein a swelling ratio B of the ethylene-propylene-diene rubber is 10% or less, the swelling ratio B being represented by a weight change rate before and after immersion of an ethylene-propylene-diene rubber test piece, which is generated when the test piece is immersed in the sealing agent at 40 ℃ for one week.

8. The encapsulant of any one of claims 1-7, wherein UV-LED lamps with a wavelength of 395nm are used at an illuminance: 1000mW/cm²Accumulated light amount: 1500mJ/cm²The sealant is cured by ultraviolet rays under the conditions of (1) and then cured at 100 ℃ for 30 minutes to obtain a cured product having a dielectric constant at a frequency of 100kHz of 3.10 or less.

9. A sealant according to any one of claims 1 to 8, which is used for a display element.

10. The sealant according to any one of claims 1 to 9, which is used for coating by an inkjet method.

11. The sealant according to claim 9 or 10, wherein the display element is an organic electroluminescent element.

Technical Field

The present invention relates to a sealant.

Background

In recent years, display devices using display elements such as organic electroluminescent elements (hereinafter referred to as organic EL elements) have been developed, but the display elements are generally susceptible to deterioration due to moisture and oxygen in the atmosphere. Therefore, in various display devices, a display element is generally sealed by a sealing layer (surface sealing). In addition, a sealing agent is also used to seal various elements such as a solar cell element and a semiconductor element.

For example, in devices including various elements such as an organic EL element, the elements such as the organic EL element may be surface-sealed by a cured product of a sealant including a curable resin. Conventionally, a sealing agent is generally applied (printed) by a screen printing method. However, in recent years, in order to achieve flexibility of devices, it has been required to planarize or thin a cured product of a sealant (hereinafter, also referred to as a "sealant"). Therefore, application of a sealant by an inkjet method has been studied. When the sealing agent is applied by an ink jet device, it is required to stably discharge the sealing agent from a nozzle for a long period of time. In addition, it is required to suppress swelling of an adhesive or a rubber material used for the head portion of the ink jet device and to reduce damage to the device.

Here, as a composition for coating with an inkjet device, an inkjet composition containing an epoxidized vegetable oil, an alicyclic epoxy group-containing compound, an oxetanyl group-containing compound, and a photo cationic polymerization initiator has been proposed (for example, patent document 1).

Disclosure of Invention

Problems to be solved by the invention

However, the surface sealing agent described in patent document 1 is not easily applied stably from an ink jet apparatus.

In recent years, display devices with touch panels have been widely used. In this display device, a display element sealed with a sealing layer is disposed in proximity to a sensor such as a touch panel. Further, when the thickness of the sealing layer is reduced, the display element and the sensor are likely to interfere with each other, and the operation of the display device is likely to become unstable. In order to prevent such an unstable operation, the dielectric constant of the sealing layer is desirably low.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a sealing agent suitable for stably applying by an ink jet method for a long period of time.

Means for solving the problems

The present invention provides the following sealants.

[1] A sealant, comprising:

(A) an alicyclic epoxy compound having two or more ethylhexyl groups,

(B) A polyfunctional oxetane compound, and

(C) a monofunctional glycidyl ether.

[2] The sealing agent according to [1], wherein the viscosity is 8 to 40 mPas as measured at 25 ℃ and 20rpm with an E-type viscometer.

[3] The sealant according to any one of [1] or [2], wherein the alicyclic epoxy compound (A) having two or more ethylhexyl groups is bis (2-ethylhexyl) epoxyhexahydrophthalate represented by the following formula (I).

[ solution 1]

[4] The sealant according to any one of [1] to [3], wherein the (C) monofunctional glycidyl ether is a phenyl glycidyl ether derivative.

[5] The sealant according to any one of [1] to [4], wherein a swelling ratio A of the ethylene-propylene-diene rubber, which is expressed by a weight change ratio before and after immersion of the test piece, generated when the test piece of the ethylene-propylene-diene rubber is immersed in the (C) monofunctional glycidyl ether at 25 ℃ for one week, is 5% or less.

[6] The sealant according to any one of [1] to [5], wherein the monofunctional glycidyl ether (C) has a viscosity of 35 mPas or less as measured with an E-type viscometer at 25 ℃ and 20 rpm.

[7] The sealant according to any one of [1] to [6], wherein a swelling ratio B of the ethylene-propylene-diene rubber, which is expressed by a weight change ratio before and after immersion of an ethylene-propylene-diene rubber test piece, generated when the test piece is immersed in the sealant at 40 ℃ for one week, is 10% or less.

[8]Such as [1]]To [7]]The sealant according to any one of, wherein a UV-LED lamp having a wavelength of 395nm is used in a state that an illuminance: 1000mW/cm²Accumulated light amount: 1500mJ/cm²The sealant is cured by ultraviolet rays under the conditions of (1) and then cured at 100 ℃ for 30 minutes to obtain a cured product having a dielectric constant at a frequency of 100kHz of 3.10 or less.

[9] The sealant according to any one of [1] to [8], which is used for a display element.

[10] The sealant according to any one of [1] to [9], which is used for coating by an inkjet method.

[11] The sealant according to [10], wherein the display element is an organic electroluminescent element.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a sealant suitable for application by an inkjet method can be provided.

Detailed Description

1. Sealing agent

The sealant of the present invention is used for surface sealing of various elements such as a display element, a solar cell element, and a semiconductor element, or sealing of liquid crystal of a liquid crystal display element. The sealant comprises (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) a monofunctional glycidyl ether. The composition may contain other components as required, and may contain, for example, (D) a cationic polymerization initiator, (E) various additives, and the like.

As a result of diligent studies, the present inventors have found that the viscosity of a sealant can be set to a value suitable for inkjet application by appropriately combining (a) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) a monofunctional glycidyl ether. Further, by suppressing swelling of an adhesive or a rubber material used in an ink jet head of an ink jet device, deformation of the ink jet head is suppressed, and a sealing agent can be stably ejected for a long period of time. Further, it has been found that the dielectric constant of a cured product of the sealant can be reduced.

The reason is not clear, but is presumed as follows. The adhesive and the rubber material used for the head section of the ink jet device are often made of a material having a low polarity, such as EPDM rubber. On the other hand, if the sealant contains a compound having a bulky structure such as (a) an alicyclic epoxy compound having two or more ethylhexyl groups, the sealant is less likely to have affinity with a rubber material having low polarity, and the swelling ratio of the rubber material with respect to the sealant is likely to decrease. Further, when the sealant contains (B) a polyfunctional oxetane compound, the viscosity of the sealant is easily lowered. Further, when the sealant contains (C) monofunctional glycidyl ether, the swelling ratio of the adhesive, rubber material, or the like to the sealant is likely to decrease. In addition, the dielectric constant of the cured product of the sealant is also easily decreased. By using such a sealing agent, a sealing layer having high flatness and a small thickness can be stably formed for a long period of time by an ink jet method. In addition, when the display element is sealed with such a sealant, the display element is less likely to interfere with a sensor such as a touch panel, and can be disposed close to the sensor. Therefore, the display device can be thinned.

The sealant of the present invention is particularly suitable for application by an ink jet method, but the application method is not limited to the ink jet method, and application by a dispenser, screen printing, spin coating, or the like is also possible.

Alicyclic epoxy compound having two or more ethylhexyl groups (A)

(A) The alicyclic epoxy compound having two or more ethylhexyl groups is not particularly limited as long as it has one or more alicyclic hydrocarbon structures and one or more epoxy groups in the molecule and has two or more ethylhexyl groups. The alicyclic epoxy compound having two or more ethylhexyl groups has a structure larger in volume than the alicyclic epoxy compound having one ethylhexyl group, and therefore, a rubber material which may be present in the ink jet head portion is less likely to swell.

(A) The alicyclic epoxy compound having two or more ethylhexyl groups is preferably a compound that is liquid at 25 ℃, and the viscosity measured with an E-type viscometer at 25 ℃ and 20rpm is preferably 10 to 500mPa · s, more preferably 30 to 300mPa · s. When the viscosity of the alicyclic epoxy compound (a) having two or more ethylhexyl groups is in this range, the viscosity of the sealant is easily in the range described below, and stable application by an ink jet method is easily performed.

(A) The alicyclic epoxy compound having two or more ethylhexyl groups preferably has a molecular weight or weight average molecular weight of 100 to 790, more preferably 140 to 500. The weight average molecular weight is a value (in terms of polystyrene) measured by Gel Permeation Chromatography (GPC). When the molecular weight or the weight average molecular weight of the alicyclic epoxy compound (a) having two or more ethylhexyl groups is 100 or more, the alicyclic epoxy compound (a) having two or more ethylhexyl groups is less likely to volatilize in the ink jet device. Further, if the molecular weight or the weight average molecular weight is 790 or less, the viscosity of the (a) alicyclic epoxy compound having two or more ethylhexyl groups is not excessively increased, and the viscosity of the sealant can be set to the above range.

The alicyclic epoxy compound (a) having two or more ethylhexyl groups preferably has an oxygen atom content of 15% or more, as represented by formula (1).

Oxygen atom content (%) — total mass of oxygen atoms in one molecule/weight average molecular weight × 100 … (1)

When the content of oxygen atoms in the alicyclic epoxy compound (a) having two or more ethylhexyl groups is 15% or more, the polarity of the compound can be increased, and therefore, the compound is less likely to have affinity with an adhesive or a rubber material (e.g., EPDM rubber) having low polarity used in the head portion of the ink jet device, and the adhesive or the rubber material (e.g., EPDM rubber) is less likely to swell. This can reduce deterioration of the adhesive and the rubber material (damage to the device). From the above viewpoint, the oxygen atom content is preferably 18% or more. The upper limit of the oxygen atom content is not particularly limited as long as the dielectric constant of the obtained sealing layer does not excessively increase, and is preferably 30% or less, for example.

(A) The total mass of oxygen atoms in one molecule of an alicyclic epoxy compound having two or more ethylhexyl groups can be calculated by determining the structure of the alicyclic epoxy compound by GC-MS method, NMR method, or the like, determining the number of oxygen atoms in one molecule of the compound, and multiplying the number by the atomic weight of the oxygen atoms. The oxygen atom content of the alicyclic epoxy compound (a) having two or more ethylhexyl groups can be calculated by applying the total mass of the obtained oxygen atoms and the weight average molecular weight measured by the GPC method to the formula (1).

(A) The oxygen atom content of the alicyclic epoxy compound having two or more ethylhexyl groups can be adjusted by, for example, the number of epoxy groups in the molecule and the number of groups having oxygen atoms (for example, -CO- (carbonyl), -O-CO-O- (carbonate group), -COO- (carbonyloxy or ester group), -O- (ether group), -CONH- (amide group), etc.). That is, in order to reduce the oxygen atom content, it is preferable to reduce the number of groups having oxygen atoms in one molecule.

(A) The alicyclic epoxy compound having two or more ethylhexyl groups is preferably a compound having one cycloolefin oxide and two ethylhexyl groups bonded to the alicyclic structures, respectively. Further, a compound in which two ethylhexyl groups are bonded to an alicyclic structure via ester bonds, respectively, is more preferable.

Specific examples of such compounds include bis (2-ethylhexyl) epoxyhexahydrophthalate represented by the following formula (I).

[ solution 2]

Examples of the commercially available products of bis (2-ethylhexyl) epoxyhexahydrophthalate include SANSO CIZER E-PS (manufactured by Nissi chemical and physical Co., Ltd.) and the like.

The amount of the (a) alicyclic epoxy compound having two or more ethylhexyl groups is preferably 10 to 50% by mass based on the total mass of the sealant. When the amount of the alicyclic epoxy compound (a) having two or more ethylhexyl groups is 10% by mass or more, the dielectric constant of the sealant is likely to decrease. On the other hand, if the amount is 50% by mass or less, the viscosity of the sealant becomes an appropriate value, and the swelling ratio of the adhesive or rubber material used in the ink jet head portion to the sealant is likely to be reduced. Further, the amount of the (B) polyfunctional oxetane compound is relatively large, and the dielectric constant is liable to be low. The content of the alicyclic epoxy compound (a) having two or more ethylhexyl groups is more preferably 10 to 40% by mass, and still more preferably 15 to 30% by mass, based on the total mass of the sealant.

(B) polyfunctional oxetane compound

(B) The polyfunctional oxetane compound is not limited as long as it is a bifunctional or higher compound having two or more oxetanyl groups, and the molecular weight or the weight average molecular weight is preferably 180 or more. Further, the oxygen atom content represented by the formula (1) is preferably 15% or more.

When the weight average molecular weight of the polyfunctional oxetane compound (B) is 180 or more, the volatility of the compound can be reduced. Therefore, deterioration of the working environment and damage to the object to be coated (display element) when the sealant is applied by the inkjet method can be reduced. From the viewpoint of reducing the volatility of the sealant, the weight average molecular weight of the (B) polyfunctional oxetane compound is preferably 190 or more, and more preferably 200 or more. The upper limit of the weight average molecular weight is not particularly limited as long as the ejection property of the sealing agent when applied by the inkjet method is not impaired, and is, for example, more preferably 400 or less. The weight average molecular weight can be measured by the same method as described above.

When the oxygen atom content of the polyfunctional oxetane compound (B) is 15% or more, the polarity of the compound can be increased, and thus deterioration (damage to the apparatus) of an adhesive, a rubber material, or the like having low polarity used in the head portion of the ink jet apparatus can be reduced. The content of the oxygen atom in the (B) polyfunctional oxetane compound is preferably 20% or more from the viewpoint of reducing damage to the device. The oxygen atom content is preferably, for example, 30% or less from the viewpoint that the dielectric constant of the sealing layer does not excessively increase. The oxygen atom content can be defined and measured in the same manner as described above.

The polyfunctional oxetane compound (B) is preferably a compound which is liquid at 25 ℃ and has a viscosity of preferably 1 to 500 mPas, more preferably 1 to 300 mPas, as measured at 25 ℃ and 20rpm with an E-type viscometer. When the viscosity of the polyfunctional oxetane compound (B) is in this range, the viscosity of the sealant is easily in the above range, and stable application by an ink jet method is easily performed.

In order to increase the oxygen atom content of the polyfunctional oxetane compound (B), for example, the number of oxetanyl groups in one molecule of the compound and the oxygen atom-containing group (for example, R in the formula (B-1) described later) are increased₂Polyoxyalkylene group represented by the formula R₂The oxygen atom contained in (1), and an oxygen atom-containing group such as a carbonyl group or a sulfonyl group) may be used.

(B) The polyfunctional oxetane compound is preferably a compound represented by the following formula (II-1) or formula (II-2).

[ solution 3]

R of the formulae (II-1) and (II-2)₁Each independently a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an allyl group, an aryl group, an aralkyl group, a furyl group or a thienyl group. R₂Are each a divalent organic residue. Wherein R is₁And R₂The compound represented by the formula (II-1) or (II-2) is selected so that the weight average molecular weight and the oxygen atom content satisfy the above ranges.

Examples of the alkyl group having 1 to 6 carbon atoms include: methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl. Examples of aryl groups include: phenyl, naphthyl, tolyl, xylyl. Examples of aralkyl groups include: benzyl, phenethyl.

Examples of divalent organic residues include: alkylene, polyoxyalkylene, phenylene, xylylene, and a structure represented by the following formula.

[ solution 4]

In the formula₃Is an oxygen atom, a sulfur atom, -CH₂-、-NH-、-SO-、-SO₂-、-C(CF₃)₂-or-C (CH)₃)₂-。

R₄Is an alkylene group or arylene group having 1 to 6 carbon atoms. Examples of alkylene groups include: an alkylene group having 1 to 15 carbon atoms such as a methylene group, an ethylene group, a propylene group, a butylene group, and a cyclohexylene group. The polyoxyalkylene group is preferably a polyoxyalkylene group having 4 to 30 carbon atoms, preferably 4 to 8 carbon atoms, and examples thereof include a polyoxyethylene group and a polyoxypropylene group.

Examples of the compound represented by the general formula (II-2) include 3-ethyl-3 { [ (3-ethyloxetan-3-yl) methoxy ] methyl } OXETANE and the like, and examples of commercially available products thereof include ARON OXETANE OXT-221 (manufactured by east Asia synthetic Co., Ltd.) and the like.

The amount of the (B) polyfunctional oxetane compound is preferably 20 to 80% by mass relative to the total mass of the sealant. When the content of the polyfunctional oxetane compound (B) is 20% by mass or more, the viscosity of the sealant can be easily sufficiently reduced and curability can be easily improved, and when the content is 80% by mass or less, the curability can be easily prevented from being reduced by excessively decreasing the component (a) or the component (C). From the above viewpoint, the content of the (B) polyfunctional oxetane compound is more preferably 25 to 80% by mass, and still more preferably 30 to 70% by mass, based on the total mass of the sealant.

(C) monofunctional glycidyl Ether

The sealant further comprises (C) a monofunctional glycidyl ether. (C) The monofunctional glycidyl ether is a compound containing only one glycidyl ether group, and the group bonded to the glycidyl ether group may be any of aliphatic, alicyclic, and aromatic. (C) Since the monofunctional glycidyl ether has a bulky structure, when the monofunctional glycidyl ether is contained in a sealant, the swelling ratio of the rubber material to the sealant is reduced. Further, since the monofunctional glycidyl ether (C) is a compound having a low oxygen content, when the monofunctional glycidyl ether (C) is contained in the sealant, the dielectric constant of a cured product of the sealant is lowered.

(C) Examples of monofunctional glycidyl ethers include: methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, n-butyl glycidyl ether, octyl glycidyl ether, 2-ethylhexyl glycidyl ether, decyl glycidyl ether, dodecyl glycidyl ether, stearyl glycidyl ether, ethoxybutyl glycidyl ether, 1-allyloxy-2, 3-epoxypropane, 1- (1',1' -dimethylpropynyloxy) -2, 3-epoxypropane, phenyl glycidyl ether, cresol glycidyl ether, butylphenyl glycidyl ether, naphthyl glycidyl ether, phenylphenol glycidyl ether, benzyl alcohol glycidyl ether, and the like.

The monofunctional glycidyl ether (C) is preferably a glycidyl ether in which a glycidyl ether group is bonded to an aromatic group, and more preferably a phenyl glycidyl ether derivative in which the aromatic group is a phenyl group. Examples of phenyl glycidyl ether derivatives include: phenyl glycidyl ether, o-cresol glycidyl ether, m-p-cresol glycidyl ether, butylphenyl glycidyl ether, t-butylphenyl glycidyl ether, phenylphenol glycidyl ether, and the like. The phenyl glycidyl ether derivative has a bulky structure in the monofunctional glycidyl ether, and therefore easily exhibits an effect of reducing the swelling ratio.

Further, as for the (C) monofunctional glycidyl ether, it is preferable that the swelling ratio a of the ethylene-propylene-diene rubber, which is expressed by the weight change rate before and after immersion of the EPDM test piece in the (C) monofunctional glycidyl ether, and which is generated when the EPDM test piece is immersed in the (C) monofunctional glycidyl ether at 25 ℃ for one week, is 5% or less. By using the monofunctional glycidyl ether (C), the swelling ratio of the rubber material such as EPDM rubber or the adhesive used in the ink jet head portion to the sealant can be reduced. The swelling ratio A can be measured by the method described later.

(C) The monofunctional glycidyl ether preferably has a viscosity of 35 mPas or less as measured with an E-type viscometer at 25 ℃ and 20 rpm. When the viscosity of the monofunctional glycidyl ether (C) is in this range, the viscosity of the sealant is likely to fall within the range described below, and stable application by an ink jet method is likely to be performed. (C) The viscosity of the monofunctional glycidyl ether is more preferably 3 to 30 mPas, and still more preferably 5 to 25 mPas. When the viscosity of the sealant is 3mPa · s or more, the curability of the sealant is improved, and the dielectric constant of the cured product is easily lowered.

The amount of the (C) monofunctional glycidyl ether is preferably 5 to 50% by mass based on the total mass of the sealant. When the amount of the monofunctional glycidyl ether (C) is 5% by mass or more, the swelling ratio of the adhesive or rubber material used in the head portion of the ink jet device to the sealing agent tends to be low. On the other hand, when the amount is 50% by mass or less, the dielectric constant of the cured product tends to be low. The content of the monofunctional glycidyl ether (C) is more preferably 10 to 40% by mass, and still more preferably 15 to 30% by mass, based on the total mass of the sealant.

Cationic polymerization initiator (D)

The sealant may further comprise (D) a cationic polymerization initiator. (D) The cationic polymerization initiator may be a photo cationic polymerization initiator which generates an acid capable of initiating cationic polymerization by irradiation with light such as ultraviolet rays, or may be a thermal cationic polymerization initiator which generates an acid by heating. The sealant may contain only the photo cation polymerization initiator, only the thermal cation polymerization initiator, or both of them. The sealant may contain only one kind (D) of the cationic polymerization initiator, or two or more kinds thereof. Among them, it is preferable to reduce damage to the element by heating, that is, to cure the sealant by light, and it is preferable to include one or more than one kind of photo cation polymerization initiator.

Examples of the photo cation polymerization initiator include: anion part is BF₄ ^-、(R_f)_nPF_6-n(R_fIs an organic group, n is an integer of 1 to 5), PF₆ ^-、SbF₆ ^-Or BX₄ ^-An aromatic sulfonium salt, an aromatic iodonium salt, an aromatic diazonium salt, an aromatic ammonium salt, and the like of (X is a phenyl group substituted with at least two or more fluorine groups or trifluoromethyl groups).

Examples of aromatic sulfonium salts include: bis [4- (diphenylsulfonium) phenyl ] sulfide bishexafluorophosphate, bis [4- (diphenylsulfonium) phenyl ] sulfide bishexafluoroantimonate, bis [4- (diphenylsulfonium) phenyl ] sulfide bistetrafluoroborate, bis [4- (diphenylsulfonium) phenyl ] sulfide tetrakis (pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl-4- (phenylthio) phenylsulfonium tetrafluoroborate, and the like.

Examples of the aromatic iodonium salt include: an iodonium hexafluorophosphate, an iodonium hexafluoroantimonate, an iodonium tetrafluoroborate, an iodonium tetrakis (pentafluorophenyl) borate, a bis (dodecylphenyl) iodonium hexafluorophosphate, a bis (dodecylphenyl) iodonium hexafluoroantimonate, a bis (dodecylphenyl) iodonium tetrafluoroborate, a bis (dodecylphenyl) iodonium tetrakis (pentafluorophenyl) borate, or the like.

Examples of aromatic diazonium salts include: phenyl diazonium hexafluorophosphate, phenyl diazonium hexafluoroantimonate, phenyl diazonium tetrafluoroborate, phenyl diazonium tetrakis (pentafluorophenyl) borate, etc.

Examples of aromatic ammonium salts include: 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, and the like.

Examples of commercial products of the photo cation polymerization initiator include: gazette (Irgacure)250, gazette (Irgacure)270, gazette (Irgacure)290 (manufactured by BASF corporation), CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, CPI-400PG (manufactured by San-Apro corporation), SP-150, SP-170, SP-171, SP-056, SP-066, SP-130, SP-140, SP-601, SP-606, SP-701 (manufactured by ADEKA corporation). Among them, sulfonium salts such as Irgacure 270, Irgacure 290, CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, CPI-400PG, SP-150, SP-170, SP-171, SP-056, SP-066, SP-601, SP-606, and SP-701 are preferable.

The amount of the (D) cationic polymerization initiator is preferably 0.1 to 10% by mass based on the mass of the entire sealant. When the amount of the cationic polymerization initiator (D) is 0.1% by mass or more, curability of the sealant is easily improved, and when the amount is 10% by mass or less, coloring of a cured product of the sealant is easily suppressed. The amount of the (D) cationic polymerization initiator is more preferably 0.1 to 5% by mass, and still more preferably 0.1 to 3% by mass, based on the mass of the entire sealant.

Other components (E)

The sealant of the present invention may further contain other components than those described above within a range not impairing the effects of the present invention. Examples of the other components include aromatic epoxy compounds, sensitizers, silane coupling agents, leveling agents, and the like.

Examples of the aromatic epoxy compound include: glycidyl ethers of aromatic ring-containing alcohols (including polyols). Examples of the aromatic epoxy compound include: bisphenol a type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol O type epoxy resin, 2' -diallylbisphenol a type epoxy resin, propylene oxide adduct bisphenol a type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, thioether type epoxy resin, diphenyl ether type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, O-cresol novolac type epoxy resin, biphenyl novolac type epoxy resin, naphthol novolac type epoxy resin, and the like. The sealant may contain only one aromatic epoxy compound, or may contain two or more kinds.

The oxygen atom content and the weight average molecular weight of the aromatic epoxy compound are not particularly limited, and the oxygen atom content represented by the above formula (1) is preferably 10% or more and 30% or less, and the weight average molecular weight is preferably 100 or more, from the viewpoint of volatility of the compound and reduction in the dielectric constant of a cured product of the sealant.

Among them, when the sealant contains a large amount of, for example, bisphenol a type epoxy resin or bisphenol F type epoxy resin, the viscosity tends to be high. Further, if the sealant contains a large amount of the aromatic epoxy resin, the cured product of the sealant is easily colored. Therefore, the content of the aromatic epoxy resin is preferably adjusted to such an extent that the influence on the viscosity of the sealant and the coloring of the cured product is small.

The sensitizer has a function of further improving the polymerization initiation efficiency of the above (D) cationic polymerization initiator and further promoting the curing reaction of the sealant. Examples of sensitizers include: thioxanthone compounds such as 2, 4-diethylthioxanthone, 2-dimethoxy-1, 2-diphenylethan-1-one, benzophenone, 2, 4-dichlorobenzophenone, methyl o-benzoylbenzoate, 4 '-bis (dimethylamino) benzophenone, 4-benzoyl-4' -methyldiphenyl sulfide, 9, 10-dibutoxyanthracene, and the like. The sealant may contain only one sensitizer, or may contain two or more sensitizers.

The silane coupling agent improves the adhesion between the sealing agent and the object to be sealed. The silane coupling agent may be a silane compound having a reactive group such as an epoxy group, a carboxyl group, a methacryloyl group, and an isocyanate group. Examples of such silane compounds include: trimethoxysilylbenzoic acid, gamma-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, gamma-isocyanatopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, etc. The sealant may contain only one kind of silane coupling agent, or may contain two or more kinds.

The leveling agent improves the flatness of the coating film of the sealant. Examples of the leveling agent include silicone-based, acrylic-based, and fluorine-based leveling agents. Examples of commercial products of leveling agents include: BYK-340, BYK-345 (both manufactured by BYK Chemie Japan), Shafulon (Surflon) S-611 (manufactured by AGC Seimi Chemical Co., Ltd.), and the like. The sealant may contain only one leveling agent, or may contain two or more.

From the viewpoint of suppressing volatilization of the sealing agent and reducing damage to the device, the total amount of the (E) other components is preferably 20 mass% or less, more preferably 10 mass% or less, relative to the total mass of the sealing agent.

Physical Properties of the sealant

(viscosity)

The viscosity of the sealant measured at 25 ℃ and 20rpm with an E-type viscometer is preferably 8 to 40 mPas, more preferably 10 to 30 mPas, still more preferably 11 to 28 mPas, and most preferably 11 to 25 mPas. If the viscosity of the sealing agent is in the above range, the sealing agent can be easily ejected from the ink jet apparatus. Further, the cured product (sealing layer) can be easily formed to a desired thickness without excessive wet spreading after coating.

(swelling ratio of EPDM B)

The swelling ratio of the ethylene-propylene-diene rubber (EPDM) to the sealant (hereinafter also referred to as EPDM swelling ratio B) is preferably 10.0% or less, more preferably 9.5% or less, and still more preferably 9.0% or less. When the EPDM swelling ratio B is within the above range, damage to the parts including EPDM, such as the head, can be suppressed even when the inkjet device is used for a long period of time to apply the sealing agent.

The EPDM swelling ratio was measured by the following method.

A weight of 0.56g (W) was prepared₁) Ethylene-propylene-diene rubber (EPDM; the test piece "faucet gasket 9074" manufactured by Kakudai corporation) was put into a 20mL brown screw tube while maintaining this state, and 10g of a sealing agent was added thereto to impregnate the EPDM test piece. The screw tube was covered and then left at 40 ℃ for one week. Thereafter, the EPDM test piece was taken out from the sealant, washed with isopropyl alcohol (IPA), wiped with a rag on the surface, and then measured for weight (W)₂). The EPDM swelling ratio B was calculated from the weight change of the EPDM test piece after the sheet was immersed in the sealant based on the following formula.

EPDM swell ratio B ═ W₂-W₁)/W₁×100

(dielectric constant)

UV-LED with the wavelength of 395nm is utilized to illuminate at 1000mW/cm²And a cumulative light amount of 1500mJ/cm²The sealant was cured and further heat cured at 100 ℃ for 30 minutesThe dielectric constant of the cured product obtained by the curing at 100kHz is 3.10 or less, preferably 3.00 or less, more preferably 2.90 or less, and still more preferably 2.80 or less. When the dielectric constant of the cured product is 3.10 or less, the cured product has sufficiently high insulation properties when sealing, for example, a display element with the cured product (sealing layer), and interference between the display element and another member (for example, a sensor or the like) can be suppressed. The dielectric constant can be measured by an LCR meter HP4284A (manufactured by Agilent Technologies) using an auto-balanced bridge method.

The dielectric constant of the cured product of the sealant can be adjusted by the oxygen content of the entire sealant. The oxygen content is preferably 30% or less, more preferably 25% or less, and still more preferably 20% or less. The oxygen atom content of the entire sealant can be calculated as (total mass of oxygen atoms contained in the sealant/total mass of the sealant) × 100 (%). The total mass of oxygen atoms contained in the sealant can be calculated as follows: the atomic weight of oxygen atoms was multiplied by the content ratio of oxygen atoms calculated by elemental analysis.

(light transmittance)

Regarding the light transmittance at a thickness of 10 μm of a cured product of the sealant, the average value of the light transmittance at a wavelength of 380nm to 800nm is preferably 85% or more, and more preferably 90% or more. When the light transmittance of the cured product of the sealing agent is in the above range, the sealing agent has good light transmittance, and thus is suitable as a surface sealing agent for an organic EL device, for example. The average light transmittance can be measured, for example, as an average value of light transmittances measured for every 1nm of wavelength in a range of 380nm to 800nm using an ultraviolet-visible spectrophotometer (manufactured by SHIMADZU corporation).

Preparation of sealants

The sealing agent can be obtained by mixing the above components and mixing them with a mixer such as a homomixer, a universal mixer, a planetary mixer, a kneader, or a three-roll mixer. From the viewpoint of stable mixing of the sealing agent, it is more preferable to mix the cationic polymerization initiator (D) after mixing the components other than the cationic polymerization initiator (D).

Use of sealants

The sealing agent is suitable for sealing various elements such as organic EL elements, LED elements, semiconductor elements, and solar cell elements. The application is not limited to surface sealing of elements, and for example, the sealant may be used as a liquid crystal sealant for a liquid crystal display device. In addition, since it is excellent in light transmittance, it is particularly suitable as a surface sealing agent for a display element.

2. Method for manufacturing various devices

Hereinafter, a method for manufacturing various devices in which various elements are surface-sealed using the above-described sealing agent will be described. However, the method for manufacturing a device using the sealant is not limited to this method. The method for manufacturing the various devices may include 1) a step of preparing an element, and 2) a step of applying the sealing agent to the element and sealing the element, and may include other steps.

1) In the process, the element is prepared. The device is typically disposed on a substrate. The substrate may be a glass substrate or a resin substrate. In the case of obtaining a flexible display device, a resin substrate (resin film) is preferable.

The type of the element is not particularly limited, and may be a semiconductor element or the like, and is preferably an element that converts electricity into light or converts light into electricity. Examples of such elements include organic EL elements, LED elements, solar cell elements, and the like. Among them, the element is preferably an organic EL element. When the element is an organic EL element, the organic EL element generally includes a reflective pixel electrode layer, an organic EL layer, and a transparent counter electrode layer. The organic EL element may further include other functional layers as necessary.

2) In the step, the sealing agent is applied by an ink jet method so as to cover the element disposed on the substrate. By applying the sealing agent by an ink jet method, a coating film having high flatness and a small thickness can be formed at high speed.

Thereafter, the sealant applied to the element is cured to obtain a cured layer. The curing of the encapsulant is preferably photo-curing. When light-cured, canA known light source such as a xenon lamp or a carbon arc lamp is used. The irradiation dose is not particularly limited as long as it is sufficient to cure the sealant, and may be, for example, 300mJ/m²～3000mJ/m²The cumulative light quantity of (2) is irradiated with light having a wavelength of 300nm to 400 nm.

Further, by performing thermal curing after photocuring, the dielectric constant of the cured product can be further reduced. In the case of heat curing which is further performed after photocuring, the heating temperature is preferably about 50 to 120 ℃ and the heating time is preferably 1 minute to 1 hour, from the viewpoint of further improving curability without causing damage to the device.

The thickness of the cured layer (sealing layer) of the sealant is preferably 1 μm to 20 μm, and more preferably 3 μm to 10 μm, for example, as long as the element can be sufficiently sealed and a film with high flatness can be obtained.