Antenna using multi-feed and electronic device including the same

文档序号：1117308 发布日期：2020-09-29 浏览：28次中文

阅读说明：本技术 使用多馈电的天线及包括该天线的电子装置 (Antenna using multi-feed and electronic device including the same ) 是由尹洙旻朴世铉郑明勳郑载勳赵宰熏郑镇佑千载奉于 2019-02-14 设计创作，主要内容包括：根据各种实施例,一种电子装置可以包括：壳体,包括第一板、定向为与第一板相对的第二板、以及围绕第一板与第二板之间的空间的侧构件；以及天线结构,包括平行于第二板的至少一个平面,其中,天线结构包括设置在平面上的第一元件、当从平面上方观察时在平面上与第一元件隔开的第二元件,以及当从平面上方观察时在平面上与第二元件隔开的第三元件,第二元件设置在第一元件与第三元件之间；无线通信电路,电气上配置为发送和接收具有10GHz至100GHz频率范围的信号,其中,无线通信电路包括连接到第一元件的第一电路径、连接到第二元件上的第一点的第二电路径(第一点离第一元件比离第三元件更近)、连接到第二元件上的第二点的第三电路径(第二点离第三元件比离第一元件更近),以及连接到第三元件的第四电路径,并且无线通信电路配置为提供来自第一点的第一信号与来自第二点的第二信号之间的相位差。各种其它实施例也是可行的。(According to various embodiments, an electronic device may include: a housing including a first plate, a second plate oriented opposite the first plate, and a side member surrounding a space between the first plate and the second plate; and an antenna structure including at least one plane parallel to the second plate, wherein the antenna structure includes a first element disposed on the plane, a second element spaced apart from the first element on the plane when viewed from above the plane, and a third element spaced apart from the second element on the plane when viewed from above the plane, the second element being disposed between the first element and the third element; a wireless communication circuit electrically configured to transmit and receive signals having a frequency range of 10GHz to 100GHz, wherein the wireless communication circuit includes a first electrical path connected to the first element, a second electrical path connected to a first point on the second element (the first point being closer to the first element than to the third element), a third electrical path connected to a second point on the second element (the second point being closer to the third element than to the first element), and a fourth electrical path connected to the third element, and the wireless communication circuit is configured to provide a phase difference between a first signal from the first point and a second signal from the second point. Various other embodiments are also possible.)

1. An electronic device, comprising:

a housing including a first plate, a second plate oriented in an opposite direction from the second plate, and a side member surrounding a space between the first plate and the second plate;

an antenna structure comprising at least one plane parallel to the first board and comprising a first antenna element arranged on the plane; and

a wireless communication circuit electrically configured to transmit and receive signals having a frequency range of 10GHz to 100GHz,

wherein the wireless communication circuit includes electrical paths electrically connected to a plurality of points spaced apart from each other on the first antenna element, respectively, and

wherein the wireless communication circuit provides at least one phase difference between at least two signals from the plurality of points.

2. The electronic device of claim 1, wherein at least two of the at least a plurality of points are symmetrical to each other with respect to a center of the first antenna element.

3. The electronic device of claim 2, wherein the first antenna element is symmetric with respect to an imaginary line passing through a center of the first antenna element, and

wherein the plurality of points include a first point disposed on one side of the first element with respect to the line, and a second point disposed on the other side with respect to the line, symmetrical to the first point.

4. The electronic device according to claim 3, wherein the first antenna element comprises a third point arranged at 90 degrees to the first point with respect to the center, and a fourth point arranged symmetrically to the third point on the first antenna element, and

wherein the third point and the fourth point are electrically connected to the wireless communication circuit.

5. The electronic device of claim 1, further comprising:

a substrate in which a plurality of insulating layers are laminated,

wherein the first antenna element is disposed on a first plane in the insulating layer of the substrate.

6. The electronic device of claim 5, wherein the wireless communication circuit is electrically connected to the first antenna element using the electrical path arranged to extend through the insulating layer of the substrate.

7. The electronic device of claim 5, wherein the electrical path is electrically connected to at least two conductive pads correspondingly arranged in the insulating layer of the substrate on a second plane different from the first plane, and

wherein the at least two conductive pads are positioned such that the at least two conductive pads can be capacitively coupled to the first antenna element.

8. The electronic device of claim 5, further comprising:

a second antenna element disposed on a third plane in the insulating layer, spaced apart from the first antenna element,

wherein at least two second conductive pads are arranged between the first antenna element and the second antenna element, an

Wherein the second antenna element is positioned such that the second antenna element can be capacitively coupled to the at least two second conductive pads.

9. The electronic device of claim 8, wherein the wireless communication circuitry transmits or receives signals having a first frequency band through the first antenna element and transmits or receives signals having a second frequency band different from the signals having the first frequency band through the second antenna element.

10. The electronic device of claim 1, further comprising:

a switching device configured to selectively switch the plurality of electrical paths.

11. The electronic device of claim 1, further comprising:

at least one conductive pattern disposed on a periphery of the first antenna element and electrically connected to the wireless communication circuit at least two points.

12. The electronic device of claim 11, wherein the at least one conductive pattern comprises a dipole antenna or a folded dipole antenna.

13. The electronic device of claim 12, wherein the at least one conductive pattern comprises first and second conductive patterns electrically connected to the wireless communication circuitry.

14. The electronic device of claim 1, further comprising:

a base plate including a first surface positioned to face the first plate and a second surface positioned to face the second plate,

wherein the first antenna element is disposed on the second surface.

15. The electronic device of claim 1, wherein the first antenna element comprises a metal pattern formed on the substrate, a metal plate attached to the substrate, a Flexible Printed Circuit Board (FPCB), or a conductive paint coated on the substrate.

Technical Field

Various embodiments of the present disclosure relate to an antenna using multi-feeding and an electronic device including the same.

Background

With the development of wireless communication technology, electronic devices (e.g., electronic devices for communication) have been commonly used in daily life, and thus, the use of content has exponentially increased. With the rapid increase in the use of content, network capacity has reached a limit, and in response to the demand for low-latency data communication, high-speed wireless communication technologies such as wireless gigabit alliance (WIGIG) (e.g., 802.11AD) or next-generation wireless communication technologies (e.g., 5G communication) have been developed.

Disclosure of Invention

Technical problem

In the next-generation wireless communication technology, millimeter waves having a frequency of 20GHz or more can be used in large quantities, and in order to increase antenna gain and overcome high free space loss due to frequency characteristics, an array structure in which a plurality of antenna elements are arranged at predetermined intervals may be used. The larger the number of element antenna elements, the larger the gain of the array antenna. However, the volume of the antenna increases, and thus, the installation of the antenna in the electronic device may be difficult.

To reduce the volume of the antenna, the spacing between the antenna elements may be reduced to reduce the antenna electronics volume. However, in this method, since the interval between the antenna elements is reduced, mutual interference increases, and thus the overall gain of the antenna may be reduced. In addition, the antenna elements are mounted on several surfaces of the substrate in order to maintain the number of the antenna elements and to reduce the size of the antenna. However, since the antennas have different directivities, it is difficult to obtain the effect of the array antenna caused by the constructive interference.

Various embodiments of the present disclosure may provide an antenna using multi-feeding and an electronic device including the same.

Various embodiments of the present disclosure may provide an antenna using multi-feeding and an electronic device including the same, capable of reducing a drop in antenna gain and reducing an installation space of the antenna.

Problem solving scheme

According to various embodiments, an electronic device may include: a housing including a first plate, a second plate oriented opposite the first plate, and a side member surrounding a space between the first plate and the second plate; an antenna structure including at least one plane parallel to the second plate, wherein the antenna structure includes a first element disposed on the plane, a second element spaced apart from the first element on the plane when viewed from above the plane, and a third element spaced apart from the second element on the plane when viewed from above the plane, the second element being disposed between the first element and the third element; and a wireless communication circuit electrically configured to transmit and receive signals having a frequency range of 10GHz to 100GHz, wherein the wireless communication circuit comprises a first electrical path connected to the first element, a second electrical path connected to a first point on the second element (the first point being closer to the first element than to the third element), a third electrical path connected to a second point on the second element (the second point being closer to the third element than to the first element), and a fourth electrical path connected to the third element, and wherein the wireless communication circuit is configured to provide a phase difference between the first signal from the first point and the second signal from the second point.

Advantageous effects of the invention

According to various embodiments of the present disclosure, the number of antenna elements is reduced by multi-feeding while the number of feeding ports remains unchanged. Accordingly, a reduction in gain is minimized, and the entire antenna volume is reduced so that the volume of the electronic device can be reduced.

Drawings

FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;

fig. 2a is a perspective view of a mobile electronic device according to various embodiments of the present disclosure;

fig. 2b is a rear perspective view of the electronic device shown in fig. 2a, according to various embodiments of the present disclosure;

fig. 2c is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

fig. 3a is a diagram illustrating an example of an electronic device supporting 5G communication according to various embodiments of the present disclosure;

fig. 3b is a block diagram of a communication device according to various embodiments of the present disclosure;

fig. 4a is a perspective view of a communication device according to various embodiments of the present disclosure;

fig. 4b is a cross-sectional view of a stacked structure of the communication device shown in fig. 4a, according to various embodiments of the present disclosure;

fig. 4c is a diagram illustrating an electric field distribution of the communication device shown in fig. 4a, according to various embodiments of the present disclosure;

fig. 4 d-4 f are cross-sectional views of various stacked structures of a communication device according to various embodiments of the present disclosure;

fig. 5 is a perspective view of a communication device according to various embodiments of the present disclosure;

fig. 6 is a diagram illustrating a configuration of a communication apparatus according to various embodiments of the present disclosure;

fig. 7a is a diagram illustrating a configuration of a communication device according to various embodiments of the present disclosure;

fig. 7b is a configuration diagram illustrating a feeding structure of the communication device shown in fig. 7a according to various embodiments of the present disclosure;

fig. 7c is a configuration diagram illustrating a feeding structure of a communication device according to various embodiments of the present disclosure;

fig. 8 is a diagram illustrating a comparison between the radiation patterns of the communication devices shown in fig. 7 a-7 c and the radiation patterns of conventional communication devices according to various embodiments of the present disclosure;

fig. 9a is a diagram showing radiation patterns of an antenna including three single-fed antenna elements according to the conventional art;

fig. 9b is a diagram illustrating a radiation pattern of the communication device shown in fig. 7 a-7 c, according to various embodiments of the present disclosure;

fig. 10a to 10h are diagrams illustrating a communication apparatus for multi-feeding by using a switching device according to various embodiments of the present disclosure;

fig. 11a and 11b are diagrams illustrating a communication device in which conductive elements arranged in different patterns configure an antenna array through multiple feeds in accordance with various embodiments of the present disclosure;

fig. 12 is a perspective view of a communication device according to various embodiments of the present disclosure;

fig. 13a is a diagram illustrating a configuration of a first antenna a1 of the communication device illustrated in fig. 12, according to various embodiments of the present disclosure;

fig. 13b is a cross-sectional view of the stacked structure of the first antenna when viewed along line a-a' shown in fig. 13a, according to various embodiments of the present disclosure;

fig. 14a is a partial perspective view of the configuration of the fifth and seventh antennas a5 and a7 of the communications device shown in fig. 12, in accordance with various embodiments of the present disclosure;

fig. 14B is a cross-sectional view of a stacked structure of a second antenna when viewed along line B-B' shown in fig. 14a, according to various embodiments of the present disclosure;

fig. 15a and 15b are diagrams illustrating various feeding structures of a communication apparatus according to various embodiments of the present disclosure;

fig. 16 is a configuration diagram of a communication device according to various embodiments of the present disclosure;

fig. 17a and 17b are diagrams illustrating feed structures of the second and fourth antenna arrays shown in fig. 16, according to various embodiments of the present disclosure;

fig. 18a to 18c are diagrams illustrating various feeding structures of the third and fifth antenna arrays shown in fig. 16 according to various embodiments of the present disclosure; and

fig. 19a and 19b are diagrams illustrating a layout of a communication device according to various embodiments of the present disclosure.

Detailed Description

Fig. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100, in accordance with various embodiments. Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM)196, or an antenna module 197. In some embodiments, at least one of the components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented to be embedded in the display device 160 (e.g., a display).

The processor 120 may run, for example, software (e.g., the program 140) to control at least one other component (e.g., a hardware component or a software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) and an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or in conjunction with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or be adapted specifically for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. The memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and the program 140 may include, for example, an Operating System (OS)142, middleware 144, or an application 146.

The input device 150 may receive commands or data from outside of the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101, such as the processor 120. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a record and the receiver may be used for incoming calls. Depending on the embodiment, the receiver may be implemented separate from the speaker, or as part of the speaker.

Display device 160 may visually provide information to the exterior of electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to embodiments, the display device 160 may include touch circuitry adapted to detect a touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of a force caused by a touch.

The audio module 170 may convert sound into an electrical signal and vice versa. According to embodiments, the audio module 170 may obtain sound via the input device 150 or output sound via the sound output device 155 or a headset of an external electronic device (e.g., the electronic device 102) directly (e.g., wired) connected or wirelessly connected with the electronic device 101.

The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more particular protocols to be used to directly (e.g., wired) or wirelessly connect the electronic device 101 with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of a Power Management Integrated Circuit (PMIC), for example.

The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) that are separate from one another. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information, such as an International Mobile Subscriber Identity (IMSI), stored in the subscriber identity module 196.

The antenna module 197 may transmit signals or power to or receive signals or power from outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components other than the radiating element, such as a Radio Frequency Integrated Circuit (RFIC), may be additionally formed as part of the antenna module 197.

At least some of the above components may be interconnected and communicate signals (e.g., commands or data) communicatively between them via an inter-peripheral communication scheme (e.g., bus, General Purpose Input Output (GPIO), Serial Peripheral Interface (SPI), or Mobile Industry Processor Interface (MIPI)).

According to an embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected with the second network 199. Each of the electronic device 102 and the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to embodiments, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to performing the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the functions or services or perform another function or another service related to the request and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may comprise, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to the embodiments of the present disclosure, the electronic devices are not limited to those described above.

It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents, or alternatives to the respective embodiments. For the description of the figures, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the relevant context clearly dictates otherwise. As used herein, each of the phrases such as "a or B," "at least one of a and B," "at least one of a or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any or all possible combinations of the items listed together with the respective one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to distinguish one element from another element simply and not to limit the elements in other respects (e.g., importance or order). It will be understood that, if an element (e.g., a first element) is referred to as being "coupled to", "connected to" or "connected to" another element (e.g., a second element), it can be directly (e.g., wiredly) connected to, wirelessly connected to, or connected to the other element via a third element, when the term "operatively" or "communicatively" is used or not.

As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, the modules may be implemented in the form of Application Specific Integrated Circuits (ASICs).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to be operable to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Where the term "non-transitory" simply means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting a transaction between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disc read only memory (CD-ROM), or may be distributed (e.g., downloaded or uploaded) online via an application store (e.g., a Play store), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). At least part of the computer program product may be temporarily generated if it is published online, or at least part of the computer program product may be at least temporarily stored in a machine readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a forwarding server.

According to various embodiments, each of the above components (e.g., modules or programs) may comprise a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. Operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added, in accordance with various embodiments.

Fig. 2a is a perspective view of a mobile electronic device 200 according to various embodiments of the present disclosure. Fig. 2b is a perspective view of the back surface of the mobile electronic device 200 shown in fig. 1, according to various embodiments of the present disclosure.

Referring to fig. 2a and 2B, the mobile electronic device 200 according to an embodiment may include a case 210, the case 210 including a first surface (or a front surface) 210A, a second surface (or a rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the case may refer to a structure constituting a portion of the first surface 210A, the second surface 210B, and the side surface 210C shown in fig. 1. According to an embodiment, the first surface 210A may be comprised of at least a portion of a substantially transparent front sheet 202 (e.g., a polymer sheet or a glass sheet including various coatings) 202. The second surface 210B may be comprised of a substantially opaque back plate 211. The backplane 211 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two materials. Side surface 210C may be comprised of a side frame structure (or "side member") 218 coupled to front plate 202 and back plate 211 and comprising metal and/or polymer. In an embodiment, the back plate 211 and the side frame structure 218 may be integrally configured and may comprise the same material (e.g., a metal material such as aluminum).

In the illustrated embodiment, the front plate 202 may include two first regions 210D that extend seamlessly from the first surface 210A to curve toward the back plate 211 on both long edges of the front plate 202. In the illustrated embodiment (see fig. 2B), the back plate 211 may comprise two second regions 210E, said second regions 210E extending seamlessly from the second surface 210B to curve towards the front plate 202 at both long edges of the back plate. In an embodiment, the front plate 202 (or the back plate 211) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, a portion of the first region 210D or the second region 210E may not be included. In an embodiment, the side bezel structure 218 may have a first thickness (or width) in a side surface excluding the first region 210D or the second region 210E described above, and may have a second thickness smaller than the first thickness in a side surface including the first region 210D or the second region 210E, when viewed from a side surface of the electronic device 200.

According to an embodiment, the electronic device 200 may include at least one of a display 201, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting element 206, and connector holes 208 and 209. In an embodiment, the electronic device 200 may omit at least one of the elements (e.g., the key input device 217 or the light emitting element 206), or additionally include another element.

The display 201 may be exposed, for example, through a major portion of the front plate 202. In an embodiment, at least a portion of the display 201 may be exposed through the front plate 202, the front plate 202 constituting a first surface 210A and a first region 210D disposed at the side surface 210C. In an embodiment, an edge of the display 201 may be configured to be substantially the same shape as an outer portion of the front plate 202 adjacent to the edge. In another embodiment (not shown), to extend the exposed area of the display 201, the spacing between the exterior portion of the display 201 and the exterior portion of the front plate 202 may be configured to be substantially the same as each other.

In another embodiment (not shown), a notch or opening may be provided at a portion of the screen display area of the display 201, and at least one of the audio module 214, the sensor module 204, the camera module 205, and the light emitting element 206 may be included to align with the notch or opening. In another embodiment (not shown), at least one of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element 206 may be included on a rear surface of a screen display area of the display 201. In another embodiment (not shown), the display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that uses a magnetic field to detect a stylus. In an embodiment, at least a portion of the sensor modules 204 and 219 and/or at least a portion of the key input device 217 may be disposed in the first region 210D and/or the second region 210E.

The audio modules 203, 207, and 214 may include a microphone aperture 203 and speaker apertures 207 and 214. A microphone configured to acquire external sound may be disposed in the microphone hole 203, and in an embodiment, a plurality of microphones may be arranged therein to sense a direction of sound. The speaker apertures 207 and 214 may include an external speaker aperture 207 and a call receiver aperture 214. In embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or may include a speaker without the speaker holes 207 and 214 (e.g., a piezoelectric speaker).

The sensor modules 204, 216, and 219 may generate electrical signals or data values corresponding to internal operating states or external environmental states of the electronic device 200. The sensor modules 204, 216, and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and/or a third sensor module 219 (e.g., an HRM sensor) and/or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on the second surface 210B of the housing 210 and on the first surface 210A (e.g., the display 201). The electronic device 200 may also include a sensor module, not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204.

The camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, and a second camera device 212 and/or a flash 213 disposed on a second surface 210B. The camera modules 205 and 212 may include one or more of a lens, an image sensor, and/or an image signal processor. The flash lamp 213 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, two or more lenses (an infrared camera and wide and telephoto lenses) and an image sensor may be arranged on one surface of the electronic device 200.

The key input device 217 may be disposed on the side surface 210C of the case 210. In another embodiment, the electronic device 200 may not include a portion or all of the key input device 217 described above, and the non-included key input device 217 may be implemented in a different manner, such as a soft key on the display 201. In an embodiment, the key input device may include a sensor module 216 disposed on the second surface 210B of the housing 210.

The light emitting element 206 may, for example, be disposed on the first surface 210A of the housing 210. The light emitting element 206 may provide status information of the electronic device 200, for example, by using light. In another embodiment, the light emitting elements 206 may provide a light source that interacts with the operation of the camera module 205, for example. For example, the light emitting elements 206 may include LEDs, IR LEDs, and xenon lamps.

The connector holes 208 and 209 may include a first connector hole 208, the first connector hole 208 being capable of receiving a connector (e.g., a USB connector) configured to transmit or receive power and/or data to or from an external electronic device; and/or a second connector aperture (e.g., a headphone jack) 209, the second connector aperture 209 capable of receiving a connector configured to transmit or receive audio signals to or from an external electronic device.

Fig. 2c is an exploded perspective view of the mobile electronic device shown in fig. 2a (e.g., the mobile electronic device 200 in fig. 2 a) according to various embodiments of the present disclosure.

Referring to fig. 2c, the mobile electronic device 220 may include a side bezel structure 221, a first support member 2211 (e.g., a stand), a front panel 222, a display 223, a printed circuit board 224, a battery 225, a second support member 226 (e.g., a rear case), an antenna 227, and a back panel 228. In embodiments, the electronic device 220 may omit at least one of the elements (e.g., the first support member 2211 or the second support member 226) or otherwise include another element. At least one element of the electronic device 220 may be the same as or similar to at least one element of the electronic device 200 shown in fig. 2a or 2 b. Hereinafter, a repetitive description will be omitted.

The first support member 2211 may be provided in the electronic device 220 to be connected to the side frame structure 221, or may be integrally formed with the side frame structure 221. The first support member 2211 may be made of, for example, a metallic material and/or a non-metallic (e.g., polymeric) material. The display 223 may be coupled to one surface of the first support member 2211, and the printed circuit board 224 may be coupled to the other surface. The processor, memory, and/or interfaces may be mounted on a printed circuit board 224. The processor may include, for example, one or more of a central processing device, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communications processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high-definition multimedia interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 220 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

Battery 225 is a device configured to provide power to at least one element of electronic device 220 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 225 may be disposed substantially on the same plane as the printed circuit board 224, for example. The battery 225 may be integrally provided in the electronic device 220, and may be detachably attached to the electronic device 220.

The antenna 227 may be disposed between the backplate 228 and the battery 225. The antenna 227 may include, for example, a Near Field Communication (NFC) antenna, a wireless charging antenna, and/or a Magnetic Secure Transport (MST) antenna. The antenna 227 may perform near field communication with an external device, for example, or wirelessly transmit or receive power necessary for charging. In another embodiment, the antenna structure may be configured by a portion of the side frame structure 221 and/or the first support member 2211, or a combination thereof.

Fig. 3a is a diagram illustrating an example of an electronic device 300 supporting 5G communication.

Referring to fig. 3a, an electronic device 300 (e.g., the electronic device 200 in fig. 2 a) may include a housing 310, a processor 340, a communication module 350 (e.g., the communication module 190 in fig. 1), a first communication device 321, a second communication device 322, a third communication device 323, a fourth communication device 324, a first conductive wire 331, a second conductive wire 332, a third conductive wire 333, or a fourth conductive wire 334.

According to an embodiment, the housing 310 may protect other elements of the electronic device 300. The housing 310 may include, for example, a front plate, a back plate oriented opposite the front plate, and side members (or metal frames) attached to or integrally configured with the back plate and surrounding a space between the front plate and the back plate.

According to an embodiment, the electronic device 300 may comprise a first communication device 321, a second communication device 322, a third communication device 323 or a fourth communication device 324.

According to an embodiment, the first communication device 321, the second communication device 322, the third communication device 323, or the fourth communication device 324 may be disposed in the housing 310. According to the embodiment, the first communication device 321 may be disposed at the upper left of the electronic device 300, the second communication device 322 may be disposed at the upper right of the electronic device 300, the third communication device 323 may be disposed at the lower left of the electronic device 300, and the fourth communication device 300 may be disposed at the lower right of the electronic device 300, when viewed from above the rear panel of the electronic device.

According to an embodiment, the processor 340 may include one or more of a central processing device, an application processor, a Graphics Processing Unit (GPU), an image signal processor of a camera, or a baseband processor (or Communication Processor (CP)). According to an embodiment, processor 340 may be implemented as a system on chip (SoC) or a System In Package (SiP).

According to an embodiment, the communication module 350 may be electrically connected to the first communication device 321, the second communication device 322, the third communication device 323, or the fourth communication device 324 by using the first conductive wire 331, the second conductive wire 332, the third conductive wire 333, or the fourth conductive wire 334. The communication module 350 may include, for example, a baseband processor or at least one communication circuit (e.g., an IFIC or RFIC). In addition to processor 340 (e.g., an Application Processor (AP)), communication module 350 may include, for example, a separate baseband processor. The first conductive line 331, the second conductive line 332, the third conductive line 333, or the fourth conductive line 334 may include, for example, a coaxial cable or an FPCB.

According to an embodiment, the communication module 350 may include a first Baseband Processor (BP) (not shown) or a second Baseband Processor (BP) (not shown). The electronic device 300 may also include one or more interfaces to support inter-chip communication between the first BP (or the second BP) and the processor 340. The processor 340 and the first BP or the second BP may transmit or receive data by using an inter-chip interface (inter-processor communication channel).

According to an embodiment, the first BP or the second BP may provide an interface configured to perform communication with other entities. The first BP may support, for example, wireless communication for a first network (not shown). The second BP may support, for example, wireless communication for a second network (not shown).

According to an embodiment, the first BP or the second BP and the processor 340 may be configured as a single module. For example, the first BP or the second BP may be integrally formed with the processor 340. As another example, the first BP or the second BP may be provided in a single chip or may be configured as a separate chip. According to an embodiment, the processor 340 and at least one baseband processor (e.g., a first BP) may be integrally formed in a single chip (SoC chip), and another baseband processor (e.g., a second BP) may be configured as a separate chip.

According to an embodiment, the first network (not shown) or the second network (not shown) may correspond to the network 199 shown in fig. 1. According to an embodiment, the first network (not shown) or the second network (not shown) may include a fourth generation (4G) network and a fifth generation (5G) network, respectively. The 4G network may support Long Term Evolution (LTE) protocols as defined in, for example, 3 GPP. The 5G network may support a New Radio (NR) protocol, for example as defined in 3 GPP.

Fig. 3b is a block diagram of a communication device 360 according to an embodiment.

Referring to fig. 3b, a communication device 360 (e.g., the first communication device 321, the second communication device 322, the third communication device 323, or the fourth communication device 324 in fig. 3 a) may include a communication circuit 362 (e.g., an RFIC), a Printed Circuit Board (PCB)361, a first antenna array 363, or a second antenna array 364.

According to an embodiment, the communication circuitry 362, the first antenna array 363 or the second antenna array 364 may be arranged on the PCB 361. For example, the first antenna array 363 or the second antenna array 364 may be disposed on a first surface of the PCB361, and the communication circuit 362 may be disposed on a second surface of the PCB 361. The PCB361 may include a connector (e.g., a coaxial cable connector or a board-to-board (B-to-B) connector) configured to perform an electrical connection to another PCB (e.g., a PCB on which the communication module 350 of fig. 3a is disposed) by using a transmission line (e.g., the first conductive line 331 and the coaxial cable of fig. 3 a). For example, the PCB361 may be connected to the PCB on which the communication module 350 is disposed through a coaxial cable by using a coaxial cable connector, and the coaxial cable may be used to transmit and receive an IF signal or an RF signal. As another example, power or other control signals may be transmitted through the B-to-B connectors.

According to an embodiment, the first antenna array 363 or the second antenna array 364 may comprise a plurality of antenna elements. The antenna elements may include patch antennas, loop antennas, or dipole antennas. For example, the antenna elements included in the first antenna array 363 may be patch antennas to form a beam toward a backplane of the electronic device 360. As another example, the antenna elements included in the second antenna array 364 may be dipole antennas or loop antennas to form a beam toward a side member of an electronic device (e.g., electronic device 200 in fig. 2 a).

According to an embodiment, the communication circuit 362 may support at least a portion of the frequency band (e.g., 24GHz to 30GHz or 37GHz to 40GHz) in the frequency band of 3GHz to 100 GHz. According to an embodiment, the communication circuit 362 may be upconverted or downconverted. For example, the communication circuitry 362 included in the communication device 360 (e.g., the first communication device 321 in fig. 3 a) may up-convert an IF signal received from a communication module (e.g., the communication module 350 in fig. 3 a) over a conductive line (e.g., the first conductive line 331 in fig. 3 a) to an RF signal. As another example, the communication circuitry 362 included in the communication device 360 (e.g., the first communication device 321 in fig. 3 a) may downconvert RF signals (e.g., millimeter wave signals) received through the first antenna array 363 or the second antenna array 364 to IF signals, and may transmit the IF signals to the communication module through conductive lines.

Fig. 4a is a perspective view of a communication device 400 according to various embodiments of the present disclosure.

Communication apparatus 400 in fig. 4a may be at least partially similar to communication apparatuses 321, 322, 323, and 324 in fig. 3a, or may include other embodiments of communication apparatuses.

Referring to fig. 4a, a communication device 400 may include a substrate 410. According to an embodiment, the substrate 410 may include a first surface 411, and a second surface 412 oriented opposite the first surface 411. According to an embodiment, the substrate 410 may be arranged such that the second surface 412 is oriented towards a backplane (e.g. backplane 211 in fig. 2b) of an electronic device (e.g. electronic device 200 in fig. 2 b). However, the present disclosure is not limited thereto, and the substrate 410 may be disposed such that the second surface 412 is oriented toward a side member (e.g., side member 216 in fig. 2 a) or a front plate (e.g., front plate 202 in fig. 2 a) of the electronic device. According to an embodiment, the communication device 400 may include an antenna 450 disposed on the second surface 412 of the substrate 410. According to an embodiment, the antenna structure may comprise the antenna 450 and at least one plane of the substrate 410 parallel to a second plate of the electronic device (e.g. the electronic device 300 in fig. 3 a). According to an embodiment, the antenna 450 may include an antenna element 420 (e.g., a conductive plate or a conductive patch) disposed on the second surface 412 of the substrate 410. However, the present disclosure is not limited thereto, and the antenna element 420 may be interposed between a plurality of insulating layers included in the substrate 410.

According to various embodiments, the antenna element 420 may have a symmetrical shape with respect to a line C-C' passing through the center of the antenna element. According to an embodiment, the antenna element 420 may include a pair of feeding portions 421 and 422. According to an embodiment, the pair of feeding portions 421 and 422 may be arranged to be symmetrical to each other (e.g., to face each other) with respect to the line of symmetry C-C'. According to an embodiment, the pair of power feeding portions 421 and 422 may be electrically connected to the wireless communication circuit 430 disposed on the first surface 411 of the substrate 410. According to an embodiment, the wireless communication circuitry 430 may be configured to transmit or receive at least one signal having a frequency band of 10GHz to 100GHz through the antenna element 420. According to an embodiment, the pair of power feeding portions 421 and 422 may be electrically connected to the wireless communication circuit 430 through a conductive via that electrically connects the first surface 411 and the second surface 412 of the substrate 410. According to an embodiment, the pair of feeding portions 421 and 422 may be electrically connected to the wireless communication circuit 430 via a coupling feed. According to an embodiment, the antenna element 420 may include a conductive pattern disposed in a substrate. According to an embodiment, the antenna element 420 may include a metal plate, a Flexible Printed Circuit Board (FPCB), or a conductive paint attached to the substrate 410.

According to various embodiments, the communication device 400 may be configured such that two feed ports of the wireless communication circuitry 430 are electrically connected to one antenna element 420, which serves as an antenna element. For example, the communication apparatus 400 has a doubled number of input ports, and thus the input power applied to the antenna element 420 is increased, so that the output power of the communication apparatus 400 can be increased.

Fig. 4b is a cross-sectional view of the stacked structure of the communication device 400 shown in fig. 4a, according to various embodiments of the present disclosure.

Referring to fig. 4b, the substrate 410 may include a plurality of insulating layers. According to an embodiment, the substrate 410 may include: a first layer region 4101 including at least one insulating layer; or second layer region 4102, is adjacent to first layer region 4101 and comprises at least another insulating layer. According to an embodiment, the first layer region 4101 may include an antenna 450. According to an embodiment, the antenna 450 may include an antenna element 420 (e.g., a conductive plate or a conductive patch). According to an embodiment, the first layer region 4101 may include a first feeding portion 421 and a second feeding portion 422 that extend from the antenna element 420 to the second layer region 4102 at positions symmetrical to each other and are electrically connected to the wireless communication circuit 430. According to an embodiment, each of the first and second power feeding portions 421 and 422 may include a conductive via hole extending through the first layer region 4101 in a thickness direction of the substrate 410. According to an embodiment, the first feeding portion 421 may be electrically connected to the wireless communication circuit 430 through a first feeding line 442 disposed in the second layer region 4102. According to an embodiment, the second feeding portion 422 may be electrically connected to the wireless communication circuit 430 through a second feeding line 443 disposed in the second layer region 4102. According to an embodiment, the first and second feeding lines 442, 443 may be configured to be electrically disconnected from the at least one ground plane 441 arranged in the second layer region 4102. The number of ground planes 441 may be one or more according to an embodiment. According to an embodiment, the antenna element 420 may be disposed on an uppermost surface (e.g., the second surface 412) in the first layer region 4101 of the substrate 410. However, the present disclosure is not limited thereto. For example, the antenna element 420 may be disposed on an insulating layer in the first layer region 4101.

According to various embodiments, the second layer region 4102 may comprise ground planes 441 arranged on different insulating layers, respectively. According to an embodiment, the wireless communication circuit 430 may be mounted on the first surface 411 of the substrate 410 in a Ball Grid Array (BGA) scheme. According to an embodiment, the ground planes 441 may be electrically connected to each other through the conductive vias 4411. According to an embodiment, the number of the conductive vias 4411 may be one or more.

Fig. 4C is a diagram illustrating an electric field distribution of the communication apparatus 400 in fig. 4a according to various embodiments of the present disclosure, and as shown in fig. 4C, it may be noted that an electric field distribution having a bilateral symmetry with respect to the symmetry line C-C' shown in fig. 4a is formed. Therefore, although the feeding portions 421 and 422 are arranged to be symmetrical (face) to each other in the respective regions with respect to the line of symmetry C-C', the radiation characteristic of the antenna element 420 is not changed and the output power can be increased.

Fig. 4 d-4 f are cross-sectional views of various stacked structures of a communication device according to various embodiments of the present disclosure.

Referring to fig. 4d, the communication device 400-1 may include a substrate 410. According to an embodiment, the substrate 410 may include: a first layer region 4101 including at least one insulating layer; or second layer region 4102, is adjacent to first layer region 4101 and comprises at least another insulating layer. According to an embodiment, the first layer region 4101 may include an antenna 450. According to an embodiment, the antenna 450 may include an antenna element 420. According to an embodiment, the first layer region 4101 may include a first feeding portion 421 and a second feeding portion 422 that extend from the antenna element 420 to the second layer region 4102 at positions symmetrical to each other and are electrically connected to the wireless communication circuit 430. According to an embodiment, each of the first and second power feeding portions 421 and 422 may include a conductive via hole extending through the first layer region 4101 in a thickness direction of the substrate 410. According to an embodiment, the first feeding portion 421 may be electrically connected to the wireless communication circuit 430 through a first feeding line 442 disposed in the second layer region 4102. According to an embodiment, the second feeding portion 422 may be electrically connected to the wireless communication circuit 430 through a second feeding line 443 disposed in the second layer region 4102.

According to an embodiment, the second layer region 4102 may comprise extension regions F that extend without overlapping when viewed from above the second surface 412. According to the embodiment, the extension region F may be flexibly extended. At least a portion of the extension region F may extend from the first surface 411 and may include wireless communication circuitry 430 mounted on the first surface. According to an embodiment, the extension area F may be as short as possible to achieve low losses. According to an embodiment, the extension region F may be made of a high frequency low loss material. According to the embodiment, by using the extension area F, the communication device 400-1 may be installed at various positions of the electronic device (from a side surface (e.g., side surface 210C in fig. 2 a) of the electronic device (e.g., electronic device 200 in fig. 2 a) to a position of the back panel (e.g., back panel 210B in fig. 2C)) so that the installation space can be maximally utilized.

Referring to fig. 4e, the communication device 400-2 may include a substrate 410. According to an embodiment, the substrate 410 may include: a first layer region 4101 including at least one insulating layer; or second layer region 4102, is adjacent to first layer region 4101 and comprises at least another insulating layer. According to an embodiment, the first layer region 4101 may include an antenna 450. According to an embodiment, the antenna 450 may include an antenna element 420. According to an embodiment, the first layer region 4101 may include a first conductive pad 423 and a second conductive pad 424 spaced apart from the antenna element 420 by a first distance (d1) and arranged at positions symmetrical to each other. According to an embodiment, the first conductive pad 423 and the second conductive pad 424 may be electrically connected to the antenna element 420, thereby capacitively coupling to the antenna element 420. According to an embodiment, the first layer region 4101 may include a first feeding portion 421 and a second feeding portion 422 that extend from the first feeding pad 423 and the second feeding pad 424 to the second layer region 4102 and are electrically connected to the wireless communication circuit 430. According to an embodiment, each of the first and second power feeding portions 421 and 422 may include a conductive via hole extending through the first layer region 4101 in a thickness direction of the substrate 410. According to an embodiment, the first feeding portion 421 may be electrically connected to the wireless communication circuit 430 through a first feeding line 442 disposed in the second layer region 4102. According to an embodiment, the second feeding portion 422 may be electrically connected to the wireless communication circuit 430 through a second feeding line 443 disposed in the second layer region 4102.

Referring to fig. 4f, the communication device 400-3 may include a substrate 410. According to an embodiment, the substrate 410 may include: a first layer region 4101 including at least one insulating layer; or second layer region 4102, is adjacent to first layer region 4101 and comprises at least another insulating layer. According to an embodiment, the communication device may include antennas 450-1 disposed at different locations in the first layer region 4101. According to an embodiment, the antenna 450-1 may include a first antenna element 420 disposed in the first floor area 4101. According to an embodiment, the first layer region 4101 may include a first conductive pad 423 and a second conductive pad 424 spaced apart from the first antenna element 420 by a first distance (d1) and arranged at positions symmetrical to each other. According to an embodiment, the antenna 450-1 may include a second antenna element 426 spaced a second distance (d2) from the first conductive pad 423 and the second conductive pad 424 in the first layer area 4101. According to an embodiment, the first conductive pad 423 and the second conductive pad 424 may be electrically connected to the first antenna element 420 and the second antenna element 426 between the first antenna element 420 and the second antenna element 426, thereby capacitively coupling to the first antenna element 420 and the second antenna element 426. According to an embodiment, the first layer region 4101 may include a first feeding portion 421 and a second feeding portion 422 that extend from the first feeding pad 423 and the second feeding pad 424 to the second layer region 4202 and are electrically connected to the wireless communication circuit 430. According to an embodiment, each of the first and second power feeding portions 421 and 422 may include a conductive via hole extending through the first layer region 4101 in a thickness direction of the substrate 410. According to an embodiment, the first feeding portion 421 may be electrically connected to the wireless communication circuit 430 through a first feeding line 442 disposed in the second layer region 4102. According to an embodiment, the second feeding portion 422 may be electrically connected to the wireless communication circuit 430 through a second feeding line 443 disposed in the second layer region 4102.

According to an embodiment, the wireless communication circuit 430 may transmit or receive a wireless signal having a first frequency band through the first antenna element 420. According to an embodiment, the wireless communication circuit 430 may transmit or receive wireless signals having a second frequency band through the second antenna element 426. According to an embodiment, the first frequency may be configured to be higher than the second frequency. However, the present disclosure is not limited thereto, and the first frequency may be configured to be relatively lower than the second frequency according to the sizes of the first and second antenna elements 420 and 426.

Fig. 5 is a perspective view of a communication device 510 according to various embodiments of the present disclosure.

The communication devices in fig. 5 may be at least partially similar to communication devices 321, 322, 323, and 324 in fig. 3, or may include other embodiments of communication devices.

Fig. 5 illustrates a communication apparatus having a relatively reduced size compared to a conventional communication apparatus by multi-feeding (e.g., dual-feeding) applied to an antenna element according to an exemplary embodiment of the present disclosure.

Referring to fig. 5, the communication device 510 may include: a substrate 511, an antenna array 520 disposed in the substrate 511, and wireless communication circuitry 514 electrically connected to the antenna array 520. According to an embodiment, the antenna array 520 may include a first antenna 551 and a second antenna 552 spaced apart from each other by a predetermined interval. According to an embodiment, the first antenna 551 may include a first antenna element 512. According to an embodiment, the second antenna 552 may include a second antenna element 513. According to an embodiment, the wireless communication circuitry 514 may be configured to transmit or receive at least one signal having a frequency band of 10GHz to 100GHz through the first antenna element 512 and the second antenna element 513.

According to various embodiments, the antenna elements 512 and 513 disposed at predetermined intervals on the second face 5112 of the substrate 511 may be electrically connected to the wireless communication circuit 514 disposed on the first face 5111 of the substrate 511. According to an embodiment, the communication device 510 may include a wireless communication circuit 514 having four feed ports and antenna elements 512 and 513 disposed in a substrate 511. According to an embodiment, the antenna elements 512 and 513 may be electrically connected to the wireless communication circuit 514 in the same or similar manner as the configuration shown in fig. 4a and 4b described above. For example, the wireless communication circuit 514 may be electrically connected to the first and second feeding portions 5121 and 5122, respectively, of the first antenna element 512 through two feeding ports, and may be electrically connected to the third and fourth feeding portions 5131 and 5132, respectively, of the second antenna element 513 through the remaining two feeding ports. According to an embodiment, the first and second feeding portions 5121 and 5122 of the first antenna element 512, or the third and fourth feeding portions 5131 and 5132 of the second antenna element 513 may be arranged to be symmetrical (face) to each other with respect to a line C-C' passing through the center of each of the first and second antenna elements 512 and 513.

According to various embodiments, in the communication device 510, the same number of feeding ports are used, but the number of antenna elements (e.g., conductive plates) is reduced by multi-feeding (e.g., dual-feeding), so that the volume of the communication device can be reduced. For example, if the wireless communication circuit 514 having four feeding ports is connected to the first antenna element 512 and the second antenna element 513 by double feeding, the length (L) of the substrate 511 may be reduced to be smaller than the length (e.g., 2L) of the substrate in the case where the wireless communication circuit 514 is electrically connected to the four antenna elements in a single feeding manner. Therefore, the installation space in the electronic device (e.g., the electronic device 200 in fig. 2 a) in which the communication device is installed is effectively utilized, so that the electronic device can be slim.

According to various embodiments, in a case where the number of antenna elements is inevitably limited in consideration of the installation space of the communication device 510 in an electronic apparatus (for example, the electronic apparatus 200 in fig. 2 a), if a multi-feeding configuration is applied to the antenna elements 512 and 513, the number of antenna elements is reduced, which leads to a slight decrease in gain. However, the number of ports is increased compared to the case where a single feed configuration is applied to a reduced number of antenna elements. Therefore, the Effective Isotropic Radiated Power (EIRP) can be relatively increased. For example, if a communication device having four antenna elements fed by four feeding ports of the wireless communication circuit 514 has only two antenna elements due to the limitation of installation space and becomes a single feeding manner, the EIRP may be significantly reduced. However, although the communication device 510 has only two antenna elements 512 and 513, a multi-feed (dual-feed) configuration is applied according to an embodiment of the present disclosure. Therefore, the number of feed ports is maintained, and thus the EIRP drop can be reduced.

For example, the following < table 1> shows various electrical connection relationships of an antenna element (e.g., the first antenna element 512 or the second antenna element 513) electrically connected to the wireless communication circuit 514 having four feeding ports. For example, "single 1 × 4" may represent that four antenna elements are singly fed through four feeding ports (case (a)), and "double 1 × 2" may represent that two antenna elements are doubly fed through four feeding ports (case (b)) (e.g., the case shown in fig. 5), and "double 1 × 3" may represent that one of three antenna elements is doubly fed through two of four feeding ports (case (c)) (e.g., the case shown in fig. 7 a).

[ TABLE 1 ]

	(a) Sheet 1 × 4	(b) Bis 1 × 2	(c) Bis 1 × 3
				Number of ports	4	4	4
Single PA output power	10dBm	10dBm	10dBm
				Total PA output power	16dBm	16dBm	16dBm
Antenna element gain	5dBi	5dBi	5dBi
				Antenna array gain	11dBi	8dBi	9.78dBi
Peak EIRP	27dBm	24dBm	25.78dBm

Referring to < table 1> above, in comparison of the communication device of (a) and the communication device of (b), when the gain of each antenna element is 5dBi and the input power of one feed port is 10dBm, the gain is slightly reduced from 11dBi to 8 dBi. However, the feed port count can be maintained, and thus it is noted that the EIRP decreases from 27dBm to 24dBm, with a decrease in drop amplitude.

Fig. 6 is a diagram illustrating a configuration of a communication apparatus 600 according to various embodiments of the present disclosure.

Communications apparatus 600 in fig. 6 may be at least partially similar to communications apparatus 310, 320, 330, and 340 in fig. 3, or may include other embodiments of communications apparatus.

Referring to fig. 6, a communication apparatus 600 may include: a substrate 610, an antenna 650 disposed on the second surface 612 of the substrate 610, and wireless communication circuitry 630 disposed on the first surface 611 of the substrate 610 to electrically connect to the antenna element 620. Antenna 650 may include antenna element 620. According to an embodiment, the antenna element 620 may be symmetrically configured with respect to at least two imaginary lines (e.g., x-axis and y-axis) passing through the center of the antenna element and perpendicular to each other. According to an embodiment, the antenna element 620 may be configured to be circular. However, the present disclosure is not limited thereto, and the antenna element 620 may be configured as a square or a regular octagon.

According to various embodiments, the antenna element 620 may be electrically connected to the wireless communication circuit 630 in a multi-feed manner. According to an embodiment, the antenna element 620 may be fed by four feed ports of the wireless communication circuitry 630 at four points of the antenna element 620. For example, the antenna element 620 may include a first feeding portion 621, and a second feeding portion 622 disposed at 90 degrees to the first feeding portion 621 with respect to the z-axis. According to an embodiment, the antenna element may include a third feeding portion 623 symmetrical to the first feeding portion 621 with respect to the y-axis, and a fourth feeding portion 624 symmetrical to the second feeding portion 622 with respect to the x-axis. According to the embodiment, the first power feeding portion 621 and the third power feeding portion 623 disposed symmetrically to the first power feeding portion 621 with respect to an electric field may have increased output power and may form a first polarized wave. According to the embodiment, the second feeding portion 622 and the fourth feeding portion 624 symmetrically disposed with the second feeding portion 622 with respect to an electric field may form a second polarized wave perpendicular to the first polarized wave and having an increased output power.

According to various embodiments, the positions of the feeding portions 621, 622, 623, and 624 may be changed for impedance matching, etc. According to the embodiment, the communication apparatus 600 can equally apply multi-feeding even to a structure supporting two circularly polarized waves (e.g., RHCP or LHCP) by a symmetrical structure, instead of a structure supporting dual polarized waves in which adjacent feeding portions are arranged perpendicular to each other.

Fig. 7a is a diagram illustrating a configuration of a communication device 710 according to various embodiments of the present disclosure.

The communication means in fig. 7a may be at least partly similar to the communication means 321, 322, 323 and 324 in fig. 3, or may comprise other embodiments of the communication means 321, 322, 323 and 324.

Fig. 7a shows a communication device 710 that incorporates antenna elements 712 and 714 that employ a single feed and antenna element 713 that employs multiple feeds (e.g., dual feeds).

Referring to fig. 7a, the communication device 710 may include: a substrate 711, an antenna array 720 disposed in the substrate 711, and wireless communication circuitry 715 (e.g., communication circuitry 362 in fig. 3 b) electrically connected to the antenna array 720. According to an embodiment, the antenna array 720 may include a first antenna 751, a second antenna 752, and a third antenna 753 disposed in the substrate 711 at predetermined intervals. According to an embodiment, the first antenna 751 may comprise a first antenna element 712. According to an embodiment, the second antenna 752 may include a second antenna element 713. According to an embodiment, the third antenna 753 may include the third antenna element 714. According to an embodiment, the communication device 710 may include wireless communication circuitry 715 electrically connected to the first antenna element 712, the second antenna element 713, or the third antenna element 714. According to an embodiment, the wireless communication circuit 715 may be configured to transmit or receive at least one signal having a frequency band of 10GHz to 100GHz via the first antenna element 712, the second antenna element 713, or the third antenna element 714.

According to various embodiments, the antenna elements 712, 713, and 714 disposed on the second face 7112 of the substrate 711 at predetermined intervals may be electrically connected to the wireless communication circuit 715 disposed on the first face 7111 of the substrate 711. According to an embodiment, the communication device 710 may include a wireless communication circuit 715 with four feed ports, or antenna elements 712, 713, and 714 disposed in a substrate 711. According to an embodiment, the first 712 or third 714 antenna element may be electrically connected to the corresponding feed port of the wireless communication circuit 715 by a single feed through the first 7121 or fourth 7141 feed. According to an embodiment, the fourth feeding portion 7141 may be disposed at opposite sides of symmetry in the third antenna element 714. In order to minimize interference with the internal wiring of the second antenna element 713 or the third feeding portion 7132, the fourth feeding portion is disposed at a maximum distance so that the degree of freedom of the internal wiring can be improved. According to an embodiment, the second antenna element 713 disposed between the first antenna element 712 and the third antenna element 714 may be electrically connected to two ports of the wireless communication circuit 715 in a dual feeding manner through the second feeding portion 7131 and the third feeding portion 7132. According to an embodiment, the second and third feeding portions 7131 and 7132 of the second antenna element 713 may be arranged to be symmetrical (face) to each other with respect to a line C-C' passing through the center of the second antenna element. According to the embodiment, if the wireless communication circuit 715 having four feeding ports is electrically connected to the second antenna element 713 disposed at the center by a dual feeding, the length (1.5L) of the substrate 521 may be reduced to be smaller than the length (e.g., 2L) of the substrate in the case where the wireless communication circuit is electrically connected to the four antenna elements by a single feeding. Therefore, the installation space in the electronic apparatus in which the communication apparatus is installed is effectively utilized, so that the electronic apparatus can be made slim.

According to various embodiments, if dual feeding is applied to at least one antenna element (e.g., the second antenna element 713) among the plurality of antenna elements (e.g., the first antenna element 712, the second antenna element 713, or the third antenna element 714), a drop in EIRP may be reduced as described above. For example, referring to < table 1> above, in comparison of the communication apparatus of (a) with the communication apparatus of (c) (e.g., fig. 7a to 7c), when the gain of each antenna element is 5dBi and the input power of one feed port is 10dBm, the gain is slightly reduced from 11dBi to 9.78 dBi. However, the feed port count was maintained, and therefore it was noted that the EIRP decreased from 27dBm to 25.78dBm, with the decrease in droop amplitude.

According to various embodiments, if dual feeding is applied to at least one antenna element (e.g., the second antenna element 713 in fig. 7a) among a plurality of antenna elements (e.g., the antenna elements 712, 713, and 714 in fig. 7a), for example, only to at least one centrally disposed antenna element (e.g., the second antenna element 713 in fig. 7a) among the plurality of antenna elements (e.g., the antenna elements 712, 713, and 714 in fig. 7a), the antenna element (e.g., the second antenna element 713 in fig. 7a) disposed at the center relative to the surrounding antenna elements (e.g., the first antenna element 712 and the third antenna element 714 in fig. 7a) employing single feeding may radiate higher power. With this configuration, the Side Lobe Level (SLL) can be reduced, and the single beam width can be increased.

For example, the following < table 2> shows a change in radiation pattern according to the power distribution of a communication apparatus having a (1 × 3) antenna element layout. For example, "(d) Single 1:1:1 "indicates that three antenna elements are electrically connected to the wireless communication circuit by a single feed, and" (e) dual 1:2:1 "indicates that one dual-fed antenna element is disposed between two single-fed antenna elements (e.g., fig. 7 a).

Fig. 7b is a configuration diagram illustrating a feeding structure of the communication device 710 illustrated in fig. 7a according to various embodiments of the present disclosure.

Referring to fig. 7b, the first antenna element 712 may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit 715 in fig. 7a) in a single feed manner through the first RF chain 7151. According to an embodiment, the second antenna element 713 may be electrically connected to a wireless communication circuit (e.g., wireless communication circuit 715 in fig. 7a) in a dual feed manner through the second chain 7152 and the third chain 7153. According to an embodiment, the third antenna element 714 may be electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 715 in fig. 7a) in a single feed through the fourth RF chain 7154. According to an embodiment, the communication device 710 may include phase shifters 7161, 7162, 7163, and 7164 electrically connected to the antenna elements 712, 713, and 714 to have a particular phase. According to an embodiment, the phase shifters 7161, 7162, 7163, and 7164 may include: a first phase shifter 7161 disposed on the first RF chain 7151 to determine the phase of the first antenna element 712; a second phase shifter 7162 and a third phase shifter 7163 disposed on the second RF chain 7152 and the third RF chain 7153, respectively, to determine the phase of the second antenna element 712; and a fourth phase shifter 7164 disposed on the fourth RF chain 7154 to determine the phase of the third antenna element 714. According to an embodiment, if the first antenna element 712 is fed by the first RF chain 7151 to have a phase of 0 degrees, the second antenna element 713 is fed by the second RF chain 7152 to have a phase of 0 degrees and by the third RF chain 7153 to have a phase of 180 degrees, and the third antenna element 714 is fed by the fourth RF chain 7154 to have a phase of 120 degrees, the beam pattern 742 of the communication device 730 may be formed as a beam pattern 741 directed perpendicular to the second surface 7112 of the substrate 711 in an outward direction.

Fig. 7c is a configuration diagram illustrating a feeding structure of a communication device 710 according to various embodiments of the present disclosure.

Referring to fig. 7c, the first antenna element 712 may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit 715 in fig. 7a) in a single feed manner through the first RF chain 7151. According to an embodiment, the second antenna element 713 may be electrically connected to a wireless communication circuit (e.g., wireless communication circuit 715 in fig. 7a) in a dual feed manner through the second chain 7152 and the third chain 7153. According to an embodiment, the third antenna element 713 may be electrically connected to a wireless communication circuit (e.g., wireless communication circuit 715 in fig. 7a) in a single feed manner through the fourth RF chain 7154. According to an embodiment, two feeding portions (e.g., the second feeding portion 7131 or the third feeding portion 7132 in fig. 7a) of the second antenna element 713 may be fed to have a phase difference of 180 degrees by the second RF chain 7152 and the third RF chain 7153. For example, if one feeding portion of the second antenna element 713 (e.g., the second feeding portion 7131 in fig. 7a) may be fed to have a phase of 60 degrees through the second RF chain 7152, another feeding portion of the second antenna element 713 (e.g., the third feeding portion 7132 in fig. 7a) may be fed to have a phase of 240 degrees through the third RF chain 7153.

According to various embodiments, the phase difference of at least one of the plurality of antenna elements may be used to change the direction of a beam pattern of a communication device (e.g., communication device 710 in fig. 7 a). For example, if the first antenna element 712 is fed by the first RF chain 7151 to have a phase of 0 degrees, the second antenna element 713 is fed by the second RF chain 7152 to have a phase of 60 degrees and is fed by the third RF chain 7153 to have a phase of 240 degrees, and the third antenna element 714 is fed by the fourth RF chain 7154 to have a phase of 120 degrees, the communication device 730 may be configured to be oriented outward from the second surface 7112 of the substrate 711 and biased toward the third antenna element 714.

Fig. 8 is a diagram illustrating a comparison between the radiation pattern of the communication device shown in fig. 7a and the radiation pattern of a conventional communication device, according to various embodiments of the present disclosure.

[ TABLE 2 ]

Power ratio	(d) 1:1 sheet	(e) Bis 1:2:1
			Peak gain (dBi)	10.39	9.83
Single beam 3dB BW	32.9°	37.5°
			SLL(dB)	-13dB	-42dB

Referring to < table 2> and fig. 8, in comparing the case of (d) with the case of (e), it is noted that SLL is significantly reduced from-13 dB to-42 dB, and the single beam width is also significantly increased from 32.9 ° to 37.5 °.

Fig. 9a is a diagram showing radiation patterns of an antenna having three single- feed antenna elements 712, 713, and 714 according to the conventional art; and fig. 9b is a diagram illustrating a radiation pattern of the communication device 710 shown in fig. 7 a-7 c, according to various embodiments of the present disclosure. Note that in case (e), beamforming is smoothly performed in the corresponding direction.

According to various embodiments, in the communication device 710, among the three antenna elements 712, 713, and 714, only the second antenna element 713 disposed at the center is implemented as a dual feed so that EIRP drop is reduced or SLL is reduced, but the present disclosure is not limited thereto. For example, a communication device comprising four or more antenna elements arranged therein may be implemented such that at least one antenna element arranged substantially in the center of the communication device is double fed.

Fig. 10a to 10h are diagrams illustrating communication devices 1010, 1020, 1030, and 1040 that perform multi-feeding by using a switching device according to various embodiments of the present disclosure.

Communications devices 1010, 1020, 1030, and 1040 in fig. 10 a-10 h may be at least partially similar to communications devices 321, 322, 323, and 324 in fig. 3a, or may include other embodiments of communications devices 321, 322, 323, and 324.

Referring to fig. 10a and 10b, the communication device 1010 may include an antenna array 1019 disposed in a substrate 1011. According to an embodiment, the antenna array 1019 may include a first antenna 1051, a second antenna 1052, and a third antenna 1053 disposed in the substrate 1010 at predetermined intervals. According to an embodiment, the first antenna 1051 may comprise a first antenna element 1012. According to an embodiment, the second antenna 1052 may include a second antenna element 1013. According to an embodiment, the third antenna 1053 may include a third antenna element 1014. According to an embodiment, the first antenna element 1012 and the third antenna element 1014 may be electrically connected in a single feed manner to the wireless communication circuit 1016 by means of the first feed portion F1 and the fourth feed portion F5, respectively. According to an embodiment, the second antenna element 1013 may be disposed between the first antenna element 1012 and the third antenna element 1014 and may be electrically connected to the wireless communication circuit 1016 in a dual feeding manner through the second feeding portion F3 and the third feeding portion F4. According to an embodiment, the third feeding portion F4 may be disposed at opposite sides of symmetry in the third antenna element 1014. In order to minimize interference with the internal wiring of the second antenna element 1013 or the third feeding portion F4, the third feeding portion is provided at the maximum distance so that the degree of freedom of the internal wiring can be improved.

According to various embodiments, the communication device 1010 may include a switching device 1015 interposed between the antenna elements 1012, 1013, and 1014, and a plurality of feed ports P1-P6 of the wireless communication circuit 1016. According to an embodiment, an electronic device (e.g., electronic device 200 in fig. 2 a) may control the switching device 1015 to electrically connect the second antenna element 1013 of the antenna elements 1012, 1013, and 1014 with the wireless communication circuit 1016 in a dual feed manner. For example, the first antenna element 1012 and the third antenna element 1014 may be electrically connected to the first port P1 and the fifth port P5, respectively, in a single feeding manner through the switching device 1015. According to an embodiment, the second antenna element 1013 may be electrically connected to the wireless communication circuit 1016 in a dual feeding manner by using the third port P3 and the fourth port P4 of the wireless communication circuit 1016.

Referring to fig. 10c and 10d, the communication device 1020 may include an antenna array 1029 disposed in the substrate 1021. According to an embodiment, the antenna array 1029 may include a first antenna 1054, a second antenna 1055, a third antenna 1056, and a fourth antenna 1057 disposed in the substrate 1020 at predetermined intervals. According to an embodiment, the first antenna 1054 may include a first antenna element 1022. According to an embodiment, the second antenna 1055 may include a second antenna element 1023. According to an embodiment, the third antenna 1056 may include a third antenna element 1024. According to an embodiment, fourth antenna 1057 may include fourth antenna element 1025. According to an embodiment, each of the first and fourth antenna elements 1022, 1025 may be electrically connected to the wireless communication circuit 1027 in a single feed manner through one feed portion (e.g., the first feed portion F1 or the sixth feed portion F7), respectively. According to an embodiment, the second antenna element 1023 and the third antenna element 1024 may be arranged between the first antenna element 1022 and the fourth antenna element 1025, and each of the second antenna element and the third antenna element may be electrically connected to the wireless communication circuit 1027 in a dual feeding manner through two feeding portions (e.g., the second feeding portion F3 and the third feeding portion F4, or the fourth feeding portion F5 and the fifth feeding portion F6). According to an embodiment, the sixth feeding portion F7 may be disposed at opposite sides of symmetry in the fourth antenna element 1057. In order to minimize interference with the internal wiring of the third antenna element 1056 or the fifth feeding portion F6, the sixth feeding portion is disposed at the maximum distance so that the degree of freedom of the internal wiring can be improved.

According to various embodiments, the communications apparatus 1020 may include a switching apparatus 1026 interposed between the antenna elements 1022, 1023, 1024, and 1025, and a plurality of feed ports P1-P8 of the wireless communications circuitry 1027. According to an embodiment, the electronic device may control the switching device 1026 to electrically connect the second antenna element 1023 or the third antenna element 1024 of the antenna elements 1022, 1023, 1024, and 1014 and the wireless communication circuit 1027 in a double-feeding manner. For example, the first antenna element 1022 and the fourth antenna element 1025 may be electrically connected to the first port P1 and the seventh port P7, respectively, in a single feed manner through the switching device 1026. According to an embodiment, the second antenna element 1023 may be electrically connected to the wireless communication circuit 1027 in a dual feeding manner by using the third port P3 and the fourth port P4 of the wireless communication circuit 1027. According to an embodiment, the third antenna element 1024 may be electrically connected to the wireless communication circuit 1027 in a dual feeding manner by using the fifth port P5 and the sixth port P6 of the wireless communication circuit 1027.

Referring to fig. 10e and 10f, the communication device 1030 may include an antenna array 1039 disposed in the substrate 1031. According to an embodiment, the antenna array 1039 may include a first antenna 1058, a second antenna 1059, and a third antenna 1060 disposed in the substrate 1030 at predetermined intervals. According to an embodiment, the first antenna 1058 may include a first antenna element 1032. According to an embodiment, the second antenna 1059 may include a second antenna element 1033. According to an embodiment, the third antenna 1060 may include a third antenna element 1034. According to an embodiment, each of the first antenna element 1032 and the third antenna element 1034 may be electrically connected to the wireless communication circuit 1036 by two feeding portions (e.g., the first feeding portion F1 and the second feeding portion F2, or the seventh feeding portion F9 and the eighth feeding portion F10) in such a manner as to feed each polarized wave of the dual polarized waves singly. According to an embodiment, the second antenna element 1033 may be disposed between the first antenna element 1032 and the third antenna element 1034, and may be electrically connected to the wireless communication circuit 1036 by four feeding portions (e.g., the third feeding portion F5, the fourth feeding portion F6, the fifth feeding portion F7, and the sixth feeding portion F8) in a manner of each polarized wave of the dual-fed dual-polarized waves. According to an embodiment, the seventh feeding portion F9 may be disposed on opposite sides of symmetry in the third antenna element 1034. In order to minimize interference with the internal wiring of the second antenna element 1033 or the fifth feeding portion F7, the seventh feeding portion is disposed at the maximum distance so that the degree of freedom of the internal wiring can be improved.

According to various embodiments, the communications device 1030 may include a switching device 1035 between the antenna elements 1032, 1033, and 1034, and a plurality of feed ports P1-P12 of the wireless communications circuitry 1016. According to an embodiment, an electronic device (e.g., electronic device 200 in fig. 2 a) may control the switching device 1035 to electrically connect the second antenna element 1033 of the antenna elements 1032, 1033, and 1034 with the wireless communication circuit 1036 in a manner that each of the dual-fed polarized waves is each. For example, the first antenna element 1032 and the third antenna element 1034 may be electrically connected to the first port P1, the second port P2, the ninth port P9, and the tenth port P10 through the switching device 1035 in such a manner as to feed each of the dual polarized waves singly. According to an embodiment, the second antenna element 1033 may be electrically connected to the wireless communication circuit 1036 in a manner of double-fed each polarized wave of the dual-polarized waves by using the fifth port P5, the sixth port P6, and the seventh port P7 and the eighth port P8 of the wireless communication circuit 1036.

Referring to fig. 10g and 10h, the communication device 1040 may include an antenna array 1049 disposed in a substrate 1041. According to an embodiment, the antenna array 1049 may include a first antenna 1061, a second antenna 1062, a third antenna 1063, and a fourth antenna 1064 disposed in the substrate 1040 at predetermined intervals. According to an embodiment, the first antenna 1061 may include a first antenna element 1042. According to an embodiment, the second antenna 1062 may include a second antenna element 1043. According to an embodiment, the third antenna 1063 may include a third antenna element 1044. According to an embodiment, the fourth antenna 1064 may include a fourth antenna element 1045. According to an embodiment, each of the first antenna element 1042 and the fourth antenna element 1045 may be electrically connected to the wireless communication circuit 1047 by two feeding portions (e.g., the first feeding portion F1 and the second feeding portion F2, or the eleventh feeding portion F11 and the twelfth feeding portion F12) in such a manner as to feed each polarized wave of the dual polarized waves singly. According to an embodiment, the second antenna element 1043 and the third antenna element 1044 may be disposed between the first antenna element 1042 and the fourth antenna element 1045, and each of the second antenna element and the third antenna element may be electrically connected to the wireless communication circuit 1047 by four feeding portions (e.g., the third feeding portion F3, the fourth feeding portion F4, the fifth feeding portion F5, and the sixth feeding portion F6, or the seventh feeding portion F7, the eighth feeding portion F8, the ninth feeding portion F9, and the tenth feeding portion F10) in each polarized wave of the dual-fed dual-polarized waves.

According to various embodiments, the communication device 1040 may include a switching device 1046 interposed between the antenna elements 1042, 1043, 1044, and 1045, and a plurality of feed ports P1-P16 of the wireless communication circuit 1047. In an embodiment, an electronic device (e.g., electronic device 200 in fig. 2 a) may control the switching device 1046 to electrically connect the second antenna element 1043 or the third antenna element 1044 of the antenna elements 1042, 1043, 1044, and 1045 with the wireless communication circuit 1047 in a manner that each polarized wave of the dual-feed dual-polarized waves. For example, the first antenna element 1042 and the fourth antenna element 1045 may be electrically connected to the first port P1, the second port P2, the thirteenth port P13, and the fourteenth port P14 by the switching device 1046 in such a manner that each polarized wave of the single-fed dual-polarized waves is single-fed. According to an embodiment, the second antenna element 1043 may be electrically connected to the wireless communication circuit 1047 in a manner of double-fed each polarized wave of the dual-polarized waves by using the fifth port P5, the sixth port P6, and the seventh port P7 and the eighth port P8 of the wireless communication circuit 1047. According to an embodiment, the third antenna element 1044 may be electrically connected to the wireless communication circuit 1047 in a manner of double-fed each polarized wave of dual-polarized waves by using the ninth port P9, the tenth port P10, the eleventh port P11, and the twelfth port P12 of the wireless communication circuit 1047.

According to various embodiments, an electronic device (e.g., electronic device 200 in fig. 2 a) selectively configures electrical connections between a plurality of ports (e.g., plurality of ports P1-P6 in fig. 10b) and an antenna element (e.g., antenna elements 1012, 1013, and 1014 in fig. 10 a) through a switching device (e.g., switching device 1015 in fig. 10b) of a communication device (e.g., communication device 1010 in fig. 10 a). With the selected configuration, the electronic device can electrically connect to at least one antenna element provided at a specific position and the wireless communication circuit by means of single feeding, double feeding, each of single-feeding dual polarized waves, and/or each of double-feeding dual polarized waves.

Fig. 11a is a diagram illustrating a communication device 1130 arranged as antenna elements having different shapes to configure an antenna array by multi-feeding according to various embodiments of the present disclosure.

The communication means in fig. 11a may be at least partly similar to the communication means 321, 322, 323 and 324 in fig. 3a, or may comprise other embodiments of the communication means.

Fig. 11a illustrates a communication apparatus having a relatively reduced size compared to a conventional communication apparatus by applying multiple feeding (e.g., dual feeding) to conductive elements having different shapes according to an exemplary embodiment of the present disclosure.

Referring to fig. 11a, the communication device 1130 may include: a substrate 1131, a first antenna array 1110 disposed in the substrate 1131 to have a predetermined interval, and a second antenna array 1120 disposed near the first antenna array 1110. According to an embodiment, the first antenna array 1110 may include a first antenna 1111 and a second antenna 1112 arranged on the second surface 1104 of the substrate 1131 at a predetermined interval. According to an embodiment, the first antenna 1111 may include a first antenna element 1132. According to an embodiment, the second antenna 1112 may include a second antenna element 1134. According to an embodiment, the second antenna array 1120 may include a third antenna 1121 disposed adjacent to the first antenna 1111 and a fourth antenna 1122 disposed adjacent to the second antenna 1112 on the second surface 1104 of the substrate 1131. According to an embodiment, the third antenna 1121 may include a third antenna element 1136 and a fourth antenna element 1137 arranged at a predetermined interval. According to an embodiment, the fourth antenna 1122 may include a fifth antenna element 1138 and a sixth antenna element 1139 arranged at a predetermined interval. According to an embodiment, the communication device 1130 may include wireless communication circuitry 1170 disposed on the first surface 1103 of the substrate 1131 and electrically connected to the first antenna array 1110 and the second antenna array 1120. According to an embodiment, the first antenna array 1110 may be electrically connected to the wireless communication circuit 1170 by a pair of feeding portions 1142 and 1143 or 1144 and 1145 disposed symmetrically with respect to a line C-C passing through a center of each of the first and second antenna elements 1132 and 1134. According to an embodiment, the second antenna array 1120 may be electrically connected to the wireless communications circuitry 1170 by a pair of feed portions 1146 and 1147 or 1148 and 1149 arranged based on a line C-C passing between the third and fourth antenna elements 1136 and 1137, or between the fifth and sixth antenna elements 1138 and 1139. According to an embodiment, each of the first antenna element 1132 and the second antenna element 1134 included in the first antenna array 1110 may be constituted by a radiator such as a conductive plate or a conductive patch. According to an embodiment, the third antenna element 1136, the fourth antenna element 1137, the fifth antenna element 1138 and the sixth antenna element 1139 comprised in the second antenna array 1120 may be constituted by a dipole transmitter, such as a conductive pattern formed in the substrate 1131. For example, third antenna element 1136 and fourth antenna element 1137 may be formed from single dipole type transmitters. The fifth and sixth antenna elements 1138 and 1139 may be formed from another single dipole transmitter. According to an embodiment, the communication device 1130 may be configured to transmit or receive at least one signal having a frequency band of 10GHz to 100GHz via the wireless communication circuitry 1170.

According to various embodiments, the communication device 1130 in fig. 11a may have eight feed ports. According to an embodiment, at least one of the first antenna element 1132 and the second antenna element 1134 of the first antenna array 1110, or at least one of the third antenna element 1136, the fourth antenna element 1137, the fifth antenna element 1138 and the sixth antenna element 1139 of the second antenna array 1120 is double fed. Accordingly, the first antenna array 1110 and the second antenna array 1120 have a reduced number of antenna elements, so that the volume of the communication device can be reduced.

Fig. 11b is a diagram illustrating a communication device 1150 arranged to configure an antenna array with multiple feeds of conductive elements having different shapes according to various embodiments of the present disclosure.

Communications apparatus 1150 of fig. 11b may be at least partially similar to communications apparatus 321, 322, 323, and 324 of fig. 3a, or may include other embodiments of communications apparatus 321, 322, 323, and 324.

Referring to fig. 11b, the communication device 1150 may include a substrate 1151, a first antenna array 1180 disposed in the substrate 1151 to have a predetermined interval, and a second antenna array 1190 disposed near the first antenna array 1180. According to an embodiment, the first antenna array 1180 may include a first antenna 1113, a second antenna 1114, and a third antenna 1115 arranged at predetermined intervals on the second surface 1106 of the substrate 1151. According to an embodiment, the first antenna 1113 may include a first antenna element 1152. According to an embodiment, the second antenna 1114 may include a second antenna element 1153. According to an embodiment, the third antenna 1115 may include a third antenna element 1155. According to an embodiment, the second antenna array 1190 may include a fourth antenna 1123, a fifth antenna 1124, and a sixth antenna 1125 arranged at predetermined intervals on the second surface 1106 of the substrate 1151. According to an embodiment, the fourth antenna 1123 may include a fourth antenna element 1156 and a fifth antenna element 1157 arranged at a predetermined interval. According to an embodiment, the fifth antenna 1124 may include a sixth antenna element 1158 and a seventh antenna element 1159 arranged at a predetermined interval. According to an embodiment, the sixth antenna 1125 may include an eighth antenna element 1160 and a ninth antenna element 1161 arranged at a predetermined interval. According to an embodiment, the communication device 1150 may include wireless communication circuitry 1170 disposed on the first surface 1105 of the substrate 1151 and electrically connected to the first antenna array 1180 and the second antenna array 1190. According to an embodiment, the plurality of antenna elements 1152, 1153, and 1155 included in the first antenna array 1180 may be constituted by a transmitter such as a conductive plate or a conductive patch. According to an embodiment, the plurality of antenna elements 1156, 1157, 1158, 1159, 1160, and 1161 included in the second antenna array 1190 may be comprised of dipole transmitters, each having a conductive pattern formed in the substrate 1151. For example, the fourth and fifth antenna elements 1156 and 1157 may be formed of single-dipole type transmitters. For example, the sixth and seventh antenna elements 1158 and 1159 may be formed of another single-dipole type transmitter. The eighth antenna element 1160 and the ninth antenna element 1161 may be comprised of yet another single dipole transmitter.

According to various embodiments, the first antenna element 1152 or the third antenna element 1155 of the first antenna array 1180 may be electrically connected to the wireless communications circuitry 1170 through the first feed portion 1162 or the fourth feed portion 1165. According to various embodiments, the fourth antenna element 1156 or the eighth antenna element 1160 of the second antenna array 1190 may be electrically connected to the wireless communications circuitry 1170 through a fifth feeding portion 1166 or an eighth feeding portion 1169. According to various embodiments, the second antenna element 1153 may be disposed between the first and third antenna elements 1152, 1155 of the first antenna array 1180 and may be electrically connected to the wireless communication circuitry 1170 by the second and/or third feed portions 1163, 1164. According to an embodiment, the sixth and seventh antenna elements 1158, 1159 of the second antenna array 1190 may be disposed between the fifth and eighth antenna elements 1157, 1160 and may be electrically connected to the wireless communication circuitry 1170 by a sixth and/or seventh feeding portion 1167, 1168.

According to various embodiments, if dual feeding is applied to at least one of the antennas configured by the plurality of antenna elements 1152, 1153, and 1155 of the first antenna array 1180 and/or the plurality of antenna elements 1156, 1157, 1158, 1159, 1160, and 1161 of the second antenna array 1190, EIRP degradation of the communication apparatus 1150 can be reduced even if the volume is reduced. According to an embodiment, if at least one of the antennas configured by the plurality of antenna elements 1152, 1153 and 1155 of the first antenna array 1180 and/or the plurality of antenna elements 1156, 1157, 1158, 1159, 1160 and 1161 of the second antenna array 1190 applies dual feeding, for example, if at least one antenna employing dual feeding is disposed at the center of the other antennas, the antenna disposed relatively at the center may transmit higher power than the surrounding antennas employing single feeding. With this configuration, the SLL can be reduced, and the single beam width can be increased.

Fig. 12 is a perspective view of a communication device according to various embodiments of the present disclosure.

Communications apparatus 1200 in fig. 12 may be at least partially similar to communications apparatus 321, 322, 323, and 324 in fig. 3a, or may include other embodiments of communications apparatus 321, 322, 323, and 324.

Referring to fig. 12, the communication device 1200 may include a substrate 1210. According to an embodiment, the substrate 1210 may include a first surface 1211, a second surface 1213 oriented opposite the first surface 1211, and a side surface 1213 surrounding a space between the first surface 1211 and the second surface 1212. According to an embodiment, the substrate 1210 may be arranged such that the second surface 1212 is oriented towards a back plate (e.g., back plate 211 in fig. 2b) of an electronic device (e.g., electronic device 200 in fig. 2 b). However, the present disclosure is not limited thereto, and the substrate 1210 may be disposed such that the second surface 1212 of the substrate is oriented towards a side member (e.g., side member 216 in fig. 2 a) or a front plate (e.g., front plate 202 in fig. 2 a) of the electronic device.

According to various embodiments, the communications device 1200 may include a first antenna array 1214, a second antenna array 1215, a third antenna array 1216, a fourth antenna array 1217, and a fifth antenna array 1218 disposed in a substrate 1210. According to an embodiment, the first antenna array 1214 may be arranged such that a beam pattern is formed through the second surface 1212 of the substrate 1210 along the z-axis. According to an embodiment, the second antenna array 1215 may be arranged such that a beam pattern is formed in the first edge region E1 of the substrate 1210 along the y-axis. According to an embodiment, third antenna array 1216 may be disposed adjacent to second antenna array 1215 and may be disposed such that a beam pattern is formed in first edge region E1 of substrate 1210 along the y-axis. According to an embodiment, the fourth antenna array 1217 may be disposed such that a beam pattern is formed in a second edge area E2 of the substrate 1210 along the x-axis, the second edge area E2 extending from the first edge area E1 at a predetermined angle (e.g., perpendicularly). According to an embodiment, the fifth antenna array 1218 may be disposed adjacent to the fourth antenna array 1217 and may be disposed such that a beam pattern is formed in the second edge region E2 of the substrate 1210 along the x-axis.

According to various embodiments, the first antenna array 1214 may include a first antenna a1, a second antenna a2, a third antenna A3, or a fourth antenna a4 arranged at predetermined intervals on the second surface 1212 of the substrate 1210. According to an embodiment, the second antenna array 1215 may include fifth antennas a5 or sixth antennas a6 arranged at predetermined intervals in the first edge region E1 of the substrate 1210. According to an embodiment, the third antenna array 1216 may include seventh antennas a7 or eighth antennas a8 arranged in the first edge region E1 at predetermined intervals. According to an embodiment, the fourth antenna array 1217 may include ninth antennas a9 or tenth antennas a10 arranged at predetermined intervals in the second edge region E2 of the substrate. According to an embodiment, the fifth antenna array 1218 may include eleventh antennas a11 or twelfth antennas a12 arranged at predetermined intervals in the second edge region E2. According to an embodiment, the communication device 1200 may include a wireless communication circuit 1247 mounted on the first surface 1211 of the substrate 1210 and electrically connected to the plurality of antennas a 1-a 12. According to an embodiment, the wireless communication circuit 1247 may be configured to transmit or receive at least one signal having a frequency band of 10GHz to 100GHz through the plurality of antennas a1 to a 12.

According to various embodiments, at least one of the first antenna a1, the second antenna a2, the third antenna A3, or the fourth antenna a4 of the first antenna array 1214, at least one of the fifth antenna a5 or the sixth antenna A6 of the second antenna array 1215, at least one of the seventh antenna a7 or the eighth antenna A8 of the third antenna array 1216, at least one of the ninth antenna a9 or the tenth antenna a10 of the fourth antenna array 1217, and at least one of the eleventh antenna a11 or the twelfth antenna a12 of the fifth antenna array 1218 may be electrically connected to the wireless communication circuitry 1247 by dual feed and/or dual polarized wave dual feed. With this configuration, although the same number of feed ports are used, the number of antennas is reduced by multi-feeding (e.g., double-feeding), so that the volume of the communication device can be reduced.

Fig. 13a is a diagram illustrating a configuration of a first antenna a1 of the communication device 1200 shown in fig. 12, according to various embodiments of the present disclosure. Fig. 13b is a cross-sectional view of the stacked structure of the first antenna, when viewed along line a-a' shown in fig. 13a, according to various embodiments of the present disclosure.

Referring to fig. 13a, the configuration of the first antenna a1 in the first antenna array 1214 is shown and described. However, it is apparent that the second antenna a2, the third antenna a2, or the fourth antenna a4 of the first antenna array 1214 may also be configured the same as or similar to the first antenna a 1.

Referring to fig. 13a, the first antenna a1 may include an antenna element 1221 disposed on the second surface 1212 of the substrate 1210. According to an embodiment, the antenna element 1221 may be configured as a metal plate or a metal patch type. According to an embodiment, the first antenna a1 may include a conductive pattern 1226 disposed around the antenna element 1221 to surround the antenna element 1221. According to an embodiment, as shown in fig. 13a, there may be a plurality of conductive patterns 1226, and other conductive patterns may also have the same or similar configuration as the conductive patterns 1226.

According to an embodiment, the conductive pattern 1226 may have an inner space and may be a closed loop. According to an embodiment, the conductive pattern 1226 may have a quadrangular shape, but is not limited thereto. For example, the conductive pattern 1226 may have various shapes such as a circle, an ellipse, or a polygon. According to an embodiment, the conductive pattern 1226 may be disposed at a position where the conductive pattern may be capacitively coupled to the antenna element 1221 to improve radiation performance of the antenna element 1221. According to an embodiment, the conductive pattern 1226 may have a specific periodic structure. For example, the antenna element 1221 may be a periodic structure having an electrical length of λ/4. According to an embodiment, the antenna element 1221 may have an Artificial Magnetic Conductor (AMC) structure or include a coated artificial magnetic conductor (SAMC).

According to various embodiments, the conductive pattern 1226 may include a dummy pattern 1227 disposed in the inner space when viewed from above the second surface 1212 of the substrate 1210. According to an embodiment, the dummy pattern 1227 provides a uniform thermal expansion coefficient when the substrate is manufactured, so that it is possible to prevent bending of the substrate 1210, which may occur due to high temperature. According to an embodiment, the dummy pattern 1227 may be made of a conductive material or a non-conductive material. According to an embodiment, as shown in fig. 13a, there may be a plurality of dummy patterns 1227, and other dummy patterns may also have the same or similar configuration as the dummy patterns 1227.

According to various embodiments, the antenna element 1221 may be electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12) mounted on the first surface 1211 of the substrate 1210. According to an embodiment, the antenna element 1221 may be electrically connected to the wireless communication circuit 1247 through four feeding portions 1222, 1223, 1224, and 1225. According to an embodiment, the antenna element 1221 of the at least one first antenna a1 may be electrically connected to the wireless communication circuit 1247 in a dual polarized wave dual feeding manner through the first feeding portion 1222 or the second feeding portion 1223 arranged to be symmetrical to each other, and the third feeding portion 1224 or the fourth feeding portion 1225 arranged to be 90 degrees from the respective feeding portions with respect to the central axis.

Referring to fig. 13b, the substrate 1210 may include a plurality of insulating layers. According to an embodiment, the substrate 1210 may include: a first layer region 1201 comprising at least one insulating layer; and a second layer region 1202 adjacent to the first layer region 1201 and comprising at least one further insulating layer. According to an embodiment, the first layer area 1201 may include an antenna element 1221.

According to various embodiments, the first layer area 1201 may include a first feeding portion 1222 and a second feeding portion 1223 extending from the antenna element 1221 to the second layer area 1202 at positions symmetrical to each other, and electrically connected to the wireless communication circuit 1247. Although not shown, a third feeding portion (e.g., the third feeding portion 1224 in fig. 13 a) and a fourth feeding portion (e.g., the fourth feeding portion 1225 in fig. 13 a) may also be electrically connected to the wireless communication circuit 1247 in the same manner. According to an embodiment, each of the first and second power feeding portions 1222 and 1223 may include a conductive via extending through the first layer region 1201 in a thickness direction of the substrate 1210.

According to various embodiments, the first feed portion 1222 may be electrically connected to the wireless communication circuit 1247 through a first feed line 1205 disposed in the second layer region 1202. According to an embodiment, the second feeding portion 1223 may be electrically connected to the wireless communication circuit 1247 through the second feeding line 1206 provided in the second layer area 1202. According to an embodiment, the first and second feed lines 1205, 1206 may be configured to be electrically disconnected from a ground plane 1203 disposed in the second layer region 1202.

According to various embodiments, the antenna element 1221 may be disposed in the first layer area 1201 of the substrate 1210. According to an embodiment, the conductive pattern 1226 may be disposed on a plane closer to the second surface 1212 of the substrate 1210 than the antenna element 1221 in the first layer area 1201 of the substrate 1210. According to an embodiment, the dummy pattern 1227 may be disposed on a plane farther from the second surface 1212 of the substrate 1210 than the conductive pattern 1226. In an embodiment, the antenna element 1221 may be disposed on the same plane as a plane in which at least a portion of the dummy pattern 1227 is disposed. However, the present disclosure is not limited thereto, and the antenna element 1221, the conductive pattern 1226, and/or the dummy pattern 1227 may be disposed on the same plane and/or a different plane in the first layer area 1201.

According to various embodiments, the first antenna a1 may have an extended bandwidth and improved gain through the conductive pattern 1226. For example, as shown in < table 3> below, if the first antenna is composed of only the antenna element 1221, the gain may be 6.5dBi and the bandwidth may be 1 GHz. According to an embodiment, if the first antenna has an Artificial Magnetic Conductor (AMC) structure further comprising a plurality of conductive patterns, each having a conventional shape and arranged around the antenna element 1221, the gain and bandwidth may be increased to 7.5dBi and 2.5GHz, respectively. If the first antenna has an upper artificial electromagnetic conductor (SAMC) structure further including a loop-shaped conductive pattern 1226 arranged around the antenna elements, the gain and bandwidth may be increased to 8.2dBi and 5GHz, respectively.

[ TABLE 3 ]

Fig. 14a is a partial perspective view of the configuration of the fifth antenna a5 and the seventh antenna a7 of the communication device 1200 shown in fig. 12, in accordance with various embodiments of the present disclosure. Fig. 14B is a cross-sectional view of a stacked structure of a second antenna when viewed along line B-B' shown in fig. 14a, according to various embodiments of the present disclosure.

Referring to fig. 14a, the configuration of the fifth antenna a5 in the second antenna array 1215 is shown and described. However, it is apparent that the sixth antenna a6 of the second antenna array 1215 and the ninth and tenth antennas a9, a10 of the fourth antenna array 1217 may also be configured the same as or similar to the first antenna a 5. As another example, a configuration of a seventh antenna a7 in third antenna array 1216 is shown and described. However, it is apparent that the eighth antenna A8 of the third antenna array 1216 and the eleventh antenna a11 and the twelfth antenna a12 of the fifth antenna array 1218 may also be configured the same as or similar to the seventh antenna a 7.

Referring to fig. 14a, the fifth antenna a5 may include a first antenna element 1232 and a second antenna element 1233. According to an embodiment, the first and second antenna elements 1232 and 1233 may be spaced apart from each other by a predetermined interval while overlapping at least a partial region when viewed from above the second surface 1212 of the substrate 1210. According to an embodiment, wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12) may transmit or receive vertically polarized waves through the first antenna element 1232 and the second antenna element 1233. According to an embodiment, each of the first and second antenna elements 1232 and 1233 may be configured as a metal plate or a metal patch type.

According to various embodiments, the seventh antenna a7 may include a third antenna element 1236 and a fourth antenna element 1237. According to an embodiment, the third antenna element 1236 and the fourth antenna element 1237 may be arranged in parallel and may be arranged in a space between the first antenna element 1232 and the second antenna element 1233. According to an embodiment, wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12) may transmit or receive horizontally polarized waves through third antenna element 1236 and fourth antenna element 1237. According to an embodiment, the third and fourth antenna elements 1236, 1237 may be configured as a metal-pattern dipole transmitter in the substrate 1210.

According to various embodiments, the first and second antenna elements 1232, 1233 of the fifth antenna a5 and/or the third and fourth antenna elements 1236, 1237 of the seventh antenna a7 are electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12). With this configuration, the same number of feed ports are used, but the number of antennas is reduced by multi-feeding (e.g., double-feeding), so that the volume of the communication apparatus can be reduced.

Referring to fig. 14b, the substrate 1210 may include a feeding area NA, a matching area MA, and an antenna placement area FA. According to an embodiment, the fifth antenna a5 may include a first antenna element 1232 and a second antenna element 1233 arranged on different planes in an insulating layer of the substrate 1210. According to an embodiment, the first antenna element 1232 may be electrically connected to the wireless communication circuit 1247 at a first feeding point 1242 through a first feeding line 1251 and a first feeding line 1241. According to an embodiment, the second antenna element 1233 may be electrically connected to the wireless communication circuit 1247 at a second feeding point 1244 through a second feeding line 1252 and a second feeding line 1243.

According to various embodiments, the operating band of the fifth antenna a5 may be determined by the first matching region MA1 (e.g., impedance matching region, cavity) and the second matching region MA2 (e.g., impedance matching region, cavity) of the first antenna element 1232 and the second antenna element 1233. According to an embodiment, the operating frequency of the fifth antenna a5 may be determined according to a capacitance value depending on the vertical distance and/or coupling area between the first antenna element 1232 and the first power supply line 1241. According to an embodiment, the operating frequency of the fifth antenna a5 may be determined according to a capacitance value depending on the vertical distance and/or the coupling area between the second antenna element 1233 and the second power feed line 1243. However, the present disclosure is not limited thereto, and the operating frequency of the fifth antenna a5 may be determined according to a capacitance value depending on a vertical distance and/or a coupling area between the first power supply line 1241 and the ground plane 1207 and/or between the second power supply line 1243 and the ground plane 1207.

According to various embodiments, the seventh antenna a7 may be disposed in a space between the first and second antenna elements 1232 and 1233 of the fifth antenna a5, and may include third and fourth conductive patterns 1236 and 1237 arranged on respective ends of third and fourth power supply lines 1245 and 1246, the third and fourth power supply lines 1245 and 1246 being formed to at least partially protrude from the fifth antenna a 5. According to an embodiment, the third power feed 1245 can be electrically connected to the wireless communication circuit 1247 through the third power feed 1253. According to an embodiment, the fourth power feed 1246 can be electrically connected to the wireless communication circuit 1247 through the fourth power feed 1254.

Fig. 15a and 15b are diagrams illustrating various feeding structures of a communication apparatus 1500 according to various embodiments of the present disclosure.

The communication means in fig. 15a may be at least partly similar to the communication means 321, 322, 323 and 324 in fig. 3a, or may comprise other embodiments of the communication means 321, 322, 323 and 324.

Referring to fig. 15a, the communication device 1500 may include a first antenna array 1520 disposed in a substrate 1510, a second antenna array 1530 disposed in the substrate 1510 to be adjacent to the first antenna array 1520, and a third antenna array 1540 disposed in the substrate 1510 to be adjacent to the second antenna array 1530. According to an embodiment, the first antenna array 1520 may include four antennas a1, a2, A3, and a4 having a1 × 4 layout and arranged in the substrate 1510. The antennas a1, a2, A3, and a4 of the first antenna array 1520 may have the same or similar configuration as the first antenna a1 in fig. 12. According to an embodiment, the second antenna array 1530 may include four antennas a5, a6, a7, and A8 having a1 × 4 layout and arranged in the substrate 1510. According to an embodiment, the antennas a5, a6, a7, and A8 of the second antenna array 1530 may have the same or similar configuration as the fifth antenna a5 in fig. 12. According to an embodiment, the third antenna array 1540 may include four antennas a9, a10, a11, and a12 having a1 × 4 layout and arranged in the substrate 1510. The antennas a9, a10, a11, and a12 of the third antenna array 1540 may have the same or similar structure as the first antenna a7 of fig. 12.

According to various embodiments, the first antenna array 1520 may include a first antenna a1, a second antenna a2, a third antenna A3, and a fourth antenna a 4. According to an embodiment, the first antenna a1 may include a first antenna element 1521, a conductive pattern 1526 (e.g., the conductive pattern 1226 in fig. 13 a) disposed around the first antenna element 1521 and having a closed loop shape, and a dummy pattern 1527 (e.g., the dummy pattern 1227 in fig. 13 a) disposed in an inner space of the conductive pattern 1526. For example, there may be a plurality of conductive patterns 1526 or dummy patterns 1527. According to an embodiment, the first antenna element 1521 may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit 1247 in fig. 12) in the form of a double-fed dual polarized wave through the first feeding portion F1, the second feeding portion F2, the third feeding portion F3, and the fourth feeding portion F4. According to an embodiment, the second antenna a2, the third antenna A3, and the fourth antenna a4 may also include a second antenna element 1522, a third antenna element 1523, and a fourth antenna element 1524. In the same manner as the first antenna element 1521, the second, third, and fourth antenna elements 1522, 1523, and 1524 may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit 1247 in fig. 12) by a plurality of feeding portions F6, F7, F8, F9, F10, F11, F12, F13, F14, F15, and F16 in a double-fed dual polarized wave manner.

According to various embodiments, the first antenna array 1520 is electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12) by way of the first antenna element 1221, the first antenna element 1522, the third antenna element 1223, and the fourth antenna element 1524 in a dual-feed dual polarized wave. With this configuration, although the same number of feed ports are used, the number of antennas is reduced by multi-feeding (e.g., dual-feeding) as compared with the conventional case, so that the volume of the communication device can be reduced.

As shown in fig. 15b, among the antenna elements 1521, 1522, 1523 and 1524 in the four antennas a1, a2, A3 and a4 arranged in the first antenna array 1520 in fig. 15a, the first antenna element 1521 of the first antenna a1 and the fourth antenna element 1524 of the fourth antenna a4 may be electrically connected to a wireless communication circuit (for example, the wireless communication circuit 1247 in fig. 12) by way of the first feeding portion F1, the fourth feeding portion F4, the thirteenth feeding portion F13 and the sixteenth feeding portion F16 in a single-feeding of each polarized wave of the dual-polarized waves. The second antenna element 1522 of the second antenna a2 and the third antenna element 1532 of the third antenna A3 may be electrically connected to a wireless communication circuit (for example, the wireless communication circuit 1247 in fig. 12) by the fifth feeding portion F5 and the twelfth feeding portion F12 in a manner of double-feeding each of the dual polarized waves. In the first antenna array 1520, if the double feed of each of the dual polarized waves is applied to the corresponding antenna elements 1522 and 1523 of the second antenna a2 and the third antenna A3 arranged at least at the center among the plurality of antennas a1, a2, A3, and a4, the second antenna and the third antenna can radiate higher power than the surrounding antennas a1 and a4 that employ a single feed of each of the dual polarized waves. With this configuration, the Side Lobe Level (SLL) can be reduced, and the single beam width can be increased.

Fig. 16 is a configuration diagram of a communication device according to various embodiments of the present disclosure.

The communication device of fig. 16 may be at least partially similar to communication devices 321, 322, 323, and 324 in fig. 3a, or may include other embodiments of communication devices 321, 322, 323, and 324.

Referring to fig. 16, the communication device 1600 may include a substrate 1610. The substrate 1610 may include a first surface 1611, and a second surface 1612 oriented opposite the first surface 1611. According to an embodiment, the communication device 1600 may include an antenna array 1620 disposed in the substrate 1610, and a second antenna array 1630 and a third antenna array 1640 arranged at one side of the substrate 1610. According to an embodiment, the communication device 1600 may include a fourth antenna array 1650 and a fifth antenna array 1660 arranged near one side of the substrate 1610 opposite the other. According to an embodiment, the second antenna array 1630 and the fourth antenna array 1650 may comprise substantially the same configuration. According to embodiments, the third antenna array 1640 and the fifth antenna array 1660 may comprise substantially the same configuration. According to an embodiment, the first antenna array 1620 may include a first antenna 1621, a second antenna 1622, and a third antenna 1623 that form a beam pattern in the direction of the second surface 1612 of the substrate 1610. According to an embodiment, each of the first, second, and third antennas 1621, 1622, and 1623 may be configured as a conductive plate or patch type.

According to various embodiments, the second antenna array 1630 may include a fourth antenna 1631, a fifth antenna 1632, or a sixth antenna 1633 disposed at one side of the substrate 1610 corresponding to the antennas 1621, 1622, and 1623 of the first antenna array 1620. According to an embodiment, the fourth antenna array 1650 may include a seventh antenna 1651, an eighth antenna 1652, or a ninth antenna 1653 disposed at the other side of the substrate 1610 corresponding to the antennas 1621, 1622, and 1623 of the first antenna array 1620. According to an embodiment, each of the fourth to ninth antennas 1631 to 1653 may be configured as a conductive plate or a conductive patch type.

According to various embodiments, the third antenna array 1640 may include a tenth antenna 1641, an eleventh antenna 1642, or a twelfth antenna 1643 disposed near the second antenna array 1630. According to embodiments, the fifth antenna array 1660 may include a thirteenth antenna 1661, a fourteenth antenna 1662, or a fifteenth antenna 1663 disposed near the fourth antenna array 1650. According to an embodiment, the tenth through fifteenth antennas 1641 through 1663 may be configured as dipole emitters, each having a conductive pattern formed in the substrate 1610. According to an embodiment, each of the fourth to ninth antennas 1631 to 1653 may have substantially the same configuration as the fifth antenna a5 in fig. 14 a. According to an embodiment, each of the tenth through fifteenth antennas 1641 through 1653 may have substantially the same configuration as the seventh antenna a7 in fig. 14 a.

According to various embodiments, the fourth antenna 1631 may include a first antenna element 1631-1 and a second antenna element 1631-2 spaced apart from each other by a predetermined interval and arranged to face each other. Fifth antenna 1632 may include a third antenna element 1632-1 and a fourth antenna element 1632-2. The sixth antenna 1633 may include a fifth antenna element 1633-1 and a sixth antenna element 1633-2. The seventh antenna 1651 may include a seventh antenna element 1651-1 and an eighth antenna element 1651-2, according to an embodiment. The eighth antenna 1652 can include a ninth antenna element 1652-1 and a tenth antenna element 1652-2. The ninth antenna 1653 may include an eleventh antenna element 1653-1 and a twelfth antenna element 1653-2.

According to various embodiments, the tenth antenna 1641 may include a thirteenth antenna element 1641-1 and a fourteenth antenna element 1641-2 spaced apart from each other by a predetermined interval and disposed to face each other. The eleventh antenna 1642 may include a fifteenth antenna element 1642-1 and a sixteenth antenna element 1642-2. The twelfth antenna 1643 may include a seventeenth antenna element 1643-1 and an eighteenth antenna element 1643-2. According to embodiments, the thirteenth antenna 1661 may include nineteenth 1661-1 and twentieth 1661-2 antenna elements. The fourteenth antenna 1662 may include a twenty-first antenna element 1662-1 and a twenty-second antenna element 1622-2. The fifteenth antenna 1663 may include a twenty-third antenna element 1663-1 and a twenty-fourth antenna element 1663-2.

According to various embodiments, the second antenna array 1630 and the fourth antenna array 1650 may be electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12) to generate vertically polarized waves in a lateral direction of the substrate 1610. According to an embodiment, the third and fifth antenna arrays 1640, 1660 may be electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 1247 in fig. 12) to generate horizontally polarized waves in a lateral direction of the substrate 1610.

Fig. 17a and 17b are diagrams illustrating feed structures of the second antenna array 1630 and the fourth antenna array 1650 illustrated in fig. 16, according to various embodiments of the disclosure.

Referring to fig. 17a and 17b, the fifth antenna 1632 disposed at the center between the three antennas of the second antenna array 1630 and the eighth antenna 1652 disposed at the center between the three antennas of the fourth antenna array 1650 may be electrically connected by dual feeding to the feeding ports (ports 1 to 8) of the wireless communication circuit (e.g., the wireless communication circuit 1247 in fig. 12) of the wireless communication circuit 1600. According to an embodiment, in the second antenna array 1630, the first antenna element 1631-1 of the fourth antenna 1631 may be connected to the first feed port (port 1), the third antenna element 1632-1 and the fourth antenna element 1632-2 of the fifth antenna 1632 may be connected to the second feed port (port 2) and the third feed port (port 3), respectively, and the fifth antenna element 1633-1 of the sixth antenna 1633 may be electrically connected to the fourth feed port (port 4). According to an embodiment, in the fourth antenna array 1650, the seventh antenna element 1651-1 of the seventh antenna 1651 may be connected to a fifth feed port (port 5), the ninth antenna element 1652-1 and the tenth antenna element 1652-2 of the eighth antenna 1652 may be connected to a sixth feed port (port 6) and a seventh feed port (port 7), respectively, and the eleventh antenna element 1653-1 of the ninth antenna 1653 may be electrically connected to an eighth feed port (port 8).

Fig. 18 a-18 c are diagrams illustrating various feed structures of the third and fifth antenna arrays 1640, 1660 shown in fig. 16, according to various embodiments of the disclosure.

Referring to fig. 18a, an eleventh antenna 1642 disposed at the center between the three antennas of the third antenna array 1640 and a fourteenth antenna 1662 disposed at the center between the three antennas of the fifth antenna array 1660 may be electrically connected by double feeding to some feeding ports (ports 9 to 16) of the wireless communication circuit (e.g., wireless communication circuit 1247 in fig. 12) of the wireless communication circuit 1600. According to an embodiment, in the third antenna array 1640, a thirteenth antenna element 1641-1 of a tenth antenna 1641 may be connected to a ninth feeding port (port 9), a fifteenth antenna element 1642-1 and a sixteenth antenna element 1642-2 of an eleventh antenna 1642 may be connected to a tenth feeding port (port 10) and an eleventh feeding port (port 11), respectively, and an eighteenth antenna element 1643-2 of a twelfth antenna 1643 may be electrically connected to a twelfth feeding port (port 12). According to an embodiment, in the fifth antenna array 1660, the nineteenth antenna element 1661-1 of the thirteenth antenna 1661 may be connected to the thirteenth feed port (port 13), the twenty-first antenna element 1662-1 and the twenty-second antenna 1662-2 of the fourteenth antenna 1662 may be connected to the fourteenth feed port (port 14) and the fifteenth feed port (port 15), respectively, and the twenty-fourth antenna element 1663-2 of the fifteenth antenna 1663 may be electrically connected to the sixteenth feed port (port 16).

As shown in fig. 18b, the three antennas 1641, 1642, 1643 of third antenna array 1640 may have substantially the same feed structure as shown in fig. 18a, and may be configured as folded dipole-type antenna elements 1644, 1645, and 1646. According to embodiments, the three antennas 1661, 1662, 1663 of the fifth antenna array 1660 may have substantially the same feed structure as shown in fig. 18a, and may be configured as folded dipole- type antenna elements 1664, 1665, and 1666.

Referring to fig. 18c, in the configuration shown in fig. 18b, tenth and twelfth antennas 1644 and 1646 may be configured as general-purpose dipole- type antennas 1641 and 1643, and eleventh antenna 1645 may be configured as a folded dipole type. However, the present disclosure is not limited thereto, and at least one of folded dipole- type antennas 1645, 1664, 1665, and 1666 may also be configured as at least one of general dipole antennas 1642, 1661, 1662, and 1663, as shown in fig. 18 a.

Fig. 19a and 19b are diagrams illustrating a layout of a communication device according to various embodiments of the present disclosure.

Communication devices 520, 520-1, 520-2 in fig. 19a and 19b may be at least partially similar to communication devices 321, 322, 323, and 324 in fig. 3a, communication device 400 in fig. 4a, communication device 510 in fig. 5, communication device 600 in fig. 6, communication device 710 in fig. 7a, communication device 1010 in fig. 10a, communication device 1020 in fig. 10c, communication device 1030 in fig. 10e, communication device 1040 in fig. 10g, communication device 1130 in fig. 11a, communication device 1150 in fig. 11b, communication device 1200 in fig. 12, communication device 1500 in fig. 15a, communication device 1160 in fig. 16, or may include other embodiments of communication devices.

Referring to fig. 19a, electronic device 1900 may include a housing 1910. According to an embodiment, housing 1910 may include side members 1920. According to an embodiment, at least a partial area of the side member 1920 may be formed of a conductive member, and may be implemented as an element conductive portion by a non-conductive portion to function as an antenna radiator.

According to various embodiments, the housing 1910 may include a first portion 1911 having a first length, a second portion 1912 extending perpendicular to the first portion 1911 and having a second length, a third portion 1913 extending from the second portion 1912 to be parallel to the first portion 1911 and having the first length, and a fourth portion 1914 extending from the third portion 1913 to be parallel to the second portion 1912 and having the second length.

According to various embodiments, the first communication device 520 or the second communication device 520-1 may be disposed in the interior 1901 of the electronic device 1900. According to an embodiment, the first communication device 520 or the second communication device 520-1 may be disposed in at least one corner portion of the electronic device 1900 having substantially a quadrangular shape.

According to various embodiments, the first side portion 5201 of the first communication device 520 may be disposed adjacent to the first portion 1911 of the housing 1910 and the second side portion 5202 of the first communication device 520 may be disposed adjacent to the second portion 1912 of the housing 1910. The electrical connection members 550 (e.g., power and/or RF terminals) of the first communication device 520 may extend from the fourth side portion 5204 of the first communication device 520 toward the center of the electronic device 1900. According to another example, the electrical connection member 550 may extend from the third side portion 5203 of the first communication device 520 toward a center of the electronic device 1900. According to various embodiments, the first side portion 5201 of the second communication device 520-1 may be disposed adjacent to the fourth portion 1914 of the housing 1910 and the second side portion 5202 of the second communication device 520-1 may be disposed adjacent to the first portion 1911 of the housing 1910.

According to various embodiments, the first communication device 520 may generate a beam pattern towards a backplane of the electronic device (e.g., backplane 211 in fig. 2 b).

Referring to fig. 19b, the first communication device 520, the second communication device 520-1 or the third communication device 520-2 may be disposed in a partial area of an edge of the electronic device 1900. According to an embodiment, the first communication device 520 may be arranged such that the second surface of the substrate 521 (e.g. the second surface 412 in fig. 4 a) of the first communication device 520 is oriented towards the first portion 1911 and is arranged substantially at the center of the first portion 1911 of the housing 1910. According to an embodiment, the first communication device 520 may be arranged such that the first side portion 5201 of the substrate 521 of the first communication device 520 is parallel to the first portion 1911 of the housing 1910, when viewed from above the second plate (e.g., the second plate 211 in fig. 2b) of the electronic device 1900. According to an embodiment, the second communication device 520-1 may be arranged such that the second surface (e.g., the second surface 412 in fig. 4 a) of the substrate 521 of the second communication device 520-1 is parallel to and adjacent to the fourth portion 1914 of the housing 1910 in a partial area of the fourth portion 1914. According to an embodiment, the third communication device 520-2 may be arranged such that the second surface (e.g., the second surface 412 in fig. 4 a) of the substrate 521 of the third communication device 520-2 is parallel to and adjacent to the second portion 1912 of the housing 1910 in a partial area of the second portion 1912.

According to various embodiments, the first communication device 520 may generate a beam pattern towards the first portion 1911 of the housing 1910 (e.g., in the (r) direction). According to various embodiments, the second communication device 520-1 may generate a beam pattern toward the fourth portion 1914 of the housing 1910 (e.g., in the direction (r)). According to various embodiments, the third communication device 520-2 may generate a beam pattern towards the second portion 1912 of the housing 1910 (e.g., in direction (s)).

According to various embodiments, although not shown, the communication devices 520, 520-1, and 520-2 shown in fig. 19a and 19b may be arranged in at least partial areas of corners or edges of the electronic device 1900 having a substantially rectangular shape, or may be arranged in both the corners and the edges.

According to various embodiments, a region of the housing 1910 corresponding to a portion where the communication devices 520, 520-1, and 520-2 are mounted may be formed of a material (e.g., a dielectric material) different from a conductive material to prevent a reduction in radiation performance of the communication devices. However, the present disclosure is not limited thereto, and holes may be formed through the housing in a beam generating direction of the communication apparatus in corresponding regions of the housing 1910, or these regions may be replaced with a metal periodic structure (e.g., a metal mesh) through which a beam can pass.

According to various embodiments, an electronic device (e.g., electronic device 200 in fig. 2 a) may include: a housing (e.g., housing 210 in fig. 2 a) comprising a first plate (e.g., first plate 202 in fig. 2 a), a second plate (e.g., second plate 211 in fig. 2b) oriented opposite the first plate, and a side member (e.g., side support structure 218 in fig. 2 a) surrounding a space between the first and second plates; an antenna structure (e.g., antenna array 720 in fig. 7a) comprising at least one plane parallel to the second plate, wherein the antenna structure comprises a first element (e.g., second element 712 in fig. 7a) disposed on the plane, a second element (e.g., second element 713 in fig. 7a) spaced apart from the first element in the plane when viewed from above the plane, and a third element (e.g., third element 714 in fig. 7a) spaced apart from the second element in the plane when viewed from above the plane, the second element disposed between the first element and the third element; and wireless communication circuitry (e.g., wireless communication circuitry 715 in fig. 7a), electrically configured to transmit and receive signals having a frequency range of 10GHz to 100GHz, wherein the wireless communication circuit includes a first electrical path (e.g., first electrical path 7121 in FIG. 7a) connected to the first element, a second electrical path (e.g., second electrical path 7131 in FIG. 7a) connected to a first point on the second element (the first point being closer to the first element than to the third element), a third electrical path (e.g., third electrical path 7132 in FIG. 7a) connected to a second point on the second element (the second point being closer to the third element than to the first element), and a fourth electrical path (e.g., fourth electrical path 7141 in FIG. 7a) connected to the third element, and wherein the wireless communication circuitry is configured to provide a phase difference between a first signal from the first point and a second signal from the second point.

According to various embodiments, the phase difference may be 180 degrees.

According to various embodiments, the first element (e.g., the first element 712 in fig. 7a), the second element (e.g., the second element 713 in fig. 7a), and the third element (e.g., the third element 714 in fig. 7a) may have symmetrical shapes with the same diameter.

According to various embodiments, a first point (e.g., the first point 7131 in fig. 7a) may be disposed between the center of a second element (e.g., the second element 713 in fig. 7a) and a first element (e.g., the first element 712 in fig. 7a), and a second point (e.g., the second point 7132 in fig. 7a) may be disposed between the center of the second element (e.g., the second element 713 in fig. 7a) and a third element (e.g., the third element 714 in fig. 7 a).

According to various embodiments, the first element (e.g., the first element 1152 in fig. 11 b), the second element (e.g., the second element 1153 in fig. 11 b), and the third element (e.g., the third element 1155 in fig. 11 b) may be configured in a first row (e.g., the first row 1180 in fig. 11 b), and the antenna structure may further include an array of dipole antennas (e.g., the second antenna array 1190 in fig. 11 b) disposed in a second row parallel to the first row.

According to various embodiments, an electronic device may comprise: a housing (e.g., housing 210 in fig. 2 a) comprising a first plate (e.g., first plate 202 in fig. 2 a), a second plate (e.g., second plate 211 in fig. 2 a) oriented opposite the first plate, and a side member (e.g., side support structure 218 in fig. 2 a) surrounding a space between the first and second plates; an antenna structure (e.g., antenna 450 in fig. 4 a) comprising a plane parallel to the first plate and comprising at least one first antenna element (e.g., antenna element 420 in fig. 4 a) disposed on the plane; and wireless communication circuitry (e.g., wireless communication circuitry 430 in fig. 4 a) electrically configured to transmit and receive signals having a frequency range of 10GHz to 100GHz, wherein the wireless communication circuitry comprises electrical paths (e.g., electrical paths 421 and 422 in fig. 4 a) electrically connected to a plurality of points on the first antenna element, respectively, that are spaced apart from one another, and wherein the wireless communication circuitry is configured to provide at least one phase difference between at least two signals from the plurality of points.

According to various embodiments, at least two of the at least a plurality of points may be symmetrical to each other with respect to the center of the first antenna element.

According to various embodiments, the first antenna element (e.g., the antenna element 620 in fig. 6) may be symmetrical with respect to an imaginary line passing through a center of the first antenna element, and the plurality of points may include a first point (e.g., the first point 621 in fig. 6) disposed at one side of the first element with respect to the line, and a second point (e.g., the second point 623 in fig. 6) symmetrical with the first point at the other side with respect to the line.

According to various embodiments, the first antenna element may include a third point (e.g., third point 622 in fig. 6) disposed at 90 degrees from the first point with respect to the center, and a fourth point (e.g., fourth point 624 in fig. 6) disposed symmetrically to the third point on the first antenna element, and the third and fourth points may be electrically connected to a wireless communication circuit (e.g., wireless communication circuit 630 in fig. 6).

According to various embodiments, the electronic device may further include a substrate (e.g., the substrate 410 in fig. 4 b) on which a plurality of insulating layers are stacked, and the first antenna element (e.g., the antenna element 420 in fig. 4 b) may be disposed on a first plane (e.g., the first plane 4101 in fig. 4 b) in the insulating layers of the substrate.

According to various embodiments, the wireless communication circuitry may be electrically connected to the first antenna element by using electrical paths (e.g. electrical paths 421 and 422 in fig. 4 b) arranged to extend through the insulating layer of the substrate.

According to various embodiments, the electrical paths (e.g., electrical paths 421 and 422 in fig. 4 e) may be electrically connected to at least two conductive pads (e.g., conductive pads 423 and 424 in fig. 4 e) disposed correspondingly on a second plane (e.g., second plane 4101 in fig. 4 e) of the insulating layer of the substrate that is different from the first plane, and the at least two conductive pads may be positioned such that the pads can be capacitively coupled to the antenna element.

According to various embodiments, the electronic device may further include a second antenna element (second antenna element 426 in fig. 4 f) disposed on the third plane (e.g., third plane 4101 in fig. 4 f) in the insulating layer, spaced apart from the first antenna element (e.g., first antenna element 420 in fig. 4 f), the at least two second conductive pads (e.g., two conductive pads 423 and 424 in fig. 4 f) may be disposed between the first antenna element and the second antenna element, and the second antenna element may be positioned such that the second antenna element can be capacitively coupled to the at least two second conductive pads.

According to various embodiments, wireless communication circuitry (e.g., wireless communication circuitry 430 in fig. 4 f) may transmit or receive signals having a first frequency band through a first antenna element (e.g., antenna element 420 in fig. 4 f) and may transmit or receive signals having a second frequency band, different from the first frequency band, through a second antenna element (e.g., second antenna element 426 in fig. 4 f).

According to various embodiments, the electronic device may further include a switching device (e.g., switching device 1015 in fig. 10b) configured to selectively switch the plurality of electrical paths.

According to various embodiments, the electronic device may further include at least one conductive pattern (e.g., conductive patterns 1121 and 1122 in fig. 11 a) configured to be located on a periphery of the first antenna element (e.g., antenna elements 1232 and 1234 in the antenna element in fig. 11 a) and electrically connected to wireless communication circuitry (e.g., wireless communication circuitry 1170 in fig. 11 a) at least two points.

According to various embodiments, the at least one conductive pattern (e.g., conductive patterns 1121 and 1122 in fig. 11 a) may include a dipole antenna or a folded dipole antenna.

According to various embodiments, the at least one conductive pattern (e.g., conductive patterns 1121 and 1122 in fig. 11 a) may include first and second conductive patterns electrically connected to wireless communication circuitry.

According to various embodiments, the electronic device may further include a substrate (e.g., substrate 1131 in fig. 11 a) including a first surface (e.g., first surface 1103 in fig. 11 a) positioned to face the first board (e.g., first substrate 202 in fig. 2 a) and a second surface (e.g., second surface 1104 in fig. 11 a) positioned to face the second board (e.g., second board 211 in fig. 2b), and the first antenna element (e.g., antenna element 1132 in fig. 11 a) may be disposed on the second surface.

According to various embodiments, the first antenna element (e.g., the antenna element 1132 in fig. 11 a) may include a metal pattern formed on a substrate, a metal plate attached to a substrate, a Flexible Printed Circuit Board (FPCB), or a conductive paint coated on a substrate.

The embodiments described and illustrated in the specification and drawings have expressed specific examples to facilitate explanation of technical contents of the embodiments and to assist understanding of the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of various embodiments should be construed to include all changes and modifications based on the technical idea of various embodiments in addition to the embodiments disclosed herein.

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