阅读说明：本技术 天线设备 (Antenna device ) 是由 李杬澈 金楠基 琴宰民 柳正基 于 2019-12-31 设计创作，主要内容包括：本公开提供一种天线设备,所述天线设备包括：第一贴片天线图案,包括通孔；第二贴片天线图案,设置在所述第一贴片天线图案的上方并且与所述第一贴片天线图案间隔开；第一馈电过孔,电连接到所述第一贴片天线图案；第二馈电过孔,贯穿所述第一贴片天线图案的所述通孔；以及馈电图案,设置在所述第一贴片天线图案与所述第二贴片天线图案之间,并且所述馈电图案的一端连接到所述第二馈电过孔,所述馈电图案的另一端在比所述第二馈电过孔靠近所述第二贴片天线图案的边缘的点处连接到所述第二贴片天线图案。(The present disclosure provides an antenna apparatus, the antenna apparatus including: a first patch antenna pattern including a through hole; a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern; a first feed via electrically connected to the first patch antenna pattern; a second feeding via hole penetrating the through hole of the first patch antenna pattern; and a feeding pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feeding via hole and the other end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feeding via hole.)

1. An antenna apparatus, comprising:

a first patch antenna pattern including a through hole;

a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern;

a first feed via electrically connected to the first patch antenna pattern;

a second feeding via hole penetrating the through hole of the first patch antenna pattern; and

a feeding pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feeding via hole and the other end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feeding via hole.

2. The antenna device as claimed in claim 1, wherein the first feeding via is disposed farther from a center of the first patch antenna pattern than the second feeding via.

3. The antenna device according to claim 1, wherein electrical connection points of the first patch antenna pattern are offset more from a center of the first patch antenna pattern and a center of the second patch antenna pattern in a horizontal direction than electrical connection points of the second patch antenna pattern.

4. The antenna device of claim 1, further comprising a coupling patch pattern disposed above and spaced apart from the second patch antenna pattern.

5. The antenna device of claim 4, wherein a spacing distance between the first patch antenna pattern and the second patch antenna pattern is shorter than a spacing distance between the second patch antenna pattern and the coupling patch pattern.

6. The antenna device of claim 4, wherein the coupling patch pattern comprises a slot.

7. The antenna device of claim 6, wherein a size of the second patch antenna pattern is smaller than a size of the first patch antenna pattern and larger than a size of the coupling patch pattern.

8. The antenna device as claimed in claim 6, wherein the second patch antenna pattern has a shape without holes.

9. The antenna device of claim 1, further comprising a plurality of shielded vias electrically connected to the first patch antenna pattern and surrounding the second feed via.

10. The antenna device of claim 9, wherein the plurality of shielded vias are offset from a center of the first patch antenna pattern in a first direction, and

the antenna device further includes a plurality of dummy vias electrically connected to the first patch antenna pattern and offset from a center of the first patch antenna pattern in a second direction different from the first direction in which the plurality of shield vias are offset from the center of the first patch antenna pattern.

11. The antenna device as claimed in claim 10, further comprising a ground plane disposed below the first patch antenna pattern and including two through holes through which the first and second feed vias pass,

wherein the plurality of shielded vias and the plurality of dummy vias are electrically connected to the ground plane.

12. The antenna device of claim 10, wherein the plurality of dummy vias are disposed symmetrically to the plurality of shielded vias with respect to a center of the first patch antenna pattern.

13. An antenna apparatus, comprising:

a first patch antenna pattern including a through hole;

a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern;

a first feed via electrically connected to the first patch antenna pattern;

a second feeding via hole penetrating the through hole of the first patch antenna pattern;

a plurality of shielded via holes electrically connected to the first patch antenna pattern, surrounding the second feeding via holes and offset from a center of the first patch antenna pattern in a first direction; and

a plurality of dummy vias electrically connected to the first patch antenna pattern and offset from a center of the first patch antenna pattern in a second direction different from the first direction in which the plurality of shielding vias are offset from the center of the first patch antenna pattern.

14. The antenna device of claim 13, wherein the plurality of dummy vias are disposed symmetrically to the plurality of shielded vias with respect to a center of the first patch antenna pattern.

15. The antenna device as claimed in claim 13, further comprising a ground plane disposed below the first patch antenna pattern and including two through holes through which the first and second feed vias pass,

wherein the plurality of shielded vias and the plurality of dummy vias are electrically connected to the ground plane.

16. The antenna device of claim 13, further comprising a coupling patch pattern comprising a slot and disposed over and spaced apart from the second patch antenna pattern.

17. An antenna apparatus, comprising:

a first patch antenna pattern including a through hole;

a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern;

a first feed via electrically connected to the first patch antenna pattern; and

a second feeding via hole penetrating the through hole of the first patch antenna pattern and electrically connected to the second patch antenna pattern,

wherein a first connection point, at which the first feeding via is electrically connected to the first patch antenna pattern, is farther from a center of the first patch antenna pattern in a first direction than a distance from the center of the first patch antenna pattern in a second direction opposite to the first direction.

18. The antenna device as claimed in claim 17, wherein the second feeding via is electrically connected to the second connection point of the second patch antenna pattern closer to an edge of the second patch antenna pattern in the second direction than the first connection point to the edge of the first patch antenna pattern in the first direction.

19. The antenna apparatus of claim 18, further comprising:

a feeding pattern disposed between the first patch antenna pattern and the second patch antenna pattern; and

a third via hole disposed between the first patch antenna pattern and the second patch antenna pattern,

wherein a first end of the feeding pattern is connected to the second feeding via,

a second end of the feeding pattern is connected to a first end of the third via hole, and

a second end of the third via is connected to the second patch antenna pattern at the second connection point.

20. The antenna apparatus of claim 17, further comprising:

a plurality of shielded vias electrically connected to the first patch antenna pattern and surrounding the second feed via; and

a plurality of dummy vias electrically connected to the first patch antenna pattern,

wherein each of the plurality of dummy vias is disposed at a first distance from a center of the first patch antenna pattern in the first direction, the first distance being equal to a second distance at which a corresponding one of the plurality of shielding vias is disposed from the center of the first patch antenna pattern in the second direction.

Technical Field

The present application relates to an antenna apparatus.

Background

Mobile communication data traffic is rapidly increasing every year. Active technological developments are being made to support the real-time transmission of such rapidly growing data in wireless networks. For example, internet of things (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), live VR/AR in conjunction with Social Networking Services (SNS), autonomously navigated content, and applications such as synchronized windows (user real-time video transmission using subminiature cameras) may require communications (e.g., fifth generation (5G) communications or millimeter wave (mmWave) communications) that support the sending and receiving of large amounts of data.

Recently, millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively studied, and research for standardization and commercialization of an antenna apparatus for effectively performing such communication is being actively conducted.

Since Radio Frequency (RF) signals in high frequency bands (e.g., 24GHz, 28GHz, 36GHz, 39GHz, and 60GHz) are easily absorbed and lost during their transmission, the quality of communication using such RF signals may be drastically degraded. Therefore, an antenna for communication in a high frequency band may require a different method from that of the conventional antenna technology, and a separate method may require additional special technologies such as a separate power amplifier for providing sufficient antenna gain, integrating the antenna and a Radio Frequency Integrated Circuit (RFIC), and realizing sufficient Effective Isotropic Radiated Power (EIRP).

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, an antenna apparatus includes: a first patch antenna pattern including a through hole; a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern; a first feed via electrically connected to the first patch antenna pattern; a second feeding via hole penetrating the through hole of the first patch antenna pattern; and a feeding pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feeding via hole and the other end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feeding via hole.

The first feeding via may be disposed farther from a center of the first patch antenna pattern than the second feeding via.

The first feed via hole may be more biased in an edge direction than an electrical connection point of the feed pattern to the second patch antenna pattern to be electrically connected to the first patch antenna pattern.

The antenna device may further include a coupling patch pattern disposed above and spaced apart from the second patch antenna pattern.

A spacing distance between the first patch antenna pattern and the second patch antenna pattern may be shorter than a spacing distance between the second patch antenna pattern and the coupling patch pattern.

The coupling patch pattern may include a slot.

The size of the second patch antenna pattern may be smaller than that of the first patch antenna pattern and larger than that of the coupling patch pattern.

The second patch antenna pattern may have a shape without holes.

The antenna device may further include a plurality of shielded vias electrically connected to the first patch antenna pattern and surrounding the second feed via.

The plurality of shielded vias may be offset from a center of the first patch antenna pattern in a first direction, and the antenna device may further include a plurality of dummy vias electrically connected to the first patch antenna pattern and offset from the center of the first patch antenna pattern in a second direction different from the first direction in which the plurality of shielded vias are offset from the center of the first patch antenna pattern.

The antenna apparatus may further include a ground plane disposed below the first patch antenna pattern and including two through holes through which the first and second feeding vias penetrate, and the plurality of shield vias and the plurality of dummy vias may be electrically connected to the ground plane.

The plurality of dummy vias may be disposed substantially symmetrically to the plurality of shielded vias with respect to a center of the first patch antenna pattern.

In another general aspect, an antenna apparatus includes: a first patch antenna pattern including a through hole; a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern; a first feed via electrically connected to the first patch antenna pattern; a second feeding via hole penetrating the through hole of the first patch antenna pattern; a plurality of shielded via holes electrically connected to the first patch antenna pattern, surrounding the second feeding via holes and offset from a center of the first patch antenna pattern in a first direction; and a plurality of dummy vias electrically connected to the first patch antenna pattern and offset from a center of the first patch antenna pattern in a second direction different from the first direction in which the plurality of shield vias are offset from the center of the first patch antenna pattern.

The plurality of dummy vias may be disposed substantially symmetrically to the plurality of shielded vias with respect to a center of the first patch antenna pattern.

The antenna apparatus may further include a ground plane disposed below the first patch antenna pattern and including two through holes through which the first and second feeding vias penetrate, and the plurality of shield vias and the plurality of dummy vias may be electrically connected to the ground plane.

The antenna apparatus may further include a coupling patch pattern including a slot and disposed above and spaced apart from the second patch antenna pattern.

In another general aspect, an antenna apparatus includes: a first patch antenna pattern including a through hole; a second patch antenna pattern disposed above and spaced apart from the first patch antenna pattern; a first feed via electrically connected to the first patch antenna pattern; and a second feeding via hole penetrating the through hole of the first patch antenna pattern and electrically connected to the second patch antenna pattern, wherein a first connection point electrically connected to the first patch antenna pattern is farther from a center of the first patch antenna pattern in a first direction than the through hole is from the center of the first patch antenna pattern in a second direction opposite to the first direction.

The second feeding via may be electrically connected to a second connection point of the second patch antenna pattern may be closer to an edge of the second patch antenna pattern in the second direction than the first connection point is to the edge of the first patch antenna pattern in the first direction.

The antenna apparatus may further include: a feeding pattern disposed between the first patch antenna pattern and the second patch antenna pattern; and a third via hole disposed between the first patch antenna pattern and the second patch antenna pattern, wherein a first end of the feed pattern is connected to the second feed via hole, a second end of the feed pattern is connected to a first end of the third via hole, and a second end of the third via hole is connected to the second patch antenna pattern at the second connection point.

The antenna apparatus may further include: a plurality of shielded vias electrically connected to the first patch antenna pattern and surrounding the second feed via; and a plurality of dummy vias electrically connected to the first patch antenna pattern, wherein each of the plurality of dummy vias is disposed at a first distance from a center of the first patch antenna pattern in the first direction, the first distance being equal to a second distance at which a corresponding one of the plurality of shielding vias is disposed from the center of the first patch antenna pattern in the second direction.

Other features and aspects will be apparent from the following detailed description, the accompanying drawings, and the claims.

Drawings

Fig. 1A and 1B are a perspective view and a side view illustrating an example of a plurality of patch antenna patterns and a plurality of feed vias of an antenna device.

Fig. 2A and 2B are a side view and a top view, including a partial perspective view, showing a modified example in which the antenna apparatus of fig. 1A and 1B further includes a shielding via, a feeding pattern, and a slot.

Fig. 3A and 3B are side and top views illustrating a modified example in which the antenna apparatus of fig. 2A and 2B further includes a dummy via.

Fig. 4A is a top view showing an example of a ground plane of the antenna device.

Fig. 4B is a plan view showing an example of a feeder and a wired ground plane below the ground plane of fig. 4A.

Fig. 4C is a top view illustrating an example of the second ground plane and the routing vias below the routing ground plane of fig. 4B.

Fig. 4D is a top view illustrating an example of the routing vias, IC placement area, end fire antenna and IC ground plane below the second ground plane of fig. 4C.

Fig. 5A and 5B are side views illustrating the structure illustrated in fig. 4A to 4D and an example of the structure on the bottom surface thereof.

Fig. 6A and 6B are plan views showing examples of the arrangement of the antenna apparatus in the electronic device.

Like reference numerals refer to like elements throughout the drawings and the detailed description. The figures may not be drawn to scale and the relative sizes, proportions and depictions of the elements in the figures may be exaggerated for clarity, illustration and convenience.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, devices, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and/or systems described herein will be apparent to those skilled in the art upon review of the disclosure of this application. For example, the order of operations described herein is merely an example and is not limited to the order set forth herein, but rather, variations may be made in addition to operations which must occur in a particular order which will be apparent upon understanding the disclosure of the present application. Moreover, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent after understanding the disclosure of the present application.

The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. Further, while the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on," "connected to," or "coupled to" another element, the element may be directly "on," "connected to," or "coupled to" the other element, or one or more other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there may be no intervening elements present.

As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more of the items.

Although terms such as "first", "second", and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections are not limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section referred to in the examples described herein may be termed a second element, component, region, layer or section without departing from the teachings of the examples.

Spatially relative terms such as "above … …", "above", "below … …" and "below" may be used herein for ease of description to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be oriented "below" or "lower" relative to the other element. Thus, the term "above … …" includes both an orientation of above and below depending on the spatial orientation of the device. The device may also be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular is also intended to include the plural unless the context clearly dictates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.

Fig. 1A and 1B are a perspective view and a side view illustrating an example of a plurality of patch antenna patterns and a plurality of feed vias of an antenna device.

Referring to fig. 1A and 1B, the antenna apparatus includes a first patch antenna pattern 111A and a second patch antenna pattern 112a to transmit and receive Radio Frequency (RF) signals in a plurality of different frequency bands. The antenna device further includes a coupling patch pattern 115a to increase the frequency band of the second patch antenna pattern 112 a. The coupling patch pattern 115a may be omitted according to a bandwidth design condition.

In addition, the antenna apparatus includes first feed vias 121a and 121b, second feed vias 122a and 122b, and a ground plane 201 a.

The first patch antenna pattern 111a is electrically connected to one end of each of the first feed vias 121a and 121 b. Accordingly, the first patch antenna pattern 111a receives two first RF signals in a first frequency band (e.g., 28GHz) from the first feed vias 121a and 121b and transmits the received first RF signals, or receives the first RF signals and outputs the received first RF signals to the first feed vias 121a and 121 b.

The second patch antenna pattern 112a is electrically connected to one end of each of the second feed vias 122a and 122 b. Accordingly, the second patch antenna pattern 112a receives two second RF signals in a second frequency band (e.g., 39GHz) from the second feed vias 122a and 122b and transmits the received second RF signals, or receives the second RF signals and outputs the received second RF signals to the second feed vias 122a and 122 b.

The first patch antenna pattern 111a resonates in the first frequency band to receive energy corresponding to the first RF signal from the first feed vias 121a and 121b and radiate the received energy as the first RF signal, or to receive energy corresponding to the first RF signal and output the received energy as the first RF signal to the first feed vias 121a and 121b, and the second patch antenna pattern 112a resonates in the second frequency band to receive energy corresponding to the second RF signal from the second feed vias 122a and 122b and radiate the received energy as the second RF signal, or to receive energy corresponding to the second RF signal and output the received energy as the second RF signal to the second feed vias 122a and 122 b.

The first and second RF signals radiated through the first and second patch antenna patterns 111A and 112a are reflected by the ground plane 201A such that the radiation patterns of the first and second patch antenna patterns 111A and 112a are concentrated in a specific direction (for example, the Z direction as shown in fig. 1A and 1B). Accordingly, the gain of the first patch antenna pattern 111a and the gain of the second patch antenna pattern 112a are improved by the ground plane 201 a.

The resonant frequency of the first patch antenna pattern 111a depends on a combination of inductance and capacitance corresponding to the first patch antenna pattern 111a and a peripheral structure of the first patch antenna pattern 111a, and the resonant frequency of the second patch antenna pattern 112a depends on a combination of inductance and capacitance corresponding to the second patch antenna pattern 112a and a peripheral structure of the second patch antenna pattern 112 a.

The size of the top and/or bottom surface of each of the first and second patch antenna patterns 111a and 112a has an influence on the resonant frequency. For example, the size of the top and/or bottom surface of each of the first and second patch antenna patterns 111a and 112a depends on the first and second wavelengths corresponding to the first and second frequencies, respectively. When the first frequency (e.g., 28GHz as described above) is lower than the second frequency (e.g., 39GHz as described above), the size of the top and/or bottom surface of the first patch antenna pattern 111a is greater than the size of the top and/or bottom surface of the second patch antenna pattern 112 a.

At least a portion of the first patch antenna pattern 111a and at least a portion of the second patch antenna pattern 112a overlap each other when viewed in a vertical direction (e.g., Z direction). This enables the size of the antenna apparatus in the horizontal direction (e.g., X direction and/or Y direction) to be significantly reduced, thereby enabling the antenna apparatus to be easily miniaturized.

The first feed vias 121a and 121b and the second feed vias 122a and 122b penetrate through the respective through holes in the ground plane 201 a. Accordingly, one end of each of the first and second feed vias 121a and 121b and 122a and 122b is disposed above the ground plane 201a, and the other end of each of the first and second feed vias 121a and 121b and 122a and 122b is disposed below the ground plane 201 a. The other end of each of the first and second feed vias 121A and 121B and 122a and 122B is electrically connected to an Integrated Circuit (IC) (not shown in fig. 1A and 1B) to output and receive first and second RF signals to and from the IC. The electromagnetic isolation between the first and second patch antenna patterns 111a and 112a and the IC is improved by the ground plane 201 a.

The first feed vias 121a and 121b include 1 st-1 st and 1 st-2 nd feed vias 121a and 121b through which 1 st-1 st and 1 st-2 nd RF signals having different phases pass, respectively. The second feed vias 122a and 122b include 2-1 st and 2-2 nd feed vias 122a and 122b through which 2-1 st and 2-2 nd RF signals having different phases pass, respectively.

Thus, each of the first and second patch antenna patterns 111a and 112a receives two RF signals, which may be two carrier signals having different types of data encoded thereon. Accordingly, the data transmission and reception rate of each of the first and second patch antenna patterns 111a and 112a is doubled by the transmission and reception of two RF signals.

The 1 st-1 st and 1 st-2 nd RF signals have different phases (e.g., 90 degrees or 180 degrees out of phase) to reduce mutual interference, and the 2 nd-1 st and 2 nd-2 nd RF signals have different phases (e.g., 90 degrees or 180 degrees out of phase) to reduce mutual interference.

For example, the 1 st-1 st RF signal and the 2 nd-1 st RF signal each generate an electromagnetic wave in which an electric field and a magnetic field are perpendicular to each other (e.g., an electric field in the X direction and a magnetic field in the Y direction) and perpendicular to a propagation direction (e.g., the Z direction). Further, the 1 st-2 nd and 2 nd-2 nd RF signals each generate an electromagnetic wave in which an electric field and a magnetic field are perpendicular to each other (e.g., an electric field in the Y direction and a magnetic field in the X direction) and perpendicular to a propagation direction (e.g., the Z direction). Thus, the polarization of the electromagnetic waves generated by the 1 st-1 st RF signal is opposite to the polarization of the electromagnetic waves generated by the 1 st-2 nd RF signal. In addition, the polarization of the electromagnetic waves generated by the 2 nd-1 st RF signal is opposite to the polarization of the electromagnetic waves generated by the 2 nd-2 nd RF signal. To achieve this, in the first and second patch antenna patterns 111a and 112a, surface currents corresponding to the 1 st-1 st and 2 nd-1 st RF signals flow perpendicular to each other, and surface currents corresponding to the 1 st-2 nd and 2 nd-2 nd RF signals flow perpendicular to each other.

Accordingly, the 1 st-1 and 2 nd-1 feed vias 121a and 122a are connected to the first and second patch antenna patterns 111a and 112a near edges of the first and second patch antenna patterns 111a and 112a in one direction (e.g., Y direction), and the 1 st-2 and 2 nd-2 feed vias 121b and 122b are connected to the first and second patch antenna patterns 111a and 112a near edges of the first and second patch antenna patterns 111a and 112a in another direction (e.g., X direction) perpendicular to the one direction. However, the specific connection point may vary depending on the design of the antenna device.

The shorter the electrical length from the first and second patch antenna patterns 111a and 112a to the IC, the less the energy loss of the first and second RF signals in the antenna device. Since the heights of the first and second patch antenna patterns 111a and 112a and the IC in the vertical direction (e.g., the Z direction) are relatively short, the first feed vias 121a and 121b enable the electrical distance between the first patch antenna pattern 111a and the IC to be easily reduced, and the second feed vias 122a and 122b enable the electrical distance between the second patch antenna pattern 112a and the IC to be easily reduced.

When at least a portion of the first patch antenna pattern 111a and at least a portion of the second patch antenna pattern 112a overlap each other when viewed in the Z direction, the second feeding vias 122a and 122b may penetrate the first patch antenna pattern 111a to enable the second feeding vias 122a and 122b to be electrically connected to the second patch antenna pattern 112 a.

Accordingly, transmission energy loss of the first and second RF signals in the antenna device may be reduced, and connection points of the first feed vias 121a and 121b and the first patch antenna pattern 111a and connection points of the second feed vias 122a and 122b and the second patch antenna pattern 112a may be more freely selected.

The connection point of the first feed vias 121a and 121b and the connection point of the second feed vias 122a and 122b affect the impedance of the patch antenna patterns 111a and 112 a. The closer the impedance of the patch antenna pattern 111a is matched to the transmission line impedance (e.g., 50 ohms) of the transmission line transmitting the 1 st-1 st and 2 nd RF signals to the first feed vias 121a and 121b and the impedance of the patch antenna pattern 112a is matched to the transmission line impedance (e.g., 50 ohms) of the transmission line transmitting the 2 nd-1 st and 2 nd RF signals to the second feed vias 122a and 122b, the more reflection loss in the transmission line is reduced. Accordingly, when the degree of freedom of selection of the connection point of the first feed vias 121a and 121b and the connection point of the second feed vias 122a and 122b is high, the gain of the first patch antenna pattern 111a and the gain of the second patch antenna pattern 112a may be more easily increased.

However, when the second feeding vias 122a and 122b penetrate the first patch antenna pattern 111a, the second feeding vias 122a and 122b are affected by the first RF signal radiated from the first patch antenna pattern 111 a. Accordingly, an electromagnetic isolation between the first RF signal and the second RF signal is reduced, resulting in a reduction in gain of each of the first and second patch antenna patterns 111a and 112 a.

Fig. 2A and 2B are a side view and a top view, including a partial perspective view, showing a modified example in which the antenna apparatus of fig. 1A and 1B further includes a shielding via, a feeding pattern, and a slot.

Referring to fig. 2A and 2B, the modified example of the antenna device further includes a plurality of shielded vias 131a surrounding the second feed via 122A and a plurality of shielded vias 131B surrounding the second feed via 122B.

The plurality of shielded vias 131a and 131b electrically connect the first patch antenna pattern 111a and the ground plane 201a to each other. Accordingly, the first RF signal radiated from the first patch antenna pattern 111a toward the second feed vias 122a and 122b is reflected by the plurality of shielding vias 131a and 131 b. Accordingly, the electromagnetic isolation between the first RF signal and the second RF signal is improved, resulting in an improved gain of each of the first and second patch antenna patterns 111a and 112 a.

The number and width of the plurality of shielded vias 131a and 131b are not limited. When the space between the plurality of shielded vias 131a and the space between the plurality of shielded vias 131b is short compared to a certain length (e.g., a length depending on the first wavelength of the first RF signal), the first RF signal cannot substantially pass through the space between the plurality of shielded vias 131a and the space between the plurality of shielded vias 131 b. Therefore, the electromagnetic isolation between the first RF signal and the second RF signal is further improved.

Referring to fig. 2A and 2B, the antenna apparatus further includes feeding patterns 132A and 132B.

The feeding pattern 132a is disposed between the first and second patch antenna patterns 111a and 112a, and one end of the feeding pattern 132a is electrically connected to the second feeding via hole 122a, and the other end of the feeding pattern 132a is electrically connected to the second patch antenna pattern 112a at a point closer to one edge of the second patch antenna pattern 112a than the second feeding via hole 122 a. Further, the feeding pattern 132b is disposed between the first and second patch antenna patterns 111a and 112a, and one end of the feeding pattern 132b is electrically connected to the second feeding via 122b, and the other end of the feeding pattern 132b is electrically connected to the second patch antenna pattern 112a at a point closer to the other edge of the second patch antenna pattern 112a than the second feeding via 122 b.

For example, the 2-3 feeding via 122c electrically connects the feeding pattern 132a and the second patch antenna pattern 112a to each other, and the 2-4 feeding via 122d electrically connects the feeding pattern 132b and the second patch antenna pattern 112a to each other. The feed pattern 132a may include the 2 nd-3 rd feed via 122c or may be connected to the 2 nd-3 rd feed via 122c, and the feed pattern 132b may include the 2 nd-4 th feed via 122d or may be connected to the 2 nd-4 th feed via 122 d.

Since the through hole of the first patch antenna pattern 111a and the plurality of shielding vias 131a and 131b serve as an obstacle to surface current corresponding to the first RF signal, a negative effect of the first RF signal on the second feed vias 122a and 122b is reduced.

The closer the connection point of the second feed vias 122a and 122b is to the edge of the second patch antenna pattern 112a, the more advantageous for transmission line impedance matching.

When the first optimal positions of the through holes of the first patch antenna pattern 111a and the shielding vias 131a and 131b do not match the second optimal positions at which the second feeding vias 122a and 122b are connected to the second patch pattern 112a, the feeding patterns 132a and 132b enable both the first optimal positions and the second optimal positions to be implemented.

Accordingly, the gain of each of the first and second patch antenna patterns 111a and 112a is improved.

In addition, the through hole of the first patch antenna pattern 111a and the shielding vias 131a and 131b serve as obstacles to surface currents corresponding to the first RF signal. Accordingly, the longer the electrical distance between the first feed vias 121a and 121b and the shield vias 131a and 131b, to which the first RF signal is transmitted, the less negative influence is exerted on the first RF signal.

Due to the feeding pattern 132a, the spaced distance between the first and second feeding vias 121a and 122a may be easily increased, and due to the feeding pattern 132b, the spaced distance between the first and second feeding vias 121b and 122b may be easily increased.

For example, the first feed vias 121a and 121b may be more offset in a direction from the center to the edge of the first patch antenna pattern 111a than the second feed vias 122a and 122b to be electrically connected to the first patch antenna pattern 111 a. For example, connection points at which the first feed vias 121a and 121b are electrically connected to the first patch antenna pattern 111a are farther from the center of the first patch antenna pattern 111a in one direction than through holes through which the second feed vias 122a and 122b penetrate the first patch antenna pattern 111a are from the center of the first patch antenna pattern 111a in another direction opposite to the one direction. Further, a connection point at which the second feed vias 122a and 122b are electrically connected to the second patch antenna pattern 112a may be close to an edge of the second patch antenna pattern 112a in the other direction, compared to a connection point at which the first feed vias 121a and 121b are electrically connected to the first patch antenna pattern 111a to an edge of the first patch antenna pattern 111a in the one direction.

The electrical connection point of the first patch antenna pattern 111a may be offset more from the center of the first patch antenna pattern 111a and the center of the second patch antenna pattern 112a in the horizontal direction than the electrical connection point of the second patch antenna pattern 112 a. For example, the first feed vias 121a and 121b may be more offset in an edge direction than electrical connection points of the feed patterns 132a and 132b to the second patch antenna pattern 112a to be electrically connected to the first patch antenna pattern 111 a.

Accordingly, in the first patch antenna pattern 111a, the negative effects of the through hole and the plurality of shielding vias 131a and 131b on the first RF signal are reduced. Accordingly, the gain of the first patch antenna pattern 111a is further improved.

Referring to fig. 2A and 2B, the coupling patch pattern 115a has a slot 133 a. Although the coupling patch pattern 115a has been omitted in fig. 2B for clarity of illustration, the slot 133a is shown in fig. 2B to illustrate its position relative to other elements.

The coupling patch pattern 115a provides additional capacitance and additional inductance such that the second patch antenna pattern 112a has an extrinsic resonance frequency, thereby increasing the bandwidth of the second patch antenna pattern 112 a. In this case, the extrinsic resonance frequency is determined based on the area of the coupling patch pattern 115a and the spaced distance between the coupling patch pattern 115a and the second patch antenna pattern 112 a.

The extrinsic resonance frequency of the second patch antenna pattern 112a is lower than the intrinsic resonance frequency. Although fig. 2A illustrates that the size of the coupling patch pattern 115a is slightly smaller than that of the second patch antenna pattern 112A, the size of the coupling patch pattern 115a may be the same as that of the second patch antenna pattern 112A or larger than that of the second patch antenna pattern 112A according to a desired extrinsic resonance frequency. The eigenresonance frequency is determined by the eigenparameters of the patch antenna pattern, such as the shape, size, height, and dielectric constant of the insulating layer.

The coupling patch pattern 115a is also electromagnetically coupled to the first patch antenna pattern 111 a. As a result, the electromagnetic isolation between the first RF signal and the second RF signal is reduced.

Accordingly, the coupling patch pattern 115a has the slot 133a such that the surface current in the coupling patch pattern 115a flows while bypassing the slot 133 a. For example, an electrical distance according to the surface current is increased by the slot 133a of the coupling patch pattern 115 a. Accordingly, the size of the coupling patch pattern 115a having the slot 133a may be smaller than the size of the coupling patch pattern 115a without the slot 133a, while still lowering the extrinsic resonance frequency. In addition, the electromagnetic isolation between the first RF signal and the second RF signal is increased.

The size of the second patch antenna pattern 112a is smaller than that of the first patch antenna pattern 111a and larger than that of the coupling patch pattern 115 a. This causes the electromagnetic coupling of the coupling patch pattern 115a to be further concentrated on the second patch antenna pattern 112a, thereby increasing the electromagnetic isolation between the first RF signal and the second RF signal.

In addition, the second patch antenna pattern 112a has a shape without a hole (e.g., a through hole, a slot, or any other hole). This causes the electromagnetic coupling of the coupling patch pattern 115a to be further concentrated on the second patch antenna pattern 112a, thereby increasing the electromagnetic isolation between the first RF signal and the second RF signal.

A spacing distance between the first patch antenna pattern 111a and the second patch antenna pattern 112a is shorter than a spacing distance between the second patch antenna pattern 112a and the coupling patch pattern 115 a.

Since the separation distance between the first and second patch antenna patterns 111a and 112a is reduced, the feeding patterns 132a and 132b are further electromagnetically isolated from the outside of the first and second patch antenna patterns 111a and 112a, and the electromagnetic coupling of the coupling patch pattern 115a is further concentrated on the second patch antenna pattern 112 a. As a result, the gain and bandwidth of the second patch antenna pattern 112a are further improved.

Referring to fig. 2A and 2B, the antenna apparatus further includes a peripheral shielding member 180a surrounding the first and second patch antenna patterns 111a and 112A. The peripheral shield member 180a is electrically connected to the ground plane 201a by a peripheral via 185 a. The peripheral shield member 180a improves the electromagnetic isolation between the antenna device in fig. 2A and 2B and the adjacent antenna device. In the example shown in fig. 2A and 2B, the peripheral shielding members 180a each include a combination of horizontal patterns and vertical vias, but are not limited thereto. The peripheral shield member 180a and the peripheral via 185a may be omitted depending on the design of the antenna apparatus.

Referring to fig. 2A and 2B, the first feed via 121a includes a supporting pattern 124a having a width greater than that of the first feed via 121a, the second feed via 122A includes similar supporting patterns 125a and 126a, and each of the shielding vias 131a includes a similar supporting pattern 136 a. Although not shown in fig. 2A and 2B, the first feed via 121B, the second feed via 122B, and the shield via 131B include similar support patterns. However, similar support patterns of the support patterns 124a, 125a, 126a, and 136a and the first feed via 121b, the second feed via 122b, and the shield via 131b may be omitted according to the design of the antenna device.

The dielectric layer 150a fills in the space between the various elements between the ground plane 201a and the coupling patch pattern 115 a.

Fig. 3A and 3B are side and top views illustrating a modified example in which the antenna apparatus of fig. 2A and 2B further includes a dummy via.

Referring to fig. 3A and 3B, the modified example of the antenna apparatus of fig. 2A and 2B further includes a plurality of dummy vias 134a and 134B.

The plurality of dummy vias 134a are offset from the center of the first patch antenna pattern 111a in a direction opposite to a direction in which the plurality of shield vias 131a are offset from the center of the first patch antenna pattern 111 a. In addition, the plurality of dummy vias 134b are offset from the center of the first patch antenna pattern 111a in a direction opposite to a direction in which the plurality of shield vias 131b are offset from the center of the first patch antenna pattern 111 a.

Each of the dummy vias 134a includes a support pattern 135a having a width greater than that of the first dummy via 134 a. Although not shown in fig. 3A and 3B, each of the dummy vias 134B includes a similar support pattern. However, similar support patterns of the support pattern 135a and the dummy via 134b may be omitted according to the design of the antenna device.

The plurality of dummy vias 134a and 134b electrically connect the first patch antenna pattern 111a and the ground plane 201a to each other.

Accordingly, the plurality of shielded vias 131a and the plurality of dummy vias 134a are arranged to be generally symmetrical to each other, and the plurality of shielded vias 131b and the plurality of dummy vias 134b are arranged to be generally symmetrical to each other, with respect to the center of the first patch antenna pattern 111 a.

Although the connection point of the first feed via 121a receiving the 1 st-1 st RF signal and the connection point of the first feed via 121b receiving the 1 st-2 nd RF signal are different from each other in the first patch antenna pattern 111a, since a plurality of vias electrically connected to the first patch antenna pattern 111a are substantially symmetrically arranged with each other, the electrical characteristics of the surface current generated by the 1 st-1 st RF signal and the electrical characteristics of the surface current generated by the 1 st-2 nd RF signal are similar to each other. The higher the similarity of the electrical characteristics of the surface currents generated by the 1 st-1 st RF signals to the electrical characteristics of the surface currents generated by the 1 st-2 nd RF signals, the less the mutual interference between the 1 st-1 st RF signals and the 1 st-2 nd RF signals.

Accordingly, the plurality of dummy vias 134a and 134b increases the overall symmetry of the arrangement of the plurality of vias electrically connected to the first patch antenna pattern 111a, thereby reducing interference between the 1 st-1 st and 1 st-2 nd RF signals and increasing the overall gain of the first patch antenna pattern 111 a.

The plurality of dummy vias 134a are disposed to be symmetrical to the plurality of shielded vias 131a with respect to the center of the first patch antenna pattern 111a, and the plurality of dummy vias 134b are disposed to be symmetrical to the plurality of shielded vias 131b with respect to the center of the first patch antenna pattern 111 a. Accordingly, the plurality of dummy vias 134a and 134b further increases the overall symmetry of the arrangement of the plurality of vias electrically connected to the first patch antenna pattern 111a, thereby reducing interference between the 1 st-1 st and 1 st-2 nd RF signals and increasing the overall gain of the first patch antenna pattern 111 a.

Fig. 4A is a top view showing an example of a ground plane of the antenna device. Fig. 4B is a plan view showing an example of a feeder and a wired ground plane below the ground plane of fig. 4A. Fig. 4C is a top view illustrating an example of the second ground plane and the routing vias below the routing ground plane of fig. 4B. Fig. 4D is a top view illustrating an example of the routing vias, IC placement area, end fire antenna and IC ground plane below the second ground plane of fig. 4C.

Referring to fig. 4A to 4D, the feed via 120a corresponds to the first and second feed vias 121a and 121b and 122a and 122b described above. The plurality of antenna apparatuses may be arranged in a horizontal direction (for example, in either or both of the X direction and the Y direction).

Referring to fig. 4A, a ground plane 201A has a through hole through which a feed via 120a passes, and provides electromagnetic shielding between patch antenna patterns (such as the first and second patch antenna patterns 111A and 112a shown in fig. 1A to 3B) and a feed line of an antenna device. The peripheral via 185a extends in the Z-direction (e.g., as shown in fig. 2B and 3B) over the ground plane 201 a.

Referring to fig. 4B, the wired ground plane 202a shields at least a portion of the end-fire antenna feed line 220a and the feed line 221 a. One end of each of the endfire antenna feed lines 220a is electrically connected to a respective one of the second routing vias 232a, and the other end of each of the endfire antenna feed lines 220a is electrically connected to a respective one of the endfire antenna feed vias 211 a. One end of each of the feed lines 221a is electrically connected to a corresponding one of the first routing vias 231a, and the other end of each of the feed lines 221a is electrically connected to a corresponding one of the feed vias 120 a. The wiring ground plane 202a provides electromagnetic shielding between the endfire antenna feed line 220a and the feed line 221 a.

Referring to fig. 4C, the second ground plane 203a has through holes through which the first and second routing vias 231a and 232a pass, and includes a coupling ground pattern 235 a. The second ground plane 203a provides electromagnetic shielding between the endfire antenna feed line 220a and the feed line 221a and the IC.

Referring to fig. 4D, the IC ground plane 204a has through holes through which the first and second routing vias 231a and 232a penetrate. As shown by the dashed box in fig. 4D, the IC 310 is disposed below the IC ground plane 204a and is electrically connected to the first and second routing vias 231a and 232 a. The end-fire antenna pattern 210a and the director pattern 215a are disposed at substantially the same height as the IC ground plane 204a to form an end-fire antenna.

The IC ground plane 204a may include circuit patterns and ground patterns to connect the IC 310 to one or more passive components. Depending on the design of the antenna device, the IC ground plane 204a may include circuit patterns and ground patterns to provide power and signals to the IC 310 and one or more passive components. Thus, IC ground plane 204a may be electrically connected to IC 310 and one or more passive components.

The wiring ground plane 202a, the second ground plane 203a, and the IC ground plane 204a have a concave shape to provide cavities at their edges. This enables the end-fire antenna pattern 210a to be disposed closer to the IC ground plane 204 a.

The vertical relationship and shape of the wired ground plane 202a, the second ground plane 203a, and the IC ground plane 204a may vary depending on the design of the antenna device.

Fig. 5A and 5B are side views illustrating the structure illustrated in fig. 4A to 4D and an example of the structure on the bottom surface thereof.

Referring to fig. 5A, an example of an antenna apparatus includes a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, a passive component 350, and a core member 410.

The connection member 200 has a structure in which a plurality of metal layers and a plurality of insulation layers having patterns are stacked, as in a Printed Circuit Board (PCB). The connection member 200 represents the structure shown in fig. 4A to 4D.

The IC 310 is the IC described above in connection with fig. 4D and is mounted on the bottom surface of the connecting member 200. The IC 310 is electrically connected to the routing vias (e.g., the first and second routing vias 231a and 232a in fig. 4D) of the connection member 200 or the circuit pattern of the connection member 200 to transmit and receive the RF signal, and the IC 310 is electrically connected to one or more ground planes or ground patterns of the connection member 200 to be grounded. For example, IC 310 may perform at least some of frequency conversion, amplification, filtering, phase control, and power generation to produce an RF signal from a baseband or Intermediate Frequency (IF) signal, and to produce a baseband or IF signal from the RF signal.

The adhesive member 320 bonds the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 electrically connects the IC 310 and the connection member 200 to each other. For example, the electrical connection structure 330 may have structures such as solder balls, pins, pads, and pads. The melting point of the electrical connection structure 330 is lower than that of the wiring and ground plane of the connection member 200, enabling the IC 310 and the connection member 200 to be electrically connected to each other using a predetermined connection process using the lower melting point of the electrical connection structure 330.

The encapsulant 340 encapsulates the IC 310 and improves the heat radiation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be a photosensitive encapsulant (PIE), ABF (Ajinomoto Build-up Film), or Epoxy Molding Compound (EMC).

The passive component 350 is mounted on the bottom surface of the connection member 200 and is electrically connected to either or both of the circuit pattern and the ground plane or the ground pattern of the connection member 200 through an electrical connection structure (not shown). For example, the passive component 350 may be a capacitor (e.g., a multilayer ceramic capacitor (MLCC)), an inductor, or a chip resistor. Encapsulant 340 also encapsulates passive components 350.

The core member 410 is disposed below the connection member 200 and electrically connected to the connection member 200 to receive an IF signal or a baseband signal from an external component and transmit the IF signal or the baseband signal to the IC 310, or to receive an IF signal or a baseband signal from the IC and transmit the IF signal or the baseband signal to the external component. The frequency of the RF signal (e.g., 24GHz, 28GHz, 36GHz, 39GHz, or 60GHz) is higher than the frequency of the IF signal (e.g., 2GHz, 5GHz, or 10 GHz).

For example, as with the IC ground plane 204a in fig. 4D, the core member 410 may transmit or receive an IF signal or a baseband signal to or from the IC 310 through the circuit pattern and the ground pattern of the IC ground plane of the connection member 200. The first ground layer of the connection member 200 is disposed between the IC ground plane and the circuit pattern, enabling the IF signal or the baseband signal to be electrically isolated from the RF signal in the antenna apparatus.

Referring to fig. 5B, another example of an antenna apparatus omits the core member 410 of fig. 5A, but includes a shielding member 360, a connector 420, and an end-fire patch antenna 430.

The shielding member 360 is disposed under the connection member 200 to shield the IC 310 together with the passive components 350 and a portion of the connection member 200. For example, the shielding member 360 may be configured to conformally shield the IC 310 and the passive components 350 together, or to separately shield the IC 310 and the passive components 350 at intervals. For example, the shielding member 360 may have a hexahedral shape with one open side, and a hexahedral receiving space may be formed by being combined with the connection member 200. The shielding member 360 may be made of a material having high conductivity, such as copper, to have a shallow skin depth, and is electrically connected to the ground plane of the connection member 200. Accordingly, the shielding member 360 reduces electromagnetic noise applied to the IC 310 and the passive components 350.

The connector 420 may be a connector for a cable (such as a coaxial cable) or a flexible PCB, electrically connected to the IC ground plane of the connection member 200, and performs a function similar to that of the core member 410 in fig. 5A. For example, the connector 420 may receive an IF signal or a baseband signal and power from the cable or may output the IF signal or the baseband signal and power to the cable.

The end-fire patch antenna 430 transmits or receives RF signals to assist the antenna apparatus. For example, the end-fire patch antenna 430 includes: a dielectric block having a dielectric constant greater than that of the insulating layer of the connection member 200; and two electrodes disposed on opposite surfaces of the dielectric block. One of the two electrodes is electrically connected to the circuit pattern of the connection member 200, and the other of the two electrodes is electrically connected to the ground plane or the ground pattern of the connection member 200.

Fig. 6A and 6B are plan views showing examples of the arrangement of the antenna apparatus in the electronic device.

Referring to fig. 6A, an antenna apparatus 1140g including a patch antenna pattern 100g is disposed in an inner corner of a case of an electronic device 700g on a substrate 600g of the electronic device 700 g.

The electronic device 700g may be, but is not limited to, a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet PC, a laptop computer, a netbook, a television, a video game console, a smart watch, or an automotive component.

A communication module 610g and a baseband circuit 620g are also provided on the substrate 600 g. The antenna apparatus is electrically connected to either or both of the communication module 610g and the baseband circuit 620g through a coaxial cable 630 g.

The communication module 610g includes at least some of the following: a memory chip such as a volatile memory (e.g., Dynamic Random Access Memory (DRAM)) or a non-volatile memory (e.g., Read Only Memory (ROM)) or a flash memory; an application processor chip, such as a central processing unit (e.g., Central Processing Unit (CPU)), a graphics processor (e.g., Graphics Processing Unit (GPU)), a digital signal processor, a cryptographic processor, a microprocessor, or a microcontroller; and logic chips such as analog-to-digital converters or application specific ics (asics).

The baseband circuit 620g generates a baseband signal or an IF signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal, and generates an analog signal by performing frequency conversion, filtering, amplification, and digital-to-analog conversion on the baseband signal or the IF signal. The baseband signal or the IF signal is transmitted to or received from the antenna apparatus through the coaxial cable 630 g.

For example, like the IC 310 in fig. 4D, 5A, and 5B, a baseband signal or an IF signal may be transmitted to or received from the IC of the antenna apparatus through the electrical connection structure, the via hole, the circuit pattern, and the ground pattern. The IC converts a baseband signal or an IF signal into an RF signal in a millimeter wave (mmWave) band for transmission, and converts a received RF signal into a baseband signal or an IF signal.

Referring to fig. 6B, two antenna devices each including a patch antenna pattern 100i are disposed adjacent to the center of the inside of the case of the polygonal electronic device 700i on the substrate 600i of the electronic device 700 i. The communication module 610i and the baseband circuit 620i are further disposed on the substrate 600 i. The antenna apparatus is electrically connected to either or both of the communication module 610i and the baseband circuit 620i through a coaxial cable 630 i.

The dielectric layer 150a in fig. 2A and 3A and the insulating layer of the connection member 200 in fig. 5A and 5B may be made using a Liquid Crystal Polymer (LCP), a low temperature co-fired ceramic (LTCC), a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide resin, or a resin (e.g., a prepreg, ABF (Ajinomoto Build-up Film), FR-4, Bismaleimide Triazine (BT) resin, a photo dielectric (PID) resin, a Copper Clad Laminate (CCL), or a glass or ceramic based insulating material) of a thermosetting resin or a thermoplastic resin impregnated in a core material such as a glass fiber, a glass cloth, or a glass cloth together with an inorganic filler.

The various patterns, vias, ground planes, feed lines, and electrical connection structures disclosed herein may include a metal material (e.g., a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy of any two or more thereof), and may be formed by a plating method such as Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), sputtering, a subtractive process, an additive process, a semi-additive process (SAP), or a modified semi-additive process (mSAP). However, the plating method is not limited thereto.

The RF signals disclosed herein may have a format according to the following protocol: Wi-Fi (IEEE 802.11 family), Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 family), IEEE 802.20, Long Term Evolution (LTE), evolution data optimized (EV-DO), evolved high speed packet Access + (HSPA +), High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), enhanced data rates for GSM evolution (EDGE), Global System for Mobile communications (GSM), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, 3G, 4G, and 5G, and any other wireless or wired protocol, but is not limited thereto.

The examples of the antenna apparatus described herein improve antenna performance (e.g., gain, bandwidth, directivity, and transmission-reception rate) or can be easily miniaturized while providing the ability to transmit and receive RF signals in different frequency bands.

In addition, the examples of the antenna device described herein reduce the overall size of the antenna device due to the compact arrangement of the patch antenna patterns, reduce transmission line energy loss, while increasing the degree of freedom of transmission line impedance matching for different frequency bands, increasing the degree of isolation between different frequency bands, increasing the gain of each of the different frequency bands, and more efficiently radiating multiple RF signals having different polarizations.

While the present disclosure includes particular examples, it will be apparent, after understanding the disclosure of the present application, that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each example will be considered applicable to similar features or aspects in other examples. Suitable results may be obtained if the described techniques were performed in a different order and/or if components in the described systems, architectures, devices, or circuits were combined in a different manner and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all changes within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.