阅读说明：本技术 一种基于电磁能隙结构的印制电路板 (Printed circuit board based on electromagnetic energy gap structure ) 是由 王敬文 于 2020-05-28 设计创作，主要内容包括：本发明公开了一种基于电磁能隙结构的印制电路板,包括接地层和由多个金属片平铺组成的电源层,其中,金属片的外围挖空,形成第一挖空结构；金属片的内部设有第二挖空结构；相邻的金属片的第一挖空结构之间通过第一金属线连接形成信道。本发明提供的应用于印制电路板的电磁能隙结构在现有的直线型信道共平面电磁能隙结构的基础上,增加了金属片内部的第二挖空结构,从而从噪声源(板上电源)处抑制了噪声的传播,并在第二挖空结构中填充第二金属线,使得电源层金属片内部的电感性更加平衡,使抑制噪声带宽持续增加,在现有技术的基础上进一步增强了抑制接地弹跳噪声的能力,优化了现有技术中直线型信道共平面电磁能隙结构的讯号完整性问题。(The invention discloses a printed circuit board based on an electromagnetic energy gap structure, which comprises a ground layer and a power supply layer formed by tiling a plurality of metal sheets, wherein the peripheries of the metal sheets are hollowed to form a first hollowed structure; a second hollow structure is arranged inside the metal sheet; the first hollow structures of the adjacent metal sheets are connected through a first metal wire to form a channel. The electromagnetic energy gap structure applied to the printed circuit board is additionally provided with the second hollow structure inside the metal sheet on the basis of the existing linear channel coplanar electromagnetic energy gap structure, so that the noise transmission is inhibited from a noise source (an on-board power supply), and the second metal wire is filled in the second hollow structure, so that the inductance inside the metal sheet of the power supply layer is more balanced, the noise inhibiting bandwidth is continuously increased, the capability of inhibiting the grounding bounce noise is further enhanced on the basis of the prior art, and the signal integrity problem of the linear channel coplanar electromagnetic energy gap structure in the prior art is optimized.)

1. A printed circuit board based on an electromagnetic energy gap structure is characterized by comprising a ground layer and a power supply layer formed by tiling a plurality of metal sheets;

hollowing the periphery of the metal sheet to form a first hollow structure; a second hollow structure is arranged inside the metal sheet; the first hollow structures of the adjacent metal sheets are connected through a first metal wire to form a channel; and a second metal wire used for communicating the non-hollowed part of the metal sheet is arranged in the second hollowed structure.

2. The printed circuit board of claim 1, wherein the second metal lines particularly form an X-shaped structure.

3. The printed circuit board of claim 2, wherein the second metal lines are configured in a plurality of X-shaped configurations.

4. The printed circuit board of claim 1, wherein the first metal line is embodied in a straight structure.

5. The printed circuit board of claim 1, wherein the first metal line is embodied in a meander-type structure.

6. The printed circuit board of claim 5, wherein the first metal line is embodied in a multi-fold structure.

7. The printed circuit board according to claim 6, wherein the metal sheet is a square structure with a side length of 30mm, the first hollowed structure is a square structure with a width of 2mm, and the first metal wire is a four-fold structure.

8. Printed circuit board according to claim 7, characterized in that the second hollowed-out structure is in particular a square structure with a side of 10 mm.

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board based on an electromagnetic energy gap structure.

Background

In the development of modern technology products toward high speed and miniaturization, especially in the case of chip signal transmission rate in high performance servers, the problem of signal distortion caused by signal interference and destruction is more and more important, factors affecting signal integrity may include signal to timing problems, signal ringing, signal reflection, near-end and remote crosstalk, switching Noise, Ground Bounce and power Bounce, attenuation, capacitive load, electromagnetic radiation, battery interference, etc., and Ground Bounce Noise (GBN) between the signal input terminal and the signal output terminal is one of the main Noise sources.

Disclosure of Invention

The invention aims to provide a printed circuit board based on an electromagnetic energy gap structure, which can better inhibit the propagation of grounding bounce noise compared with the existing linear type channel coplanar electromagnetic energy gap structure, and optimizes the problem of poor signal integrity of the linear type channel coplanar electromagnetic energy gap structure in the prior art.

In order to solve the technical problem, the invention provides a printed circuit board based on an electromagnetic energy gap structure, which comprises a ground layer and a power layer formed by tiling a plurality of metal sheets;

hollowing the periphery of the metal sheet to form a first hollow structure; a second hollow structure is arranged inside the metal sheet; the first hollow structures of the adjacent metal sheets are connected through a first metal wire to form a channel; and a second metal wire used for communicating the non-hollowed part of the metal sheet is arranged in the second hollowed structure.

Optionally, the second metal line specifically forms an X-type structure.

Optionally, the second metal lines specifically form a plurality of X-shaped structures.

Optionally, the first metal wire is specifically a straight-line structure.

Optionally, the first metal line is a bent structure.

Optionally, the first metal line is of a multi-fold structure.

Optionally, the metal sheet is specifically a square structure with a side length of 30mm, the width of the first hollowed structure is specifically 2mm, and the first metal wire is specifically a four-fold structure.

Optionally, the second hollow structure is a square structure with a side length of 10 mm.

The invention provides a printed circuit board based on an electromagnetic energy gap structure, which comprises a ground layer and a power supply layer formed by tiling a plurality of metal sheets, wherein the peripheries of the metal sheets are hollowed to form a first hollowed structure; a second hollow structure is arranged inside the metal sheet; the first hollow structures of the adjacent metal sheets are connected through a first metal wire to form a channel. The electromagnetic energy gap structure applied to the printed circuit board is additionally provided with the second hollow structure inside the metal sheet on the basis of the existing linear channel coplanar electromagnetic energy gap structure, so that the noise transmission is inhibited from a noise source (an on-board power supply), and the second metal wire is filled in the second hollow structure, so that the inductance inside the metal sheet of the power supply layer is more balanced, the noise inhibiting bandwidth is continuously increased, the capability of inhibiting the grounding bounce noise is further enhanced on the basis of the prior art, and the signal integrity problem of the linear channel coplanar electromagnetic energy gap structure in the prior art is optimized.

Drawings

In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of an electromagnetic bandgap structure in the prior art;

FIG. 2 is an equivalent circuit diagram of the electromagnetic bandgap structure of FIG. 1;

FIG. 3 is a diagram of a prior art electromagnetic bandgap structure applied to a printed circuit board;

FIG. 4 is an equivalent circuit of the electromagnetic bandgap structure of FIG. 3;

fig. 5 is a bottom view of a power layer of a printed circuit board based on an electromagnetic energy gap structure according to an embodiment of the present invention;

FIG. 6 is a bottom view of the electromagnetic energy gap structure shown in FIG. 3;

fig. 7 is a bottom view of a power plane of a printed circuit board based on an electromagnetic energy gap structure according to another embodiment of the present invention;

FIG. 8 is an equivalent circuit schematic diagram of the electromagnetic bandgap structure of FIG. 7;

fig. 9 is a simulation graph of the noise suppression capability of the electromagnetic bandgap structure of fig. 7.

Wherein, P is a metal sheet, G1 is a first hollow structure, G2 is a third hollow structure, G3 is a second hollow structure, s1 is a first metal line, and s2 is a second metal line.

Detailed Description

The core of the invention is to provide a printed circuit board based on an electromagnetic energy gap structure, which can better inhibit the propagation of grounding bounce noise compared with the existing linear type channel coplanar electromagnetic energy gap structure, and optimizes the problem of poor signal integrity of the linear type channel coplanar electromagnetic energy gap structure in the prior art.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 5 is a bottom view of a power layer of a printed circuit board based on an electromagnetic energy gap structure according to an embodiment of the present invention; fig. 6 is a bottom view of the electromagnetic energy gap structure shown in fig. 3.

The printed circuit board based on the electromagnetic energy gap structure comprises a ground layer and a power layer formed by tiling a plurality of metal sheets P;

hollowing out the periphery of the metal sheet P to form a first hollow structure G1; a second hollow structure G3 is arranged inside the metal sheet P; the first hollow structures G1 of adjacent metal sheets P are connected by a first metal line s1 to form a channel.

As shown in fig. 5, the periphery of the metal sheet P of the power layer of the printed circuit board is hollowed to form a first hollowed structure G1; the second hollow structure G3 is formed by hollowing out the inside of the metal piece P, and preferably hollowing out the metal piece P in the vicinity of the power source. Since the metal sheet P of the power layer needs to carry power devices and peripheral circuits, the areas of the first hollow structure G1 and the second hollow structure G3 need to be determined according to the areas of the devices on the metal sheet P. A conventional metal sheet P is designed to have a square structure with a side length of 30mm, and the width of the first hollowed structure G1 may be 0.5-2 mm.

The first metal wire s1 is added to the first hollow structure G1 for connecting with the corresponding first metal wire s1 of another metal sheet P, and the first metal wire s1 is linked with the electromagnetic energy gap structure to increase the inductance between channels, so as to avoid the mutual interference between the channels and the body of the metal sheet P, thereby achieving the effects of expanding the bandwidth and suppressing the noise.

The first metal wire s1 may be a straight-line structure as shown in fig. 3, and its bottom view is shown in fig. 6, where the dark part is a solid body of the metal sheet P, the framed blank part is a hollow part of the metal sheet P, the hollow part at the periphery of the metal sheet P is a first hollow structure G1, and the hollow parts at both sides of the straight channel (the first metal wire s1) on the metal sheet P are third hollow structures G2. The third hollowed out structure G2 may have a width of 1.5mm and a length L of 5.0 mm; the width of G1 may be 0.5 mm; the width W of the first metal line s1 may be 0.15 mm.

Based on fig. 6, the first metal line s1 may also be a bent structure as shown in fig. 5, specifically, the third hollow structure G2 is filled up, the first hollow structure G1 is retained and widened to provide a winding space for the first metal line s1, the bent first metal line s1 is added, referring to formula (1) in the background art section, the bent first metal line s1 is longer than the linear metal line, so that the equivalent inductance of L is increased, and the input impedance Z can be enabled to be_inBecomes larger.

On the basis of this principle, if the first metal line s1 occupies the first hollow structure G1 as much as possible so that the equivalent inductance value of L is as large as possible, the first metal line s1 is configured as a multi-fold structure. With reference to the above parameters: the metal sheet P is designed to be a square structure with the side length of 30mm, the width of the first hollowed structure G1 is 2mm, and the first metal wire s1 can be a four-fold structure; to prevent the first wires s1 on each side of the metal sheet P from interfering with each other, the winding length of the first wires s1 may be 20 mm.

By providing the second hollowed structure G3 in the vicinity of the power supply inside the metal piece P, noise propagation from a noise source can be prevented, thereby reducing signal loss. The second hollowed-out structure G3 may be a square structure with a side of 10 mm.

In practical applications, according to the difference of the occupied space of the devices on the metal sheet P, other dimensions can be designed besides those listed in the embodiments of the present invention.

The printed circuit board based on the electromagnetic energy gap structure comprises a ground layer and a power supply layer formed by tiling a plurality of metal sheets, wherein the peripheries of the metal sheets are hollowed to form a first hollowed structure; a second hollow structure is arranged inside the metal sheet; the first hollow structures of the adjacent metal sheets are connected through a first metal wire to form a channel. The electromagnetic energy gap structure applied to the printed circuit board provided by the embodiment of the invention is additionally provided with the second hollowed structure inside the metal sheet on the basis of the existing linear type channel coplanar electromagnetic energy gap structure, so that the noise propagation is inhibited from a noise source (an on-board power supply), the capability of inhibiting the grounding bounce noise is further enhanced on the basis of the prior art, and the signal integrity problem of the linear type channel coplanar electromagnetic energy gap structure in the prior art is optimized.

Fig. 7 is a bottom view of a power plane of a printed circuit board based on an electromagnetic energy gap structure according to another embodiment of the present invention; FIG. 8 is an equivalent circuit schematic diagram of the electromagnetic bandgap structure of FIG. 7; fig. 9 is a simulation graph of the noise suppression capability of the electromagnetic bandgap structure of fig. 7.

On the basis of the above embodiments, in order to further hinder noise propagation and improve signal integrity, in the printed circuit board based on the electromagnetic bandgap structure provided in the embodiment of the present invention, the second hollow structure G3 is provided with the second metal line s2 for communicating with the non-hollow portion of the metal sheet P, so that the inductance inside the power layer metal sheet P is more balanced, and the noise-suppression bandwidth can be continuously increased.

Fig. 8 shows an equivalent circuit of the electromagnetic gap structure in fig. 7, and similar to fig. 4, the first metal line s1 in the first hollow structure G1 forms an equivalent circuit formed by connecting an inductor L1 and a capacitor C1 in parallel, and after the second hollow structure G3 is provided and the second metal line s2 is added, the equivalent circuit formed by an inductor L2 and a capacitor C3 is further added. Referring to formula (1) of the background art section, the first metal line s1 is configured in a bent structure to increase the equivalent inductance value of L, so that the input impedance becomes larger, and the impedance Z of the noise propagation path is increased_in. On the basis, the following formula (3) can be derived by adding the second hollow structure G3 and the second metal wire s2, and the second metal wire s2 can extend the resonance frequency point of the noise to a high frequency:

in a specific implementation, the second metal wire s2 may be a straight line structure penetrating through the metal sheet P entities on both sides of the second hollow structure G3, or may form an X-shaped structure, that is, a path formed by two second metal wires s 2. As space allows, it can be understood that the longer second metal line s2 helps to further increase the equivalent inductance value of L, and the second metal line s2 may form a plurality of X-shaped structures. As shown in fig. 7, the second metal line s2 forms two X-shaped structures (the single line segment forming the X-shaped structure may be 10mm long), and accordingly, in the equivalent circuit shown in fig. 8, there are two groups of equivalent circuits formed by an inductor L2 and a capacitor C3.

The results shown in fig. 9 were obtained by respectively simulating the coplanar electromagnetic bandgap structure of the linear channel in the prior art and the X-shaped structure (the second metal line s2) + the four-fold bending structure (the first metal line s1) provided in the embodiments of the present invention. The ordinate S21(dB) of fig. 9 represents the gain, and the abscissa f (ghz) represents the resonance frequency. As can be seen from fig. 9, in the high frequency band, the X-shaped structure (the second metal wire s2) + the four-fold bent structure (the first metal wire s1) provided by the embodiment of the present invention has a significantly better noise suppression capability.

The printed circuit board based on the electromagnetic energy gap structure provided by the invention is described in detail above. The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.