阅读说明：本技术 电路板 (Circuit board ) 是由 朴锡纶 李石峰 于 2019-01-02 设计创作，主要内容包括：根据一个实施例的电路板包括：端子部,包括多个第一端子；主体部,与端子部分开,包括多个第二端子；以及布线部,位于端子部与主体部之间,其中,布线部包括用于将所述多个第一端子连接到所述多个第二端子的电力布线和接地布线,并且在布线部内,接地布线设置成比电力布线向外。(The circuit board according to one embodiment includes: a terminal portion including a plurality of first terminals; a main body portion including a plurality of second terminals, separated from the terminal portion; and a wiring portion located between the terminal portion and the main body portion, wherein the wiring portion includes power wirings and ground wirings for connecting the plurality of first terminals to the plurality of second terminals, and the ground wirings are provided outward of the power wirings within the wiring portion.)

1. A circuit board, the circuit board comprising:

a terminal portion including a plurality of first terminals;

a main body portion spaced apart from the terminal portion and including a plurality of second terminals; and

a wiring portion located between the terminal portion and the main body portion,

wherein the wiring portion includes power wiring and ground wiring connecting the plurality of first terminals and the plurality of second terminals, and

the ground wiring is disposed in the wiring portion to be more outward than the power wiring.

2. The circuit board of claim 1,

the wiring portion is a flexible circuit board.

3. The circuit board of claim 1,

the circuit board is connected with the main board and the battery module.

4. The circuit board of claim 3,

when the main board is divided into two regions by a reference line between the ground wiring and the power wiring, the ground wiring is provided at a side corresponding to a region having a smaller area among the two divided regions within the wiring portion, and

the power wiring is provided at a side corresponding to a region having a larger area among the two divided regions.

5. The circuit board of claim 3,

when a plurality of modules are mounted on the main board, the ground wiring is provided at a side spaced farther from the plurality of modules than the power wiring in the wiring portion.

6. The circuit board of claim 1,

each of the terminal portion, the body portion, and the wiring portion includes a base layer, a first copper foil layer located on the base layer, a first plating layer located on the first copper foil layer, a second copper foil layer located below the base layer, and a second plating layer located below the second copper foil layer.

7. The circuit board of claim 6,

each of the first and second copper foil layers of the wiring portion includes a power wiring and a ground wiring, and

the ground wiring of the first copper foil layer and the ground wiring of the second copper foil layer are positioned corresponding to each other at respective sides of the wiring portion.

8. The circuit board of claim 6,

the first copper foil layer and the second copper foil layer have a thickness of 18 μm, and

the thickness of the first plating layer and the second plating layer was 15 μm.

9. The circuit board of claim 6,

the wiring part further includes a first cover film attached to the first plating layer through a first adhesive layer and a second cover film attached to the second plating layer through a second adhesive layer, and

the base layer, the first cover film, and the second cover film are formed of a resin material.

10. The circuit board of claim 6,

in the terminal portion, the first copper foil layer and the second copper foil layer are connected to each other through the contact hole.

11. The circuit board of claim 3,

a battery protection integrated circuit protecting the battery module is mounted in the main body part.

Technical Field

The present disclosure relates to a circuit board.

Background

Typically, the internal circuitry of an electronic device is implemented on a circuit board. The internal circuit of such an electronic device is driven by receiving power from the battery module. At this time, the electrical connection between the internal circuit and the battery module may be accomplished through the circuit board.

Meanwhile, various circuit modules are mounted in an internal space of a mobile terminal such as a mobile phone, and thus the internal space is narrowed, so that EMI noise may be generated in power supplied from a battery module.

Accordingly, a PCB having a shielding layer on a power transmission line has been developed to solve EMI noise, but manufacturing costs may increase due to additional processes. Therefore, a transmission line capable of efficiently transmitting power without EMI noise is required.

Disclosure of Invention

Technical problem

It is an object of the present invention to address the above problems and others. Another object is to provide a circuit board that can shield EMI noise.

Technical scheme

An embodiment for achieving the one object and the other objects provides a circuit board including: a terminal portion including a plurality of first terminals; a main body portion spaced apart from the terminal portion and including a plurality of second terminals; and a wiring portion located between the terminal portion and the main body portion, wherein the wiring portion includes a power wiring and a ground wiring that connect the plurality of first terminals and the plurality of second terminals, and the ground wiring is provided inside the wiring portion to be outward of the power wiring.

The wiring portion may be a flexible circuit board.

The circuit board is connected with the main board and the battery module.

When the main board is divided into two regions by a reference line between the ground wiring and the power wiring, the ground wiring is disposed at a side corresponding to a region having a smaller area among the divided two regions, and the power wiring is disposed at a side corresponding to a region having a larger area among the divided two regions.

When a plurality of modules are mounted on the main board, the ground wiring is provided at a side spaced farther from the plurality of modules than the power wiring in the wiring portion.

Each of the terminal portion, the body portion, and the wiring portion includes a base layer, a first copper foil layer located on the base layer, a first plating layer located on the first copper foil layer, a second copper foil layer located below the base layer, and a second plating layer located below the second copper foil layer.

Each of the first and second copper foil layers of the wiring portion includes a power wiring and a ground wiring, and the ground wiring of the first copper foil layer and the ground wiring of the second copper foil layer are positioned corresponding to each other at respective sides of the wiring portion.

The first and second copper foil layers had a thickness of 18 μm, and the first and second plating layers had a thickness of 15 μm.

The wiring portion further includes a first cover film attached to the first plating layer through a first adhesive layer and a second cover film attached to the second plating layer through a second adhesive layer, the base layer, the first cover film, and the second cover film being formed of a resin material.

In the terminal portion, the first copper foil layer and the second copper foil layer are connected to each other through the contact hole.

A battery protection IC (integrated circuit) that protects the battery module is mounted in the main body portion.

Technical effects

According to the present invention, a signal in which EMI noise is reduced can be transmitted through the transmission line of the circuit board.

According to the present invention, a circuit board capable of shielding EMI noise can be manufactured at low cost.

Drawings

Fig. 1 shows an internal block diagram of an electronic device connected through a circuit board according to an embodiment.

Fig. 2 illustrates a top plan view of a circuit board according to an embodiment.

Fig. 3 shows a schematic cross-sectional view of a stacked structure of circuit boards according to an embodiment.

Fig. 4 shows a top plan view of a first copper foil layer of a circuit board according to an embodiment.

Fig. 5 shows a top plan view of a second copper foil layer of a circuit board according to an embodiment.

Fig. 6 shows an internal block diagram of an electronic device connected through a circuit board according to another embodiment.

Detailed Description

The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, without departing from the spirit or scope of the present disclosure.

The terms "module", "component", portion ", and" unit "used in the following description to represent constituent elements are only for the purpose of facilitating understanding of the specification. Thus, these terms do not have meanings or roles of distinguishing them from each other by themselves. In addition, in describing exemplary embodiments of the present specification, detailed descriptions of well-known technologies associated with the present invention will be omitted when it is determined that they may obscure the gist of the present invention.

Parts irrelevant to the description will be omitted to clearly describe the present disclosure, and like reference numerals denote like elements throughout the specification.

Further, in the drawings, the size and thickness of each element are arbitrarily shown for ease of description, and the present disclosure is not necessarily limited to those shown in the drawings. In the drawings, the thickness of layers, films, panels, areas, regions, etc. are exaggerated for clarity. In the drawings, the thickness of some layers and regions are exaggerated for ease of description.

It will be understood that when an element such as a layer, film, region, plate or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. Further, in the specification, the words "on …" or "above …" mean being positioned on or below the object part, and do not necessarily mean being positioned on the upper side of the object part based on the direction of gravity.

Additionally, unless explicitly described to the contrary, the word "comprise", and variations such as "comprises" or "comprising", will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

Further, throughout the specification, the phrase "in a plan view" or "on a plane" means that the target portion is viewed from the top, and the phrase "in a cross section" or "on a cross section" means that a cross section formed by vertically cutting the target portion is viewed from the side.

Terms including ordinal numbers such as first, second, etc., will be used only to describe various constituent elements, and should not be construed as limiting the constituent elements. The term is used only to distinguish one constituent element from other constituent elements.

It will be understood that, when one constituent element is referred to as being "connected" or "coupled" to another constituent element, the constituent element may be directly connected or directly coupled to the other constituent element or connected or coupled to the other constituent element with the other constituent element interposed therebetween. On the other hand, it will be understood that, when one constituent element is referred to as being "directly connected or directly coupled" to another constituent element, the constituent element may be connected or coupled to the other constituent element without another constituent element interposed therebetween.

It will be further understood that the terms "comprises" and "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

Hereinafter, a circuit board according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 shows an internal block diagram of an electronic device connected through a circuit board 100 according to an embodiment.

As shown, the main board 10, the battery module 20, and the circuit board 100 connecting the main board 10 and the battery module 20 are mounted inside the electronic device.

The main board 10 may include a plurality of modules (not shown) of the driving electronics. For example, a processor module such as a CPU, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), and a Field Programmable Gate Array (FPGA), a memory chip such as a Random Access Memory (RAM) and a Read Only Memory (ROM), a communication module, a display module, and the like may be mounted on the main board 10.

The battery module 20 supplies power to the main board 10. The battery module 20 may be provided as at least one unit cell (not shown) that is modularized, or may be provided as an assembly of a plurality of unit cells connected in series or in parallel.

The main board 10 and the battery module 20 are connected by a circuit board 100. The circuit board 100 includes a terminal portion 110, a wiring portion 120, and a main body portion 130. Here, the circuit board 100 may be a Printed Circuit Board (PCB). More specifically, in some embodiments, the circuit board 100 may be a rigid printed circuit board (rigid PCB), a Flexible Printed Circuit Board (FPCB), or a combination of at least two types of printed circuit boards.

The terminal portion 110 includes a plurality of terminals 112 and 114 coupled to the main board 10. The first terminal 112 and the second terminal 114 are connected to the main board 10.

The body portion 130 includes a plurality of terminals 132 and 134 connected to the battery module 20 and a battery protection IC 136. The third terminal 132 and the fourth terminal 134 are connected to the battery module 20. In addition, the first terminal 112 and the third terminal 132 are connected by the first power transmission line 122, and the second terminal 114 and the fourth terminal 134 are connected by the second power transmission line 124.

The battery protection IC 136 is connected to the two terminals 132 and 134 to protect the battery module 20 from malfunctions due to overcharge, overdischarge, overcurrent, and temperature rise. For example, when a failure occurs in the battery module 20, the battery protection IC 136 may release the electrical connection between the battery module 20 and the main board 10.

The wiring portion 120 includes power transmission lines 122 and 124. The power transmission lines 122 and 124 transmit power from the battery module 20 to the main board 10. The power transmission lines 122 and 124 include power wiring 122 and ground wiring 124.

In the wiring portion 120, the ground wiring 124 is provided to be outward of the power wiring 122. For example, when the ground wiring 124 is disposed outward of the power wiring 122, in the case where the main board 10 is divided into two regions 11 and 12 by the reference line 111 between the ground wiring 124 and the power wiring 122, the ground wiring 124 may be disposed in the wiring portion 120 at a side corresponding to the region 12 having a smaller area among the divided two regions 11 and 12, and the power wiring 122 may be disposed in the wiring portion 120 on a side corresponding to the region 11 having a larger area among the divided two regions 11 and 12.

As another example, when the ground wiring 124 is disposed outward of the power wiring 122, the ground wiring 124 is disposed at a side spaced farther from a module mounted on the motherboard 10 within the wiring portion 120 than the power wiring 122. When more modules are installed in the area 11 than the area 12, the ground wiring 124 may be provided to correspond to the area 12 in which less modules are installed.

Since the ground wiring 124 is disposed to be outward of the power wiring 122 within the wiring portion 120, the ground wiring 124 may shield EMI noise from the outside.

In this regard, the circuit board 100 will be described in detail with reference to fig. 2 and 3.

Fig. 2 illustrates a top plan view of the circuit board 100 according to the embodiment, and fig. 3 illustrates a schematic cross-sectional view of a stacked structure of the circuit board 100 according to the embodiment.

As shown in fig. 2, the circuit board 100 includes a terminal portion 110, a wiring portion 120, and a main body portion 130. The ground wiring 124 is provided inside the wiring portion 120 to be more outward than the power wiring 122 in the wiring portion 120.

The circuit board 100 may include three different regions. The first region 200a is a region in which the terminal portions 110 of the circuit board 100 are formed, the second region 200b is a region in which the wiring portions 120 are formed, and the third region 200c is a region in which the main body portion 130 is formed.

The first through third regions 200a through 200c collectively include a first substrate layer 201, a first copper foil layer 203 on the first substrate layer 201, a first plating layer 210 on the first copper foil layer 203, a second copper foil layer 205 under the first substrate layer 201, a second plating layer 220 under the second copper foil layer 205, a first cover film 233 attached to the first plating layer 210 by an adhesive layer 231, and a second cover film 243 attached to the second plating layer 220 by an adhesive layer 241.

The power wiring 122 and the ground wiring 124 are formed of a first copper foil layer 203 and a second copper foil layer 205. Each of the first and second copper foil layers 203 and 205 preferably has a thickness of 18 μm, the first matrix layer 201 between the first and second copper foil layers 203 and 205 preferably has a thickness of 25 μm, and the first and second plating layers 210 and 220 preferably have a thickness of 15 μm.

In this case, the first and second plating layers 210 and 220 are formed to improve corrosion resistance and wear resistance of the first and second copper foil layers 203 and 205.

The first base layer 201, the first coverlay film 233, and the second coverlay film 243 may include a resin-based material such as polyimide or polyester.

In the first and third regions 200a and 200c, the first and second copper foil layers 203 and 205 may be connected to each other through contact holes (not shown).

The first region 200a includes a reinforcement plate 253 under the second cover film 243. Since the first and second terminals 112 and 114 are mounted in the first region 200a, damage to the first and second terminals 112 and 114 is prevented, and the reinforcing plate 253 is formed on the back surface of the second cover film 243 through the adhesive layer 251 so that the first and second terminals 112 and 114 are easily bonded to the main board 10.

The third region 200c may further include insulation layers 271 and 273 on the first coverlay film 233, a third copper foil layer 261 on the insulation layers 271 and 273, a third plating layer 263 on the third copper foil layer 261, and a PSR layer 265 on the third plating layer 263. In addition, the third region 200c may further include insulating layers 275 and 277 positioned under the second cover film 243, a fourth copper foil layer 281 positioned under the insulating layers 275 and 277, a fourth plating layer 283 positioned under the fourth copper foil layer 281, and a PSR layer 285 positioned under the fourth plating layer 283.

The arrangement of the first and second copper foil layers 203 and 205 as the power wiring 122 and the ground wiring 124 will be described with reference to fig. 4 and 5.

Fig. 4 illustrates a top plan view of the first copper foil layer 203 of the circuit board 100 according to an embodiment, and fig. 5 illustrates a top plan view of the second copper foil layer 205 of the circuit board 100 according to an embodiment.

As shown in fig. 4, the first copper foil layer 214 as the ground wiring 124 is disposed outward than the first copper foil layer 212 as the power wiring 122.

Similarly, as shown in fig. 5, the second copper foil layer 224 as the ground wiring 124 is disposed outward than the second copper foil layer 222 as the power wiring 122.

That is, the ground wiring 124 may be disposed inside the wiring portion 120 to the outside of the power wiring 122 to block the EMI noise from the outside from being transmitted to the power wiring 122.

Hereinafter, a circuit board 500 according to another embodiment will be described with reference to fig. 6.

Fig. 6 shows an internal block diagram of electronic devices connected through a circuit board 500 according to another embodiment.

As shown, the motherboard 30 and the battery module 40 are connected by a circuit board 500. Descriptions of the main board 30, the battery module 40, and the circuit board 500 of fig. 6 that are the same as or similar to the descriptions of the main board 10, the battery module 20, and the circuit board 100 of fig. 1 will be omitted.

The shape of the circuit board 500 of fig. 6 is the same as that of the circuit board 100 of fig. 1, but the positions of the ground wiring 524 and the power wiring 522 in the wiring portion 520 are different from each other. In the case of the circuit board 500 of fig. 6, when the main board 30 is divided into two regions 31 and 32 by the reference line 521 between the ground wiring 524 and the power wiring 522, the ground wiring 524 is provided at a side corresponding to the region 31 having a smaller area among the two divided regions 31 and 32 within the wiring section 520, and the power wiring 522 is provided at a side corresponding to the region 32 having a larger area among the two divided regions 31 and 32 within the wiring section 520. That is, in the wiring portion 520, the ground wiring 524 is provided outward of the power wiring 522.

As another example, when more modules are mounted in the area 32 than in the area 31, the ground wiring 524 is provided corresponding to the area 31 in which fewer modules are mounted, so that the ground wiring 524 is provided outward of the power wiring 522 within the wiring section 520.

That is, the ground wiring 524 may be disposed inside the wiring portion 520 outward of the power wiring 522 to block EMI noise from the outside from being transmitted to the power wiring 522.

While the invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, the invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.