阅读说明：本技术 天线封装模组和电子设备 (Antenna packaging module and electronic equipment ) 是由 贾玉虎 于 2019-03-20 设计创作，主要内容包括：本申请涉及一种天线封装模组和电子设备,天线封装模组,包括：天线基板,天线基板相背的两侧分别设置有第一叠层电路和接地层；辐射元件,设置于第一叠层电路背离天线基板的一侧；第二叠层电路,设置于接地层背离天线基板的一侧,第二叠层电路背离接地层的一侧用于设置射频芯片；馈电结构,馈电结构贯穿第二叠层电路、接地层、天基板及第一叠层电路,用于连接射频芯片与辐射元件；导电栅格,导电栅格包括多个间隔设置的导电结构,导电结构贯穿天线基板,并与接地层连接,部分馈电结构位于相邻的两个导电结构形成的间隔内,可以抑制表面波,可以提高天线辐射效率和天线增益。(The application relates to an antenna encapsulation module and electronic equipment, antenna encapsulation module includes: the antenna comprises an antenna substrate, wherein a first laminated circuit and a grounding layer are respectively arranged on two opposite sides of the antenna substrate; the radiating element is arranged on one side, away from the antenna substrate, of the first laminated circuit; the second laminated circuit is arranged on one side of the grounding layer, which is far away from the antenna substrate, and the radio frequency chip is arranged on one side of the second laminated circuit, which is far away from the grounding layer; the feed structure penetrates through the second laminated circuit, the grounding layer, the antenna substrate and the first laminated circuit and is used for connecting the radio frequency chip and the radiating element; the antenna comprises a conductive grid, wherein the conductive grid comprises a plurality of conductive structures arranged at intervals, the conductive structures penetrate through an antenna substrate and are connected with a grounding layer, and part of feed structures are positioned in the intervals formed by two adjacent conductive structures, so that surface waves can be inhibited, and the radiation efficiency and the gain of the antenna can be improved.)

1. An antenna package module, comprising:

the antenna comprises an antenna substrate, wherein a first laminated circuit and a grounding layer are respectively arranged on two opposite sides of the antenna substrate;

the radiating element is arranged on one side, away from the antenna substrate, of the first laminated circuit;

the second laminated circuit is arranged on one side, away from the antenna substrate, of the grounding layer, and a radio frequency chip is arranged on one side, away from the grounding layer, of the second laminated circuit;

the feed structure penetrates through the second laminated circuit, the grounding layer, the antenna substrate and the first laminated circuit and is used for connecting the radio frequency chip and the radiating element;

the conductive grid comprises a plurality of conductive structures arranged at intervals, the conductive structures penetrate through the antenna substrate and are connected with the grounding layer, and part of the feed structures are positioned in the intervals formed by two adjacent conductive structures.

2. The antenna package module of claim 1, wherein the first laminate circuit comprises a first conductive layer adjacent to a side of the antenna substrate.

3. The antenna package module of claim 2, wherein the conductive structure comprises a conductive post penetrating through the antenna substrate and a conductive sheet disposed on the first conductive layer, and the conductive sheet is connected to the ground layer through the conductive post.

4. The antenna package module of claim 1, wherein the number of the conductive sheets disposed on the first conductive layer is multiple and is periodically arranged.

5. The antenna package module of claim 4, wherein the periodically arranged conductive strips are rotationally or axially symmetric in the same plane.

6. The antenna package module of claim 5, wherein the plurality of conductive strips arranged periodically have the same geometric shape, and the area of the conductive strip at the center of the conductive grid is the largest, and the area of the conductive strip emitted from the center to the periphery is gradually decreased; or the like, or, alternatively,

the area of the conducting strips in each row in the plurality of conducting strips which are arranged periodically is gradually reduced or increased in the same direction; or the like, or, alternatively,

the areas of the conducting strips arranged in the periodic mode are equal.

7. The antenna package module of claim 1, wherein the second stacked circuit, the ground plane, the antenna substrate, and the first stacked circuit are all formed with through holes filled with conductive material to form the feeding structure.

8. The antenna package module of any one of claims 1-7, wherein the radiating element is an antenna array comprising at least one of a patch antenna, a dipole antenna, and a yagi antenna.

9. An electronic device, comprising:

a housing; and

the antenna package module of any one of claims 1-8, wherein the antenna package module is housed within the housing.

10. The electronic device of any of claim 9, wherein the number of the antenna packaging modules is plural;

the shell comprises a first side edge and a third side edge which are arranged in a back-to-back manner, and a second side edge and a fourth side edge which are arranged in a back-to-back manner, wherein the second side edge is connected with one end of the first side edge and one end of the third side edge, and the fourth side edge is connected with the other end of the first side edge and the other end of the third side edge;

at least two of the first side, the second side, the third side and the fourth side are respectively provided with the antenna packaging module.

Technical Field

With the development of wireless communication technology, 5G network technology has emerged. The 5G network, as a fifth generation mobile communication network, has a peak theoretical transmission speed of several tens of Gb per second, which is hundreds of times faster than the transmission speed of the 4G network. Therefore, the millimeter wave band having sufficient spectrum resources becomes one of the operating bands of the 5G communication system.

The millimeter wave packaging antenna module is a mainstream packaging scheme in future 5G millimeter wave electronic equipment, a multilayer PCB high-density interconnection process can be adopted, and a radiating element is arranged on the surface of one side of the module. However, the radiating element is generally a microstrip patch antenna array, and the size of the microstrip patch antenna array is mainly limited by the dielectric constant of the multilayer PCB, and the radiating efficiency is low.

Disclosure of Invention

The embodiment of the application provides an antenna packaging module and electronic equipment, which can increase the radiation efficiency and gain of the antenna packaging module.

An antenna package module, comprising:

the antenna comprises an antenna substrate, wherein a first laminated circuit and a grounding layer are respectively arranged on two opposite sides of the antenna substrate;

the radiating element is arranged on one side, away from the antenna substrate, of the first laminated circuit;

the second laminated circuit is arranged on one side, away from the antenna substrate, of the grounding layer, and a radio frequency chip is arranged on one side, away from the grounding layer, of the second laminated circuit;

the feed structure penetrates through the second laminated circuit, the grounding layer, the antenna substrate and the first laminated circuit and is used for connecting the radio frequency chip and the radiating element;

the conductive grid comprises a plurality of conductive structures arranged at intervals, the conductive structures penetrate through the antenna substrate and are connected with the grounding layer, and part of the feed structures are positioned in the intervals formed by two adjacent conductive structures.

Further, there is provided an electronic device including: the antenna packaging module is accommodated in the shell.

Above-mentioned antenna package module and electronic equipment includes: the antenna comprises an antenna substrate, wherein a first laminated circuit and a grounding layer are respectively arranged on two opposite sides of the antenna substrate; the radiating element is arranged on one side, away from the antenna substrate, of the first laminated circuit; the second laminated circuit is arranged on one side, away from the antenna substrate, of the grounding layer, and a radio frequency chip is arranged on one side, away from the grounding layer, of the second laminated circuit; the feed structure penetrates through the second laminated circuit, the grounding layer, the antenna substrate and the first laminated circuit and is used for connecting the radio frequency chip and the radiating element; the conductive grid comprises a plurality of conductive structures arranged at intervals, the conductive structures penetrate through the antenna substrate and are connected with the grounding layer, and part of the feed structures are positioned in the intervals formed by two adjacent conductive structures. By introducing the conductive grid, surface waves can be suppressed, and the radiation efficiency and gain of the antenna can be improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a perspective view of an electronic device in one embodiment;

fig. 2 is a schematic structural diagram of an antenna package module according to an embodiment;

FIGS. 3a-3c are schematic views of conductive sheets according to an embodiment;

fig. 4 is a schematic structural diagram of an antenna package module according to another embodiment;

FIG. 5 is a front view of a housing assembly of the electronic device of FIG. 1 in another embodiment;

fig. 6 is a block diagram of a partial structure of a mobile phone related to an electronic device provided in an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element, and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

In one embodiment, the electronic Device may be a communication module including a Mobile phone, a tablet computer, a notebook computer, a palm computer, a Mobile Internet Device (MID), a wearable Device (e.g., a smart watch, a smart bracelet, a pedometer, etc.), or other configurable array antenna Device.

As shown in FIG. 1, in an embodiment of the present application, the electronic device 10 may include a display screen assembly 110, a housing assembly 120, and a controller. The display screen assembly 110 is fixed to the housing assembly 120, and forms an external structure of the electronic device together with the housing assembly 120. The housing assembly 120 may include a center frame and a rear cover. The middle frame can be a frame structure with a through hole. The middle frame can be accommodated in an accommodating space formed by the display screen assembly and the rear cover. The back cover is used to form the outer contour of the electronic device. The rear cover may be integrally formed. In the forming process of the rear cover, structures such as a rear camera hole, a fingerprint identification module, an antenna device mounting hole and the like can be formed on the rear cover. Wherein, the back lid can be behind the nonmetal lid, for example, the back lid can be behind the plastic lid, the lid behind the pottery, the lid behind the 3D glass etc.. The controller can control the operation of the electronic device, etc. The display screen component can be used for displaying pictures or fonts and can provide an operation interface for a user.

In an embodiment, an antenna package module is integrated in the housing component 120, and the antenna package module can transmit and receive millimeter-wave signals through the housing component 120, so that the electronic device can achieve wide coverage of millimeter-wave signals.

Millimeter waves refer to electromagnetic waves having a wavelength on the order of millimeters, and having a frequency of about 20GHz to about 300 GHz. The 3GPP has specified a list of frequency bands supported by 5G NR, the 5G NR spectrum range can reach 100GHz, and two frequency ranges are specified: frequency range 1(FR1), i.e. the sub-6 GHz band, and Frequency range 2(FR2), i.e. the millimeter wave band. Frequency range of Frequency range 1: 450MHz-6.0GHz, with a maximum channel bandwidth of 100 MHz. The frequency range of frequency mirror 2 is 24.25GHz-52.6GHz, and the maximum channel bandwidth is 400 MHz. The near 11GHz spectrum for 5G mobile broadband comprises: 3.85GHz licensed spectrum, for example: 28GHz (24.25-29.5GHz), 37GHz (37.0-38.6GHz), 39GHz (38.6-40GHz) and 14GHz unlicensed spectrum (57-71 GHz). The working frequency bands of the 5G communication system comprise three frequency bands of 28GHz, 39GHz and 60 GHz.

As shown in fig. 2, an embodiment of the present invention provides an antenna package module, which includes an antenna substrate 210, a first stacked circuit 220, a ground layer 230, a radiating element 240, a second stacked circuit 250, a feeding structure 260, a radio frequency chip 270, and a conductive grid 280.

In an embodiment, the antenna substrate 210, the first laminated circuit 220, the ground layer 230, and the second laminated circuit 250 may be formed in a multi-layer Printed Circuit Board (PCB) integrated by using an HDI (high density interconnect) process. The multilayer printed circuit board may include a core layer (core layer), PP (prepreg) layers respectively stacked on two sides of the core layer, and a metal layer TM plated on each of the PP layers and the core layer. The PP layer is a prepreg, which is disposed between two copper layers, and serves to insulate and bond the two copper layers. The metal layer TM may be a copper layer, a tin layer, a lead-tin alloy layer, a tin-copper alloy layer, or the like.

In an embodiment, the antenna substrate 210 may be understood as a core layer (core layer), wherein the antenna substrate 210 includes a first surface and a second surface opposite to each other, and wherein the first laminated circuit 220 is disposed on the first surface of the antenna substrate 210. The first laminated circuit 220 may include a plurality of metal layers TM and PP arranged at intervals. Wherein the metal layer TM is located above the PP layer.

In an embodiment, the ground layer 230 is disposed on the second surface of the antenna substrate 210.

In an embodiment, the second laminated circuit 250 is disposed on a side of the ground plane 230 away from the antenna substrate 210, and a side of the second laminated circuit 250 away from the ground plane 230 is used for disposing the rf chip 270. The second laminated circuit 250 may also include a plurality of metal layers TM and PP arranged at intervals. Wherein the metal layer TM is located above the PP layer.

In an embodiment, the radiation element 240 is disposed on a side of the first stacked circuit 220 facing away from the antenna substrate 210. Specifically, the radiating element 240 is disposed on the top metal layer TM-p, and is configured to receive and transmit millimeter wave signals. The radiating element 240 is further provided with a feeding point for feeding a current signal, and the feeding point is connected to the rf chip 270 through the feeding structure 260.

In an embodiment, the radiating element 240 may be a phased antenna array for radiating millimeter wave signals. For example, the radiating element 240 for radiating millimeter-wave signals may be a patch antenna, a dipole antenna, a yagi antenna, a beam antenna, or an antenna array of other suitable antenna elements.

The feeding structure 260 penetrates through the second stacked circuit 250, the ground layer 230, the antenna substrate 210 and the first stacked circuit 220, and is used for connecting the rf chip 270 and the radiating element 240.

In an embodiment, through holes may be formed in the second stacked circuit 250, the ground layer 230, the antenna substrate 210 and the first stacked circuit 220, and the through holes are disposed at the position of the first stacked circuit 220 corresponding to the position of the feeding point. The through hole can be filled with a conductive material to form a feeding structure 260, and the rf chip 270 and the radiating element 240 are electrically connected through the feeding structure 260. The feed structure 260 of the rf chip 27040 is connected to the radiating element 240, so as to feed a current signal into the radiating element 240, thereby implementing the transceiving of millimeter wave signals.

The conductive grid 280 includes a plurality of spaced apart conductive structures 281, the conductive structures 281 penetrate through the antenna substrate 210 and are connected to the ground layer 230, and a portion of the feeding structure 260 is located in a space formed by two adjacent conductive structures 281.

In an embodiment, the conductive structure 281 may be made of a conductive material, such as a metal material, an alloy material, a conductive silicone material, a graphite material, and in this embodiment, a metal copper may be used.

The antenna package module can suppress surface waves, i.e., surface waves in a certain frequency band, by introducing the conductive grid 280 into the antenna substrate 210; specifically, the surface wave with the frequency within the stop band is suppressed, or the surface wave with the frequency within the stop band is not supported, so that the radiation efficiency of the antenna can be improved, and the gain of the antenna can be improved. In the planar antenna, a dielectric substrate is a guided wave that propagates along an interface between two media, and a part of the electromagnetic wave is bound to the interface between the media and air and propagates through the interface. Meanwhile, the introduced conductive grid 280 is analogous to a plurality of parallel LC antenna paths, which can improve the impedance bandwidth of the antenna and increase the isolation between the antenna ports. The size of the radiating element 240 in the non-scanning direction can also be reduced by introducing the conductive grid 280, thereby reducing the volume of the whole antenna package module.

In one embodiment, the first stacked circuit 220 includes a first conductive layer 221 adjacent to one side of the antenna substrate 210. The first conductive layer 221 may be understood as a metal layer TM disposed near the antenna substrate 210 in the first laminated circuit 220. The metal layer may be a copper layer, a tin layer, a lead-tin alloy layer, a tin-copper alloy layer, or the like.

Specifically, the conductive structure 281 includes a conductive pillar 281a penetrating through the antenna substrate 210 and a conductive sheet 281b disposed on the first conductive layer 221, and the conductive sheet 281b is connected to the ground layer 230 through the conductive pillar 281 a.

As shown in fig. 3a-3c, the geometric shape of the conductive sheet 281b may include rectangular (fig. 3a), circular (fig. 3b), circular (fig. 3c), oval, mushroom, inverted "H" -shaped, "cross" -shaped, etc. In the embodiment of the present application, the geometric shape of the conductive sheet 281b may also be set according to practical requirements, and is not limited to the above illustration.

It should be noted that the size of the conductive sheet 281b is related to the thickness and the dielectric constant of the antenna substrate 210, and in the embodiment of the present application, the size of the conductive sheet 281b is not further limited, and the resonant frequency of the radiating element 240 can be adjusted by adjusting the size of the conductive sheet 281b, the thickness and the dielectric constant of the antenna substrate 210.

In one embodiment, the conductive pillars 281a correspond to the conductive sheets 281b one to one, and the conductive structure 281 is electrically connected to the antenna layer 240 through the conductive pillars 281 a. Specifically, a plurality of vias may be opened in the antenna substrate 210, and a conductive material may be filled in the vias to form the conductive pillar 281 a. The conductive posts 281a correspond to the conductive sheets 281b one by one, and the conductive structure 281 is electrically connected to the antenna ground layer through the conductive posts 281a, so that the conductive sheets 281b are grounded through the conductive posts 281 a. Meanwhile, the conductive sheets 281b arranged at intervals are independent from each other and are not connected to each other, so that mutual capacitive coupling between the conductive sheets 281b can be realized.

In one embodiment, the cross-sectional shape of the conductive pillar 281a along the plane of the antenna substrate 210 is the same as the geometric shape of the corresponding conductive sheet 281 b. That is, the conductive pillar 281a can be understood as a conductive sheet 281b with a larger thickness, wherein the thickness of the conductive pillar 281a is the thickness of the antenna substrate 210. For example, when the conductive sheet 281b is circular, the conductive column 281a connected thereto is a cylinder. The conductive pillar 281a formed by filling the via with a conductive material is made of the same material as the conductive structure 281, and may be a metal material, a graphite material, or the like.

In one embodiment, the conductive sheets 281b disposed on the first conductive layer 221 are multiple and are arranged periodically, for example, they may be arranged in a honeycomb manner, a diamond manner, a rectangular manner, a radial manner, a gradient manner, etc. In the same conductive grid 280, the conductive sheets 281b may have the same shape or different shapes. For example, the plurality of conductive sheets 281b having a periodic arrangement are rotationally symmetric or axisymmetric in the same plane.

In one embodiment, the geometric shape of each of the conductive sheets 281b having a plurality of conductive sheets 281b arranged periodically in the same plane is the same, and the area of each of the conductive sheets 281b is the same, refer to fig. 3 a. For example, the conductive sheets 281b in the conductive grid 280 are arranged in a two-dimensional array.

In one embodiment, each of the conductive sheets 281b in the conductive structure 281 has the same geometric shape, and the area of the conductive sheet 281b located at the center of the conductive grid 280 is the largest, and the area of the conductive sheet 281b emitted from the center to the periphery is gradually reduced. For example, the conductive sheets 281b in the conductive grid 280 are in a two-dimensional rectangular array of M × M, and the geometric shape of each conductive sheet 281b in the conductive grid 280 is circular, and the center distance or edge distance between two adjacent conductive sheets 281b is equal. Where M may be 4, 5, 6 or a number greater than 6, and in the embodiment of the present application, the shape of the conductive sheet 281b and the value of M are not further limited.

In this embodiment, the conductive grid 280 is set to be a two-dimensional rectangular array of M × M, and each conductive sheet 281b in the rectangular array is in a two-dimensional gradually-changed shape, so that the impedance bandwidth and the gain of the antenna module can be simultaneously improved, the main lobe beam width of the antenna is narrowed, and the directivity is strong.

In one embodiment, the geometric shape of each of the conductive sheets 281b in the conductive grid 280 is the same, and the area of each row of the conductive sheets 281b in the conductive grid 280 is gradually decreased in the same direction. For example, the conductive sheets 281b in the conductive grid 280 are in a two-dimensional rectangular array of M × M, and the geometry of each of the conductive sheets 281b in the conductive grid 280 is rectangular. In one embodiment, in the two-dimensional rectangular array of M × M, the areas of the conductive sheets 281b from the first row to the mth row become gradually smaller or larger in the row direction, and the trends of becoming gradually smaller or larger between two adjacent conductive sheets 281b in the row direction are the same, that is, becoming gradually smaller or larger according to the same ratio.

In one embodiment, in the two-dimensional rectangular array of M × M, the areas of the conductive sheets 281b from the first column to the mth column become gradually smaller in the column direction, and the trends of becoming gradually smaller or larger between two adjacent conductive sheets 281b in the column direction are the same, that is, becoming gradually smaller or larger according to the same ratio.

Further, in the two-dimensional rectangular array of M × M, the center distance or the edge distance between two adjacent conductive sheets 281b is equal. Where M may be 4, 5, 6 or a number greater than 6, and in the embodiment of the present application, the shape of the conductive sheet 281b and the value of M are not further limited.

It should be noted that the center distance can be understood as the distance between the respective centers of two adjacent conductive sheets 281 b; the margin can be understood as the shortest distance between the edges of two adjacent conductive sheets 281 b.

In this embodiment, the conductive grid 280 is set to be a two-dimensional rectangular array of M × M, and each single eye of the rectangular array is in a two-dimensional gradually-changing shape, so that the impedance bandwidth and the gain of the antenna module can be simultaneously improved, the main lobe beam width of the antenna is narrowed, and the directivity is strong.

As shown in fig. 4, in an embodiment, the antenna package module includes: an antenna substrate 210, a first laminate circuit 220, a ground plane 230, a radiating element 240, a second laminate circuit 250, a feed structure 260, and a conductive grid 280. The antenna substrate 210, the first laminated circuit and the second laminated circuit 250 are stacked by using a PCB of an 8-layer millimeter wave packaged antenna integrated by an HDI (high density interconnect) process. The first laminated circuit 220 includes metal layers TM 1-TM 4, and PP layers (including PP 1-PP 3) between adjacent metal layers. The metal layers TM 1-TM 4 are copper layer marking layers of the antenna part. The metal layer TM4 may be understood as the first laminated circuit 220 including the first conductive layer 221 near one side of the antenna substrate 210.

The radiating element 240 is disposed on the layer of metal TM 1.

Metal layer TM5 is ground layer 230.

The second laminated circuit 250 comprises metal layers TM 6-TM 8 and PP layers (including PP 4-PP 6) between adjacent metal layers, wherein the metal layers TM 6-TM 8 are feed networks and control line wiring copper layers of the antenna packaging module, and the radio frequency chip 270 is welded on the TM8 layer.

It should be noted that PP1 to PP6 are prepregs, and are located between two metal layers TM (e.g., copper layers) to isolate and bond the two copper layers.

By introducing the conductive grid 280 (the conductive sheets 281b located at the plurality of intervals of the TM4 and the conductive columns 281a penetrating the antenna substrate 210) into the metal layer TM4 and the antenna substrate 210 to be connected to the TM5 (the ground layer 230) to form the antenna bottom layer of the radiating element 240, the surface wave can be suppressed, and the antenna radiation efficiency can be improved to improve the antenna gain. Meanwhile, the introduced conductive grid 280 is analogous to a plurality of parallel LC antenna paths, which can improve the impedance bandwidth of the antenna and increase the isolation between the antenna ports. The size of the radiating element 240 in the non-scanning direction can also be reduced by introducing the conductive grid 280, thereby reducing the volume of the whole antenna package module.

As shown in fig. 5, an electronic device includes a housing and the antenna package module in any of the above embodiments, wherein the antenna package module is accommodated in the housing.

In one embodiment, the electronic device includes a plurality of antenna package modules distributed on different sides of the housing. For example, the casing includes a first side 121 and a third side 123 disposed opposite to each other, and a second side 122 and a fourth side 124 disposed opposite to each other, the second side 122 is connected to one end of the first side 121 and one end of the third side 123, and the fourth side 124 is connected to the other end of the first side 121 and the other end of the third side 123. At least two of the first side 121, the second side 122, the third side 123 and the fourth side 124 are respectively provided with a millimeter wave module. When the number of the millimeter wave modules is 2, 2 millimeter wave modules 200 are respectively located at the second side 122 and the fourth side 124, so that the overall size of the antenna package module is reduced in the dimension in the non-scanning direction, and the antenna package module can be placed on two sides of the electronic device.

The electronic device with the antenna device of any embodiment can be suitable for receiving and transmitting 5G communication millimeter wave signals, the directional diagram distortion and the impedance bandwidth of the antenna module are improved, the radiation efficiency and the radiation gain of the millimeter wave signals are improved, and meanwhile, the occupied space of the antenna module in the electronic device can be reduced.

The electronic Device may be a communication module including a Mobile phone, a tablet computer, a notebook computer, a palm computer, a Mobile Internet Device (MID), a wearable Device (e.g., a smart watch, a smart bracelet, a pedometer, etc.), or other settable antenna.

Fig. 6 is a block diagram of a partial structure of a mobile phone related to an electronic device provided in an embodiment of the present invention. Referring to fig. 6, a handset 600 includes: the array antenna 610, the memory 620, the input unit 630, the display unit 640, the sensor 650, the audio circuit 660, a wireless fidelity (WIFI) module 670, the processor 680, and the power supply 690. Those skilled in the art will appreciate that the handset configuration shown in fig. 6 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.

The array antenna 610 may be used for receiving and transmitting information or receiving and transmitting signals during a call, and may receive downlink information of a base station and then process the downlink information to the processor 680; the uplink data may also be transmitted to the base station. The memory 620 may be used to store software programs and modules, and the processor 680 may execute various functional applications and data processing of the mobile phone by operating the software programs and modules stored in the memory 620. The memory 620 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function (such as an application program for a sound playing function, an application program for an image playing function, and the like), and the like; the data storage area may store data (such as audio data, an address book, etc.) created according to the use of the mobile phone, and the like. Further, the memory 620 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.

The input unit 630 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the cellular phone 600. In one embodiment, the input unit 630 may include a touch panel 631 and other input devices 632. The touch panel 631, which may also be referred to as a touch screen, may collect touch operations performed by a user on or near the touch panel 631 (e.g., operations performed by the user on or near the touch panel 631 using any suitable object or accessory such as a finger, a stylus, etc.) and drive the corresponding connection device according to a preset program. In one embodiment, the touch panel 631 may include two parts, a touch measurement device and a touch controller. The touch measuring device measures the touch direction of a user, measures signals brought by touch operation and transmits the signals to the touch controller; touch controller receives touch information from the touch measurement device and converts it to touch point coordinates, which are provided to processor 680 and can receive commands from processor 680 and execute them. In addition, the touch panel 631 may be implemented using various types, such as resistive, capacitive, infrared, and surface acoustic wave. The input unit 630 may include other input devices 632 in addition to the touch panel 631. In one embodiment, other input devices 632 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), and the like.

The display unit 640 may be used to display information input by the user or information provided to the user and various menus of the mobile phone. The display unit 640 may include a display panel 641. In one embodiment, the display panel 641 may be configured in the form of a Liquid Crystal Display (LCD), an organic Light-Emitting Diode (OLED), or the like. In one embodiment, the touch panel 631 may cover the display panel 641, and when the touch panel 631 measures a touch operation thereon or nearby, the touch panel is transmitted to the processor 680 to determine the type of the touch event, and then the processor 680 provides a corresponding visual output on the display panel 641 according to the type of the touch event. Although in fig. 6, the touch panel 631 and the display panel 641 are two independent components to implement the input and output functions of the mobile phone, in some embodiments, the touch panel 631 and the display panel 641 may be integrated to implement the input and output functions of the mobile phone.

The handset 600 may also include at least one sensor 650, such as a light sensor, motion sensor, and other sensors. In one embodiment, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel 641 according to the brightness of ambient light, and a proximity sensor that turns off the display panel 641 and/or the backlight when the mobile phone is moved to the ear. The motion sensor can comprise an acceleration sensor, the acceleration sensor can measure the magnitude of acceleration in each direction, the magnitude and the direction of gravity can be measured when the mobile phone is static, and the motion sensor can be used for identifying the application of the gesture of the mobile phone (such as horizontal and vertical screen switching), vibration identification related functions (such as pedometer and knocking) and the like. The mobile phone may be provided with other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor.

Audio circuit 660, speaker 661, and microphone 662 can provide an audio interface between a user and a cell phone. The audio circuit 660 may transmit the electrical signal converted from the received audio data to the speaker 661, and convert the electrical signal into an audio signal through the speaker 661 for output; on the other hand, the microphone 662 converts the collected sound signal into an electrical signal, which is received by the audio circuit 660 and converted into audio data, and the audio data is output to the processor 680 for processing, and then the processed audio data may be transmitted to another mobile phone through the array antenna 610, or the audio data may be output to the memory 620 for subsequent processing.

The processor 680 is a control center of the mobile phone, and connects various parts of the entire mobile phone by using various interfaces and lines, and performs various functions of the mobile phone and processes data by operating or executing software programs and/or modules stored in the memory 620 and calling data stored in the memory 620, thereby performing overall monitoring of the mobile phone. In one embodiment, processor 680 may include one or more processing units. In one embodiment, processor 680 may integrate an application processor and a modem processor, wherein the application processor primarily handles operating systems, user interfaces, applications, and the like; the modem processor handles primarily wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 680.

The handset 600 also includes a power supply 690 (e.g., a battery) for powering the various components, which may preferably be logically coupled to the processor 680 via a power management system, such that the power management system may be used to manage charging, discharging, and power consumption.

In one embodiment, the handset 600 may also include a camera, a bluetooth module, and the like.

Any reference to memory, storage, database, or other medium used herein may include non-volatile and/or volatile memory. Suitable non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RM), which acts as external cache memory. By way of illustration and not limitation, RMs are available in a variety of forms, such as static RM (srm), dynamic RM (drm), synchronous drm (sdrm), double data rate sdrm (ddr sdrm), enhanced sdrm (esdrm), synchronous link (Synchlink) drm (sldrm), memory bus (Rmbus) direct RM (rdrm), direct memory bus dynamic RM (drdrm), and memory bus dynamic RM (rdrm).

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.