阅读说明：本技术 热塑性树脂组合物和由其形成的模制品 (Thermoplastic resin composition and molded article formed therefrom ) 是由 李善熺 埃里克·阿里芬 李旼洙 李凤宰 洪尚铉 于 2018-12-31 设计创作，主要内容包括：本发明的热塑性树脂组合物包括：约5-35wt％的包含由化学式1表示的重复单元的改性聚芳醚酮树脂；约5-35wt％的改性聚醚醚酮树脂；约20-40wt％的改性聚苯砜树脂；以及约15-50wt％的玻璃纤维。热塑性树脂组合物具有优异的金属结合强度和抗冲击性等。(The thermoplastic resin composition of the present invention comprises: about 5 to 35 wt% of a modified polyaryletherketone resin comprising a repeating unit represented by chemical formula 1; about 5 to 35 weight percent of a modified polyetheretherketone resin; about 20 to 40 weight percent of a modified polyphenylsulfone resin; and about 15 to 50 weight percent glass fiber. The thermoplastic resin composition has excellent metal bonding strength, impact resistance, and the like.)

1. A thermoplastic resin composition comprising:

about 5 wt% to about 35 wt% of a modified polyaryletherketone resin comprising a repeat unit represented by formula 1;

about 5 wt% to about 35 wt% of a polyetheretherketone resin;

about 20 wt% to about 40 wt% of a polyphenylsulfone resin; and

about 15 wt% to about 50 wt% glass fibers,

[ formula 1]

Wherein Ar is₁、Ar₂And Ar₃Each independently is phenyl or biphenyl, and Ar₁、Ar₂And Ar₃At least one of which is biphenyl.

2. The thermoplastic resin composition of claim 1, wherein said modified polyaryletherketone resin and said polyetheretherketone resin are present in a weight ratio of about 1:0.2 to about 1: 5.

3. The thermoplastic resin composition of claim 1 or 2, wherein said modified polyaryletherketone resin has a weight average molecular weight of from about 50,000g/mol to about 80,000g/mol and a melting point of from about 290 ℃ to about 330 ℃.

4. The thermoplastic resin composition according to any one of claims 1 to 3, wherein the polyether ether ketone resin comprises a repeating unit represented by formula 2,

[ formula 2]

5. The thermoplastic resin composition of any of claims 1-4, wherein the polyetheretherketone resin has a weight average molecular weight of about 60,000g/mol to about 90,000g/mol and a melting point of about 330 ℃ to about 370 ℃.

6. The thermoplastic resin composition according to any one of claims 1 to 5, wherein the polyphenylsulfone resin comprises a repeating unit represented by formula 3,

[ formula 3]

7. The thermoplastic resin composition of any of claims 1-6, wherein the polyphenylsulfone resin has a melt flow index of about 10g/10min to about 30g/10min when measured at a temperature of 360 ℃ under a load of 10kgf according to ASTM D1238.

8. The thermoplastic resin composition of any of claims 1-7, wherein said thermoplastic resin composition has a notched izod impact strength of about 9 kgf-cm/cm to about 12 kgf-cm/cm when measured on an 1/8 "thick sample according to ASTM D256.

9. The thermoplastic resin composition of any of claims 1-8, wherein the thermoplastic resin composition has an impact strength of about 35cm to about 80cm, when determined by measuring the height from which 500g of dart is dropped resulting in a 50% quantity of a 2mm thick sample breaking in a DuPont drop test using a dart impact tester.

10. The thermoplastic resin composition of any of claims 1-9, wherein the thermoplastic resin composition has an adhesion strength of about 35MPa to about 55MPa when measured relative to metal according to ISO 19095.

11. A molded article formed from the thermoplastic resin composition according to any one of claims 1 to 10.

Technical Field

The present invention relates to a thermoplastic resin composition and a molded article formed therefrom. More particularly, the present invention relates to a polyaryletherketone-based thermoplastic resin composition having good properties in terms of adhesion to metals and impact resistance, and a molded article formed therefrom.

Background

Polyaryletherketone (PAEK) resins, such as Polyetheretherketone (PEEK) resins, have good properties in terms of heat resistance, chemical resistance, rigidity, and fatigue resistance, and thus are used in the office automation equipment and automotive fields. However, the polyaryletherketone resin is not sufficiently suitable for use in various fields including metal bonding materials for portable devices such as smartphones because of its poor adhesion to metal and its low impact resistance.

In order to improve the impact resistance of such polyaryletherketone resins, a method of blending polyaryletherketone resins with polysulfone resins has been proposed. However, this method has problems of deterioration of processability and adhesion of the polyaryletherketone resin to metal.

Therefore, there is a need for a polyaryletherketone-based thermoplastic resin composition having good properties in terms of adhesion to metals and impact resistance.

Disclosure of Invention

[ problem ] to provide a method for producing a semiconductor device

An aspect of the present invention is to provide a thermoplastic resin composition having good properties in terms of adhesion to metal and impact resistance.

Another aspect of the present invention is to provide a molded article formed of the thermoplastic resin composition set forth above.

The above and other aspects of the present invention will become apparent from the detailed description of the embodiments below.

[ technical solution ] A

1. One aspect of the present invention relates to a thermoplastic resin composition. The thermoplastic resin composition comprises: about 5 wt% to about 35 wt% of a modified polyaryletherketone resin comprising a repeating unit represented by formula 1; about 5 wt% to about 35 wt% of a polyetheretherketone resin; about 20 wt% to about 40 wt% of a polyphenylsulfone resin; and about 15 wt% to about 50 wt% of glass fibers,

[ formula 1]

Wherein Ar is₁、Ar₂And Ar₃Each independently is phenyl or biphenyl, and Ar₁、Ar₂And Ar₃Is biphenyl.

2. In embodiment 1, the modified polyaryletherketone resin and the polyetheretherketone resin may be present in a weight ratio of about 1:0.2 to about 1: 5.

3. In embodiment 1 or embodiment 2, the modified polyaryletherketone resin may have a weight average molecular weight of about 50,000g/mol to about 80,000g/mol and a melting point of about 290 ℃ to about 330 ℃.

4. In embodiments 1 to 3, the polyetheretherketone resin may include a repeating unit represented by formula 2:

[ formula 2]

5. In embodiments 1 to 4, the polyetheretherketone resin may have a weight average molecular weight of about 60,000g/mol to about 90,000g/mol and a melting point of about 330 ℃ to about 370 ℃.

6. In embodiments 1 to 5, the polyphenylsulfone resin may include a repeating unit represented by formula 3:

[ formula 3]

7. In embodiments 1 to 6, the polyphenylsulfone resin may have a melt flow index of about 10g/10min to about 30g/10min when measured at a temperature of 360 ℃ under a load of 10kgf according to ASTM D1238.

8. In embodiments 1 to 7, the thermoplastic resin composition may have a notched izod impact strength of about 9kgf cm/cm to about 12kgf cm/cm when measured on a 1/8 "thick sample according to ASTM D256.

9. In embodiments 1 to 8, the thermoplastic resin composition may have an impact strength of about 35cm to about 80cm, when determined by measuring a height at which a 500g dart is dropped to cause a 50% quantity of a 2 mm-thick sample to break in a dupont drop test using a dart impact tester.

10. In embodiments 1 to 9, the thermoplastic resin composition may have an adhesive strength of about 35MPa to about 55MPa when measured with respect to a metal according to ISO 19095.

11. Another aspect of the invention relates to a molded article. The molded article is formed from the thermoplastic resin composition according to any one of embodiments 1 to 10.

[ PROBLEMS ] the present invention

The present invention provides a polyaryletherketone-based thermoplastic resin composition having good properties in terms of adhesion to metals and impact resistance, and a molded article formed therefrom.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail.

The thermoplastic resin composition according to the present invention comprises: (A) modified polyaryletherketone resin; (B) polyether ether ketone resin; (C) a polyphenylsulfone resin; and (D) glass fibers.

As used herein to represent a particular numerical range, the expression "a through b" means ". gtoreq.a and ≦ b".

(A) Modified polyaryletherketone resin

The modified polyaryletherketone resin according to the present invention is used to improve adhesion to metal and impact resistance of a thermoplastic resin composition in combination with a polyetheretherketone resin, and may include a polyaryletherketone resin including a repeating unit represented by formula 1.

[ formula 1]

Wherein Ar is₁、Ar₂And Ar₃Each independently is phenyl or biphenyl, and Ar₁、Ar₂And Ar₃Is biphenyl.

In some embodiments, the modified polyaryletherketone resin may have a weight average molecular weight (Mw) of from about 50,000g/mol to about 80,000g/mol, for example, from about 60,000g/mol to about 70,000g/mol, as measured by Gel Permeation Chromatography (GPC). Within this range, the thermoplastic resin composition may have good processability and mechanical properties.

In some embodiments, the modified polyaryletherketone resin may have a melting point of about 290 ℃ to about 330 ℃, for example, about 300 ℃ to about 320 ℃, when measured using a Differential Scanning Calorimeter (DSC) at a heating rate of 20 ℃/min. Within this range, the thermoplastic resin composition may have good processability and flow properties.

In some embodiments, the modified polyaryletherketone resin may be present in an amount of about 5 wt% to about 35 wt%, for example, about 10 wt% to about 30 wt%, based on the total weight of the thermoplastic resin composition. If the amount of the modified polyaryletherketone resin is less than about 5 wt%, the thermoplastic resin composition may have poor properties in terms of adhesion to metal, impact resistance and processability, and if the amount of the modified polyaryletherketone resin exceeds about 35 wt%, the thermoplastic resin composition may have poor properties in terms of processability and heat resistance.

(B) Polyether ether ketone resin

The polyether ether ketone resin according to the present invention is used in combination with the modified polyaryletherketone resin to improve adhesion to metal and impact resistance of the thermoplastic resin composition, and may include a typical polyether ether ketone resin including a repeating unit represented by formula 2.

[ formula 2]

In some embodiments, the polyetheretherketone resin can have a weight average molecular weight (Mw) of about 60,000g/mol to about 90,000g/mol, for example, about 70,000g/mol to about 80,000g/mol, as measured by Gel Permeation Chromatography (GPC). Within this range, the thermoplastic resin composition may have good processability and mechanical properties.

In some embodiments, the melting point of the polyetheretherketone resin can be from about 330 ℃ to about 370 ℃, for example, from about 340 ℃ to about 360 ℃, when measured using a Differential Scanning Calorimeter (DSC) at a heating rate of 20 ℃/min. Within this range, the thermoplastic resin composition may have good processability and mechanical properties.

In some embodiments, the polyetheretherketone resin may be present in an amount of about 5 wt% to about 35 wt%, for example, about 10 wt% to about 30 wt%, based on the total weight of the thermoplastic resin composition. If the amount of the polyether ether ketone resin is less than about 5 wt%, the thermoplastic resin composition may have poor properties in terms of adhesion to metal, impact resistance, and processability, and if the amount of the polyether ether ketone resin exceeds about 35 wt%, the thermoplastic resin composition may have poor properties in terms of adhesion to metal and impact resistance.

In some embodiments, the modified polyaryletherketone resin (a) and the polyetheretherketone resin (B) may be present in a weight ratio (a: B) of about 1:0.2 to about 1:5, for example, about 1:0.3 to about 1: 3. Within this range, the thermoplastic resin composition may have good properties in terms of adhesion to metal and impact resistance.

(C) Polyphenylene sulfone resin

The polyphenylsulfone resin according to the present invention is used to improve impact resistance of a thermoplastic resin composition, and may include a polyphenylsulfone resin including a repeating unit represented by formula 3.

[ formula 3]

In some embodiments, the polyphenylsulfone resin can have a melt flow index of about 10g/10min to about 30g/10min, for example, about 15g/10min to about 25g/10min, when measured according to ASTM D1238 under a load of 10kgf at a temperature of 360 ℃. Within this range, the thermoplastic resin composition may have good properties in terms of impact resistance, processability, and adhesion to metal.

In some embodiments, the polyphenylsulfone resin can be present in an amount of about 20 wt% to about 40 wt%, for example about, 25 wt% to about 35 wt%, based on the total weight of the thermoplastic resin composition. If the amount of the polyphenylsulfone resin is less than about 20 wt%, the thermoplastic resin composition may have poor properties in terms of impact resistance and processability, and if the amount of the polyphenylsulfone resin exceeds about 40 wt%, the thermoplastic resin composition may have poor adhesion to metal and poor mechanical properties.

(D) Glass fiber

The glass fiber according to one embodiment of the present invention is used to improve mechanical properties, such as rigidity, of the thermoplastic resin composition, and may include glass fibers used in typical thermoplastic resin compositions.

In some embodiments, the glass fibers may have various shapes, such as fibrous, granular, rod-like, needle-like, flake-like, and amorphous shapes, and may have various cross-sections, such as circular, elliptical, and rectangular cross-sections. For example, in terms of mechanical properties, it may be desirable to use fibrous glass fibers having a circular and/or rectangular cross-section.

In some embodiments, the circular-section glass fibers may have a cross-sectional diameter of about 5 μm to about 20 μm and a pre-processed length of about 2mm to about 20mm, and the rectangular-section glass fibers may have a cross-sectional aspect ratio (ratio of cross-sectional major diameter to cross-sectional minor diameter) of about 1.5 to about 10, a cross-sectional minor diameter of about 2 μm to about 10 μm, and a pre-processed length of about 2mm to about 20 mm. Within this range, the thermoplastic resin composition may have good properties in terms of rigidity and processability.

In some embodiments, the glass fiber may be present in an amount of about 15 wt% to about 50 wt%, for example, about 20 wt% to about 40 wt%, based on the total weight of the thermoplastic resin composition. If the amount of the glass fiber is less than about 15 wt%, the thermoplastic resin composition may have poor mechanical properties, and if the amount of the glass fiber exceeds about 50 wt%, the thermoplastic resin composition may have poor properties in terms of processability and flow properties.

The thermoplastic resin composition according to one embodiment of the present invention may further include an additive used in typical thermoplastic resin compositions. Examples of additives may include flame retardants, fillers, antioxidants, anti-drip agents, lubricants, mold release agents, nucleating agents, heat stabilizers, UV stabilizers, pigments, dyes, and combinations thereof. When used in the thermoplastic resin composition, the additive may be contained in an amount of about 0.001 parts by weight to about 40 parts by weight, for example, about 0.1 parts by weight to about 20 parts by weight, relative to about 100 parts by weight of the thermoplastic resin composition.

The thermoplastic resin composition according to the present invention may be prepared in the form of pellets by: the above components are mixed and then melt extruded in a typical twin screw extruder at about 250 ℃ to about 400 ℃ (e.g., about 320 ℃ to about 400 ℃).

In some embodiments, the thermoplastic resin composition may have a notched izod impact strength of about 9 kgf-cm/cm to about 12 kgf-cm/cm when measured on a 1/8 "thick sample according to ASTM D256.

In some embodiments, the thermoplastic resin composition may have an impact strength of about 35cm to about 80cm, as determined by measuring the height at which a 500g dart is dropped using a dart impact tester in a dupont drop impact test resulting in the breakage of a 2mm thick sample in a 50% quantity.

In some embodiments, the thermoplastic resin composition may have an adhesion strength of about 35MPa to about 55MPa when measured relative to a metal according to ISO 19095.

The molded article according to the present invention is formed of the thermoplastic resin composition set forth above. The thermoplastic resin composition may be prepared in the form of particles. The prepared pellets can be produced into various molded articles (products) by various molding methods such as injection molding, extrusion, vacuum forming and casting. These molding methods are well known to those skilled in the art. The molded article according to the present invention has good properties in terms of adhesion to metal and impact resistance, and thus can be used as a metal bonding material for portable devices such as smart phones.

[ modes for the invention ]

Next, the present invention will be described in more detail with reference to some examples. It should be understood that these examples are provided for illustration only and are not to be construed as limiting the invention in any way.