阅读说明：本技术 一种电气或电子装置的散热模组 (Heat radiation module of electric or electronic device ) 是由 程俊 于 2020-07-07 设计创作，主要内容包括：本发明公开了一种电气或电子装置的散热模组,其包括散热风扇,所述散热风扇包括扇框(1)、叶轮(2)、底板(3)、导叶(4)、轮毂(5)、叶片(6)、轴套(7)、转轴(8)、电机定子(9)、磁体(10)、电路板(11)、倾斜部(12)、外缘(13),其特征在于：所述倾斜部(12)的内周的气流下游侧设置有第一回流槽(14),倾斜部的内周的气流上游侧设置有第二回流槽(16),第一回流槽与第二回流槽之间通过设置于扇框内的一个或多个回流通道(15)连通。所述散热风扇能够使叶轮出口处的一部分气流通过回流结构回流至叶轮进口处附近,从而能够有效降低叶轮出口处因附壁而产生的紊流,因而能够降低散热风扇噪音水平。(The invention discloses a heat dissipation module of an electric or electronic device, which comprises a heat dissipation fan, wherein the heat dissipation fan comprises a fan frame (1), an impeller (2), a bottom plate (3), a guide vane (4), a hub (5), blades (6), a shaft sleeve (7), a rotating shaft (8), a motor stator (9), a magnet (10), a circuit board (11), an inclined part (12) and an outer edge (13), and is characterized in that: the air flow downstream side of the inner periphery of the inclined part (12) is provided with a first backflow groove (14), the air flow upstream side of the inner periphery of the inclined part is provided with a second backflow groove (16), and the first backflow groove and the second backflow groove are communicated through one or more backflow channels (15) arranged in the fan frame. The heat radiation fan can enable a part of air flow at the outlet of the impeller to flow back to the position near the inlet of the impeller through the backflow structure, thereby effectively reducing turbulent flow generated at the outlet of the impeller due to wall attachment, and reducing the noise level of the heat radiation fan.)

1. A heat radiation module of an electric or electronic device comprises a heat radiation fan, wherein the heat radiation fan comprises a fan frame (1), an impeller (2), a bottom plate (3), a guide vane (4), a hub (5), blades (6), a shaft sleeve (7), a rotating shaft (8), a motor stator (9), a magnet (10), a circuit board (11), an inclined part (12) and an outer edge (13), the fan frame is arranged on the periphery of the impeller, the bottom of the impeller is connected with the bottom plate, the periphery of the bottom plate is connected with the fan frame through a plurality of guide vanes, the impeller comprises the hub and a plurality of blades, the plurality of blades are uniformly distributed on the periphery of the hub along the circumferential direction, the hub is connected with the bottom plate through the rotating shaft and the shaft sleeve, the rotating shaft is connected with the shaft sleeve through one or a plurality of bearings, the motor stator is arranged on the periphery of the shaft, one or a, the slope sets up for the rotation axis slope of impeller, and the blade has the outer fringe, and the outer fringe is located one side of keeping away from the wheel hub of blade, and the outer fringe is adjacent with the slope and sets up its characterized in that relatively: the air flow downstream side of the inner periphery of the inclined part (12) is provided with a first backflow groove (14), the air flow upstream side of the inner periphery of the inclined part is provided with a second backflow groove (16), and the first backflow groove and the second backflow groove are communicated through one or more backflow channels (15) arranged in the fan frame.

2. The heat dissipating module for an electrical or electronic device as recited in claim 1, wherein the first reflow groove (14) has a substantially triangular cross-section and is an annular groove along an inner periphery of the inclined portion.

3. The heat dissipating module for an electrical or electronic device as recited in claim 2, wherein the second reflow groove (16) has a substantially arc or semicircular cross section, and the second reflow groove is an annular groove provided along an inner periphery of the inclined portion.

4. The heat dissipation module for electrical or electronic devices according to claim 3, wherein the return channel (15) comprises an axial channel (17), an arc-shaped connecting portion (19), and a radial channel (18) connected in sequence, and the angle between the radial channel and the axial channel is 65-85 °.

5. A heat-dissipating module for an electrical or electronic device according to claim 4, characterized in that the inclined portion (12) is disposed non-parallel to the outer edge, and the angle a =1-5 ° between the inclined portion and the outer edge.

6. The heat dissipation module for electrical or electronic devices of claim 5, wherein the blade has a leading edge and a trailing edge (21), the leading edge and the trailing edge being respectively located upstream and downstream in the airflow direction, and the first recirculation channel has a top portion (20), and an axial height of the top portion is substantially equal to an axial height of an intersection of the outer edge and the trailing edge.

7. The heat dissipating module for an electric or electronic device as claimed in claim 5, wherein the inclined portion has an angle of 10 to 30 ° with respect to the rotation axis of the impeller, and the heat dissipating fan is a diagonal flow fan.

Technical Field

The invention relates to the technical field of heat dissipation of electric or electronic devices, in particular to a heat dissipation module of an electric or electronic device.

Background

The heat dissipation module is widely used for heat dissipation of various electrical or electronic devices, and the combination of a heat dissipation fan and a heat dissipation fin is a commonly used heat dissipation module. However, the existing heat dissipation fan has the problems of turbulent flow and high noise at the outlet.

Disclosure of Invention

The present invention is directed to overcome the disadvantages of the prior art, and provides a heat dissipation module for an electrical or electronic device, which is configured with a backflow structure, so that a portion of the airflow at the outlet of an impeller flows back to the vicinity of the inlet of the impeller through the backflow structure, thereby effectively reducing the turbulence at the outlet of the impeller due to wall attachment, and reducing the noise level of a heat dissipation fan.

In order to achieve the purpose, the invention adopts the technical scheme that:

a heat radiation module of an electric or electronic device comprises a heat radiation fan, wherein the heat radiation fan comprises a fan frame (1), an impeller (2), a bottom plate (3), a guide vane (4), a hub (5), blades (6), a shaft sleeve (7), a rotating shaft (8), a motor stator (9), a magnet (10), a circuit board (11), an inclined part (12) and an outer edge (13), the fan frame is arranged on the periphery of the impeller, the bottom of the impeller is connected with the bottom plate, the periphery of the bottom plate is connected with the fan frame through a plurality of guide vanes, the impeller comprises the hub and a plurality of blades, the plurality of blades are uniformly distributed on the periphery of the hub along the circumferential direction, the hub is connected with the bottom plate through the rotating shaft and the shaft sleeve, the rotating shaft is connected with the shaft sleeve through one or a plurality of bearings, the motor stator is arranged on the periphery of the shaft, one or a, the slope sets up for the rotation axis slope of impeller, and the blade has the outer fringe, and the outer fringe is located one side of keeping away from the wheel hub of blade, and the outer fringe is adjacent with the slope and sets up its characterized in that relatively: the air flow downstream side of the inner periphery of the inclined part (12) is provided with a first backflow groove (14), the air flow upstream side of the inner periphery of the inclined part is provided with a second backflow groove (16), and the first backflow groove and the second backflow groove are communicated through one or more backflow channels (15) arranged in the fan frame.

Further, the first return grooves (14) are substantially triangular in cross section, and are annular grooves provided along the inner periphery of the inclined portion.

Further, the second return groove (16) has a substantially arc-shaped or semicircular cross section, and is an annular groove provided along the inner periphery of the inclined portion.

Furthermore, the backflow channel (15) comprises an axial channel (17), an arc-shaped connecting part (19) and a radial channel (18) which are sequentially connected, and an included angle between the radial channel and the axial channel is 65-85 degrees.

Further, the inclined part (12) is arranged in a non-parallel mode with the outer edge, and the included angle a =1-5 degrees.

Further, the blade is provided with a front edge and a rear edge (21), the front edge and the rear edge are respectively positioned at the upstream and the downstream in the airflow direction, the first backflow groove is provided with a top part (20), and the axial height position of the top part is substantially equal to the axial height position of the intersection point of the outer edge and the rear edge.

Furthermore, the included angle between the inclined part and the rotation axis of the impeller is 10-30 degrees, and the heat dissipation fan is an inclined flow fan.

The heat dissipation module of the electric or electronic device can enable a part of air flow at the outlet of the impeller to flow back to the position near the inlet of the impeller through the backflow structure by the arrangement of the backflow structure, thereby effectively reducing turbulent flow generated at the outlet of the impeller due to wall attachment and reducing the noise level of the heat dissipation fan.

Drawings

FIG. 1 is a schematic view of a heat dissipation module of an electrical or electronic device in the prior art;

FIG. 2 is a schematic view of a heat dissipation fan of an electrical or electronic device according to the present invention;

fig. 3 is a schematic view of a heat dissipation fan of an electrical or electronic device according to the present invention.

In the figure: the fan comprises a fan frame 1, an impeller 2, a bottom plate 3, a guide vane 4, a hub 5, blades 6, a shaft sleeve 7, a rotating shaft 8, a motor stator 9, a magnet 10, a circuit board 11, an inclined part 12, an outer edge 13, a first backflow groove 14, a backflow channel 15, a second backflow groove 16, an axial channel 17, a radial channel 18, an arc-shaped connecting part 19, a top part 20 and a rear edge 21.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1-3, a heat dissipation module for an electrical or electronic device comprises a heat dissipation fan, the heat dissipation fan comprises a fan frame 1, an impeller 2, a bottom plate 3, a guide vane 4, a hub 5, a blade 6, a shaft sleeve 7, a rotating shaft 8, a motor stator 9, a magnet 10, a circuit board 11, an inclined portion 12, and an outer edge 13, the fan frame 1 is annularly arranged on the outer periphery of the impeller 2, the bottom of the impeller 2 is connected with the bottom plate 3, the outer periphery of the bottom plate 3 is connected with the fan frame 1 through a plurality of guide vanes 4, the impeller 2 comprises a hub 5 and a plurality of blades 6, the plurality of blades 6 are circumferentially and uniformly distributed on the outer periphery of the hub 5, the hub 5 is connected with the bottom plate 3 through the rotating shaft 8 and the shaft sleeve 7, the rotating shaft 8 is connected with the shaft sleeve 7 through one or more bearings, the outer periphery of the shaft sleeve 7 is provided with the, the inner periphery of the fan frame 1 is provided with an inclined portion 12, the inclined portion 12 is arranged obliquely with respect to the rotation axis of the impeller, the angle between the inclined portion 12 and the rotation axis of the impeller is 15-25 °, preferably 20 °, the blade 6 has an outer edge 13, the outer edge 13 is located on the side of the blade 6 away from the hub 5, and the outer edge 13 is located adjacent to and opposite to the inclined portion 12; the heat radiation fan is an oblique flow fan.

A first return groove 14 is provided downstream (lower side) of the air flow of the inner periphery of the inclined portion 12, a second return groove 16 is provided upstream (upper side) of the air flow of the inner periphery of the inclined portion 12, and the first return groove 14 and the second return groove 16 are communicated with each other through one or more return passages 15 provided in the fan frame 1.

First return grooves 14 are substantially triangular in cross section, first return grooves 14 being annular grooves provided along the inner periphery of inclined portion 12; the second return groove 16 has a substantially arc-shaped or semicircular cross section, and the second return groove 16 is an annular groove provided along the inner periphery of the inclined portion 12; the return channel 15 comprises an axial channel 17, an arc-shaped connecting part 19 and a radial channel 18 which are connected in sequence, and the included angle between the radial channel 18 and the axial channel 17 is 70-80 degrees, preferably 75 degrees. Through the arrangement of the backflow structure, part of air flow at the outlet of the impeller can flow back to the position near the inlet of the impeller through the backflow structure, so that the turbulent flow generated by wall attachment at the outlet of the impeller can be effectively reduced, and the noise level of the cooling fan can be reduced.

Further, the inclined portion 12 is disposed non-parallel to the outer edge 13, and an included angle a =1-5 °, preferably 2-3 °, between the inclined portion 12 and the outer edge 13.

Further, the blade 6 has a leading edge and a trailing edge 21, the leading edge and the trailing edge 21 are respectively located upstream and downstream in the airflow direction, the first backflow groove 14 has a top portion 20, and the axial height position of the top portion 20 is substantially equal to the axial height position of the intersection point of the outer edge 13 and the trailing edge 21. The invention can further reduce the turbulence generated by wall attachment at the outlet of the impeller by arranging the included angle a and the top, thereby reducing the noise level of the heat radiation fan.

The heat dissipation module of the electric or electronic device can enable a part of air flow at the outlet of the impeller to flow back to the position near the inlet of the impeller through the backflow structure by the arrangement of the backflow structure, thereby effectively reducing turbulent flow generated at the outlet of the impeller due to wall attachment and reducing the noise level of the heat dissipation fan.

The above-described embodiments are illustrative of the present invention and not restrictive, it being understood that various changes, modifications, substitutions and alterations can be made herein without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.