阅读说明：本技术 一种阻抗匹配靶制造方法 (Method for manufacturing impedance matching target ) 是由 谢军 杜凯 高莎莎 郑凤成 易泰民 蒋柏斌 王红莲 何智兵 张海军 杨洪 魏胜 于 2020-06-18 设计创作，主要内容包括：一种阻抗匹配靶制造方法,采用单点金刚石车削技术加工标准材料台阶,采用机械研磨技术分别通过双面研磨、单面研磨、手工研磨加工待测材料薄膜,通过聚乙烯醇溶液将待测材料薄膜与标准材料台阶装配成阻抗匹配靶。本方法分别采用固态块材加工成标准材料与待测材料样品,可确保加工前后材料纯度、密度不变,满足阻抗匹配实验用靶材料尽可能为纯净密实材料的需求,降低材料密度、纯度变化造成的物理实验结果不确定度的增加,通过聚乙烯醇溶液将标准材料/待测材料样品粘接在一起,可满足标注材料与待测材料之间的力学平衡条件和界面连续条件。(A method for manufacturing an impedance matching target comprises the steps of processing standard material steps by adopting a single-point diamond turning technology, processing a thin film of a material to be detected by adopting a mechanical grinding technology through double-sided grinding, single-sided grinding and manual grinding respectively, and assembling the thin film of the material to be detected and the standard material steps into the impedance matching target through a polyvinyl alcohol solution. The method adopts solid block materials to process the standard material and the material sample to be detected respectively, can ensure that the purity and the density of the material are unchanged before and after processing, meet the requirement that a target material for an impedance matching experiment is a pure compact material as far as possible, reduce the increase of uncertainty of a physical experiment result caused by the change of the density and the purity of the material, bond the standard material/the material sample to be detected together through a polyvinyl alcohol solution, and can meet the mechanical balance condition and the interface continuous condition between a labeling material and the material to be detected.)

1. A method for manufacturing an impedance matching target is characterized by comprising the following steps:

(1) preparing a standard material step;

(2) preparing a material film to be detected:

(2.1) feeding and discharging materials from the raw material of the material to be detected to obtain a sheet material of the material to be detected;

(2.2) grinding the material sheet to be detected into a material film to be detected with a first thickness by a double-sided grinding and polishing technology;

(2.3) bonding the material film to be detected on a grinding block by adopting instant quick-drying glue, and grinding the material film to be detected to have a second thickness by adopting a single-side grinding technology;

(2.4) removing the instant quick-drying adhesive on the surface of the thin film of the material to be detected;

(2.5) placing the material film to be detected on the surface of the superfine abrasive paper, pressing the material film to be detected through a rubber block, manually polishing, and monitoring the thickness of the film by adopting a white light interferometer until the thickness meets the requirement of an impedance matching target to obtain the required material film to be detected;

(3) and (3) adhering the thin film of the material to be tested obtained in the step (2.5) to the step of the standard material obtained in the step (1) through a polyvinyl alcohol solution, so as to obtain the impedance matching target.

2. The method for manufacturing the impedance matching target as claimed in claim 1, wherein the step (1) is specifically performed by loading and unloading the standard material raw material in a linear cutting manner, and processing the standard material step sample by a single-point diamond turning technology.

3. The method as claimed in claim 2, wherein the step (2) is performed by feeding and discharging the material to be tested from the material to be tested in a wire cutting manner to obtain a sheet of the material to be tested.

4. The method according to claim 3, wherein in the steps (1) and (2), the purity of the standard material and the purity of the material to be tested are both greater than or equal to 99.99%.

5. The method of claim 1, wherein in step (1), the step sample of the standard material has a surface roughness less than Rq50 nm.

6. The method of claim 1, wherein in step (2.2), the first thickness is approximately 100 μm.

7. The method of claim 1, wherein in step (2.3), the second thickness is approximately 20 μm.

8. The method for manufacturing an impedance matching target according to claim 1, wherein in the step (3), the concentration of the polyvinyl alcohol solution is 2% to 10%.

Technical Field

The invention belongs to the field of inertial confinement fusion target preparation, and particularly relates to a method for manufacturing an impedance matching target.

Background

The impedance matching method is one of the common methods for experimental research of material shock wave. The impedance matching method is to determine the impact compression state in the material sample to be tested by measuring the particle velocity or shock wave velocity in the standard material and according to the mechanical balance condition (equal pressure) and the interface continuous condition (equal particle velocity) at the two sides of the interface between the standard material and the material to be tested, so that the films are required to be tightly connected and the interface is seamless. In order to reduce the uncertainty of the physical experimental results caused by the experimental target, the experimental target material is a pure compact material as far as possible, i.e. a solid material with a perfect stoichiometric ratio and a density equal to or very close to the crystal density, so as to reduce the influence of the material density error on the uncertainty of the experimental results. The thickness of the target for physical experiments is generally only a few micrometers to a few tens of micrometers due to the limitation of the laser energy of the driver. The impedance matching target quasi material is generally a step sample, and the material to be detected is a film sample. Document (1) (xi Jun, Wu Weidong, Du Kai, et Al, research on Al/Cu impedance matching target preparation process, intense laser and particle beam, 17(9), 2005: 1356-1358) reports that Al/Cu impedance matching target is prepared by vacuum diffusion bonding technique using rolling state standard material and Cu thin film; document (2) (leaf junjian, bin, hezuhua, etc., impedance matching target preparation and target parameter precision measurement, atomic energy science and technology, 42(9), 2008:825-828) reports that assembly forming of an Al/Cu impedance matching target is realized by using rolled Al and Cu films and using liquid materials such as kerosene. However, in the document (1), a metal thin film is adopted, and by a diffusion bonding technology, since film bonding is achieved at high temperature and high pressure, intermetallic compounds are often formed, or diffusion interlayers are considered to be introduced between metals by a method such as magnetron sputtering in order to reduce bonding conditions, and the interlayers can cause adverse effects on physical experiment results; in the document (2), since the liquid such as kerosene is used for bonding, delamination between the metal films may occur after the liquid is volatilized as the standing time of the test target becomes longer. Moreover, some metal materials to be tested cannot be prepared by rolling, conventional machining or physical vapor deposition methods due to the limitations of material properties, processing conditions and the like.

Disclosure of Invention

In view of the above scientific research needs and the current production situation, the present invention aims to provide a method for manufacturing an impedance matching target, which ensures seamless connection between a step sample of a standard material and a thin film of a material to be measured, and ensures that the density of the standard material and the density of the material to be measured are close to the theoretical density of the material.

In order to achieve the above object, a method for manufacturing an impedance matching target according to the present invention comprises the steps of:

a method for manufacturing an impedance matching target is characterized by comprising the following steps:

(1) preparing a standard material step;

(2) preparing a material film to be detected:

(2.1) feeding and discharging materials from the raw material of the material to be detected to obtain a sheet material of the material to be detected;

(2.2) grinding the material sheet to be detected into a material film to be detected with a first thickness by a double-sided grinding and polishing technology;

(2.3) bonding the material film to be detected on a grinding block by adopting instant quick-drying glue, and grinding the material film to be detected to have a second thickness by adopting a single-side grinding technology;

(2.4) removing the instant quick-drying adhesive on the surface of the thin film of the material to be detected;

(2.5) placing the material film to be detected on the surface of the superfine abrasive paper, pressing the material film to be detected through a rubber block, manually polishing, and monitoring the thickness of the film by adopting a white light interferometer until the thickness meets the requirement of an impedance matching target to obtain the required material film to be detected;

(3) and (3) adhering the thin film of the material to be tested obtained in the step (2.5) to the step of the standard material obtained in the step (1) through a polyvinyl alcohol solution, so as to obtain the impedance matching target.

Further, the step (1) is specifically that a standard material step sample is prepared by loading and unloading from a standard material raw material in a linear cutting mode and processing by adopting a single-point diamond turning technology.

Further, the step (2) is specifically to adopt a linear cutting mode to feed and discharge the raw material of the material to be detected to obtain the sheet material of the material to be detected.

Further, in the step (1) and the step (2), the purities of the standard material raw material and the material raw material to be detected are both more than or equal to 99.99%.

Further, in the step (1), the surface roughness of the standard material step sample is less than Rq50 nm.

Further, in the step (2.2), the first thickness is approximately 100 μm.

Further, in the step (2.3), the second thickness is approximately 20 μm.

Further, in the step (3), the concentration of the polyvinyl alcohol solution is 2-10%.

The method has the advantages that: the method adopts solid block materials to process the standard material and the material sample to be tested respectively, can ensure that the purity and the density of the material are unchanged before and after processing, meet the requirement that a target material for an impedance matching experiment is a pure compact material, reduce the increment of uncertainty of a physical experiment result caused by the change of the density and the purity of the material, bond the standard material and the material sample to be tested together by polyvinyl alcohol solution and applying certain pressure, can meet the requirement that the standard material and the material to be tested are connected in a seamless and non-intermediate metal transition layer, and meet the mechanical balance condition and the interface continuous condition required by the impedance matching experiment.

Drawings

FIG. 1 is a schematic diagram of an impedance matching target according to the present invention;

in the figure, 1 is a standard material step 2 and a material film is measured.

Detailed Description

The invention is further illustrated with reference to the following figures and examples.

A method for manufacturing an impedance matching target is characterized by comprising the following steps:

(1) preparing a standard material step 1;

(2) preparing a material film to be detected 2:

(2.1) feeding and discharging materials from the raw material of the material to be detected to obtain a sheet material of the material to be detected;

(2.2) grinding the material sheet to be detected into a material film to be detected with a first thickness by a double-sided grinding and polishing technology;

(2.3) bonding the material film to be detected on a grinding block by adopting instant quick-drying glue, and grinding the material film to be detected to have a second thickness by adopting a single-side grinding technology;

(2.4) removing the instant quick-drying adhesive on the surface of the thin film of the material to be detected;

(2.5) placing the material film to be detected on the surface of the superfine abrasive paper, pressing the material film to be detected through a rubber block, manually polishing, and monitoring the thickness of the film by adopting a white light interferometer until the thickness meets the requirement of an impedance matching target to obtain the required material film to be detected;

(3) and (3) bonding the material film 2 to be tested obtained in the step (2.5) to the standard material step 1 obtained in the step (1) by using a polyvinyl alcohol solution and applying a certain pressure, so as to obtain the impedance matching target shown in the figure (1). The method comprises the steps of measuring parameters such as the thickness and the surface roughness of an impedance matching target after bonding through a white light interferometer, detecting the thickness of a step of a standard material and the thickness of a thin film of a material to be tested after bonding, judging whether the material to be tested is tightly attached to the standard material or not by comparing the thickness measured values before and after bonding, and if the deviation of the measured values before and after bonding is smaller or consistent, tightly connecting the step of the standard material and the thin film of the material to be tested.

The invention meets the mechanical balance condition and interface continuous condition required by the impedance matching experiment by the seamless and non-intermediate metal transition layer tight connection between the standard material aluminum and the material iron to be measured.

Further, the step (1) is specifically that a linear cutting mode is adopted to load and unload materials from a standard material raw material, a single-point diamond turning technology is adopted to process and prepare a standard material step sample, and the step thickness is detected through a white light interferometer.

Further, the step (2) is specifically to adopt a linear cutting mode to feed and discharge the raw material of the material to be detected to obtain the sheet material of the material to be detected.

Further, in the step (1) and the step (2), the purities of the standard material raw material and the material raw material to be detected are both more than or equal to 99.99%.

Further, in the step (1), the surface roughness of the step 1 of the standard material is less than Rq50 nm.

Further, in the step (2.2), the first thickness is approximately 100 μm.

Further, in the step (2.3), the second thickness is approximately 20 μm.

Further, in the step (3), the concentration of the polyvinyl alcohol solution is 2-10%.

The impedance matching target manufacturing method of the invention respectively adopts the solid block material to process the standard material and the material sample to be tested, can ensure that the purity and the density of the material are not changed before and after processing, meet the requirement that the target material for the impedance matching experiment is as pure and compact as possible, reduce the uncertainty increase of the physical experiment result caused by the change of the density and the purity of the material, bond the standard material/the material sample to be tested together through the polyvinyl alcohol solution, and can meet the mechanical balance condition and the interface continuous condition between the labeling material and the material to be tested.