阅读说明：本技术 显示模组及显示装置 (Display module and display device ) 是由 李飞 严志辉 刘天良 王一飞 黄浩 陆旭 于 2021-09-06 设计创作，主要内容包括：本申请实施例提供一种显示模组及显示装置,该显示模组,包括：显示面板,包括相对的第一部分和第二部分、以及连接第一部分和第二部分的弯折部分；散热层,设于第一部分靠近第二部分一侧,且与第一部分固定连接；导热组件,设于散热层和第二部分之间,且与散热层和第二部分固定连接；驱动芯片,设于第二部分远离导热组件的一侧,且驱动芯片和导热组件在第二部分的投影至少部分重叠。本申请实施例用以解决现有技术存在的驱动芯片IC工作时产生的热量集中在显示面板的绑定区,容易导致显示模组损坏的技术问题。(The embodiment of the application provides a display module assembly and display device, this display module assembly includes: a display panel including first and second opposite portions and a bent portion connecting the first and second portions; the heat dissipation layer is arranged on one side of the first part, which is close to the second part, and is fixedly connected with the first part; the heat conduction assembly is arranged between the heat dissipation layer and the second part and fixedly connected with the heat dissipation layer and the second part; the driving chip is arranged on one side, far away from the heat conducting assembly, of the second portion, and the projections of the driving chip and the heat conducting assembly on the second portion are at least partially overlapped. The embodiment of the application is used for solving the technical problem that the heat generated during the working of the driving chip IC in the prior art is concentrated in the binding area of the display panel, so that the display module is easily damaged.)

1. A display module, comprising:

a display panel including first and second opposite portions and a bent portion connecting the first and second portions;

the heat dissipation layer is arranged on one side, close to the second part, of the first part and is fixedly connected with the first part;

the heat conduction assembly is arranged between the heat dissipation layer and the second part and fixedly connected with the heat dissipation layer and the second part;

the driving chip is arranged on one side, far away from the heat conducting component, of the second portion, and the projection of the driving chip and the projection of the heat conducting component on the second portion are at least partially overlapped.

2. The display module of claim 1, wherein the heat conducting assembly comprises:

the supporting structure comprises a base part and a protruding part surrounding the periphery of the base part, and the protruding part surrounding the periphery of the base part forms an accommodating cavity;

and the heat conduction structure is arranged in the accommodating cavity and fixedly connected with the supporting structure.

3. The display module of claim 2, wherein the heat conducting structure is a flat plate-shaped integral structure;

the surface of the heat conduction structure close to one side of the heat dissipation layer is flush with the surface of the protruding portion close to one side of the heat dissipation layer.

4. The display module of claim 3, wherein the heat conducting component satisfies at least one of:

a preset distance is reserved between the heat conduction structure and the protruding part, and the preset distance is smaller than 0.3 mm;

the thickness of the heat conducting structure in the first direction is 0.01 mm-0.15 mm; the first direction is perpendicular to the second portion;

the thickness of the base part in the first direction is 0.04 mm-0.3 mm;

the preset thickness of the bulge in the second direction is 0.5-3 mm; the second direction is perpendicular to the first direction.

5. The display module of claim 2, the support structure further comprising: the covering part is positioned on one side, far away from the base part, of the protruding part and covers the accommodating cavity.

6. The display module of claim 2, the thermally conductive assembly satisfying at least one of:

the material of bearing structure includes: polyethylene terephthalate PET;

and, the material of heat conduction structure includes: graphite.

7. A display module according to claim 2 or 3, wherein a first adhesive layer is disposed between the heat-conducting structure and the support structure;

the heat conduction structure is fixedly connected with the supporting structure through the first adhesive layer.

8. The display module according to claim 7, wherein the first adhesive layer has a thickness of 0.01mm to 0.05mm in a first direction, and the first direction is perpendicular to the second portion.

9. The display module assembly of claim 1, wherein a second adhesive layer is disposed between the heat conducting assembly and the heat dissipation layer, and the heat conducting assembly is fixedly connected to the heat dissipation layer through the second adhesive layer; and/or the presence of a gas in the gas,

a third adhesive layer is arranged between the heat conducting component and the second part, and the heat conducting component is fixedly connected with the second part through the third adhesive layer.

10. The display module according to claim 9, wherein the thickness of the second adhesive layer in a first direction is 0.02mm to 0.1mm, and the first direction is perpendicular to the second portion; and/or the presence of a gas in the gas,

the thickness of the third adhesive layer in the first direction is 0.02 mm-0.1 mm.

11. The display module of claim 1, wherein the heat dissipation layer comprises at least one film layer, and a film layer of the at least one film layer on a side close to the heat conductive member is a metal layer.

12. The display module of claim 11, wherein a fourth adhesive layer is disposed between the heat dissipation layer and the first portion;

the heat dissipation layer is fixedly connected with the first part through the fourth adhesive layer.

13. The display module of claim 12, wherein the metal layer has a thickness of 0.03mm to 0.05mm in a first direction, the first direction being perpendicular to the second portion; and/or the presence of a gas in the gas,

the thickness of the fourth adhesive layer in the first direction is 0.01 mm-0.1 mm.

14. The display module of claim 1, wherein a projection of the driving chip on the second portion is located within a projection of the heat conducting assembly on the second portion.

15. A display device, comprising: a display module according to any one of claims 1-14.

Technical Field

The application relates to the technical field of display, in particular to a display module and a display device.

Background

At present, electronic products are used more and more widely in life, and a display module is a core component for displaying of the electronic products. In the times of pursuing visual effects, full-screen display and large-screen display effects of electronic products such as mobile phones are increasingly favored by users.

In the existing display module, a driving chip IC (Integrated Circuit) is bound on a display Panel, and since the IC generates a large amount of heat during operation, when the heat is concentrated on a binding area of the display Panel, the display Panel is easily burned, which causes damage to the display Panel.

Disclosure of Invention

This application provides a display module assembly and display device to the shortcoming of current mode for the heat that the driver chip IC during operation that solves prior art existence produced concentrates on display panel's the district that binds, leads to the technical problem that display panel damaged easily.

In a first aspect, an embodiment of the present application provides a display module, including:

a display panel including first and second opposite portions and a bent portion connecting the first and second portions;

the heat dissipation layer is arranged on one side of the first part, which is close to the second part, and is fixedly connected with the first part;

the heat conduction assembly is arranged between the heat dissipation layer and the second part and fixedly connected with the heat dissipation layer and the second part;

the driving chip is arranged on one side, far away from the heat conducting assembly, of the second portion, and the projections of the driving chip and the heat conducting assembly on the second portion are at least partially overlapped.

In one possible implementation, a thermally conductive assembly includes:

the supporting structure comprises a base part and a protruding part surrounding the periphery of the base part, and the protruding part surrounding the periphery of the base part forms an accommodating cavity;

the heat conduction structure is arranged in the accommodating cavity and fixedly connected with the supporting structure.

In one possible implementation, the heat conducting structure is a flat plate-shaped integral structure;

the surface of the heat conducting structure close to one side of the heat dissipation layer is flush with the surface of the protruding part close to one side of the heat dissipation layer.

In one possible implementation, the heat conducting assembly satisfies at least one of:

a preset distance is formed between the heat conduction structure and the protruding part, and the preset distance is smaller than 0.3 mm;

the thickness of the heat conducting structure in the first direction is 0.01 mm-0.15 mm; the first direction is perpendicular to the second portion;

the thickness of the base part in the first direction is 0.04 mm-0.3 mm;

the preset thickness of the bulge in the second direction is 0.5 mm-3 mm; the second direction is perpendicular to the first direction.

In one possible implementation, the support structure further includes: and the covering part is positioned on one side of the protruding part far away from the base part and covers the accommodating cavity.

In one possible implementation, the heat conducting assembly satisfies at least one of:

the material of bearing structure includes: polyethylene terephthalate PET;

and, the material of heat conduction structure includes: graphite.

In one possible implementation, a first adhesive layer is provided between the heat conducting structure and the support structure;

the heat conducting structure is fixedly connected with the supporting structure through the first adhesive layer.

In one possible implementation, the thickness of the first adhesive layer in the first direction is 0.01mm to 0.05mm, and the first direction is perpendicular to the second portion.

In one possible implementation mode, a second adhesive layer is arranged between the heat conduction assembly and the heat dissipation layer, and the heat conduction assembly is fixedly connected with the heat dissipation layer through the second adhesive layer; and/or the presence of a gas in the gas,

and a third adhesive layer is arranged between the heat conduction assembly and the second part, and the heat conduction assembly is fixedly connected with the second part through the third adhesive layer.

In one possible implementation, the thickness of the second adhesive layer in the first direction is 0.02mm to 0.1mm, and the first direction is perpendicular to the second portion; and/or the presence of a gas in the gas,

the thickness of the third adhesive layer in the first direction is 0.02 mm-0.1 mm.

In one possible implementation manner, the heat dissipation layer includes at least one film layer, and a film layer on a side of the at least one film layer close to the heat conduction assembly is a metal layer.

In one possible implementation, a fourth adhesive layer is arranged between the heat dissipation layer and the first part;

the heat dissipation layer is fixedly connected with the first part through the fourth adhesive layer.

In one possible implementation, the metal layer has a thickness in a first direction of 0.03mm to 0.05mm, the first direction being perpendicular to the second portion; and/or the presence of a gas in the gas,

the thickness of the fourth adhesive layer in the first direction is 0.01 mm-0.1 mm.

In one possible implementation, the projection of the driving chip on the second portion is located within the projection of the heat conducting component on the second portion.

In a second aspect, an embodiment of the present application provides a display device, including: such as the display module of the first aspect.

The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise:

be equipped with heat dissipation layer and heat-conducting component between display panel's among the display module assembly of this application embodiment first portion and the second portion, heat-conducting component can conduct the heat dissipation layer with the production of driver chip IC during operation, and the heat dissipation layer is opened the heat equipartition to can disperse the heat that driver chip IC belonged to the district fast and open, avoid binding the heat concentration in district, bring the problem of display panel burn damage.

The heat conduction assembly enables the bending portion, connected with the first portion and the second portion, of the display panel to be bent in an arc state, and the heat conduction assembly serves as a support between the first portion and the second portion of the display panel to avoid dead folding of the display panel.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

FIG. 2 is a schematic bottom view of the structure of FIG. 1, wherein the structure of the second portion is omitted to show the structure and position relationship of the heat dissipation layer, the heat conduction assembly and the driving chip;

fig. 3 is a schematic front view of a heat conducting assembly, a second adhesive layer, and a third adhesive layer according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of the right side view of FIG. 3;

FIG. 5 is a bottom view of the structure of FIG. 3;

fig. 6 is a schematic front view illustrating a display device according to an embodiment of the present disclosure;

fig. 7 is a schematic top view illustrating a display device according to an embodiment of the present disclosure;

fig. 8 is an enlarged schematic view of a portion C of fig. 6.

Reference numerals:

100-display panel, 110-first portion, 111-first substrate, 120-second portion, 121-second substrate, 130-bent portion;

200-a heat dissipation layer;

300-heat conducting component, 310-support structure, 311-base portion, 312-projection portion, 320-heat conducting structure, a-predetermined thickness, B-predetermined spacing;

400-a driving chip;

500-a second adhesive layer;

600-a third adhesive layer;

700-glass cover plate;

800-flexible circuit board, 810-component;

900-connector;

1100-first layer of optical glue;

1200-a polarizer;

1300-a sensor;

1400-second layer of optical glue.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.

The embodiment of the application provides a display module assembly, see fig. 1 and fig. 2 and show, this display module assembly includes: the display device includes a display panel 100, a heat dissipation layer 200, a heat conductive member 300, and a driving chip 400.

The display panel 100 includes first and second portions 110 and 120 opposite to each other, and a bent portion 130 connecting the first and second portions 110 and 120.

The heat dissipation layer 200 is disposed on a side of the first portion 110 close to the second portion 120, and is fixedly connected to the first portion 110, and the heat dissipation layer 200 is used for uniformly distributing heat conducted by the heat conduction assembly 300 for heat dissipation.

The heat conducting member 300 is disposed between the heat dissipation layer 200 and the second portion 120, and is fixedly connected to the heat dissipation layer 200 and the second portion 120. The heat conductive member 300 may conduct heat in a first aspect, and may serve as a support between the first portion 110 and the second portion 120 of the display panel 100 for the display panel 100 to be bent.

The driving chip 400 is disposed on a side of the second portion 120 away from the heat conducting component 300, and projections of the driving chip 400 and the heat conducting component 300 on the second portion 120 are at least partially overlapped, so that heat generated by the heat conducting component 300 when the driving chip 400 works can be rapidly conducted to the heat dissipation layer 200.

In some embodiments, the first portion 110 and the second portion 120 of the display panel 100 in the present disclosure are each provided with a supporting protective film. The heat dissipation layer 200 is fixedly connected to the first portion 110, and may be fixedly connected to a supporting protection film located on the first portion; the heat conducting assembly 300 is fixedly connected to the second portion 120, and may be fixedly connected to a supporting protective film on the second portion.

Be equipped with heat dissipation layer 200 and heat-conducting component 300 between display panel 100's among the display module assembly of this application first portion 110 and second portion 120, heat-conducting component 300 can conduct heat dissipation layer 200 with the heat that driver chip 400 during operation produced, heat dissipation layer 200 is with the heat equipartition division to can disperse the heat that driver chip 400IC place bound the district fast, avoid binding the heat concentration in district, bring the problem that display panel 100 burns and damages.

By applying the heat conducting assembly 300 of the embodiment of the application, the bending portion 130 of the display panel 100 connecting the first portion 110 and the second portion 120 can be bent in an arc state, and the heat conducting assembly 300 serves as a support between the first portion 110 and the second portion 120 of the display panel 100, so that the display panel 100 is prevented from being folded.

Alternatively, referring to fig. 1, the first portion 110 and the second portion 120 are parallel, and the bent portion 130 is bent in a circular arc shape.

Alternatively, referring to fig. 2, the heat dissipation layer 200 is laid on the entire surface of the first portion 110 on the side close to the second portion 120. Specifically, the heat dissipation layer 200 may be a heat dissipation film for dissipating heat.

Optionally, the size of the heat conducting assembly 300 is 54.4mm (multiplied by) 6.82mm 0.21mm (millimeters).

In some embodiments, referring to fig. 3, 4 and 5, the thermally conductive assembly 300 includes: a support structure 310 and a thermally conductive structure 320.

The supporting structure 310 includes a base portion 311 and a protrusion portion 312 surrounding the base portion 311, wherein the protrusion portion 312 surrounding the base portion 311 forms a receiving cavity.

Alternatively, the base portion 311 and the protruding portion 312 are of an integrally molded structure. The material of the supporting structure 310 may be polyethylene terephthalate (PET), for example, the base portion 311 and the protrusion portion 312 are both made of PET.

The support structure 310 is used to provide a receiving cavity for receiving the heat conducting structure 320, and at the same time, the whole of the support structure 310 has a certain thickness in the first direction, so as to be used as a support between the first portion 110 and the second portion 120; the first direction is perpendicular to the second portion 120.

The heat conducting structure 320 is disposed in the accommodating cavity and fixedly connected to the supporting structure 310. The heat conducting structure 320 is disposed in the accommodating cavity, so as to prevent the heat conducting material (e.g., graphite) of the heat conducting structure 320 from falling off and causing foreign matter in the display panel 100.

Further, the supporting structure 310 may further include more than the base portion 311 and the protruding portion 312, for example, the supporting structure 310 further includes a covering portion (not shown in the drawings) located on a side of the protruding portion 312 far from the base portion 311 for covering the accommodating cavity. The material of the covering part can also be PET.

Optionally, referring to fig. 2, a dashed box within the thermally conductive assembly 300 is a thermally conductive structure 320.

Alternatively, the heat conducting structure 320 is made of graphite material with better heat conducting performance, and the powder-like material property of graphite requires that graphite is placed in the accommodating cavity of the supporting structure 310. It is contemplated that the thermally conductive structure 320 may be made of other materials having a relatively high thermal conductivity.

In some embodiments, referring to fig. 3, the heat conducting structure 320 is a flat plate-shaped integral structure, so as to increase the contact area with the heat dissipation layer 200 and improve the heat dissipation effect. When the heat conducting structure 320 is a flat plate-shaped integrated structure, the heat conducting structure 320 may be a whole surface structure, or a structure with hollow patterns (such as circular holes).

The surface of the heat conducting structure 320 close to the heat dissipation layer 200 is flush with the surface of the protrusion 312 close to the heat dissipation layer 200, so that the heat conducting structure 320 and the protrusion 312 are both fixedly connected with the heat dissipation layer 200, and the heat conducting structure 320 directly conducts heat to the heat dissipation layer 200.

In some embodiments, the thermally conductive assembly 300 includes at least one of:

referring to fig. 3 and 4, the heat conductive structure 320 and the protrusion 312 have a predetermined distance B therebetween, and the predetermined distance B is less than 0.3 mm. The predetermined interval B may be used as a form and position tolerance for the attachment of the heat conductive structure 320. Alternatively, the predetermined spacing B is typically about 0.2mm, which is determined primarily by the die-cutting plant process capability, with smaller being better in practice.

In some embodiments, the thickness of the heat conducting structure 320 in the first direction is 0.01mm to 0.15mm, for example, the thickness is in a range of 0.02mm to 0.1 mm; the first direction is perpendicular to the second portion 120. Alternatively, the thickness of the heat conductive structure 320 in the first direction includes 0.02mm and 0.1mm, and the thickness of the heat conductive structure 320 in the first direction may be 0.05 mm.

In some embodiments, the base portion 311 has a thickness in the first direction of 0.04mm to 0.3mm, for example, the thickness may range from 0.06mm to 0.25 mm. Alternatively, the thickness of the base portion 311 in the first direction includes 0.06mm and 0.25mm, and the thickness of the base portion 311 in the first direction may be 0.1 mm.

In some embodiments, the predetermined thickness a of the projection 312 in the second direction is 0.5mm to 3mm, for example, the thickness may range from 0.8mm to 1.5 mm; the second direction is perpendicular to the first direction. Alternatively, the predetermined thickness a of the projection 312 in the second direction includes 0.8mm and 1.5 mm. The predetermined thickness a may be about 1mm, and is as small as possible on the premise that the wrapping effect of the supporting structure 310 on the heat conducting structure 320 is satisfied, so that the area of the heat conducting structure 320 is as large as possible.

In some embodiments, a first adhesive layer (not shown) is disposed between the thermally conductive structure 320 and the support structure 310. The heat conducting structure 320 is fixedly connected to the supporting structure 310 by the first adhesive layer.

In some embodiments, the first adhesive layer has a thickness in a first direction between 0.01mm and 0.05mm, the first direction being perpendicular to the second portion 120. Optionally, the thickness of the first adhesive layer in the first direction comprises 0.01mm and 0.05 mm.

In some embodiments, referring to fig. 3 and 4, a second adhesive layer 500 is disposed between the heat conducting assembly 300 and the heat dissipating layer 200, and the heat conducting assembly 300 is fixedly connected to the heat dissipating layer 200 through the second adhesive layer 500; and/or the presence of a gas in the gas,

a third adhesive layer 600 is disposed between the heat conducting assembly 300 and the second portion 120, and the heat conducting assembly 300 is fixedly connected to the second portion 120 through the third adhesive layer 600.

In some embodiments, the second adhesive layer 500 has a thickness in a first direction of 0.02mm to 0.1mm, the first direction being perpendicular to the second portion 120; and/or the thickness of the third adhesive layer 600 in the first direction is 0.02mm to 0.1 mm.

Optionally, the thickness of the second adhesive layer 500 in the first direction comprises 0.02mm and 0.1 mm; the thickness of the third adhesive layer 600 in the first direction includes 0.02mm and 0.1 mm.

Alternatively, both the second adhesive layer 500 and the third adhesive layer 600 are high-viscosity adhesives, for example, the peeling force of the high-viscosity adhesive is above 2000gf (gram force)/inch. The second adhesive layer 500 and the third adhesive layer 600 are double-sided adhesive tapes, and the thickness in the first direction is 0.03 mm.

Alternatively, referring to fig. 5, two dashed boxes respectively represent the outer edges of the receiving cavity formed by the heat conducting structure 320 and the protrusion 312, and the distance between the two dashed boxes is a predetermined distance B.

The heat conducting structure 320 is a rectangular structure, the accommodating cavity is rectangular, and the heat conducting structure 320 coincides with the center of the accommodating cavity. In the embodiment of the present disclosure, an orthographic projection of the heat conducting structure 320 on the second portion 120 is a first rectangle, and an orthographic projection of the supporting structure 310 on the second portion 120 is a second rectangle. Optionally, the shapes of the two orthographic projections may also not be rectangular, for example, the shapes of the two orthographic projections may be a convex shape or a trapezoid, and the like, which is not limited by the embodiment of the disclosure.

In some embodiments, referring to fig. 1, the heat dissipation layer 200 includes at least one film layer (the film layers are not shown in fig. 1), and a film layer of the at least one film layer on a side close to the heat conductive member 300 is a metal layer. The metal layer has good thermal conductivity, so that heat dissipation from the heat conducting component can be facilitated. Optionally, the orthographic projection area of the metal layer on the first portion 110 may be the same as the orthographic projection area of the whole heat dissipation layer 200 on the first portion 110, so as to improve the heat dissipation effect of the heat dissipation layer 200; optionally, the metal layer is a copper foil. It is contemplated that other metals that dissipate heat may be used as the metal layer in embodiments of the present application.

Optionally, the heat dissipation layer 200 further includes a foam layer, and a side of the foam layer away from the metal layer is fixedly connected to the first portion 110 through a grid adhesive.

In some embodiments, a fourth adhesive layer (not shown) is disposed between the heat dissipation layer 200 and the first portion 110; the heat dissipation layer 200 is fixedly connected to the first portion 110 through a fourth adhesive layer.

In some embodiments, the metal layer has a thickness in a first direction of 0.03mm to 0.05mm, the first direction being perpendicular to the second portion 120; and/or the thickness of the fourth adhesive layer in the first direction is 0.01 mm-0.1 mm.

Optionally, the thickness of the metal layer in the first direction comprises 0.03mm and 0.05 mm; the thickness of the fourth adhesive layer in the first direction comprises 0.01mm and 0.1 mm.

Use this application embodiment, the fixed connection of each part is all fixed through the viscose layer, and the viscose layer can be for high viscidity glue firm in connection, and be convenient for conduction heat and heat dissipation.

In some embodiments, the projection of the driving chip 400 on the second portion 120 is located within the projection of the heat conducting member 300 on the second portion 120, so that the heat concentrated by the driving chip 400 can be quickly conducted to the heat conducting member 300.

Based on the same inventive concept, embodiments of the present application provide a display device, as shown in fig. 6 to 8, including: a display module according to any of the embodiments of the present application.

Alternatively, referring to fig. 6, the heat conducting member 300 of the embodiment of the present application is located at one side bend of the entire display panel 100.

In some embodiments, referring to fig. 7 and 8, the display device further includes: a glass cover plate (CG)700, a Flexible Printed Circuit Board (FPC) 800, a Connector (Connector)900, a Sensor (Sensor)1300, a first layer of optical cement (T-OCA) 1100, a second layer of optical cement (T-OCA)1400, and a Polarizer (Polarizer) 1200.

Alternatively, referring to fig. 7, the glass cover plate 700 is located on the side of the display panel 100 away from the heat dissipation layer 200; the flexible circuit board 800 is fixedly connected with the heat dissipation layer 200. The connector 900 is fixedly connected to the heat dissipation layer 200 and the flexible circuit board 800, respectively. Specifically, the flexible circuit board 800 includes a plurality of components (components) 810, which include capacitors, resistors, inductors, and the like.

Alternatively, referring to fig. 8, the first portion 110 includes a first substrate 111 and a first display region on a side of the first substrate 111 away from the second portion 120; the second portion 120 includes a second substrate 121 and a second display region located at a side of the second substrate 121 remote from the first portion 110. One side of the flexible circuit board 800 extends to and is fixedly connected with the second display region of the second portion 120; the heat conducting assembly 300 is fixedly connected with the second substrate 121 of the second portion 120, and the heat dissipation layer 200 is fixedly connected with the first substrate 111 of the first portion 110; the second layer of optical adhesive 1400, the sensor 1300, the polarizer 1200, the first layer of optical adhesive 1100 and the glass cover plate 700 are sequentially stacked on the side of the first display area of the first portion 110 away from the second portion 120.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

(1) the heat conduction assembly 300 of the embodiment of the application can conduct the heat generated by the driver chip 400 during operation to the heat dissipation layer 200, and the heat dissipation layer 200 uniformly distributes the heat, so that the heat in the binding area of the driver chip 400IC can be rapidly dispersed, the heat concentration in the binding area is avoided, and the problem of damage caused by burn of the display panel 100 is solved.

(2) The heat conducting assembly 300 according to the embodiment of the application enables the bending portion 130 of the display panel 100 connecting the first portion 110 and the second portion 120 to be bent in an arc state, and the heat conducting assembly 300 serves as a support between the first portion 110 and the second portion 120 of the display panel 100, so that the display panel 100 is prevented from being folded.

(3) The heat conducting structure 320 of the embodiment of the application is disposed in the accommodating cavity of the supporting structure 310, so as to prevent the heat conducting material (e.g., graphite) of the heat conducting structure 320 from falling off powder, which may cause foreign matter on the display panel. Meanwhile, the heat conducting structure 320 is a flat plate-shaped integrated structure, which is convenient for increasing the contact area with the heat dissipation layer 200 and improving the heat dissipation effect.

(4) One side of the heat dissipation layer 200 close to the heat conduction assembly 300 in the embodiment of the application is provided with a metal layer, so that rapid heat dissipation is facilitated; the fixed connection of each part is all fixed through the viscose layer, and the viscose layer has high viscosity and can firm in connection, and be convenient for conduct heat and dispel the heat.

The display device provided by the embodiment of the disclosure may be any product or component having a display function, such as a liquid crystal panel, electronic paper, an Organic Light-Emitting Diode (OLED) device, a Quantum dot Light-Emitting Diode (QLED) device, a Micro LED display device, and the like.

Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.