Hemispherical microlens and preparation method thereof
阅读说明：本技术 一种半球状微透镜及其制备方法 (Hemispherical microlens and preparation method thereof ) 是由 刘贤超 王军 苟君 周泓希 韩琦 于 2020-06-24 设计创作，主要内容包括：本发明公开了一种半球状微透镜及其制备方法,该透镜包括包括至少一个透镜镜体2,所述透镜镜体2为：选定标准微球透镜2′一个经过球心的面,在所述经过球心的面的两侧分别平行切割掉部分球面。制备方法分别在标准的微球透镜两侧平行切割掉部分球面,随后浸泡在第二材料膜层4内,当平行于光轴的入射光从半球状微透镜被部分切割的球面测入射时,通过被切割的球面的光线将不参与形成光斑,这有益于改善光斑的半高宽；通过未被切割的球面的光线因离光轴更远,形成具有更长工作距的焦斑,可应用在远场平行成像/光刻方面,提高特征尺寸接近或大于300nm的图案平行成像/光刻的效率。(The invention discloses a hemispherical micro lens and a preparation method thereof, wherein the lens comprises at least one lens body 2, and the lens body 2 is as follows: a surface of the standard microsphere lens 2' passing through the sphere center is selected, and partial spherical surfaces are cut off on two sides of the surface passing through the sphere center in parallel respectively. The preparation method cuts off partial spherical surfaces on two sides of a standard microsphere lens in parallel respectively, and then the spherical surfaces are soaked in the second material film layer 4, when incident light parallel to an optical axis is incident from the partially cut spherical surface of the hemispherical microlens, light rays passing through the cut spherical surface do not participate in forming light spots, and the half-height width of the light spots is favorably improved; the light rays of the uncut spherical surface are farther away from the optical axis to form a focal spot with longer working distance, so that the method can be applied to far-field parallel imaging/photoetching and can improve the efficiency of pattern parallel imaging/photoetching with the characteristic size close to or larger than 300 nm.)
1. Hemispherical microlens, comprising at least one lens body (2), characterized in that: the lens body (2) is as follows: a face passing through the sphere center of the standard microsphere lens (2') is selected, and partial spherical faces are cut off in parallel on two sides of the face passing through the sphere center respectively.
2. The hemispherical microlens as claimed in claim 1, wherein: the lens body (2) is soaked in the second material film layer (4).
3. The hemispherical microlens as claimed in claim 2, wherein: the adhesive film further comprises a third substrate (8) and a second adhesive film layer (7), wherein two sides of the second adhesive film layer (7) are respectively connected with the third substrate (8) and the second material film layer (4).
4. A hemispherical microlens as claimed in claim 3, wherein: the third substrate (8), the second adhesive film layer (7) and the second material film layer (4) are all made of transparent materials with good light transmittance.
5. The hemispherical microlens as claimed in claim 1, wherein: the lens body (2) comprises a single lens or a plurality of lenses, and the lenses are arranged in a single layer in parallel.
6. A preparation method of a hemispherical microlens is characterized in that: the method comprises a lens body cutting step: a face passing through the sphere center of the standard microsphere lens (2') is selected, and partial spherical faces are cut off in parallel on two sides of the face passing through the sphere center respectively.
7. The method for manufacturing a hemispherical microlens as claimed in claim 6, wherein:
the cutting includes a first cutting and a second cutting, the first cutting including: removing the first material film layer (3 ') and the second material film layer (4 ') covering the top ends of the microsphere lenses (2 '), and then removing the plane parts of the microsphere lenses (2 ') higher than the rest of the second material film (4 ') to obtain a first sample;
the second cutting includes: removing the part of the other side of the microsphere lens (2 ') higher than the rest of the second material film layer (4') and completely soaking the microsphere lens (2 ') in the rest of the second material film layer (4') to obtain a third sample;
the cutting is carried out in an etching mode.
8. The method of claim 7, wherein: the method further includes a first cut fixation and a second cut fixation, the first cut fixation including: bonding a second substrate (6) and the side of the microsphere lens (2 ') which is cut for the first time through a first adhesive film layer (5), dissolving the residual first material film layer (3') in the first sample, and peeling off the first substrate (1) to obtain a second sample;
the second cutting fixture comprises: bonding a third substrate (8) to the remaining second film layer of material (4 ") of the third sample via a second adhesive film layer (7);
the second cutting is fixed and then comprises an assembling step, and the assembling step comprises: the second substrate (6) and the first adhesive film layer (5) in the fourth sample are removed.
9. The method of claim 7, wherein:
before the first cutting, the method comprises the steps of self-assembling and tiling standard microsphere lenses (2 ') on a first substrate (1), and sequentially growing a first material film layer (3) and a second material film layer (4) on one side, close to the microsphere lenses (2'), of the obtained first substrate (1);
said completely immersing the microsphere lenses (2') in the remaining second material film layer (4 ") comprises: and continuously vertically growing a second material film (4) with a certain thickness on the other side of the microsphere lens (2') in the second sample after the removal treatment by a physical vapor deposition method.
10. The method of claim 7, wherein:
said dissolving the remaining first film layer of material (3 ") in the first sample and peeling off the first substrate (1) comprises: and soaking the first sample in a solution which can only dissolve the residual first material film layer (3 '), and stripping the first substrate (1) after the residual first material film layer (3') is completely dissolved.
Technical Field
The invention relates to the technical field of optics and electronics, in particular to a hemispherical microlens and a preparation method thereof.
Background
With the increase of the integration level of semiconductor devices, the sizes of components on the semiconductor devices tend to be in the micro-nanometer level, and imaging systems or photoetching systems with the resolution of 200nm-400nm are needed in more scenes. Because the traditional optical lens is limited by the limit of optical diffraction, and influenced by the quality of a light source, the light path of a system and the like, the particles with the size of 300nm are difficult to be seen clearly by a metallographic microscope. In addition, the conventional lens has a large size, and it is difficult to make a lens array to perform parallel work to improve work efficiency. Other high-resolution imaging systems, such as atomic force microscopes and scanning electron microscopes, have high equipment cost and low working efficiency. In the field of chip preparation, the light spot is compressed by adopting a mode of immersing a traditional lens in liquid, and the conditions are severe; electron beam lithography and ion beam etching are hardly used in the field of chips because of their low output efficiency.
Parallel light passes through a wavelength-order microsphere lens, a long focal spot with a super-diffraction limit size can be formed near the shadow side of the microsphere lens, meanwhile, a large-area lens array is easy to obtain through self-assembly of a colloid microsphere lens, and due to the characteristics of excellent focusing characteristic and easiness in self-assembly of the microsphere lens on incident light, existing researchers combine the microsphere lens with a traditional optical microscope system to realize imaging of 150 nm-width characteristic size, or directly assemble a single-layer microsphere lens array on a photoresist film layer, and a hole array with a minimum characteristic size of about 100nm can be obtained after exposure and development. However, the microsphere lens has the defects that the working distance is short and is within about 2 mu m, and the parallel imaging or the parallel photoetching of the microsphere lens array is not easy to be carried out under the far field condition; the current method for trying to extend the working distance of the microsphere lens is a double-layer/multi-layer concentric microsphere lens, but for the double-layer/multi-layer concentric microsphere with the outer diameter of about 10 μm, the working distance is generally less than 6 μm, and the beam waist half width of the focused light beam is greater than the working wavelength; the standard single-layer/double-layer hemispherical lens also has a longer working distance, but compared with the corresponding double-layer concentric microsphere lens, the half width of a focused light beam is obviously increased, and the light intensity is reduced.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a micro-ball lens, which can solve the problems of short working distance, large beam waist half width of focused light beam and low light intensity of the micro-ball lens in the prior art, and therefore it is urgently needed to design a micro-lens with long working distance, narrow sub-wavelength light beam half width and high light intensity, which can be applied to optical far-field sub-wavelength imaging or lithography, and can also be applied to parallel imaging or parallel lithography.
In order to solve the technical problems, the invention adopts a technical scheme that: a hemispherical microlens and a method for manufacturing the same are provided.
Wherein, hemispherical microlens, includes at least one
Preferably, the
Preferably, the adhesive film further comprises a third substrate 8 and a second
Preferably, the third substrate 8, the second
Preferably, the
A method for preparing a hemispherical microlens comprises a lens body cutting step: selecting a surface of the standard microsphere lens 2' passing through the center of a sphere, and respectively cutting off part of spherical surfaces on two sides of the surface passing through the center of the sphere in parallel;
the cutting includes a first cutting and a second cutting, the first cutting including: removing the first material film layer 3 ' and the second material film layer 4 ' covering the top end of the microsphere lens 2 ', and then removing the plane part of the microsphere lens 2 ' higher than the rest of the second material film 4 ' to obtain a first sample;
the second cutting includes: removing the part of the other side of the microsphere lens 2 'higher than the remaining second material film layer 4' and completely soaking the microsphere lens 2 'in the remaining second material film layer 4' to obtain a third sample;
the cutting is carried out in an etching mode.
Preferably, said dissolving the remaining first film layer of
Preferably, said completely immersing the microsphere lenses 2' in the remaining second
Preferably, the removal of the first material film layer 3 ' and the second material film layer 4 ' covering the top of the microsphere lens 2 ' is achieved by one or more of ultrasonic removal, adhesive tape or adhesive film adhesion removal.
The invention has the beneficial effects that: (1) different from the prior art, the invention cuts off partial spherical surfaces of the standard microsphere lens 2' in parallel through two sides of the surface of the spherical center respectively, and soaks the obtained hemispherical microlens in the second
Drawings
FIG. 1 is a flow chart of a method for fabricating hemispherical microlenses according to the present invention;
FIG. 2 is a schematic view of a hemispherical microlens unit according to the present invention;
FIG. 3 is a schematic cross-sectional view of a substrate of a tiled microsphere lens array;
FIG. 4 is a schematic cross-sectional view of the substrate after deposition of two material films in FIG. 3;
FIG. 5 is a schematic cross-sectional view of a substrate after removal of a material film over a microsphere lens;
FIG. 6 is a schematic cross-sectional view of the substrate of FIG. 5 heated at a high temperature to planarize the exposed microspheres on the film layer and etch the exposed microspheres;
FIG. 7 is a schematic cross-sectional view of another adhesive film coated substrate and the corresponding substrate of FIG. 6 being brought into close proximity and pressed together;
FIG. 8 is a schematic cross-sectional view of the resulting substrate of FIG. 7 after soaking in a solution that dissolves only the first material film deposited in FIG. 4, completely dissolving the film and removing the underlying substrate;
FIG. 9 is a schematic cross-sectional view of the substrate of FIG. 8 heated at a high temperature to planarize the exposed microspheres on the film layer and etch the exposed microsphere surface;
FIG. 10 is a schematic cross-sectional view of the substrate after deposition of the same material film of the first layer deposited in FIG. 9 as in FIG. 4;
FIG. 11 is a schematic cross-sectional view of a third substrate coated with an adhesive film and the corresponding substrate of FIG. 10 being brought close to each other and pressed;
fig. 12 is a schematic cross-sectional view of the substrate under the substrate obtained in fig. 11 removed, that is, a schematic cross-sectional view of a manufactured soaked hemispherical microlens array.
The various numbers in FIGS. 1-12 identify the description: 1. a first substrate; 2. a lens body; 3. a first film layer of material; 4. a second film layer of material; 5. a first adhesive film layer; 6. a second substrate; 7. a second adhesive film layer; 8. a third substrate; the letter O in the figure indicates the center of the microsphere lens.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and more complete, the present invention is further described with reference to the following embodiments.
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