阅读说明：本技术 电路板及其焊接工艺、电路板组件 (Circuit board, welding process thereof and circuit board assembly ) 是由 赵波 熊友军 于 2020-05-27 设计创作，主要内容包括：本申请适用于散热技术领域,提供一种电路板及其焊接工艺、电路板组件,包括介质板及设于介质板上的焊盘,焊盘上开设有散热通孔,散热通孔贯穿介质板和焊盘,散热通孔的内周壁铺设有第一导热层,散热通孔内填充有隔绝体,第一导热层与隔绝体的外周壁相抵紧。通过设置同时贯穿介质板和焊盘的散热通孔,散热通孔的内周壁铺设有第一导热层,散热通孔内部填充有隔绝体,当电子器件焊接于焊盘上时,隔绝体可阻挡焊锡流动至散热通孔内,避免焊接时焊锡分布不均匀的情况,保证电子器件的回流焊接工艺；另外,电子器件和焊盘焊接时产生的热量可通过第一导热层传导至介质板背离焊盘的一面,从而能够实现回流焊接时焊盘和电子器件的有效散热。(The utility model is suitable for a heat dissipation technical field provides a circuit board and welding process, circuit board assembly thereof, includes the medium-plate and locates the pad on the medium-plate, has seted up the heat dissipation through-hole on the pad, and the heat dissipation through-hole runs through medium-plate and pad, and first heat-conducting layer has been laid to the internal perisporium of heat dissipation through-hole, and the heat dissipation through-hole intussuseption is filled with the insulator, and first heat-conducting layer offsets tightly with the periphery wall of insulator. The first heat conduction layer is laid on the inner peripheral wall of the heat dissipation through hole, and the insulation body is filled in the heat dissipation through hole; in addition, the heat that produces when electronic device and pad weld can conduct to the one side that the dielectric plate deviates from the pad through first heat-conducting layer to pad and electronic device's effective heat dissipation when can realizing reflow soldering.)

1. The utility model provides a circuit board, its characterized in that includes the dielectric plate and locates pad on the dielectric plate, the last heat dissipation through-hole of having seted up of dielectric plate, the heat dissipation through-hole runs through the dielectric plate with the pad, first heat-conducting layer has been laid to the internal perisporium of heat dissipation through-hole, the heat dissipation through-hole intussuseption is filled with the insulator, first heat-conducting layer with the periphery wall of insulator offsets tightly.

2. The circuit board of claim 1, wherein a second thermally conductive layer is disposed on a side of the dielectric board facing away from the pads, the second thermally conductive layer being connected to the first thermally conductive layer.

3. The circuit board of claim 1, wherein the circuit board comprises at least two layers of the dielectric boards, the bonding pads are disposed on one of the dielectric boards, the heat dissipation through holes penetrate through at least two layers of the dielectric boards, and a third heat conduction layer is disposed between at least two adjacent dielectric boards.

4. The circuit board of claim 3, wherein the third thermally conductive layer is connected to the first thermally conductive layer; alternatively, the third heat conducting layer is spaced apart from the first heat conducting layer.

5. The circuit board of claim 1, wherein the insulator comprises a first insulating portion filled in the heat dissipation through hole and a second insulating portion protruding from one end of the first insulating portion, and an edge of the second insulating portion is attached to the pad.

6. The circuit board of claim 5, wherein the insulator further comprises a third insulator protruding from the other end of the first insulator, and an edge of the third insulator is attached to the dielectric plate.

7. The circuit board of any one of claims 1-6, wherein the dielectric board has a plurality of the heat dissipating through holes, and the plurality of the heat dissipating through holes are distributed at equal intervals.

8. The circuit board of any one of claims 1-6, wherein the diameter range of the heat dissipating through-hole is: 0.2 mm-0.3 mm, and the center distance between two adjacent heat dissipation through holes is 4 times-6 times of the diameter of the heat dissipation through hole.

9. A circuit board assembly comprising an electronic device and further comprising the circuit board of any one of claims 1-8, the electronic device being soldered to the solder pads.

10. A soldering process for a circuit board, applied to the circuit board according to any one of claims 1 to 8, comprising the steps of:

the method comprises the following steps of forming a heat dissipation through hole in a medium plate so that the heat dissipation through hole penetrates through the medium plate and a bonding pad arranged on the medium plate, and laying a first heat conduction layer on the inner peripheral wall of the heat dissipation through hole;

filling an insulator in the heat dissipation through hole;

and coating soldering tin on the bonding pad, and soldering the electronic device on the bonding pad by adopting reflow soldering.

Technical Field

The application belongs to the technical field of heat dissipation, and particularly relates to a circuit board, a welding process of the circuit board and a circuit board assembly.

Background

Electronic devices are generally soldered on a circuit board by means of reflow soldering, and the temperature of the electronic devices and the circuit board during soldering is rapidly increased to affect the use performance of the electronic devices and the circuit board.

The soldering tin used by the electronic device and the circuit board during welding forms liquid under the high-temperature condition, and easily flows into the through hole to cause uneven distribution of the soldering tin, so that the phenomena of insufficient soldering and welding deviation of the electronic device occur, and the welding strength of the electronic device and the circuit board is influenced.

Disclosure of Invention

One of the purposes of the embodiment of the application is as follows: the utility model provides a circuit board, aims at solving among the prior art, sets up the through-hole on the circuit board and leads to electronic component to appear rosin joint, welding off normal technical problem.

In order to solve the technical problem, the embodiment of the application adopts the following technical scheme:

the utility model provides a circuit board, includes the dielectric-slab and locates pad on the dielectric-slab, the last heat dissipation through-hole of having seted up of dielectric-slab, the heat dissipation through-hole runs through the dielectric-slab with the pad, first heat-conducting layer has been laid to the internal perisporium of heat dissipation through-hole, the heat dissipation through-hole intussuseption is filled with the insulator, first heat-conducting layer with the periphery wall of insulator offsets tightly.

In one embodiment, a second heat conduction layer is laid on one side, away from the bonding pad, of the medium plate, and the second heat conduction layer is connected to the first heat conduction layer.

In one embodiment, the circuit board includes at least two layers of the dielectric boards, the bonding pads are disposed on one of the dielectric boards, the heat dissipation through holes penetrate through at least two layers of the dielectric boards, and a third heat conduction layer is laid between at least two adjacent dielectric boards.

In one embodiment, the third heat conducting layer is connected to the first heat conducting layer; alternatively, the third heat conducting layer is spaced apart from the first heat conducting layer.

In one embodiment, the insulator includes a first insulating portion filled in the heat dissipation through hole and a second insulating portion protruding from one end of the first insulating portion, and an edge of the second insulating portion is attached to the pad.

In one embodiment, the insulator further includes a third insulating portion protruding from the other end of the first insulating portion, and an edge of the third insulating portion is attached to the dielectric plate.

In one embodiment, a plurality of the heat dissipation through holes are formed in the dielectric plate, and the heat dissipation through holes are distributed at equal intervals.

In one embodiment, the diameter range of the heat dissipation through hole is: 0.2 mm-0.3 mm, and the central distance range of two adjacent heat dissipation through holes is 4 times-6 times of the diameter of the heat dissipation through hole.

The application provides a circuit board's beneficial effect lies in: compared with the prior art, the heat dissipation through hole is formed in the medium plate, the heat dissipation through hole penetrates through the medium plate and the bonding pad at the same time, the first heat conduction layer is laid on the inner peripheral wall of the heat dissipation through hole, the first heat conduction layer also penetrates through the bonding pad and the medium plate, and the heat dissipation through hole is filled with the insulator; in addition, the heat that produces when electronic device and pad weld can conduct to the one side that the dielectric plate deviates from the pad through first heat-conducting layer to pad and electronic device's effective heat dissipation when can realizing reflow soldering.

The application also provides a circuit board assembly, which comprises an electronic device and the circuit board of any one of the above parts, wherein the electronic device is welded on the welding disc.

The application provides a circuit board assembly, through setting up heat dissipation through-hole, first heat-conducting layer and insulator, when electronic device adopted backflow welding's mode to weld on the pad, the insulator can block soldering tin when backflow welding and flow to in the heat dissipation through-hole, and the condition that soldering tin distributes inhomogeneously and leads to electronic device rosin joint or welding off normal when avoiding welding guarantees electronic device's backward flow welding technology. In addition, the heat that produces when electronic device and pad weld can conduct to the one side that the dielectric plate deviates from the pad through first heat-conducting layer to pad and electronic device's effective heat dissipation when can realizing reflow soldering.

The application also provides a welding process of the circuit board, which is applied to the circuit board, and comprises the following steps:

the method comprises the following steps of forming a heat dissipation through hole in a medium plate so that the heat dissipation through hole penetrates through the medium plate and a bonding pad arranged on the medium plate, and laying a first heat conduction layer on the inner peripheral wall of the heat dissipation through hole;

filling an insulator in the heat dissipation through hole;

and coating soldering tin on the bonding pad, and soldering the electronic device on the bonding pad by adopting reflow soldering.

According to the welding process of the circuit board, the heat dissipation through holes penetrating through the dielectric plate and the bonding pad are arranged, the first heat conduction layer is laid on the inner peripheral wall of each heat dissipation through hole before the bonding pad and the electronic device are subjected to reflow welding, and the insulation bodies are filled in the heat dissipation through holes, so that soldering tin during reflow welding is blocked by the insulation bodies and cannot flow into the heat dissipation through holes, the condition that the soldering tin is unevenly distributed during welding is avoided, and the reflow welding process of the electronic device is guaranteed; in addition, the heat that produces during reflow soldering can conduct the one side that deviates from the pad to the medium plate through first heat-conducting layer to guarantee the effective heat dissipation of pad and electron device.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a top view of a circuit board provided in an embodiment of the present application;

fig. 2 is a cross-sectional view of a circuit board provided in an embodiment of the present application after an electronic device is soldered to the circuit board;

FIG. 3 is an alternative cross-sectional view I of a circuit board after electronic components are soldered to the circuit board according to an embodiment of the present application;

fig. 4 is an alternative sectional view two of the circuit board after electronic devices are soldered thereto according to an embodiment of the present application;

fig. 5 is an alternative cross-sectional view three of the circuit board after electronic devices are soldered thereto according to an embodiment of the present application;

fig. 6 is a cross-sectional view of an insulator of a circuit board according to an embodiment of the present disclosure;

fig. 7 is a flowchart of a soldering process for a circuit board according to an embodiment of the present disclosure.

Wherein, in the figures, the respective reference numerals:

1-a dielectric plate; 2-a pad; 3-heat dissipation through holes; 4-heat conducting layer group; 41-first thermally conductive layer; 42-a second thermally conductive layer; 43-third thermally conductive layer; 431-first type thermally conductive layer; 432 — a second type of thermally conductive layer; 5-insulator/solder resist ink; 51-a first barrier; 52-second barrier; 53-third barrier; 6-soldering tin; 7-electronic device.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In order to explain the technical solutions described in the present application, the circuit board provided in the embodiments of the present application is described in detail below with reference to specific drawings and embodiments.

Referring to fig. 1 and fig. 2 together, a circuit board according to an embodiment of the present invention includes a dielectric board 1, a bonding pad 2, a thermal conductive layer group 4, and an insulator 5.

Specifically, the pads 2 are provided on one side of the dielectric board 1, and the pads 2 are capable of soldering the electronic components 7 by the solder 6. The medium plate 1 and the bonding pad 2 are both provided with heat dissipation through holes 3, and the heat dissipation through holes 3 penetrate through the medium plate 1 and the bonding pad 2 simultaneously. The heat dissipation through hole 3 is filled with the insulator 5, and the insulator 5 is filled with the heat dissipation through hole 3 to seal the heat dissipation through hole 3. The heat conduction layer group 4 is arranged on the medium plate 1 and is mainly used for conducting heat generated when the electronic device 7 is welded to the outside, the heat conduction layer group 4 comprises a first heat conduction layer 41, the first heat conduction layer 41 is laid on the inner peripheral wall of the heat dissipation through hole 3, namely the first heat conduction layer 41 is respectively arranged on the inner peripheral walls of the medium plate 1 and the bonding pad 2 and penetrates through the whole heat dissipation through hole 3. The peripheral wall of the insulator 5 filled in the heat dissipation through hole 3 is abutted against the first heat conduction layer 41, so that the effect of the insulator 5 for blocking the solder 6 can be improved.

In this embodiment, the circuit board is mainly used for reflow soldering, but is not limited thereto. During operation, the heat dissipation through hole 3 laid with the first heat conduction layer 41 is filled with the insulator 5, that is, the heat dissipation through hole 3 is blocked, the soldering tin 6 is coated on the pad 2, and then reflow soldering is performed to solder the electronic device 7 on the pad 2. During reflow soldering, the soldering tin 6 coated on the pad 2 is in a flowing state due to the high-temperature effect, and the insulator 5 can prevent the soldering tin 6 from flowing into the heat dissipation through hole 3, so that the phenomenon that the soldering tin 6 is not uniformly distributed is avoided. Meanwhile, heat generated during reflow soldering is conducted to the surface, away from the bonding pads 2, of the dielectric board 1 along the first heat conduction layer 41 and conducted to the outside, so that heat dissipation of the electronic device 7 is achieved.

In the embodiment of the application, the heat dissipation through hole 3 is formed in the dielectric plate 1, the heat dissipation through hole 3 simultaneously penetrates through the dielectric plate 1 and the pad 2, the first heat conduction layer 41 is laid on the inner peripheral wall of the heat dissipation through hole 3, the first heat conduction layer 41 also penetrates through the pad 2 and the dielectric plate 1, and the insulator 5 is filled in the heat dissipation through hole 3, when the electronic device 7 is welded on the pad 2 in a reflow welding mode, the insulator 5 can prevent the soldering tin 6 in reflow welding from flowing into the heat dissipation through hole 3, the condition that the electronic device 7 is in a false welding or welding deviation due to uneven distribution of the soldering tin 6 in welding is avoided, the processing problem in welding the electronic device 7 and the pad 2 is reduced, and the reflow welding process of the electronic device 7 is ensured; in addition, heat generated when the electronic device 7 and the pad 2 are soldered can be conducted to the surface of the dielectric board 1 away from the pad 2 through the first heat conduction layer 41, so that effective heat dissipation of the pad 2 and the electronic device 7 can be realized during reflow soldering. Therefore, the arrangement of the first heat conduction layer 41 and the insulator 5 can ensure the reflow soldering effect between the electronic device 7 and the pad 2 while achieving effective heat dissipation of the electronic device 7.

Specifically, in the present embodiment, the first heat conduction layer 41 is a metal plating layer plated on the inner peripheral wall of the heat dissipation through hole 3, and the metal plating layer preferably adopts a copper foil, which can better realize heat conduction, although the material is not limited herein.

More specifically, in the embodiment, the structure that the first heat conduction layer 41 and the pad 2 are integrally connected can simplify the process of laying the first heat conduction layer 41 in the heat dissipation hole, and simultaneously facilitate the direct conduction of heat on the electronic device 7 or the pad 2 to the first heat conduction layer 41, thereby improving the heat dissipation effect on the pad 2.

In one embodiment, the insulator 5 is configured as solder resist ink 5, and the solder resist ink 5 filled in the heat dissipation through hole 3 can effectively block the solder 6, so that compared with the insulator 5 made of other materials, the cost of the solder resist ink 5 itself is lower, and the process of filling the solder resist ink in the heat dissipation through hole 3 is also very simple. In addition, because solder resist ink 5 is filled in the heat dissipation through hole 3, then solder resist ink 5 can be abutted against the electronic device 7, and during reflow soldering, the solder resist ink 5 cannot be welded with the electronic device 7, so that the phenomenon that soldering tin 6 can flow into the heat dissipation through hole 3 due to deformation of the insulator 5 after welding can be avoided, that is, the phenomenon that the soldering tin 6 is not uniformly distributed is also avoided, the effect that the insulator 5 blocks the soldering tin 6 can be further improved, and the reflow soldering of the electronic device 7 is ensured. Further, the insulator 5 may be provided with a resin material or the like, and is not limited to this.

In one embodiment, referring to fig. 2, the heat conducting layer group 4 further includes a second heat conducting layer 42, the second heat conducting layer 42 is disposed on a side of the dielectric board 1 away from the bonding pad 2, that is, the bonding pad 2 and the second heat conducting layer 42 are respectively disposed on two opposite sides of the dielectric board 1, the second heat conducting layer 42 is exposed to the outside and can be in contact with the air, and the second heat conducting layer 42 is connected to the first heat conducting layer 41 and disposed away from the heat dissipating through holes 3. The heat generated during reflow soldering is conducted to the second heat conduction layer 42 through the first heat conduction layer 41, and the second heat conduction layer 42 can directly dissipate the heat to the air, so that the heat dissipation during reflow soldering of the electronic component is realized.

In particular, in one embodiment, the second thermally conductive layer 42 is provided as a copper foil, which is better able to conduct heat, although the material is not limited thereto. The second heat conduction layer 42 and the first heat conduction layer 41 are of an integral connection structure, so that the process of arranging the first heat conduction layer 41 and the second heat conduction layer 42 on the medium plate 1 can be simplified, and the heat dissipation effect can be improved due to the integral structure.

In one embodiment, referring to fig. 2, the circuit board includes at least two dielectric boards 1, the two dielectric boards 1 are opposite and stacked, the bonding pad 2 is disposed on one of the dielectric boards 1 and can contact the outside, and the heat dissipation through hole 3 penetrates through the bonding pad 2 and all the dielectric boards 1. The heat conducting layer group 4 further comprises a third heat conducting layer 43, the third heat conducting layer 43 is laid between at least one adjacent two layers of dielectric plates 1, the third heat conducting layer 43 is arranged to avoid the heat dissipation through holes 3, and heat of the electronic device 7 can be partially conducted to the outside through the third heat conducting layer 43 during reflow soldering.

In particular, in one embodiment, the third thermal conductive layer 43 is provided as a copper foil, which can better realize heat conduction, although the material is not limited thereto.

As an alternative embodiment of the present application, please refer to fig. 3, in which only the first heat conducting layer 41 and the second heat conducting layer 42 are disposed on the medium, and the third heat conducting layer 43 is not disposed.

In one embodiment, referring to fig. 2, at least one third heat conduction layer 43 between two adjacent dielectric boards 1 is connected to the first heat conduction layer 41, a part of heat of the electronic device 7 during reflow soldering can be conducted to the second heat conduction layer 42 through the first heat conduction layer 41 and dissipated into the air, and another part can be conducted to the third heat conduction layer 43 through the first heat conduction layer 41 and conducted to the dielectric board 1 to achieve heat dissipation, and the dual heat dissipation paths can enhance the heat dissipation effect.

The third heat conduction layer 43 and the first heat conduction layer 41 are in an integral connection structure, so that the heat dissipation effect can be improved by the integral structure while the process of arranging the first heat conduction layer 41, the second heat conduction layer 42 and the third heat conduction layer 43 on the medium plate 1 is simplified.

Alternatively, the third heat conduction layer 43 between at least one adjacent two dielectric plates 1 is spaced apart from the first heat conduction layer 41 and avoids the heat dissipation through holes 3. According to the actual heat dissipation requirement, the third heat conduction layer 43 is spaced from the first heat conduction layer 41, and can be used for realizing the diffusion of heat on the medium plate 1 and the conduction of heat on the first heat conduction layer 41.

Specifically, referring to fig. 2, in the present embodiment, the circuit board includes at least three dielectric boards 1, the three dielectric boards 1 are stacked, the pad 2 is disposed on an outermost dielectric board 1, and the heat dissipation through hole 3 simultaneously penetrates through the pad 2 and the at least three dielectric boards 1. A third heat conduction layer 43, which is a first heat conduction layer 431, is laid between two adjacent dielectric plates 1, and the first heat conduction layer 431 is connected to the first heat conduction layer 41; a third heat conduction layer 43 is also laid between the other two adjacent dielectric plates 1, and is a second heat conduction layer 432, and the second heat conduction layer 432 and the first heat conduction layer 41 are arranged at intervals, so that heat conduction on the first heat conduction layer 41 and the dielectric plates 1 can be realized more comprehensively, and effective heat dissipation of the electronic device 7 is realized.

In practical applications, the third heat conduction layer 43 may be connected to the first heat conduction layer 41 or spaced apart from the first heat conduction layer 41 according to the heat generated during reflow soldering and the requirement of heat dissipation. As an alternative embodiment of the present application, please refer to fig. 4, in this embodiment, a third heat conduction layer 43 is laid between two adjacent dielectric plates 1, the third heat conduction layer 43 is a first heat conduction layer 431, and the first heat conduction layer 431 is connected to the first heat conduction layer 41; as another alternative embodiment of the present application, please refer to fig. 5, in this embodiment, a third heat conduction layer 43 is laid between two adjacent dielectric plates 1, the third heat conduction layer 43 is a second heat conduction layer 432, and the second heat conduction layer 432 is spaced apart from the first heat conduction layer 41.

In one embodiment, referring to fig. 1, fig. 2 and fig. 6, the insulating body 5 includes a first insulating portion 51 and a second insulating portion 52, the first insulating portion 51 is filled in the heat dissipating through hole 3, the second insulating portion 52 is protruded on one end of the first insulating portion 51, and a diameter of the second insulating portion 52 is larger than a diameter of the first insulating portion 51. When filling the insulator 5 in the heat dissipation through-hole 3, first isolated portion 51 is filled in the heat dissipation through-hole 3, second isolated portion 52 is worn out outside the heat dissipation through-hole 3, and second isolated portion 52 middle part just to heat dissipation through-hole 3 and with first isolated portion 51 body coupling, the isolated portion 52 edge subsides of second are located on pad 2, also be the isolated portion 52 edge overlap joint of second on pad 2, improve the effect that blocks of insulator 5 to heat dissipation through-hole 3, avoid soldering tin 6 to flow to in the heat dissipation through-hole 3.

Specifically, the solder 6 is coated on the pad 2 and avoids the second isolation portion 52, that is, the solder 6 is coated on the periphery of the second isolation portion 52, the electronic device 7 is welded on the pad 2 through the solder 6 on the periphery of the second isolation portion 52, and the second isolation portion 52 abuts against the electronic device 7 and is not welded to the electronic device 7, so as to avoid the deformation of the second isolation portion 52 and the first isolation portion 51, which reduces the effect of blocking the solder 6.

In one embodiment, referring to fig. 2 and fig. 6, the insulator 5 further includes a third insulating portion 53 protruding from the other end of the first insulator 5, that is, the second insulating portion 52 and the third insulating portion 53 are respectively protruding from the opposite ends of the first insulating portion 51, the third insulating portion 53 is extended out of the heat dissipating through hole 3, the middle portion of the third insulating portion 53 faces the heat dissipating through hole 3 and is integrally connected to the first insulating portion 51, and the edge of the third insulating portion 53 is attached to the second heat conducting layer 42, that is, the edge of the third insulating portion 53 is overlapped on the second heat conducting layer 42. The second isolation portion 52 and the third isolation portion 53 are respectively protruded at two opposite ends of the first isolation portion 51 and respectively penetrate out of the heat dissipation through hole 3, so that the filling density of the first isolation portion 51 filled in the heat dissipation through hole 3 can be ensured, the filling effect of the heat dissipation through hole 3 can be improved, and the effect of blocking the soldering tin 6 can be improved.

In one embodiment, referring to fig. 1, the solder 6 is mainly distributed on the portion of the pad 2 not provided with the heat dissipating through holes 3, the plurality of heat dissipating through holes 3 are formed on the pad 2, and the plurality of heat dissipating through holes 3 are distributed at equal intervals, so that the solder 6 can be uniformly distributed on the pad 2, and uniformity of soldering the electronic device 7 on the pad 2 is enhanced.

According to the above description of the second isolation portion 52, it is therefore possible to distribute the solder 6 on the portion of the pad 2 where the second isolation portion 52 is not distributed, to achieve uniform distribution of the solder 6, and to enhance the soldering effect of the electronic device 7.

In one embodiment, the larger the heat dissipation through hole 3 is, the smaller the contact area between the portion of the pad 2 that can be used for soldering and the electronic device 7 is, that is, the smaller the contact area between the solder 6 and the electronic device 7 is, which is not favorable for soldering the electronic device 7; the smaller the heat dissipation through-hole 3 is, the worse the heat dissipation effect is, so here the diameter range of the heat dissipation through-hole 3 is preferably set to: 0.2 mm-0.3 mm, which is beneficial to the welding process of the electronic device 7;

specifically, the center distance range of two adjacent heat dissipation through holes 3 is 4 times to 6 times the diameter of the heat dissipation through hole 3, where the diameter of the heat dissipation through hole 3 is D, and the center distance range of two adjacent heat dissipation through holes 3 is D, and then D is 4 x D to 6 x D, which can ensure the contact area between the bonding pad 2 and the electronic device 7, ensure the welding strength and reliability of the electronic device 7, and can also ensure the heat dissipation effect when the electronic device 7 is reflow-welded. D-5 × D is preferred here, but not limited to.

According to the selection of the diameter range of the heat dissipation through hole 3, in practical application, both the cases of D being 0.254mm and 0.3mm are selected, and when D is 0.254mm, the range of D is between 1mm and 1.5mm, and is preferably 1.27 mm; when D is 0.3mm, D ranges from 1.27mm to 1.6mm, and preferably ranges from 1.4mm, and the heat dissipation through-hole 3 can ensure the heat dissipation effect and the bonding strength between the electronic component 7 and the bonding pad 2. Of course, only two sets of data are listed here, which are not intended to be exclusive, but are not exclusive.

The application also provides a circuit board assembly, which comprises an electronic device 7 and a circuit board, wherein the electronic device 7 is welded on the welding disc 2 of the circuit board. The circuit board is the circuit board described in the above embodiments, and the circuit board is not described in detail here.

The application provides a circuit board assembly, through setting up heat dissipation through- hole 3, 41 layers of first heat conduction and insulator 5, when electronic device 7 adopted backflow welding's mode to weld on pad 2, insulator 5 can block soldering tin when backflow welding and flow to heat dissipation through-hole 3 in, soldering tin distributes unevenly and leads to the condition of electronic device 7 rosin joint or welding off normal when avoiding welding, guarantees electronic device 7's reflow soldering technology. In addition, heat generated when the electronic device 7 and the pad 2 are soldered can be conducted to the surface of the dielectric board 1 away from the pad 2 through the first heat conduction layer 41, so that effective heat dissipation of the pad 2 and the electronic device 7 can be realized during reflow soldering.

The present application further provides a soldering process for a circuit board, which is applied to any one of the above circuit boards, and mainly relates to reflow soldering of the electronic device 7. Referring to fig. 7, the soldering process of the circuit board includes the following steps:

s10, forming a heat dissipation through hole 3 on the medium plate 1, so that the heat dissipation through hole 3 simultaneously penetrates through the medium plate 1 and the pad 2 arranged on the medium plate 1, and laying a first heat conduction layer 41 on the inner peripheral wall of the heat dissipation through hole 3;

in this step, the heat dissipation through-holes 3 simultaneously penetrate through the dielectric board 1 and the pads 2, and the first heat conduction layer 41 also penetrates through the heat dissipation through-holes 3. When the first heat conduction layer 41 is laid, the first heat conduction layer 41 is connected with the pad 2, so that heat on the pad 2 is conducted to the first heat conduction layer 41.

Specifically, in the present embodiment, the arrangement order of the pads 2, the heat dissipation through holes 3, and the first heat conduction layer 41 is not limited uniquely, and may be set according to specific requirements. The method comprises the following steps that a heat dissipation through hole 3 can be formed in a medium plate 1, a pad 2 is arranged on the medium plate 1, and a first heat conduction layer 41 is laid on the inner peripheral wall of the heat dissipation through hole 3; the bonding pads 2 are arranged on the medium plate 1 and then are penetrated together to form the heat dissipation through hole 3, and then the first heat conduction layer 41 is laid on the inner peripheral wall of the heat dissipation through hole 3.

The first thermal conductive layer 41 is an electroplated layer, specifically a copper foil, but the material is not limited thereto.

S20, filling the heat dissipation through hole 3 with an insulator 5;

this step is performed before reflow soldering for blocking the solder 6 from flowing into the heat dissipation through-hole 3 at the time of reflow soldering. The insulator 5 is solder resist ink 5, and includes a first insulator 51, a second insulator 52, and a third insulator 53. In this step, it is necessary to fill the first isolation portion 51 in the heat dissipation through hole 3, attach the edge of the second isolation portion 52 to the pad 2, and attach the third isolation portion 53 to the side of the dielectric board 1 away from the pad 2.

S30, the solder 6 is applied to the land 2, and the electronic component 7 is soldered to the land 2 by reflow soldering.

According to the welding process of the circuit board, the heat dissipation through holes 3 penetrating through the medium plate 1 and the bonding pad 2 simultaneously are arranged, the first heat conduction layers 41 are laid on the inner peripheral walls of the heat dissipation through holes 3 before the bonding pad 2 and the electronic device 7 are subjected to reflow welding, and the insulation bodies 5 are filled in the heat dissipation through holes 3, so that soldering tin 6 during reflow welding is blocked by the insulation bodies 5 and cannot flow into the heat dissipation through holes 3, the condition that the soldering tin 6 is unevenly distributed during welding is avoided, and the reflow welding process of the electronic device 7 is guaranteed; in addition, the heat generated during reflow soldering can be conducted to the surface of the dielectric board 1 away from the bonding pads 2 through the first heat conduction layer 41, so that effective heat dissipation of the bonding pads 2 and the electronic devices 7 is ensured.

In one embodiment, the medium board 1 is provided in multiple layers, and in step S20, the opening of the heat dissipation through-hole 3 in the medium board 1 is performed such that the heat dissipation through-hole 3 penetrates through the medium board 1 and the pad 2, and the first heat conduction layer 41 is formed on the inner peripheral wall of the heat dissipation through-hole 3, further including:

laying a second heat conduction layer 42 connected with the first heat conduction layer 41 on one side of the medium plate 1, which is far away from the bonding pad 2;

and/or a third heat conduction layer 43 is laid between at least two adjacent medium plates 1, and the third heat conduction layer 43 is connected with the first heat conduction layer 41 or is arranged at a distance from the first heat conduction layer 41.

In this embodiment, the second heat conduction layer 42 is laid on the side of the dielectric board 1 away from the pad 2, the second heat conduction layer 42 is connected to the first heat conduction layer 41, and the heat of the first heat conduction layer 41 can be dissipated to the air through the second heat conduction layer 42. Laying a third heat conduction layer 43 between at least two adjacent medium plates 1, including the following three cases:

a third heat conduction layer 43 is laid between two adjacent medium plates 1, the third heat conduction layer 43 is a first heat conduction layer 431, the first heat conduction layer 431 is connected to the first heat conduction layer 41, and the heat of the first heat conduction layer 41 can be conducted into the medium plates 1 through the first heat conduction layer 431, so that heat dissipation is realized; or a third heat conduction layer 43 is laid between two adjacent dielectric plates 1, the third heat conduction layer 43 is a second heat conduction layer 432, and the second heat conduction layer 432 and the first heat conduction layer 41 are arranged at intervals; alternatively, a first heat conduction layer 431 is laid between two adjacent dielectric plates 1, the first heat conduction layer 431 is connected to the first heat conduction layer 41, and a second heat conduction layer 432 is laid between two adjacent dielectric plates 1, and the second heat conduction layer 432 is spaced apart from the first heat conduction layer 41.

The first heat conducting layer 41, the second heat conducting layer 42 and the first heat conducting layer 431 may be an integral connecting structure, and are all copper foils, and they may be disposed at the same time.

In other embodiments, only the first heat conductive layer 41 may be provided on the medium plate 1. In addition to the first heat conduction layer 41 laid in the heat dissipation through holes 3, only the second heat conduction layer 42 or the third heat conduction layer 43 may be provided, and the arrangement may be set according to specific heat dissipation requirements, which is not listed here.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.