阅读说明：本技术 地暖系统 (Floor heating system ) 是由 高峰 刘在祥 陈艳凤 蔡园丰 王兵 牛争艳 于 2020-08-05 设计创作，主要内容包括：本申请涉及一种能耗低、即开即热、采用全干法施工且不结水垢的低温地暖系统,其包括走热水的地暖管以及位于地暖管上方的多个地板块,每个地板块由金属蜂窝板、固定于金属蜂窝板上面板的面板、固定连接于金属蜂窝板侧边位置的地板扣构成,金属蜂窝板铺设在地暖管上方并与地暖管导热连接,多个地板块通过相互配合的所述地板扣相连接。(The utility model relates to an energy consumption is low, open promptly and heat, adopt full dry construction and do not knot low temperature underfloor heating system of incrustation scale, it is including walking hydrothermal ground heating coil and being located a plurality of floor blocks of ground heating coil top, every floor block is buckled by metal honeycomb panel, the panel that is fixed in metal honeycomb panel top surface board, fixed connection in the floor of metal honeycomb panel side position and constitutes, and metal honeycomb panel is laid in ground heating coil top and is connected with ground heating coil heat conduction, a plurality of floor blocks through mutually supporting the floor is buckled and is connected.)

1. The utility model provides a floor heating system, is including walking hydrothermal ground heating coil (1) and being located a plurality of floor blocks (2) of ground heating coil top, its characterized in that, every floor block (2) by metal honeycomb panel (201), be fixed in panel (202) of metal honeycomb panel upper plate face, fixed connection in the floor of metal honeycomb panel side position is buckled (203) and is constituted, metal honeycomb panel (201) are laid ground heating coil (1) top and with ground heating coil (1) heat conduction is connected, a plurality of floor blocks (2) are through mutually supporting ground buckle (203) are connected.

2. The floor heating system according to claim 1, characterized in that the metal cellular board (201) comprises:

an upper plate body (201a),

a lower plate body (201b) arranged in parallel below the upper plate body, and

a honeycomb core layer (201c) fixedly connected between the upper plate body and the lower plate body;

and a floor buckle embedding gap (201d) located around the honeycomb core layer (201c) is formed between the upper plate body (201a) and the lower plate body (201b), and the floor buckle (203) is embedded into the floor buckle embedding gap (201d) and is welded or adhered and fixed with the upper plate body (201a) or/and the lower plate body (201 b).

3. The floor heating system according to claim 2, characterized in that the upper plate body (201a) and the lower plate body (201b) are steel plates or aluminum plates, and the honeycomb core layer (201c) is a steel honeycomb or an aluminum honeycomb.

4. The floor heating system of claim 2, characterized in that each honeycomb hole of the honeycomb core layer (201c) is vertically arranged in a penetrating manner.

5. The floor heating system according to claim 1, characterized in that the floor heating system further comprises a heat insulation mat (3) laid on the ground (6), and the floor heating pipe (1) is laid on the heat insulation mat (3).

6. The floor heating system according to claim 5, characterized in that the insulation mat (3) is a foam.

7. The floor heating system as claimed in claim 5, characterized in that the upper surface of the heat insulation pad (3) is provided with a pipe groove (301) which is concave downwards, and the floor heating pipe (1) is embedded in the pipe groove (301).

8. The floor heating system according to claim 7, characterized in that the upper surface of the heat insulation pad (3) is covered with a heat conduction film (7), a part of the heat conduction film (7) is clamped between the outer pipe wall of the floor heating pipe (1) and the groove wall of the pipe groove (301), and the metal honeycomb plate (201) is arranged against the upper surface of the heat conduction film (7).

9. The floor heating system according to claim 7, characterized in that the floor heating pipe (1) is clamped with the heat conduction pipe clamp (4), the heat conduction pipe clamp (4) is provided with a heat conduction top surface at the notch position of the pipe groove (301), and the heat conduction top surface of the heat conduction pipe clamp (4) is vertically abutted to the lower surface of the lower plate body (201 b).

10. The floor heating system according to claim 9, characterized in that the heat-conducting top surface is provided with a glue groove (401) which is concave downwards, and heat-conducting glue (5) for bonding the lower plate body (201b) and the heat-conducting pipe clamp (4) is arranged in the glue groove (401).

Technical Field

The application relates to the field of floor heating.

Background

The Floor Heating is short for Floor radiation Heating, and is called radiation Floor Heating, the whole Floor is uniformly heated by using a heat medium in a Floor radiation layer as a radiator, and heat is supplied to the indoor space by using the Floor in a radiation and convection heat transfer mode, so that the purpose of comfortable Heating is achieved. The heat transfer medium is divided into water ground heating and electric ground heating according to different heat transfer media.

The water floor heating is a heating mode which heats water to a certain temperature, conveys the water to a water pipe heat dissipation network under the floor and realizes the heating purpose by heating the floor.

The electric floor heater is a semi-transparent polyester film which can generate heat after being electrified and is made by processing and hot-pressing conductive special printing ink and metal current carrying strips between insulating polyester films. When the heating device works, the carbon-based ink is used as a heating body, and heat is sent into a space in a radiation mode, so that a human body is warmed.

However, the traditional water floor heating system and the traditional electric floor heating system have the problems of slow heat transfer rate and long startup waiting time. Wherein the temperature of water underfloor heating system need keep 50 ~ 60 ℃ just can let the user experience warmly, but heat low-temperature water to 50 ~ 60 ℃ in cold weather and need consume a large amount of energy, and the heat loss rate of 50 ~ 60 ℃ high-temperature water is high in cold day moreover, leads to underfloor heating system's energy consumption to further increase. In addition, the water temperature in the ground heating pipe is kept at 50-60 ℃ for a long time, and scales are easy to form. The traditional electric floor heating system has the problems of low heat transfer rate and high energy consumption due to structural defects.

The floor heating system can be divided into a dry floor heating system and a wet floor heating system according to different paving structures.

The dry floor heating is also named as ultra-thin floor heating, because the installation mode of the dry floor heating does not need floor heating backfill compared with the installation mode of common floor heating, the dry floor heating is also named as dry floor heating, and because a backfill layer is not needed, the occupied layer height is reduced compared with the common floor heating, and the ultra-thin floor heating is also named as ultra-thin floor heating.

However, the conventional dry floor heating has a higher manufacturing cost than the wet floor heating, and cannot be installed under floor finishing materials such as floor tiles, marble, etc., because these materials must be fixed using cement when being laid. The dry floor heating is not provided with a pea stone backfill layer, the floor heating coil is easy to damage, the service life of the floor heating is reduced to a certain extent, and even later maintenance problems such as water leakage and the like are easy to occur.

The wet floor heating is the mature installation process of the water heating floor heating, and is widely applied to the electric heating floor heating. The wet floor heating is relatively low in price and is the leading technology of the domestic floor heating market. The wet type is to embed the floor heating pipeline with concrete and then lay ground materials such as ground, ceramic tiles and the like on the concrete layer. The layer of concrete not only plays a role in protecting and fixing the water heating pipeline, but also is a main channel for transferring heat. The concrete layer can enable heat to be uniformly distributed, and the condition of local overheating or overcooling is reduced.

However, in wet floor heating, sand and stone mixed soil layers must be poured, so that the average weight is heavy, and the bearing capacity of the wet floor heating is about 8 times that of a radiator mode. In the wet floor heating, heat preservation is firstly paved on a cement surface, then pipes are arranged, then cobble cement is used for pouring and leveling, and a ground decoration layer is added, so that the height is generally 8 centimeters. In addition, the construction cycle of wet-type ground heating is long, and the requirement for constructor's specialty is high, in case bury in the water pipe or the electric heat membrane of subsurface emergence damage, must demolish concrete filling layer, and is very complicated.

Disclosure of Invention

The technical problem that this application will solve is: aiming at the problems, the low-temperature floor heating system which is low in energy consumption, can be heated immediately after being opened, adopts full-dry construction and does not cause scale formation is provided.

The technical scheme of the application is as follows:

the utility model provides a floor heating system, is including walking hydrothermal ground heating coil and being located a plurality of floor blocks of ground heating coil top, every the floor block by metal honeycomb panel, be fixed in the panel of metal honeycomb panel top surface, fixed connection in the floor of metal honeycomb panel side position is detained and is constituted, metal honeycomb panel is laid ground heating coil top and with ground heating coil heat conduction is connected, a plurality of floor blocks are through mutually supporting the floor is detained and is connected.

On the basis of the technical scheme, the application also comprises the following preferable scheme:

the metal honeycomb panel includes:

the upper plate body is provided with a plurality of concave grooves,

a lower plate arranged in parallel below the upper plate, an

The honeycomb core layer is fixedly connected between the upper plate body and the lower plate body;

and a buckle mounting gap positioned around the honeycomb core layer is formed between the upper plate body and the lower plate body, and the floor buckle is embedded into the buckle mounting gap and is welded or bonded and fixed with the upper plate body or/and the lower plate body.

The upper plate body and the lower plate body are steel plates or aluminum plates, and the honeycomb core layer is a steel honeycomb or an aluminum honeycomb.

And each honeycomb hole of the honeycomb core layer is vertically communicated.

The floor heating system further comprises a heat insulation pad paved on the ground, and the floor heating pipes are paved on the heat insulation pad.

The heat insulation pad is made of foam plastic.

The upper surface of the heat insulation pad is provided with a pipe groove which is sunken downwards, and the ground heating pipe is embedded in the pipe groove.

The upper surface of the heat insulation pad is covered with a heat conduction film, a part of the heat conduction film is clamped between the outer pipe wall of the ground heating pipe and the groove wall of the pipe groove, and the metal honeycomb plate is arranged on the upper surface of the heat conduction film in an attached mode.

The ground heating coil is connected with the heat conduction pipe clamp in a clamped mode, the heat conduction pipe clamp is provided with a heat conduction top surface located at the position of a pipe groove notch, and the heat conduction top surface of the heat conduction pipe clamp is vertically abutted to the lower surface of the lower plate body.

The heat conducting top surface is provided with a glue groove which is sunken downwards, and heat conducting glue for bonding the lower plate body and the heat conducting pipe clamp is arranged in the glue groove.

The application can realize the following beneficial effects:

1. each floor block of the floor heating system is directly paved above the floor heating pipe, and the floor blocks are connected into a whole by means of floor buckles of the floor blocks, construction of pouring sand, stone and concrete is not needed, all-dry construction is achieved, installation efficiency is high, and the floor blocks can be easily dismantled and reused.

2. The metal honeycomb plate has excellent compression resistance and bending resistance, which are just suitable for the use environment of the floor blocks paved on the ground, and just meet the use requirements of the floor blocks. Based on this, can make the panel of upper strata thin to several millimeters, save timber and stone material especially the use amount of famous and precious timber and stone material greatly. Meanwhile, the heat conduction rate of the honeycomb plate made of the metal material is high, the heat of the ground heating pipe below can be quickly guided to the thin panel and then dissipated to the indoor through the thin panel, and the indoor temperature is quickly increased. So make this underfloor heating system open promptly and heat to the temperature in the ground heating coil need not to be higher, normal use only need maintain about 30 ℃ low temperature can, not only the energy consumption is extremely low, does not knot the incrustation scale moreover.

3. The metal honeycomb plate not only has excellent compression resistance and bending resistance, but also has the advantages of less material consumption, light weight, low cost, convenient price and transportation of a novel floor block formed by combining the metal honeycomb plate with the panel, and wide market prospect.

4. All honeycomb holes of the metal honeycomb plate honeycomb core layer are vertically arranged in a penetrating manner, so that the capability of bearing vertical load and vertical impact of the floor block is further improved, and the floor block is just matched with the application environment of the floor.

5. The floor heating system has the advantages that the heat insulation pad is laid between the ground and the floor heating pipes, the heat conduction path of the floor heating pipes is cut off by the heat insulation pad, most of heat is guaranteed to be upwards transmitted to the floor blocks, and the energy utilization rate of the floor heating system is improved.

6. The heat insulation pad is made of foam plastic, has certain flexibility, has protective performance on the floor heating pipe, and is light, environment-friendly and excellent in sound insulation performance.

7. The heat insulation pad adopts a foam plastic plate made of polystyrene resin material and also has better fireproof performance.

8. The upper surface of the heat insulation pad is provided with a plurality of pipe slots which are sunken downwards, and the floor heating pipes are embedded in the pipe slots, so that the problem that the floor heating pipes are unstable in position and easy to move is solved, and the floor heating pipes are prevented from being deformed and flattened due to compression

9. The joint has the heat conduction pipe clamp of heat conduction top surface on the ground heating coil, heat conduction pipe clamp, the heat conduction top surface of heat conduction pipe clamp and the vertical butt of the lower plate body of metal honeycomb panel to arrange heat conduction glue between the two, promoted the heat conduction efficiency of ground heating coil and metal honeycomb panel.

10. When the panel is the vulnerable structure such as marble or ceramic tile, under the support effect of the metal corrugated substrate below, the floor blocks are more convenient to transport and carry, and the moving damage rate of the marble and ceramic tile floor blocks is greatly reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting on the present application.

Fig. 1 is a schematic cross-sectional structure view of one floor board part of a floor heating system according to an embodiment of the application.

Fig. 2 is a schematic structural diagram of a metal honeycomb panel according to an embodiment of the present invention.

Fig. 3 is a schematic perspective view of a floor heating system according to an embodiment of the present application.

Fig. 4 is an exploded view of fig. 3 with the floor clip removed.

Fig. 5 is a schematic cross-sectional structure view of two adjacent floor board parts of the floor heating system in the embodiment of the application.

Fig. 6 is an exploded view of one of the floor panel portions of the geothermal system of the embodiment of the present application.

Fig. 7 is a schematic cross-sectional structure view of one floor part of the three-floor heating system in the embodiment of the application.

Fig. 8 is a schematic perspective view of a four-metal honeycomb panel according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of an upper plate body of a four-metal honeycomb plate according to an embodiment of the present application in a separated state.

Fig. 10 is an enlarged view of the X1 portion of fig. 9.

Fig. 11 is a schematic structural view of a lower plate of a four-metal honeycomb panel according to an embodiment of the present invention in a separated state.

Fig. 12 is an enlarged view of the X2 portion of fig. 11.

Fig. 13 is a schematic structural diagram of an upper plate body of a metal honeycomb panel according to an embodiment of the present invention in a separated state.

Fig. 14 is a schematic structural view of the lower plate of the metal honeycomb panel according to the embodiment of the present invention in a separated state.

Wherein: 1-a ground heating pipe, 2-a floor block, 3-a heat insulation pad, 4-a heat conduction pipe clamp, 5-heat conduction glue, 6-ground and 7-a heat conduction film;

201-metal honeycomb plate, 202-panel, 203-floor buckle, 201 a-upper plate, 201 b-lower plate, 201 c-honeycomb core layer, 201 d-floor buckle embedding gap, 203 a-male buckle, 203 b-female buckle, 301-pipe groove, 401-rubber groove;

201c 1-sheet metal, 201c 2-punch protrusion, 201c1 a-upper surface of sheet metal, 201c2 a-lower surface of punch protrusion, 201c 21-cylindrical groove, 201c 22-cylindrical groove, 201c 23-inner hole of cylindrical punch protrusion, 201c21 a-top groove wall of cylindrical groove, 201c22 a-bottom groove wall of cylindrical groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings of the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the application without any inventive step, are within the scope of protection of the application.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of the present application do not denote a limitation of quantity, but rather denote the presence of at least one.

In the description of the present specification and claims, the terms "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the referred device or unit must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

Embodiments of the present application will now be described with reference to the accompanying drawings.