阅读说明：本技术 一种显示模组及其制作方法、显示装置 (Display module, manufacturing method thereof and display device ) 是由 杨俊� 游魁华 唐志舜 于 2021-04-13 设计创作，主要内容包括：本申请实施例公开了一种显示模组及其制作方法、显示装置,该显示模组包括显示面板、以及设置于显示面板上的功能膜层和密封胶层,密封胶层包括与功能膜层间隔设置的第一胶段和填充于第一胶段与功能膜层之间的第二胶段,第二胶段的弹性模量小于第一胶段的弹性模量,本申请通过将设置于所述弯折布线部上的密封胶层划分为第一胶段和第二胶段,并且使与所述功能膜层粘接的第二胶段的弹性模量小于与所述功能膜层间隔设置的所述第一胶段的弹性模量,使得与所述功能膜层粘接的第二胶段相比于第一胶段具备更好的延展性,从而在弯折布线部弯折的过程中,可以很好的释放功能膜层与第二胶段交界处产生的应力。(The embodiment of the application discloses a display module and a manufacturing method thereof, and a display device, wherein the display module comprises a display panel, a functional film layer and a sealant layer which are arranged on the display panel, the sealant layer comprises a first adhesive section which is arranged at an interval with the functional film layer and a second adhesive section which is filled between the first adhesive section and the functional film layer, the elastic modulus of the second adhesive section is smaller than that of the first adhesive section, the sealant layer arranged on the bent wiring part is divided into the first adhesive section and the second adhesive section, and the elastic modulus of the second glue segment bonded with the functional film layer is smaller than the elastic modulus of the first glue segment arranged at intervals with the functional film layer, so that the second glue segment bonded with the functional film layer has better ductility compared with the first glue segment, therefore, in the process of bending the wiring part, the stress generated at the junction of the functional film layer and the second adhesive section can be well released.)

1. A display module, comprising:

the display panel comprises a display area and a non-display area adjacent to the display area, and the display panel comprises a display function part positioned in the display area and a bent wiring part positioned in the non-display area;

the functional film layer is arranged on the display panel;

the sealing adhesive layer is arranged on the bent wiring part and is positioned in the non-display area;

wherein, the sealant layer include with the first section of gluing that function rete interval set up with fill in first glue the section with the section is glued to the second between the function rete, the elastic modulus of section is glued to the second is less than the elastic modulus of first section of gluing.

2. The display module according to claim 1, wherein the first glue segment and the second glue segment are made of the same material, and the first glue segment and the second glue segment are integrally formed, wherein the curing rate of the second glue segment is less than that of the first glue segment.

3. The display module of claim 1, wherein the second glue segment is made of a different material than the first glue segment, and wherein the second glue segment has a lower modulus of elasticity than the first glue segment.

4. The display module according to claim 3, wherein one end of the second adhesive segment is bonded to the functional film, and the other end of the second adhesive segment extends to the first adhesive segment and at least partially covers the first adhesive segment.

5. The display module of claim 1, wherein the meander wiring portion comprises a first wiring segment adjacent to the display function portion, a meander wiring segment disposed at an end of the first wiring segment away from the display function portion, and a second wiring segment disposed at an end of the meander wiring segment away from the first wiring segment, wherein the first adhesive segment is disposed on the meander wiring portion and covers the meander wiring segment.

6. The display module according to claim 5, further comprising a back plate disposed on a side of the display panel away from the sealant layer, wherein the back plate comprises a first back plate and a second back plate, a space section corresponding to the meander wiring section is disposed between the first back plate and the second back plate, and a length of the space section is less than or equal to a length of the meander wiring section.

7. The display module of claim 1, wherein the display function portion comprises at least one bending display segment, and the elastic modulus of the second adhesive segment is less than or equal to 60% of the elastic modulus of the first adhesive segment.

8. A manufacturing method of a display module is characterized by comprising the following steps:

providing a display panel, wherein the display panel comprises a display area and a non-display area adjacent to the display area, and the display panel comprises a display function part formed in the display area and a bent wiring part formed in the non-display area;

forming a functional film layer on the display panel;

form on the display panel and be located the sealant layer in the non-display area, the sealant layer include with the first section of gluing that function rete interval set up with fill in first glue the section with the section is glued to the second between the function rete, the elastic modulus of the section is glued to the second is less than the elastic modulus of first section of gluing.

9. The method of claim 8, wherein the step of forming the sealant layer on the display panel in the non-display region comprises:

forming a photosensitive adhesive layer which is positioned in the non-display area and is in contact with the functional film layer on the display panel;

adopt an illumination solidification step to make photosensitive adhesive layer solidification forms the sealant layer, wherein, photosensitive adhesive layer include with the first sub-glue that function rete interval set up with be located first sub-glue with the second between the function rete glues, the time that the second sub-glue accepts illumination is less than first sub-glue accepts illumination's time, so that the second that the sub-solidification of gluing formed glues the elastic modulus of section is less than the elastic modulus of first gluey section that the solidification of gluing formed of first sub-glue.

10. The method of claim 8, wherein the step of forming the sealant layer on the display panel in the non-display region comprises:

forming a first photosensitive adhesive layer which is positioned in the non-display area and is arranged at an interval with the functional film layer on the display panel, and curing the first photosensitive adhesive layer to form a first adhesive section by adopting a first curing step;

and forming a second photosensitive adhesive layer which is positioned in the non-display area and filled between the first adhesive section and the functional film layer on the display panel, and curing the second photosensitive adhesive layer to form a second adhesive section by adopting a second curing step so as to form a sealing adhesive layer comprising the first adhesive section and the second adhesive section, wherein the proportion of the curing agent in the second photosensitive adhesive layer is greater than that of the curing agent in the first photosensitive adhesive layer.

11. A display device, characterized in that the display device comprises a display module according to any one of claims 1-7.

Technical Field

The application relates to the field of display, in particular to a display module and a manufacturing method thereof, and a display device.

Background

The pad bending technology is used as a main technical means for realizing the narrow frame of the display module, and the narrow frame is realized by bending the part of the display module in a non-display area.

Disclosure of Invention

The embodiment of the application provides a display module, a manufacturing method thereof and a display device, and aims to solve the technical problem that local stress of the joint position of a film structure such as a polarizer and protective adhesive in a pad bonding process of the conventional display module is overlarge.

The embodiment of the application provides a display module assembly, include:

the display panel comprises a display area and a non-display area adjacent to the display area, and the display panel comprises a display function part positioned in the display area and a bent wiring part positioned in the non-display area;

the functional film layer is arranged on the display panel;

the sealing adhesive layer is arranged on the bent wiring part and is positioned in the non-display area;

wherein, the sealant layer include with the first section of gluing that function rete interval set up with fill in first glue the section with the section is glued to the second between the function rete, the elastic modulus of section is glued to the second is less than the elastic modulus of first section of gluing.

Optionally, in some embodiments of the present application, the first glue section and the second glue section are made of the same material, and the first glue section and the second glue section are of an integrally formed structure, wherein a curing rate of the second glue section is less than a curing rate of the first glue section.

Optionally, in some embodiments of the present application, a material of the second glue segment is different from a material of the first glue segment, and an elastic modulus of the material of the second glue segment is smaller than an elastic modulus of the material of the first glue segment.

Optionally, in some embodiments of the present application, one end of the second adhesive segment is bonded to the functional film layer, and the other end of the second adhesive segment extends to the first adhesive segment and at least partially covers the first adhesive segment.

Optionally, in some embodiments of the present application, the bending wiring portion includes a first wiring segment adjacent to the display function portion, a second wiring segment disposed on the first wiring segment and away from one end of the display function portion, and a second wiring segment disposed on the bending wiring segment and away from one end of the first wiring segment, and the first glue segment is disposed on the bending wiring portion and covers the bending wiring segment.

Optionally, in some embodiments of the application, the display module further includes a back plate disposed on a side of the display panel away from the sealant layer, where the back plate includes a first back plate and a second back plate, a spacing segment corresponding to the position of the meander wiring segment is disposed between the first back plate and the second back plate, and a length of the spacing segment is less than or equal to a length of the meander wiring segment.

Optionally, in some embodiments of the present application, the display function portion includes at least one bending display section, and an elastic modulus of the second adhesive section is less than or equal to 60% of an elastic modulus of the first adhesive section.

Correspondingly, the embodiment of the application further provides a manufacturing method of the display module, which comprises the following steps:

providing a display panel, wherein the display panel comprises a display area and a non-display area adjacent to the display area, and the display panel comprises a display function part formed in the display area and a bent wiring part formed in the non-display area;

forming a functional film layer on the display panel;

form on the display panel and be located the sealant layer in the non-display area, the sealant layer include with the first section of gluing that function rete interval set up with fill in first glue the section with the section is glued to the second between the function rete, the elastic modulus of the section is glued to the second is less than the elastic modulus of first section of gluing.

Optionally, in some embodiments of the present application, the step of forming a sealant layer on the display panel in the non-display area includes:

forming a photosensitive adhesive layer which is positioned in the non-display area and is in contact with the functional film layer on the display panel;

adopt an illumination solidification step to make photosensitive adhesive layer solidification forms the sealant layer, wherein, photosensitive adhesive layer include with the first sub-glue that function rete interval set up with be located first sub-glue with the second between the function rete glues, the time that the second sub-glue accepts illumination is less than first sub-glue accepts illumination's time, so that the second that the sub-solidification of gluing formed glues the elastic modulus of section is less than the elastic modulus of first gluey section that the solidification of gluing formed of first sub-glue.

Optionally, in some embodiments of the present application, the step of forming a sealant layer on the display panel in the non-display area includes:

forming a first photosensitive adhesive layer which is positioned in the non-display area and is arranged at an interval with the functional film layer on the display panel, and curing the first photosensitive adhesive layer to form a first adhesive section by adopting a first curing step;

and forming a second photosensitive adhesive layer which is positioned in the non-display area and filled between the first adhesive section and the functional film layer on the display panel, and curing the second photosensitive adhesive layer to form a second adhesive section by adopting a second curing step so as to form a sealing adhesive layer comprising the first adhesive section and the second adhesive section, wherein the proportion of the curing agent in the second photosensitive adhesive layer is greater than that of the curing agent in the first photosensitive adhesive layer.

Correspondingly, the embodiment of the application also provides a display device, and the display device comprises the display module group according to the previous embodiment.

This application embodiment through will set up in sealed glue film on the wiring portion of buckling divides into first gluey section and the gluey section of second, and make with the elastic modulus that the section was glued to the second of function rete bonding be less than with function rete interval sets up the elastic modulus of first gluey section makes with the section is glued to the second of function rete bonding is compared and is possessed better ductility in first gluey section to at the in-process that wiring portion buckled of buckling, the stress that the section juncture produced is glued to release function rete and second that can be fine.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a top view of a display module according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional view taken along line a-a in fig. 1.

Fig. 3 is another schematic cross-sectional view taken along line a-a in fig. 1.

Fig. 4 is a schematic cross-sectional view of the functional portion at B-B in fig. 1 showing the bending variation of the functional portion.

Fig. 5 is a schematic block diagram of a process of a method for manufacturing a display module according to an embodiment of the present disclosure.

Fig. 6a to fig. 6e are schematic views of a flow structure of a method for manufacturing a display module according to an embodiment of the present disclosure.

Fig. 7a to 7e are schematic views of another flow structure of a manufacturing method of a display module according to an embodiment of the present disclosure.

Fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.

The embodiment of the application provides a display module, a manufacturing method thereof and a display device. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

Referring to fig. 1 to 3, an embodiment of the present disclosure provides a display module, including:

a display panel including a display area 100 and a non-display area 200 adjacent to the display area 100, the display panel including a display function portion 10 located in the display area 100 and a meander wiring portion 20 located in the non-display area 200;

a functional film layer 30 disposed on the display panel;

a sealant layer 40 disposed on the bending wiring portion 20 and located in the non-display area 200;

the sealant layer 40 includes a first adhesive segment 41 spaced apart from the functional film layer 30 and a second adhesive segment 42 filled between the first adhesive segment 41 and the functional film layer 30, and an elastic modulus of the second adhesive segment 42 is smaller than an elastic modulus of the first adhesive segment 41.

In an embodiment, the pad bending technology is used as a main technical means for realizing the narrow frame of the display module, and the narrow frame is realized by bending a part of the display module in a non-display area. In the embodiment of the present application, the sealant layer 40 disposed on the bending wiring portion 20 is divided into the first adhesive segment 41 and the second adhesive segment 42, and the elastic modulus of the second adhesive segment 42 bonded to the functional film 30 is smaller than the elastic modulus of the first adhesive segment 41 disposed at an interval with the functional film 30, so that the second adhesive segment 42 bonded to the functional film 30 has better ductility than the first adhesive segment 41, and therefore, in the bending process of the bending wiring portion 20, the stress generated at the junction between the functional film 30 and the second adhesive segment 42 can be well released, in this embodiment, the elastic modulus of the second adhesive segment 42 is smaller than or equal to 80% of the elastic modulus of the first adhesive segment 41, specifically, the elastic modulus of the first adhesive segment 41 is 500Mpa, the elastic modulus of the second adhesive segment 42 is smaller than or equal to 400Mpa, and the distance between the functional film 30 and the first adhesive segment 41 is 0 to 0.5mm, the second glue segment 42 fills at least the area between the functional film layer 30 and the first glue segment 41. It is to be noted that the second adhesive section 42 is filled between the first adhesive section 41 and the functional film layer 30, so that the first adhesive section 41 and the second adhesive section 42 cover the bending wiring portion 20 as much as possible, and there is no gap transition between the second adhesive section 42 in the sealant layer 40 and the functional film layer 30, so that there is no exposed portion in the bending wiring portion 20, that is, the electrostatic protection for each wire in the bending wiring portion 20 can be realized.

The functional film layer 30 is a film layer attached to the display panel through an adhesive layer, and may be, for example, an optical film such as a polarizer, a touch functional film with a touch function, or a hard or soft film with a protection function, which is not limited herein. In an embodiment, referring to fig. 2, the first glue segment 41 and the second glue segment 42 are made of the same material, and the first glue segment 41 and the second glue segment 42 are integrally formed, wherein a curing rate of the second glue segment 42 is less than a curing rate of the first glue segment 41.

The first glue segment 41 and the second glue segment 42 may be made of the same material, and the first glue segment 41 and the second glue segment 42 may be made of the same process and formed into an integrated structure, the curing rate of the second glue segment 42 is smaller than that of the first glue segment 41, specifically, the first glue segment 41 and the second glue segment 42 may be made of a material such as photosensitive glue, and both the first glue segment 41 and the second glue segment 42 may be cured by an illumination curing step to form the first glue segment 41 and the second glue segment 42, wherein, in order to make the elastic modulus of the second glue segment 42 smaller than that of the first glue segment 41, the energy of illumination curing received by the photosensitive glue for making the first glue segment 41 and the photosensitive glue for making the second glue segment 42 may be adjusted to make the curing rates of the photosensitive glue for making the first glue segment 41 and the second glue segment 42 different, so that the modulus of elasticity of the second glue segment 42 is smaller than the modulus of elasticity of the first glue segment 41.

In one embodiment, the curing energy of the photosensitive adhesive material is about 3500-²The energy received by the photosensitive adhesive for manufacturing the first adhesive segment 41 can be controlled to be greater than or equal to 90% of the curing energy of the photosensitive adhesive material, so that the curing rate of the photosensitive adhesive for manufacturing the first adhesive segment 41 is greater than 90%, the first adhesive segment 41 is nearly completely cured, and the energy received by the photosensitive adhesive for manufacturing the second adhesive segment 42 can be controlled to be less than 90% of the curing energy of the photosensitive adhesive material, so that the curing rate of the photosensitive adhesive for manufacturing the second adhesive segment 42 is less than 90%, the second adhesive segment 42 is in a similar semi-cured state, and the elastic modulus of the second adhesive segment 42 is less than that of the first adhesive segment 41.

In summary, under the same illumination intensity, the illumination time for the photosensitive adhesive for manufacturing the second adhesive section 42 and the photosensitive adhesive for manufacturing the second adhesive section 42 may be adjusted to make the elastic modulus of the second adhesive section 42 smaller than that of the first adhesive section 41, for example, the illumination time received by the photosensitive adhesive for manufacturing the second adhesive section 42 may be smaller than that received by the photosensitive adhesive for manufacturing the first adhesive section 41, and details thereof are not repeated here.

In an embodiment, referring to fig. 3, the material of the second adhesive segment 42 is different from the material of the first adhesive segment 41, and the elastic modulus of the material of the second adhesive segment 42 is smaller than the elastic modulus of the material of the first adhesive segment 41.

The first glue segment 41 and the second glue segment 42 can be made of different materials in a segmented manner, so that the elastic modulus of the material of the second glue segment 42 is smaller than that of the material of the first glue segment 41, specifically, the first glue segment 41 and the second glue segment 42 can be made of different materials, the first glue segment 41 and the second glue segment 42 can be made of materials with different elastic moduli, or the first glue segment 41 and the second glue segment 42 can be made of materials with different material compositions or the same material composition but different doping proportions, respectively.

In summary, the ratio of the curing agent in the photosensitive adhesive for manufacturing the first adhesive section 41 to the curing agent in the photosensitive adhesive for manufacturing the second adhesive section 42 can be adjusted, so that the elastic modulus of the first adhesive section 41 and the second adhesive section 42 after curing by light is different, specifically, the ratio of the curing agent in the photosensitive adhesive for manufacturing the first adhesive section 41 to the curing agent in the photosensitive adhesive for manufacturing the second adhesive section 42 can be greater than the ratio of the curing agent in the photosensitive adhesive for manufacturing the second adhesive section 42, and obviously, under the same curing condition by light, the elastic modulus of the second adhesive section 42 formed by manufacturing is smaller than the elastic modulus of the first adhesive section 41.

In an embodiment, referring to fig. 3, one end of the second adhesive segment 42 is adhered to the functional film 30, and the other end of the second adhesive segment 42 extends to the first adhesive segment 41 and at least partially covers the first adhesive segment 41. In the process of bending the wiring portion 20, a large local stress is generated at the second adhesive segment 42, and in this embodiment, by making the elastic modulus of the second adhesive segment 42 smaller than that of the first adhesive segment 41, so that the second glue segment 42 is more easily deformed than the first glue segment 41, thereby relieving the local stress generated at the second adhesive segment 42 when the bending wiring part 20 is bent, in the process, the end of the second glue segment 42 away from the functional film layer 30 is arranged to extend onto the first glue segment 41 and at least partially cover the first glue segment 41, a transition zone of gradual modulus of elasticity may be formed where the second glue segment 42 overlaps the first glue segment 41, the first glue segment 41 and the second glue segment 42 have stronger integrity, and a better release effect on local stress can be realized. In an embodiment, referring to fig. 2 to 3, the meander wiring portion 20 includes a first wiring segment 21 adjacent to the display function portion 10, a meander wiring segment 22 disposed at an end of the first wiring segment 21 away from the display function portion 10, and a second wiring segment 23 disposed at an end of the meander wiring segment 22 away from the first wiring segment 21, and the first adhesive segment 41 is disposed on the meander wiring portion 20 and covers the meander wiring segment 22. Obviously, in the pad bonding process of the display panel, the bending wiring portion 20 is also bent at the position of the bending wiring section 22, and the first adhesive section 41 is disposed on the bending wiring portion 20 and covers the bending wiring section 22, that is, the first adhesive section 41 completely covers the bending wiring section 22, so that the whole surface of the bending wiring section 22 is protected.

In an embodiment, referring to fig. 2 to 3, the display module further includes a back plate 50 disposed on a side of the display panel away from the sealant layer 40, the back plate 50 comprises a first back plate 51 and a second back plate 52, a spacing section 53 corresponding to the position of the bending wiring section 22 is arranged between the first back plate 51 and the second back plate 52, the length of the spacing segment 53 is less than or equal to the length of the meander wiring segment 22, and in particular, the first back plate 51 may be disposed at a position corresponding to at least the display function portion 10 and the first wiring segment 21, the second back plate 52 may be disposed at a position corresponding to at least the second wiring segment 23, that is, the first back plate 51 is at least used for supporting the display function portion 10 and the first wiring segment 21, and the second back plate 52 is at least used for supporting the second wiring segment 23.

Obviously, the length of the spacing segment 53 is less than or equal to the length of the meander wiring segment 22, and when the length of the spacing segment 53 is equal to the length of the meander wiring segment 22, the position of the spacing segment 53 completely corresponds to the position of the meander wiring segment 22, that is, the first back plate 51 and the second back plate 52 do not extend below the meander wiring segment 22, and the first back plate 51 and the second back plate 52 are just used for supporting the display function portion 10, the first wiring segment 21, and the second wiring segment 23.

When the length of the spacing segment 53 is smaller than the length of the bending wiring segment 22, it can be understood that both the first back plate 51 and the second back plate 52 partially extend to the lower side of the bending wiring segment 22, and at this time, the first back plate 51 and the second back plate 52 not only support the display function portion 10, the first wiring segment 21 and the second wiring segment 23, but also can support the bending wiring segment 22 to a certain extent during bending, so that the stress borne by the whole of the first adhesive segment 41 and the second adhesive segment 42 can be reduced, in particular, the stress to be released by the second adhesive segment 42 can be reduced, and the excessive deformation caused by the excessive stress to be released by the second adhesive segment 42 can be avoided; specifically, the lengths of the first back plate 51 and the second back plate 52 extending to the lower portion of the meander wiring segment 22 may be less than or equal to 20% of the overall length of the meander wiring segment 22, and the lengths of the first back plate 51 and the second back plate 52 extending to the lower portion of the meander wiring segment 22 may be equal, so that the support of the meander wiring segment 22 is maximally achieved without affecting the bending of the meander wiring segment 22.

In addition, when the bending wiring portion 20 bends at the position of the bending wiring section 22, the second wiring section 23 and the second back plate 52 are driven, so that the second back plate 52 bends to a position opposite to the first back plate 51 along with the bent bending wiring section 22, wherein, referring to fig. 8, a foam layer 70, a rigid substrate 80 and a reinforcing plate 90 are further disposed between the first back plate 51 and the second back plate 52, and a Flexible Printed Circuit 60 (FPC) is further disposed on the second wiring section 23.

In an embodiment, referring to fig. 4, the display function portion 10 at least includes a bending display section 11, and an elastic modulus of the second adhesive section 42 is less than or equal to 60% of an elastic modulus of the first adhesive section 41; it can be understood that the display functional portion 10 at least includes a bending display section 11, the display functional portion 10 can be dynamically bent at the position of the bending display section 11, that is, the display module is a flexible display module having a flexible display function such as bending, and in the dynamic bending process of the flexible display module, because the bending amplitude of the display module is large, a large dislocation can be generated in a membrane structure such as a polarizer in the flexible display module, so that the local stress at the joint position between the membrane structure such as the polarizer and the protective adhesive is too large, and the stress on the protective adhesive can change continuously along with the dynamic bending of the flexible display module, so that the stress can not be released effectively due to the long-term existence of the stress, and the device performance and the service life of the flexible display module are affected; in this embodiment, the elastic modulus of the second rubber section 42 is less than or equal to 60% of the elastic modulus of the first rubber section 41, and compared to pad bonding, when the display functional portion 10 is dynamically bent at the position of the bent display segment 11, a greater stress is generated at the interface between the functional film 30 and the second adhesive segment 42, therefore, it is desirable that the difference between the modulus of elasticity of the second glue segment 42 and the modulus of elasticity of the first glue segment 41 is greater, so that the second adhesive segment 42 can better release the stress generated by bending the display module at any position, and obviously, when the elastic modulus of the first adhesive segment 41 is constant, the elastic modulus of the second adhesive segment 42 can be further reduced, specifically, the elastic modulus of the first adhesive segment 41 is 500Mpa, and the elastic modulus of the second adhesive segment 42 is less than or equal to 300 Mpa.

It should be noted that the functional film 30 is disposed on the display panel and at least covers the display area 100, that is, the functional film 30 may overlap with the display area 100, or may extend from the display area 100 to the non-display area 200, obviously, in the bending process of the display functional portion 10, in order to prevent the functional film 30 from not completely covering the display area 100 due to misalignment and affecting the normal display of the display module, in the embodiment of the present application, the functional film 30 may completely cover the display area 100 and extend from the display area 100 to the non-display area 200, in addition, the display functional portion 10 may be bent, folded or curled specifically at the position of the bent display section 11, which is not described herein again, and in addition, in order to facilitate the dynamic bending of the display functional portion 10, the first backplane 51 may be a bendable flexible backplane, specifically, the material of the first back plate 51 may be a flexible material such as polyimide. The embodiment of the present application further provides a method for manufacturing a display module, please refer to fig. 5, which includes the following steps:

s100: providing a display panel, wherein the display panel comprises a display area 100 and a non-display area 200 adjacent to the display area 100, and the display panel comprises a display function part 10 formed in the display area 100 and a bent wiring part 20 formed in the non-display area 200;

s200: forming a functional film layer 30 on the display panel;

s300: forming a sealant layer 40 on the display panel in the non-display area 200, wherein the sealant layer 40 includes a first sealant segment 41 spaced apart from the functional film layer 30 and a second sealant segment 42 filled between the first sealant segment 41 and the functional film layer 30, and an elastic modulus of the second sealant segment 42 is smaller than an elastic modulus of the first sealant segment 41.

In the process of forming the sealant layer 40 on the display panel in the non-display area 200, the first adhesive segment 41 and the second adhesive segment 42 in the sealant layer 40 may be integrally formed by using the same process, or the first adhesive segment 41 and the second adhesive segment 42 may be manufactured in a segmented manner, and the elastic modulus of the second adhesive segment 42 formed by the process is smaller than that of the first adhesive segment 41, so that in the process of bending the wiring portion 20, the second adhesive segment 42 bonded to the functional film 30 has better ductility than the first adhesive segment 41, and thus in the process of bending the wiring portion 20, stress generated at a boundary with the second adhesive segment 42 due to larger dislocation generated by the functional film 30 can be well released. In an embodiment, referring to fig. 6a to 6e, the step of forming the sealant layer 40 in the non-display area 200 on the display panel includes:

forming a photosensitive adhesive layer 401 in the non-display region 200 and in contact with the functional film layer 30 on the display panel;

adopt a light curing step to make photosensitive adhesive layer 401 solidification forms sealant layer 40, wherein, photosensitive adhesive layer 401 include with function rete 30 interval sets up first sub-gluey 4011 with be located first sub-gluey 4011 with second sub-gluey 4012 between the function rete 30, the time that second sub-gluey 4012 accepted illumination is less than first sub-gluey 4011 accepts illumination's time, so that the elastic modulus of the second gluey section 42 that the solidification of second sub-gluey 4012 formed is less than the elastic modulus of the first gluey section 41 that the solidification of first sub-gluey 4011 formed.

Adopting a light curing step to cure the photosensitive adhesive layer 401 to form the sealant layer 40, that is, integrally forming the first adhesive segment 41 and the second adhesive segment 42 in the sealant layer 40 in the same process, obviously, in order to ensure that the elastic modulus of the second adhesive segment 42 is smaller than that of the first adhesive segment 41, in the light curing process, the time that the second sub-adhesive 4012 receives light is adjusted to be smaller than that of the first sub-adhesive 4011, so that the energy that the second sub-adhesive 4012 receives light curing is smaller than that of the first sub-adhesive 4011, thereby completely curing the first sub-adhesive 4011 that is used for manufacturing the first adhesive segment 41, and semi-curing the second sub-adhesive 4012 that is used for manufacturing the second adhesive segment 42, specifically, in one curing period that the first adhesive segment 41 and the second adhesive segment 42 are cured by light, and shielding the second sub-paste 4012 by using a mask in a partial period of the curing cycle.

In an embodiment, referring to fig. 7a to 7e, the step of forming the sealant layer 40 in the non-display area 200 on the display panel includes:

forming a first photosensitive adhesive layer 4021 which is positioned in the non-display area 200 and is arranged at an interval with the functional film layer 30 on the display panel, and curing the first photosensitive adhesive layer 4021 by adopting a first curing step to form a first adhesive section 41;

a second photosensitive adhesive layer 4022 which is located in the non-display area 200 and filled between the first adhesive segment 41 and the functional film layer 30 is formed on the display panel, and a second curing step is adopted to cure the second photosensitive adhesive layer 4022 to form a second adhesive segment 42, so as to form a sealant layer 40 including the first adhesive segment 41 and the second adhesive segment 42, wherein the ratio of the curing agent in the second photosensitive adhesive layer 4022 is greater than that of the curing agent in the first photosensitive adhesive layer 4021.

The proportion of the curing agent in the second photosensitive adhesive layer 4022 is greater than that of the curing agent in the first photosensitive adhesive layer 4021, that is, the elastic modulus of the second adhesive segment 42 formed after curing is smaller than that of the first adhesive segment 41, the first curing step is respectively adopted to cure the first photosensitive adhesive layer 4021 to form the first adhesive segment 41, and the second curing step is adopted to cure the second photosensitive adhesive layer 4022 to form the second adhesive segment 42, that is, the first adhesive segment 41 and the second adhesive segment 42 in the sealant layer 40 are manufactured in a segmented manner,

specifically, the first curing step and the second curing step may be ultraviolet light irradiation curing or heating curing.

An embodiment of the present application further provides a display device, please refer to fig. 8, where the display device includes the display module according to the foregoing embodiment.

This application is through will set up in wiring portion 20 is buckled last sealing glue layer 40 divides into first gluey section 41 and the gluey section 42 of second, and make with the elastic modulus that the section 42 is glued to the second that function rete 30 bonded is less than with function rete 30 interval sets up first gluey section 41's elastic modulus, make with the section 42 is glued to the second that function rete 30 bonded is compared and is possessed better ductility in first gluey section 41 to at the in-process that wiring portion 20 buckled of buckling, the stress that the section 42 juncture produced is glued to release function rete 30 and second that can be fine.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.