阅读说明：本技术 元件安装机 (Component mounting machine ) 是由 粟生浩之 于 2018-03-09 设计创作，主要内容包括：元件安装机向基板安装电子元件。元件安装机具备：安装工具,在元件供给位置处接收电子元件,并且在基板上的预定位置处释放所接收的电子元件；收纳部,收纳多种安装工具；头,供从收纳于收纳部的多种安装工具中选择的一个安装工具以能够拆装的方式安装；移动机构,使头在元件供给位置与基板上的预定位置之间移动；异常检测部,检测与安装工具相关联的异常；及选择部,选择向头安装的安装工具,在由异常检测部检测到异常时,上述选择部能够选择不同于安装于头的第一种类的安装工具的第二种类的安装工具。(The component mounting machine mounts electronic components on a substrate. The component mounting machine comprises: a mounting tool that receives the electronic component at the component supply position and releases the received electronic component at a predetermined position on the substrate; a receiving portion for receiving a plurality of types of mounting tools; a head to which one mounting tool selected from a plurality of mounting tools stored in the storage portion is detachably mounted; a moving mechanism that moves the head between a component supply position and a predetermined position on the substrate; an abnormality detection unit that detects an abnormality associated with the mounting tool; and a selection unit that selects a mounting tool to be mounted to the head, the selection unit being capable of selecting a mounting tool of a second type different from the first type of mounting tool to be mounted to the head when the abnormality is detected by the abnormality detection unit.)

1. A component mounting machine for mounting electronic components on a substrate,

the component mounting apparatus includes:

a mounting tool that receives the electronic component at a component supply position and releases the received electronic component at a predetermined position on a substrate;

a receiving portion for receiving a plurality of types of mounting tools;

a head to which one mounting tool selected from among a plurality of types of mounting tools stored in the storage portion is detachably mounted;

a moving mechanism that moves the head between the component supply position and a predetermined position on the substrate;

an abnormality detection unit that detects an abnormality associated with the mounting tool; and

and a selection unit configured to select the mounting tool to be mounted to the head, wherein when the abnormality is detected by the abnormality detection unit, the selection unit is configured to be capable of selecting a second type of mounting tool different from a first type of mounting tool to be mounted to the head.

2. The component mounting machine according to claim 1,

the component mounting machine further comprises an imaging device for imaging the substrate on which the electronic component is mounted,

the abnormality includes a positional deviation of the electronic component on the substrate detected from the captured image,

the second kind of mounting tool is capable of holding larger electronic components than the first kind of mounting tool.

3. The component mounting machine according to claim 1,

the component mounting machine further includes an imaging device for imaging the electronic component and the mounting tool moving the electronic component from the component supply position to a predetermined position on the board,

the abnormality includes a posture deviation of the electronic component in motion detected from the captured image,

the second kind of mounting tool is capable of moving larger electronic components than the first kind of mounting tool.

4. Component mounting machine according to any one of claims 1 to 3,

the component mounting machine further includes a control unit for controlling a replacement process of the mounting tool mounted to the head,

when the selection unit selects the second type of mounting tool and the second type of mounting tool is stored in the storage unit, the control unit executes a replacement process so as to mount the second type of mounting tool on the head.

5. Component mounting machine according to any one of claims 1 to 4,

the abnormality detection section detects a first kind of abnormality in which the mounting process of the component mounting machine can be continued and a second kind of abnormality in which the mounting process of the component mounting machine cannot be continued,

the selection unit may select a second type of mounting tool different from the first type of mounting tool mounted to the head when the abnormality detected by the abnormality detection unit is a first type of abnormality.

Technical Field

The technology disclosed in the present specification relates to a component mounter which mounts electronic components onto a substrate.

Background

Some component mounting machines that mount electronic components on a substrate attract electronic components by a suction nozzle detachably mounted on a head, and move the attracted electronic components to a predetermined position on the substrate. In such a component mounting machine, when an abnormality associated with a suction nozzle is detected, the suction nozzle mounted to the head is replaced. Examples of the abnormality associated with the suction nozzle include an abnormality that the component is not sucked by the suction nozzle during the mounting process of the component mounter, and an abnormality that a lack of the component or a positional deviation of the component occurs when the mounted substrate is inspected. Such an abnormality occurs when an abnormality such as a defect occurs in the mouthpiece. Therefore, when such an abnormality is detected, the nozzles attached to the head are replaced with another nozzle of the same kind. For example, an example of a component mounter is disclosed in japanese patent application laid-open No. 2012 and 248815.

Disclosure of Invention

Problems to be solved by the invention

In a conventional component mounting machine, when the component mounting machine detects an abnormality, the suction nozzles mounted on the head are replaced with the same type of suction nozzles. On the other hand, in the component mounting machine, even if an abnormality such as a defect does not occur in the suction nozzle, an abnormality that the normal mounting process is not executed may be detected. In such a case, since no abnormality occurs in the suction nozzle itself, the abnormality is not eliminated even if the suction nozzle is replaced with the same type of suction nozzle. The present specification discloses a technique for satisfactorily eliminating an abnormality of a component mounting machine.

Means for solving the problems

The component mounter disclosed in the present specification mounts electronic components on a substrate. The component mounting machine comprises: a mounting tool that receives the electronic component at the component supply position and releases the received electronic component at a predetermined position on the substrate; a receiving portion for receiving a plurality of types of mounting tools; a head to which one mounting tool selected from among a plurality of mounting tools stored in the storage portion is detachably mounted; a moving mechanism that moves the head between a component supply position and a predetermined position on the substrate; an abnormality detection unit that detects an abnormality associated with the mounting tool; and a selection unit that selects a mounting tool to be mounted to the head, the selection unit being capable of selecting a mounting tool of a second type different from the first type of mounting tool to be mounted to the head when the abnormality is detected by the abnormality detection unit.

In the component mounting machine, the abnormality detection unit detects an abnormality associated with the mounting tool. In addition, when the abnormality detection section detects an abnormality, the selection section can select a second type of mounting tool different from the first type of mounting tool mounted to the head. Among various kinds of abnormalities generated in the component mounting machine, there is an abnormality generated due to the type of mounting tool mounted to the head being inappropriate. Therefore, by attaching different types of mounting tools to the head, it is possible to appropriately eliminate such an abnormality of the component mounting machine.

Drawings

Fig. 1 is a diagram showing a schematic configuration of a component mounting apparatus according to embodiments 1 and 2.

Fig. 2 is a sectional view taken along line II-II of fig. 1.

Fig. 3 is a block diagram showing the functions of the control device.

Fig. 4 is a flowchart showing an example of a process of replacing the suction nozzle attached to the mounting head in embodiment 1.

Fig. 5 is a flowchart showing an example of a process of replacing the suction nozzle attached to the mounting head in embodiment 2.

Detailed Description

The main features of the embodiments to be described are listed below. The technical elements described below are independent technical elements, and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

The component mounting apparatus disclosed in the present specification may further include an imaging device that images the substrate on which the electronic component is mounted. The abnormality may include a positional deviation of the electronic component on the substrate detected from the captured image. The second type of mounting tool may also be capable of holding larger electronic components than the first type of mounting tool. With this configuration, the abnormality detection unit detects a positional deviation of the electronic component on the substrate based on the captured image. Positional deviation of the electronic component may occur when the electronic component held is too large for a mounting tool mounted on the head. Therefore, in such a case, positional deviation of the electronic component can be avoided by mounting a mounting tool of a type capable of holding a large electronic component to the head. The second kind of mounting tool is capable of holding larger electronic components than the first kind of mounting tool. That is, the selection unit selects a mounting tool of a type capable of holding a larger electronic component and replaces the selected mounting tool of the second type, thereby suppressing the occurrence of positional deviation of the electronic component.

The component mounting apparatus disclosed in the present specification may further include a mounting tool for imaging the electronic component moving from the component supply position to the predetermined position on the substrate, and an imaging device for imaging the electronic component. The abnormality may include a positional deviation of the electronic component during movement detected from the captured image. The second type of mounting tool may be capable of moving larger electronic components than the first type of mounting tool. With this configuration, the abnormality detection unit detects a positional deviation of the moving electronic component from the captured image. Such positional deviation may occur when the moving electronic component is too large for a mounting tool mounted on the head. The selection unit selects a mounting tool of a type that can move a larger electronic component than the mounting tool mounted on the head, and replaces the selected mounting tool of the second type, thereby suppressing the occurrence of a positional deviation of the moving electronic component.

The component mounting apparatus disclosed in the present specification may further include a control unit that controls a replacement process of the mounting tool mounted to the head. The control unit may execute the replacement process so as to attach the second type of mounting tool to the head when the second type of mounting tool is selected by the selection unit and when the second type of mounting tool is stored in the storage unit. According to this configuration, when the selection unit selects a different type of mounting tool, the control unit mounts the mounting tool to the head. Therefore, even if the operator does not replace the mounting tool, the operator can eliminate the abnormality by replacing the mounting tool with the component mounting machine.

In the component mounting machine disclosed in the present specification, the abnormality detection unit may detect a first type of abnormality in which the mounting process of the component mounting machine can be continued and a second type of abnormality in which the mounting process of the component mounting machine cannot be continued. The selecting unit may be configured to select a second type of mounting tool different from the first type of mounting tool mounted on the head when the abnormality detected by the abnormality detecting unit is the first type of abnormality. According to this configuration, when a first type of abnormality that the mounting process can be continued is detected, the selection unit can select a second type of mounting tool different from the first type of mounting tool mounted to the head. Therefore, by replacing the mounting tool when the mounting process can be continued while the mounting process is ongoing, the abnormality of the component mounting machine is eliminated when the mounting process can be continued while the mounting process is ongoing, and the occurrence of an abnormal situation in which the mounting process cannot be continued can be suppressed.