阅读说明：本技术 光学收发组件及光纤缆线模块 (Optical transceiver module and optical fiber cable module ) 是由 黄云晟 张骏扬 李文贤 吕政鸿 陈珉儒 吴昌成 于 2019-03-18 设计创作，主要内容包括：本发明提供一种光学收发组件及光纤缆线模块。光学收发组件包括基板、光接收次组件及多个光发射次组件。光接收次组件是设置于基板上,多个光发射次组件连接于所述基板,其中所述多个光发射次组件是交错设置。光纤缆线模块包括光学收发组件及光纤缆线。本发明可实现光学模块的小型化。(The invention provides an optical transceiver module and an optical fiber cable module. The optical transceiver module comprises a substrate, a light receiving subassembly and a plurality of light emitting subassemblies. The light receiving subassemblies are arranged on the substrate, and the plurality of light emitting subassemblies are connected to the substrate, wherein the plurality of light emitting subassemblies are arranged in a staggered manner. The optical fiber cable module comprises an optical transceiver component and an optical fiber cable. The invention can realize miniaturization of the optical module.)

1. An optical transceiver module, comprising:

a housing;

a substrate disposed within the housing;

a light receiving sub-assembly disposed on the substrate;

the light emitting subassemblies are connected to the substrate, wherein the light emitting subassemblies are arranged in a staggered mode, and an included angle between 90 degrees and 180 degrees is formed between the light emitting directions of the light emitting subassemblies.

2. The optical transceiver module of claim 1, wherein: the light emission subassemblies are respectively positioned on the upper side and the lower side of the substrate and are arranged in a staggered manner.

3. The optical transceiver module of claim 1, wherein: the light emission subassemblies are respectively positioned on the same side of the substrate and are arranged in a staggered manner.

4. The optical transceiver module of claim 1, wherein: the plurality of light emission subassemblies are more than two light emission subassemblies and are arranged in a staggered way.

5. The optical transceiver module of claim 1, wherein: the light emitting subassembly is connected to the base plate through the connecting plate.

6. The optical transceiver module of claim 5, wherein: the connecting plate includes first connecting plate and second connecting plate.

7. The optical transceiver module of claim 6, wherein: one end of the first connecting plate is connected to the first surface of the substrate, and one end of the second connecting plate is connected to the second surface of the substrate.

8. The optical transceiver module of claim 6, wherein: the first connecting plate and the second connecting plate have different lengths.

9. The optical transceiver module of claim 5, wherein: the base plate comprises at least one convex part and at least one concave part, the concave part is formed on at least one side of the convex part, and the light emission subassembly is arranged in the concave part of the base plate.

10. A fiber optic cable module, comprising: the method comprises the following steps:

a fiber optic cable;

an optical transceiver component; the optical transceiver component comprises:

a housing;

a substrate disposed within the housing;

a light receiving sub-assembly disposed on the substrate;

the light emitting subassemblies are connected to the substrate, wherein the light emitting subassemblies are arranged in a staggered mode, and an included angle between 90 degrees and 180 degrees is formed between the light emitting directions of the light emitting subassemblies.

Technical Field

The present invention relates to the field of optical fiber communication technologies, and in particular, to an optical transceiver module and an optical fiber cable module.

Background

In the application of optical fiber communication technology, it is necessary to convert an electrical signal into an optical signal through an optical sub-assembly (such as a laser), and then couple the optical signal into an optical fiber conducting the optical signal.

Currently, the demand for computing devices continues to rise, and even the demand for computing devices to achieve higher performance is increasing. However, conventional electrical I/O (input/output) signaling is not expected to keep pace with the need for increased performance, particularly with the expectation of future high performance computations. Today, I/O signals are electrically routed from processor to processor and out to peripheral devices via circuit boards. Electrical signals must pass through solder joints, cables, and other electrical conductors. Thus, the electrical I/O signal rate is limited by the electrical characteristics of the electrical connector.

Conventional telecommunication transmission systems are gradually being replaced by optical fiber transmission systems. Since the optical fiber transmission system has advantages of high speed transmission, long transmission distance, and no electromagnetic wave interference, the optical fiber transmission system is not limited by bandwidth, and therefore, the electronic industry is currently developing in the direction of optical fiber transmission.

However, in recent years, further miniaturization of optical modules such as optical transceivers is required, and therefore, it is necessary to optimize the structure of an optical fiber transmission system.

Disclosure of Invention

In order to solve the existing problems, the invention provides an optical transceiver module to reduce the complexity of the optical transceiver module and to miniaturize the size of the optical transceiver module.

To achieve the above object, the present invention provides an optical transceiver module, comprising:

a housing;

a substrate disposed within the housing;

a light receiving sub-assembly disposed on the substrate;

the light emitting subassemblies are connected to the substrate, wherein the light emitting subassemblies are arranged in a staggered mode, and an included angle is formed between the light emitting directions of the light emitting subassemblies and ranges from 90 degrees to 180 degrees.

Optionally, the substrate may include at least one protrusion protruding from the substrate and at least one recess formed on at least one side of the protrusion. The circuit or the IC chip may be formed on the convex surface of the substrate to increase the layout area of the circuit.

Optionally, the optical transceiver module further comprises a connection plate, through which the tosa is allowed to be disposed in the recess of the substrate and connected to the substrate.

Alternatively, the substrate may have a plurality of protrusion shapes, and the plurality of concave portions may be respectively located at opposite sides of the protrusion.

Optionally, the plurality of recesses may have different lengths or depths.

Optionally, the substrate may have at least one L-shape, in which case at least one recess may be located on at least one side of the protrusion.

Alternatively, the substrate may have at least one stepped shape, and a plurality of concave portions may be located at least one side of the convex portion.

Optionally, the first surface and the second surface of the substrate opposite to each other may be provided with different circuits for providing circuits, chips or components with different functions.

Alternatively, the light emission subassemblies may be connected to the base plate by a connecting plate.

Optionally, the connecting board may include a Flexible Printed Circuit (FPC) board for transmitting signals between the substrate and the light emitting sub-assembly.

Optionally, the connecting plate may include a first connecting plate and a second connecting plate.

Alternatively, one end of the first connecting plate may be connected to the first surface of the base plate, and one end of the second connecting plate may be connected to the second surface of the base plate.

Alternatively, the first and second connecting plates may have different lengths.

Optionally, one end of the connecting plate may have a bent structure and be connected to the light emission sub-assembly.

Optionally, the plurality of light emission subassemblies can be respectively positioned on the upper side and the lower side of the substrate and are arranged in a staggered manner.

Optionally, the plurality of light emission subassemblies can be respectively located on the same side of the substrate and staggered.

Optionally, the plurality of light emission subassemblies are more than two light emission subassemblies and are arranged in a staggered manner.

Optionally, an inclination angle may be formed between the light emission subassembly and the substrate, and the inclination angle between the light emission subassembly and the substrate may be smaller than 90 degrees, for example, 30 degrees, 60 degrees or 45 degrees.

Optionally, each of the tosas may further include a temperature control unit.

Optionally, the position and arrangement of the tosa in the optical transceiver module may be fixed by a fixer.

Alternatively, the retainer may be integrally formed on the housing.

Optionally, the holder may include a first holder and a second holder for holding the plurality of light emission subassemblies and allowing the light emission subassemblies to form a staggered arrangement.

Alternatively, the first holder may be provided on the upper case, for example, and the second holder may be provided on the lower case, for example.

Optionally, the fixing device may include at least one fixing groove, and the shape of the fixing groove corresponds to the shape of the light emission subassembly, and is used for accommodating and clamping the light emission subassembly to fix the light emission subassembly.

Alternatively, the shape of the groove of the fixing groove may also be formed corresponding to the inclination angle of the light emission subassembly, so that the light emission subassembly is obliquely fixed.

Optionally, the light-receiving subassemblies may also be staggered, and an included angle between the light-receiving directions of the light-emitting subassemblies is between 90 degrees and 180 degrees.

Optionally, an inclination angle may be formed between the light-receiving sub-assembly and the substrate, and the inclination angle between the light-receiving sub-assembly and the substrate may be smaller than 90 degrees, for example, between 0 degree and 90 degrees, such as 1 degree, 5 degrees, 30 degrees, 60 degrees, or 45 degrees.

The present invention also provides a fiber optic cable module, comprising:

a fiber optic cable;

an optical transceiver component; the optical transceiver component comprises:

a housing;

a substrate disposed within the housing;

a light receiving sub-assembly disposed on the substrate;

the light emitting subassemblies are connected to the substrate, wherein the light emitting subassemblies are arranged in a staggered mode, and an included angle is formed between the light emitting directions of the light emitting subassemblies and ranges from 90 degrees to 180 degrees.

The invention provides an optical transceiver module, which realizes the miniaturization and compactness (compact design) of the optical transceiver module, effectively utilizes the internal space of the optical transceiver module, and has simple structure and easy manufacture.

Drawings

FIG. 1 is a block diagram of one embodiment of a system using fiber optic cable modules of the present invention;

fig. 2 to 4 are schematic views of an optical transceiver module according to an embodiment of the present invention;

FIGS. 5A-9 are schematic views of different embodiments of a substrate according to the present invention;

FIGS. 10-11 are schematic views of different embodiments of the tosa and the substrate of the present invention;

FIG. 12 is a schematic view of an exemplary embodiment of a tosa of the present invention;

FIG. 13 is a schematic view of an exemplary embodiment of a tosa of the present invention;

FIG. 14 is a schematic diagram of an optical transceiver module according to an embodiment of the present invention

Fig. 15 to 17 are schematic views of different embodiments of the substrate of the present invention.

Detailed Description

The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc. refer to directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.

The drawings and description are to be regarded as illustrative in nature, and not as restrictive. In the drawings, elements having similar structures are denoted by the same reference numerals. In addition, the size and thickness of each component shown in the drawings are arbitrarily illustrated for understanding and ease of description, but the present invention is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. In the drawings, the thickness of some layers and regions are exaggerated for understanding and convenience of description. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present.

In addition, in the description, unless explicitly described to the contrary, the word "comprising" will be understood to mean including the stated elements, but not excluding any other elements. Further, in the specification, "on.

Referring to fig. 1, the present embodiment provides an optical fiber cable module 100, and fig. 1 is a flowchart illustrating a process for using the optical fiber cable module 100, where the optical fiber cable module 100 includes an optical transceiver module 110, an optical fiber cable 130 and an electronic device 101. The electronic device 101 may be any of a number of computing or display devices including, but not limited to, a data center, a desktop or laptop computer, a notebook computer, an ultra-thin notebook, a tablet computer, a notebook, or other computing device. In addition to computing devices, it is understood that many other types of such electronic devices 101 may include one or more of the optical transceiver components 110 and/or the matching port 102 described in this disclosure, and that the embodiments described in this disclosure are equally applicable to such electronic devices. Examples of such other electronic devices 101 may include electric vehicles, hand-held devices, smart phones, media devices, Personal Digital Assistants (PDAs), portable personal computers, mobile phones, multimedia devices, memory devices, cameras, voice recorders, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic billboards, projectors, entertainment control units, portable music players, digital cameras, web devices, gaming apparatuses, game consoles, or any other electronic device 101 that may include the optical transceiver component 110 and/or the matching port 102. In other embodiments, the electronic device 101 may be any other electronic device that processes data or images.

As shown in fig. 1, the optical fiber cable 130 is connected to the optical transceiver module 110 for transmitting optical signals. The fiber optic cable 130 may include at least one or more optical fiber cores for allowing optical signals to be transmitted within the optical fiber cores.

Referring to FIG. 1, the electronic device 101 may include a processor 103, which may represent any type of processing element for processing electrical and/or optical I/O signals. It will be appreciated that the processor 103 may be a single processing device, or a plurality of separate devices. The processor 103 may include or be a microprocessor, a programmable logic device or array, a microcontroller, a signal processor, or some combination.

Referring to fig. 1, the matching port 102 of the electronic device 101 can be used as an interface to connect to the optical transceiver component 110. The optical transceiver component 110 may allow another peripheral device 105 to be interconnected with the electronic device 101. The optical transceiver component 110 of the present embodiment can support communication via an optical interface. In various embodiments, the optical transceiver component 110 may also support communication over an electrical interface.

Referring to FIG. 1, the peripheral device 105 may be a peripheral I/O device. In various embodiments, the peripheral device 105 may be any of a variety of computing devices including, but not limited to, a desktop or laptop computer, a notebook computer, an ultra-thin notebook, a tablet computer, a notebook, or other computing device. In addition to computing devices, it is understood that the peripheral device 105 may include an electric vehicle, a handheld device, a smart phone, a media device, a Personal Digital Assistant (PDA), a portable personal computer, a mobile phone, a multimedia device, a memory device, a camera, a sound recorder, an I/O device, a server, a set-top box, a printer, a scanner, a monitor, a television, an electronic billboard, a projector, an entertainment control unit, a portable music player, a digital camera, a web device, a game apparatus, a game console, or other electronic devices.

Referring to fig. 1, in one embodiment, the electronic device 101 may also include an internal optical path. The optical path may represent one or more components, which may include processing and/or terminating components that convey an optical signal between the processor 103 and the matching port 102. Transmitting a signal may include generating and converting to optical, or receiving and converting to electrical. In one embodiment, the device may also include an electrical path. Electrical paths represent one or more components that carry an electrical signal between the processor 103 and the mating port 102.

Referring to fig. 1, the optical transceiver component 110 can be used to correspondingly mate with the matching port 102 of the electronic device 101. In this embodiment, mating a connector plug with another may be used to provide a mechanical connection. Mating a connector plug with another typically also provides a communication connection. The mating port 102 may include a housing 104 that may provide the mechanical connection mechanism. The mating port 102 may include one or more optical interface components. Path 106 may represent one or more components that may include processing and/or termination components for passing optical signals (or optical and electrical signals) between the processor 103 and the matching port 102. Transmitting signals may include generating and converting to optical signals, or receiving and converting to electrical signals.

Referring to fig. 1, the optical transceiver component 110 of the present invention can be referred to as an optical connector or an optical connector. Generally, such an optical connector may be used to provide a physical connection interface with a mating connector and an optical component. The optical transceiver component 110 may be an optical engine for generating optical signals and/or receiving and processing optical signals. The optical transceiver component 110 may provide conversion from electrical-to-optical signals or from optical-to-electrical signals.

In some embodiments, the optical transceiver component 110 may be configured to process the optical signals in accordance with or according to one or more communication protocols. For embodiments in which the optical transceiver component 110 is used to transmit an optical signal and an electrical signal, the optical interface and the electrical interface may be according to the same protocol, but this is not absolutely necessary. Regardless of whether the optical transceiver component 110 processes signals according to the protocol of the electrical I/O interface, or according to a different protocol or standard, the optical transceiver component 110 may be configured or programmed within a particular module for a desired (integrated) protocol, and different transceiver modules or optical engines may be configured for different protocols.

Please refer to fig. 2-4, which are schematic diagrams illustrating an optical transceiver module according to an embodiment of the present invention. The optical transceiver module 110 of the present embodiment may include a substrate 111, a processor 112, a transmitter subassembly 113, a receiver subassembly 114, a connector 115, a housing 116, a connecting plate 117, and a holder 118. The substrate 111 may have a first surface 111a and a second surface 111b opposite to each other, and the substrate 111 may be a Printed Circuit Board (PCB) or a ceramic substrate, for example, and may include pins or connection balls for interfacing to an external device, for example. The processor 112 is connected to the substrate 111, and the processor 112 may be any type of processor die or optical IC, and is not limited to any particular processor type. The transmitter subassembly 113 and the receiver subassembly 114 are connected to the processor 112 on the substrate 111 for transmitting and receiving optical signals, respectively. The rosa 113 and rosa 114 may include transmit circuitry and receive circuitry for transmitting electrical signals, and more particularly, for processing timing or other protocol aspects of the electrical signals corresponding to the optical signals. The housing 116 may have an inner space for accommodating the substrate 111, the processor 112, the transmitter subassembly 113, the receiver subassembly 114, the connector 115, the connecting plate 117 and the holder 118. The connection board 117 is connected between the substrate 111 and the tosa 113, and the holder 118 is used to position and fix the position of the tosa 113 so as to maintain the performance loss and reliability of the joint between the fiber channel and the tosa.

Referring to fig. 4 to 9, the substrate 111 is disposed in the housing 116, the substrate 111 may include at least one protrusion 111c and at least one recess 111d, the protrusion 111c protrudes from the substrate 111, and the recess 111d is formed on at least one side of the protrusion 111 c. Wherein, the tosa 113 can be accommodated in the recess 111 d. That is, the light emitting sub-assembly 113 may be disposed on at least one side of the protrusion 111 c. It is noted that a circuit or an IC chip may also be formed on the surface of the protrusion 111c of the substrate 111 to increase the area of the circuit.

In various embodiments, as shown in fig. 5A to 7, the substrate 111 may have one or more convex shapes, and in this case, the plurality of concave portions 111d may be respectively located at opposite sides of the convex portion 111 c. As shown in fig. 7, the plurality of concave portions 111d may have different lengths or depths. Thus, different sizes of the light emitting sub-assemblies 113 can be accommodated according to the requirement. Furthermore, the raised shape of the substrate 111 can isolate different circuits (e.g., flexible circuit boards connected to the rosa 113) from interfering with each other due to spatial overlap.

In various embodiments, as shown in fig. 8, the substrate 111 may have at least one L-shape, and at least one concave portion 111d may be located on at least one side of the convex portion 111 c. As shown in fig. 9, the substrate 111 may have at least one step shape, and at this time, a plurality of concave portions 111d may be located at least one side of the convex portion 111 c.

In addition, in some embodiments, the first surface 111a and the second surface 111b of the substrate 111 can be provided with different circuits for providing different functional circuits, chips or components. For example, the rosa 114 may be disposed on the first surface 111a of the substrate 111, and the processor 112 and IC chips (such as, but not limited to LDD, PA, CDR, DSP chips, etc.) may be disposed on the second surface 111b of the substrate 111. Thus, the space for disposing the circuit or the chip can be increased, and the size of the substrate 111 can be reduced correspondingly. In some embodiments, the light receiving sub-assembly 114 may also be fixed on the first surface 111a of the substrate 111 by a chip on board (chip on board) method.

In the present embodiment, the optical transceiver module 110 can be applied to a parallel transmission over four fiber channels (PSM 4), for example, in which light with different wavelengths from four laser sources is guided into an optical fiber through a plurality of optical sub-assemblies 113, and the optical fiber is used for medium-and long-distance transmission. The rosa 114 can receive optical signals and can direct the processed optical signals to different channels respectively. However, the Optical transceiver module 110 may be applied to Wavelength Division Multiplexing (WDM), Binary Phase Shift Keying (BPSK), Quadrature Phase Shift Keying (QPSK), Coarse Wavelength Division Multiplexing (CWDM), Dense Wavelength Division Multiplexing (DWDM), Optical Add/Drop Multiplexing (OADM), tunable Optical Add/Drop Multiplexing (ROADM), or similar related Optical communication technologies, besides the PSM4 technology.

As shown in fig. 4, one or more of the light emission subassemblies 113 may be connected to the base plate 111 by a connecting plate 117, and the light emission subassemblies 113 may be arranged in a staggered manner. The light emitting directions (i.e. the emitting directions of the optical signals) of the light-emitting subassemblies 113 have an included angle, which is, for example, between 90 degrees and 180 degrees, that is, the light-emitting subassemblies 113 can be arranged in a staggered manner. When the tosas 113 are arranged in a staggered manner, the light emitting directions of the tosas 113 may be opposite to each other or different from each other, i.e. the angle between the light emitting directions of the tosas 113 is about 180 degrees.

As shown in fig. 4, each of the tosas 113 includes a light emitter 113a, a sealed housing 113b and a cylindrical member 113c, and the light emitter 113a is completely sealed in one or more sealed housings 113b, i.e. the light emitter 113a in the tosa does not contact the external environment or air outside the tosa 113, so as to prevent the components of the light emitter 113a from aging, ensure the performance of the tosa, and greatly prolong the service life of the components. Wherein the light emission subassembly 113 is sealed TO a degree suitable for TO (Transmitter Optical Sub-Assembly) type package for industrial useAnd (5) air tightness requirements. For example, the sealing degree of each of the plurality of tosas 113 may be 1 × 10^-12~5x10^-7atm*cc/sec。

In various embodiments, the optical signal emitted by the optical emitters 113a of the tosa may have a wavelength ranging from near infrared to infrared, ranging from about 830 nm to about 1660 nm. The optical transmitter 113a may be any type of laser chip suitable for generating an optical signal (e.g., edge-emitting laser device, FP/DFB/EML laser, or vertical cavity surface emitting laser, VCSEL).

In various embodiments, the light emitter 113a may be directly sealed to the sealed housing 113b without an exposed gap, so as to ensure the sealing performance of the tosa 113. In some embodiments, the sealed housing 113b is, for example, a cylindrical housing. The cylindrical member 113c is provided on one side of the seal case 113 b. The barrel 113c may be provided with a light coupling lens (not shown), such as a convex lens or a spherical lens, inside for coupling the optical signal emitted from the optical transmitter 113a to an external optical fiber via the barrel 113 c. Therefore, the light emitting direction of each of the light receiving subassemblies is directed from the light emitter 113a in the hermetic case 113b toward the cylinder 113 c.

In various embodiments, the diameter or width of the seal type housing 113b is greater than the diameter or width of the cylinder 113 c. Thus, the staggered arrangement of the tosas 113 allows the tosas 113 to be arranged more closely, so as to reduce the space for arranging the tosas 113, and thus more tosas 113 can be arranged and packaged in a small-sized optical transceiver 110, thereby realizing the miniaturization of the optical transceiver.

As shown in fig. 10, in different embodiments, the light emission subassemblies 113 may be respectively disposed on the upper and lower sides of the substrate 111 and staggered, thereby realizing the staggered arrangement of the light emission subassemblies 113 on the upper and lower sides of the substrate 111.

As shown in fig. 11, in different embodiments, the light emission subassemblies 113 may be respectively located on the same side of the substrate 111 and staggered, thereby realizing the staggered arrangement of the light emission subassemblies 113 on the same side of the substrate 111.

As shown in fig. 12, in different embodiments, more than two (e.g., three or more) of the tosas 113 may be staggered with each other, so as to achieve the staggered arrangement of more tosas 113.

In some embodiments, as shown in fig. 4 and 10, an inclination angle may be formed between the tosa 113 and the substrate 111, that is, an inclination angle may be formed between the light emitting direction of the tosa 113 and the substrate 111, and the inclination angle between the tosa 113 and the substrate 111 may be smaller than 90 degrees, such as 30 degrees, 60 degrees or 45 degrees. Accordingly, the light emission subassemblies 113 may be arranged obliquely to reduce the configuration space of the light emission subassemblies 113. In particular, in some embodiments, the tilt angle of the light emission subassemblies 113 may be implemented and fixed by the holder 118. However, the tilt angle of the light-emitting sub-assembly 113 can be realized and fixed by different structures or methods in different embodiments. For example, in some embodiments, the inclination angle of the light-emitting sub-assembly 113 may also be fixed by a fixing glue.

In the embodiment of the invention, as shown in fig. 4, the light emitting subassemblies 113 may also be arranged in a staggered manner and inclined at the same time. At this time, the front and rear ends of the tosa 113 have different sizes, so that the tosa can be more closely arranged in the optical transceiver 110, thereby achieving a better miniaturization of the optical transceiver.

Referring to fig. 13, in various embodiments, each of the tosas 113 may further include a temperature control unit 119, and the temperature control unit 119 may be disposed in the sealed housing 113 b. In some embodiments, the temperature control unit 119 may include a thermistor 119a and a thermoelectric cooler 119b, the thermistor 119a is fixed on the base of the light emitter 113a, the thermoelectric cooler 119b may be fixed in the sealed housing 113b near the light emitter 113a, for example, and the thermistor 119a is electrically connected to the thermoelectric cooler 119 b. In the present embodiment, the resistance of the thermistor 119a is changed according to the temperature of the light emitter 113a, so that the temperature of the light emitter 113a can be detected by the thermistor 119 a. Then, by controlling the current flowing direction of the thermoelectric cooler 119b, the temperature of the light emitter 113a can be cooled to control the light emitter 113a to operate in a reasonable temperature range (e.g., 40-50 degrees), so as to reduce the wavelength shift of the light emitter 113a caused by temperature variation. Furthermore, since the overall thermal load of the tosa 113 can be greatly reduced, the power consumption of the tosa 113 can be reduced. For example, the power consumption of a single tosa 113 can be reduced to 0.1-0.2W, and the power consumption of four tosas 113 can be reduced to 0.4-0.8W. In the present embodiment, the thermistor 119a and the thermoelectric cooler 119b can be fixed on the base of the light emitter 113a by a thermal conductive adhesive, for example.

As shown in fig. 3, the connector 115 may provide a reorientation mechanism to change the light between the optical transceiver component 110 and some object external (e.g., another device) across an optical fiber (not shown). For example, the connector 115 may provide a reset direction of the optical signal through the reflective surface. The angle, general size and shape of the connector 115 is dependent on the wavelength of the light, as well as the materials used to make the coupler and the requirements of the overall system. In one embodiment, the connector 115 may be designed to provide a reorientation of vertical light from the substrate 111 and horizontal light to the substrate 111.

In addition, the size, shape, and configuration of the connectors 115 are related to the standard, which includes tolerances for mating of the respective connectors. Therefore, the layout (layout) of the connector for integrating the optical I/O devices can vary according to various standards. Those skilled in the art will appreciate that the optical interface requires a line-of-sight connection to have an optical signal transmitter (both of which may be referred to as a lens) that interfaces with a receiver. Therefore, the configuration of the connector will prevent the lens from being blocked by the corresponding electrical contact assembly. For example, optical interface lenses may be disposed on the sides, or above or below the contact assemblies, depending on the space available within the connector.

In the present embodiment, the connector 115 may be, for example, MPO (Multi-fiber Push On) format, and the optical fibers may be mated one-to-one in a Multi-channel manner. In some embodiments, the CWDM/WDM system may be utilized to achieve the specification of LR4 through the steps of splitting and demultiplexing.

As shown in fig. 3, the outer casing 116 is used for protecting and assembling the substrate 111, the processor 112, the plurality of light emitting subassemblies 113, the light receiving subassemblies 114, and the connecting board 117. In other embodiments, the optical transceiver component 110 may further include a planar optical-wave chip (PLC) and a modulator. The planar opto-wave chip provides a planar integrated assembly for the transmission and conversion of light into electrical signals and vice versa. It is understood that the functionality of a planar optical-wave chip (PLC) may also be integrated into the connector 115. In this embodiment, the housing 116 may include an upper housing 116a and a lower housing 116b, and the upper housing 116a and the lower housing 116b may be combined into a whole and may form an internal space to accommodate the substrate 111, the processor 112, the plurality of light-emitting subassemblies 113, the light-receiving subassemblies 114, and the connecting plate 117. In some embodiments, the housing 116 may be made of metal, for example, to have a function of not only electrically shielding the circuit enclosed therein, but also effectively dissipating heat generated by the electronic circuit to the outside of the housing 116.

As shown in fig. 4, the connection board 117 is connected between the substrate 111 and the light-emitting subassembly 113 for fixing the light-emitting subassembly 113 and allowing the light-emitting subassembly 113 to be electrically connected to the substrate 111. That is, the substrate 111 and the tosa 113 can transmit signals to each other through the connection board 117. Specifically, the connection board 117 may include a Flexible Printed Circuit (FPC) or a flexible printed circuit board (FPC), for example, to transmit signals between the substrate 111 and the light emitting sub-assembly 113.

Also, as shown in fig. 4, the light-emitting sub-assemblies 113 may be allowed to be disposed in the concave portions 111d of the substrate 111 by the connection plates 117. Specifically, the connection plate 117 may be disposed in the recess 111d of the substrate 111 and connected to the substrate 111. And the light emission subassemblies 113 may be disposed on the connection plate 117 and connected to the connection plate 117. Therefore, the tosa 113 is disposed in the recess 111d of the substrate 111 and electrically connected to the substrate 111 through the connection plate 117.

As shown in fig. 4, the connection plate 117 may include a first connection plate 117a and a second connection plate 117 b. In some embodiments, one end of the first connection plate 117a may be connected to the first surface 111a of the substrate 111, and one end of the second connection plate 117b may be connected to the second surface 111b of the substrate 111. Therefore, the optical sub-assemblies 113 can be electrically connected to the circuits on the two opposite side surfaces of the substrate 111 through the first connecting plate 117a and the second connecting plate 117b, and can be arranged in a staggered manner in the vertical direction, so that the plurality of sealed optical sub-assemblies 113 can be arranged and packaged in a relatively small optical transceiver assembly 110, thereby realizing the miniaturization of the optical transceiver assembly.

However, in some embodiments, the first connecting plate 117a and the second connecting plate 117b may also be connected to the same side surface (the first surface 111a or the second surface 111b) of the substrate 111.

As shown in fig. 4, the first connection plate 117a and the second connection plate 117b may have different lengths. Specifically, in some embodiments, the length of the second connection plate 117b may be greater than the length of the first connection plate 117 a. Therefore, the tosas 113 can be disposed in a staggered manner at front and rear positions by the different lengths of the first connecting plate 117a and the second connecting plate 117b, so that the tosas 113 can be disposed and packaged in a smaller tosa 110 at the same time, thereby achieving miniaturization of the tosa.

As shown in fig. 4, one end of the connecting plate 117 may have a bending structure and is connected to the light-emitting subassemblies 113, and the bending structure (not shown) may form a bend corresponding to the inclination angle, position or other arrangement of the light-emitting subassemblies 113 so as to correspond to the arrangement configuration of the light-emitting subassemblies 113.

Furthermore, when the IC on the substrate 111 of the optical transceiver module 110 performs high-speed operation, large power consumption and heat are generated. At this time, the substrate 111 and the tosa 113 can be properly separated by the connection board 117, so as to prevent heat from directly transmitting to the tosa 113, thereby effectively reducing the power consumption of the temperature control unit 119 and the overall power consumption of the optical transceiver module 110.

As shown in fig. 14, in various embodiments, the position and arrangement of the tosa 113 in the optical transceiver module 110 can be fixed by the fixing device 118. Specifically, the holder 118 may be disposed on the housing 116 or the substrate 111 of the optical transceiver component 110 to hold the light-emitting subassembly 113. In some embodiments, the retainer 118 may be integrally formed on the housing 116, for example. In some embodiments, the holder 118 may include a first holder 118a and a second holder 118b for holding the plurality of tosas 113 and allowing the tosas 113 to form a staggered arrangement. As shown in fig. 3, the first retainer 118a may be disposed on the upper housing 116a, for example, and the second retainer 118b may be disposed on the lower housing 116b, for example. Furthermore, the fixing device 118 may include at least one fixing groove 118c, and the shape of the fixing groove 118c corresponds to the shape of the tosa 113 (e.g., the shape of the sealed housing 113 or the cylindrical member 113 c) for receiving and engaging the tosa 113 to fix the tosa 113. Furthermore, the shape of the fixing groove 118c may also be formed corresponding to the inclination angle of the light emission sub-assembly 113, so that the light emission sub-assembly 113 is obliquely fixed.

As shown in fig. 15, in some embodiments, the recess 111d of the substrate 111 may be a hollowed-out cavity formed on the substrate 111. As shown in fig. 16 and 17, the substrate 111 may have an I-shaped or F-shaped structure, since the plurality of recesses 111d are formed in the substrate 111. Therefore, the plurality of light emitting sub-assemblies 113 can be accommodated on the substrate 111 through the plurality of recesses 111d on the substrate 111.

In various embodiments, the size of the substrate 111 may be designed to meet the requirements of QSFP28, QSFP +, or Micro QSFP +, by the arrangement of the light emitting subassemblies 113 and/or the design of the substrate 111. For example, in some embodiments, the width of substrate 111 may be about 11-18 mm, and in some embodiments, the length of substrate 111 may be about 58-73 mm to meet the requirements of QSFP + or QSFP 28. Therefore, by arranging the tosas 113 and/or designing the substrate 111, a plurality of tosas 113 can be configured and packaged in a small-sized optical transceiver 110, thereby realizing miniaturization of the optical transceiver.

In various embodiments, the light-receiving subassemblies may also be staggered, and the light-receiving directions of the light-emitting subassemblies have an included angle between 90 degrees and 180 degrees.

In various embodiments, the light receiving sub-assembly and the substrate may have an inclination angle therebetween, and the inclination angle between the light receiving sub-assembly and the substrate may be smaller than 90 degrees, for example, between 0 degree and 90 degrees, such as 1 degree, 5 degrees, 30 degrees, 60 degrees or 45 degrees.

The optical transceiver module can be configured and packaged with a plurality of light emitting subassemblies and light receiving subassemblies in a small-sized optical transceiver module, so that the miniaturization of the optical transceiver module is realized.

The terms "in some embodiments" and "in various embodiments" are used repeatedly. The phrase generally does not refer to the same embodiment; but it may also refer to the same embodiment. The terms "comprising," "having," and "including" are synonymous, unless the context dictates otherwise.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.