阅读说明：本技术 一种smt表贴连接器平面度的测试装置及测试方法 (Device and method for testing flatness of SMT (surface mount technology) surface mount connector ) 是由 李刚 于 2020-05-08 设计创作，主要内容包括：本发明提供一种SMT表贴连接器平面度的测试装置及测试方法,包括：测试台和电子显微镜；所述测试台中间设置定位台,所述定位台的顶面设置水平测试面；所述定位台一侧设置反射面,所述反射面与测试台竖直侧面呈45°角,所述电子显微镜的竖直视角与水平测试面的平面延长线垂直相交在所述反射面上。本发明把待测连接器通过定位柱限位在测试台上,通过直角三棱镜的光反射,用电子显微镜观察测试PIN脚的共面程度增加SMT表贴连接器器件良率。(The invention provides a device and a method for testing the flatness of an SMT (surface mount technology) surface mount connector, which comprises the following steps: a test bed and an electron microscope; a positioning table is arranged in the middle of the test table, and a horizontal test surface is arranged on the top surface of the positioning table; the positioning table is characterized in that a reflecting surface is arranged on one side of the positioning table, the reflecting surface and the vertical side face of the test table form an angle of 45 degrees, and the vertical visual angle of the electron microscope and the plane extension line of the horizontal test surface are perpendicularly intersected on the reflecting surface. According to the invention, the connector to be tested is limited on the test board through the positioning column, and the coplanarity degree of the tested PIN foot is observed by using an electronic microscope through light reflection of the right-angle triple prism, so that the yield of the SMT surface mount connector device is increased.)

1. A testing arrangement of SMT table pastes connector plane degree, its characterized in that includes: a test bed and an electron microscope; a positioning table is arranged in the middle of the test table, and a horizontal test surface is arranged on the top surface of the positioning table; the positioning table is characterized in that a reflecting surface is arranged on one side of the positioning table, the reflecting surface and the vertical side face of the test table form an angle of 45 degrees, and the vertical visual angle of the electron microscope and the plane extension line of the horizontal test surface are perpendicularly intersected on the reflecting surface.

2. An SMT meter connector flatness testing apparatus according to claim 1, wherein two of the reflective surfaces are arranged on opposite sides of the positioning stage in an axisymmetric manner.

3. An SMT surface mounted connector flatness testing apparatus according to claim 1, wherein the positioning table includes at least one positioning hole that fits a positioning post on the bottom of the connector being tested.

4. An SMT meter connector flatness testing apparatus according to claim 1, wherein the testing table has side walls at edges thereof, the side walls are parallel to the positioning table, and the reflecting surface has one end abutting against the side walls and the other end abutting against a bottom end of the positioning table.

5. An SMT surface mounted connector flatness testing apparatus according to claim 4, wherein the reflecting surface is an inclined surface of an equilateral right triangular prism, one right-angled surface of the equilateral right triangular prism clings to the testing table, and the other right-angled surface of the equilateral right triangular prism clings to the side wall.

6. A method for testing the flatness of an SMT (surface mount technology) surface mount connector is characterized by comprising the following steps:

aligning a lens of the electron microscope to the reflecting surface, and acquiring the gap length between each PIN foot of the tested connector and the horizontal testing surface of the positioning table;

screening out the maximum value of all the gap lengths, and taking the maximum value as a flatness test value;

and acquiring a flatness standard value of the tested connector, and calculating and outputting a difference value between the flatness test value and the flatness standard value.

7. An SMT surface mount connector flatness testing method according to claim 6, further comprising:

judging whether the difference is a positive number:

if so, judging that the flatness of the connector is unqualified;

if not, the flatness of the connector is judged to be qualified.

8. An SMT surface mount connector flatness testing method according to claim 6, further comprising:

the method comprises the steps of obtaining the gap length between a measured PIN and a horizontal testing surface of a positioning table for multiple times, and calculating the average value of the gap length of the measured PIN;

and screening out the maximum average value of all the average values, and taking the maximum average value as a flatness test value.

Technical Field

The invention belongs to the technical field of electrical connection of components, and particularly relates to a device and a method for testing the flatness of an SMT (surface mount technology) surface mount connector.

Background

With the rapid development of technology, more and more power terminals are also using surface mount technology, and SMT surface mount connectors (hereinafter referred to as "SMT surface mount connectors") are widely used due to the advantages of low assembly cost, high density and high speed performance, but the SMT surface mount connectors also have some disadvantages that are already recognized by the public, particularly in the assembly process, the detail problem caused by PIN coplanarity of the connectors is often neglected, while reliable PIN coplanarity is very important in all industrial designs, so in the assembly stage, the PIN coplanarity of the connectors needs to be emphasized.

Usually in connector supplied materials inspection and PCBA's production process, the condition that SMT table pastes connector device PIN foot deformation can often appear, if the condition that this kind of PIN foot warp is not checked out, directly can influence the production yield, extravagant production efficiency, wasted operating time, perhaps even lead to the PCBA integrated circuit board to burn out, cause certain danger.

There is no tool and testing method that addresses the above problems, resulting in an SMT surface mount connector device that is not tested in place, thereby causing a use failure to occur.

Disclosure of Invention

In view of the above-mentioned deficiencies in the prior art, the present invention provides a device and a method for testing the planarity of an SMT surface mount connector, so as to solve the above-mentioned technical problems.

In a first aspect, the present invention provides an apparatus for testing planarity of an SMT surface mount connector, comprising: a test bed and an electron microscope; a positioning table is arranged in the middle of the test table, and a horizontal test surface is arranged on the top surface of the positioning table; the positioning table is characterized in that a reflecting surface is arranged on one side of the positioning table, the reflecting surface and the vertical side face of the test table form an angle of 45 degrees, and the vertical visual angle of the electron microscope and the plane extension line of the horizontal test surface are perpendicularly intersected on the reflecting surface.

Furthermore, there are two reflecting surfaces, and the two reflecting surfaces are arranged on two sides of the positioning table in an axisymmetric manner.

Furthermore, at least one positioning hole is formed in the positioning table, and the positioning hole is matched with the positioning column at the bottom of the measured connector.

Furthermore, the edge of testboard sets up the lateral wall, the lateral wall is parallel with the locating platform, plane of reflection one end leans on the lateral wall, and the other end leans on the bottom of locating platform.

Furthermore, the reflecting surface is an inclined surface of the equilateral right-angle triangular prism, a right-angle surface of the equilateral right-angle triangular prism is tightly attached to the test board, and another right-angle surface of the equilateral right-angle triangular prism is tightly attached to the side wall.

In a second aspect, the present invention provides a method for testing planarity of an SMT surface mount connector, including:

aligning a lens of the electron microscope to the reflecting surface, and acquiring the gap length between each PIN foot of the tested connector and the horizontal testing surface of the positioning table;

screening out the maximum value of all the gap lengths, and taking the maximum value as a flatness test value;

and acquiring a flatness standard value of the tested connector, and calculating and outputting a difference value between the flatness test value and the flatness standard value.

Further, the method further comprises:

judging whether the difference is a positive number:

if so, judging that the flatness of the connector is unqualified;

if not, the flatness of the connector is judged to be qualified.

Further, the method further comprises:

the method comprises the steps of obtaining the gap length between a measured PIN and a horizontal testing surface of a positioning table for multiple times, and calculating the average value of the gap length of the measured PIN;

and screening out the maximum average value of all the average values, and taking the maximum average value as a flatness test value.

The beneficial effect of the invention is that,

the invention provides a device and a method for testing the planeness of an SMT (surface mount technology) surface mount connector, which are characterized in that the connector to be tested is limited on a test board through a positioning column, the deformation condition of a PIN foot of the connector is observed and measured by an electronic microscope through light reflection of a right-angle triple prism, and the planeness of the PIN foot is measured; meanwhile, the invention provides a use method for the device, which is used for analyzing and processing the coplanarity condition acquired by the electron microscope and comparing the coplanarity condition with a standard value to obtain whether the PIN is qualified or not, so that the abnormal product of the SMT surface mount connector can be screened out, the yield of the SMT surface mount connector is increased, the production efficiency and the operation time are saved, the occurrence of major quality abnormity such as burning of the PCBA board card is reduced, the loss of the surface mount connector is greatly reduced, the rejection rate of the PCBA board card is reduced, and the occurrence of defects and test faults is reduced.

In addition, the invention has reliable design principle, simple structure and very wide application prospect.

Drawings

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic perspective view of an apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic side view of an apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic top view of an apparatus according to an embodiment of the present invention;

FIG. 4 is a schematic top view of a connector according to one embodiment of the present invention;

FIG. 5 is a schematic diagram of a process for using the apparatus of one embodiment of the present invention;

FIG. 6 is a flow chart of a method of one embodiment of the present invention;

wherein, 1, a test bench; 2. a right-angled prism; 3. a positioning table; 4. a horizontal test surface; 5. positioning holes; 6. an electron microscope; 7. a side wall; 8. a connector; 9. and a positioning column.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.