阅读说明：本技术 柔性线路板、显示模组、终端、绑定系统及方法 (Flexible circuit board, display module, terminal, binding system and binding method ) 是由 周俊阳 于 2020-06-23 设计创作，主要内容包括：本发明公开了一种柔性线路板、显示模组、终端、绑定系统及方法。其中,柔性线路板包括主体部、弯折部以及多个连接部；其中：所述主体部的一侧设置有所述弯折部,另一侧设置有多个所述连接部；多个所述连接部之间设有间隙并且多个所述连接部分别用于与外部电路电连接。本发明中的柔性线路板与外部电路板电连接的部分不再是一整面,而是多个相邻且设有间隔的分段,从而,柔性线路板与外部电路板绑定的方式不再是整面绑定而是分段绑定,有利于分散柔性线路板与外部电路板绑定时向外部电路板施加的弯折力,进而有利于避免由于柔性线路板的绑定所造成的外部电路板与设置于其上的其他板状结构的剥离现象。(The invention discloses a flexible circuit board, a display module, a terminal, a binding system and a binding method. The flexible circuit board comprises a main body part, a bending part and a plurality of connecting parts; wherein: one side of the main body part is provided with the bending part, and the other side of the main body part is provided with a plurality of connecting parts; gaps are arranged among the connecting parts, and the connecting parts are respectively used for being electrically connected with an external circuit. The part of the flexible circuit board electrically connected with the external circuit board is not a whole surface any more, but a plurality of adjacent subsections with intervals are arranged, so that the binding mode of the flexible circuit board and the external circuit board is not whole surface binding but subsection binding, which is beneficial to dispersing the bending force applied to the external circuit board when the flexible circuit board is bound with the external circuit board, and further beneficial to avoiding the peeling phenomenon of the external circuit board and other plate-shaped structures arranged on the external circuit board caused by the binding of the flexible circuit board.)

1. A flexible wiring board, comprising: the connecting device comprises a main body part, a bending part and a plurality of connecting parts; wherein:

one side of the main body part is provided with the bending part, and the other side of the main body part is provided with a plurality of connecting parts;

gaps are arranged among the connecting parts, and the connecting parts are respectively used for being electrically connected with an external circuit.

2. The flexible wiring board of claim 1, wherein the main body portion, the bending portion, and the plurality of connecting portions are integrally formed.

3. A display module, comprising: a thin-film transistor layer and the flexible wiring board of claim 1 or 2; wherein:

at least one of the plurality of connections is for electrically connecting to the thin-film-transistor layer.

4. The display module of claim 3, wherein the thin-film transistor layer comprises a test signal line;

at least one of the connection portions electrically connected to the thin-film transistor layer is used for electrically connecting to the test signal line.

5. The display module of claim 3, wherein the display module further comprises an integrated circuit;

at least one of the other connection portions of the plurality of connection portions except the connection portion electrically connected to the thin-film transistor layer is used for electrically connecting to the integrated circuit.

6. The display module of claim 5, wherein the integrated circuit comprises a power line and a signal line;

at least one of the connection portions electrically connected to the integrated circuit is for electrical connection to the power supply line;

at least one of the other connecting portions electrically connected to the integrated circuit, except for the connecting portion electrically connected to the power supply line, is used for electrical connection to the signal line.

7. The display module of claim 5, wherein the display module further comprises a backlight layer and a color filter layer; wherein:

the backlight layer is arranged below the thin film transistor layer;

the integrated circuit and the color filter layer are arranged above the thin film transistor layer.

8. A terminal, characterized in that the terminal comprises a display module according to any one of claims 3-7.

9. A binding system comprising a multi-head device, a thin-film transistor layer, and the flexible wiring board of claim 1 or 2; wherein:

the multi-pressure head equipment is used for adsorbing a plurality of connecting parts, aligning the connecting parts with pins of the thin film transistor layer, and simultaneously binding the adsorbed pins of the connecting parts to the pins of the thin film transistor layer.

10. A binding method implemented by the binding system of claim 9, the binding method comprising:

the multi-pressure head equipment adsorbs a plurality of connecting parts;

the multi-pressure head equipment is aligned with the plurality of connecting parts and the pins of the thin film transistor layer;

and the multi-pressure head equipment simultaneously binds the adsorbed pins of the plurality of connecting parts to the pins of the thin film transistor layer.

Technical Field

The invention relates to the technical field of hardware, in particular to a flexible circuit board, a display module, a terminal, a binding system and a binding method.

Background

The existing Flexible Printed Circuit board (FPC) mostly adopts a T-shaped structure as shown in fig. 1, see fig. 2 and fig. 3, when the Flexible Printed Circuit board is bound (bonded) with an external Circuit board, the Flexible Printed Circuit board mostly adopts a whole-surface binding mode, and a bending force downward, uniformly and intensively is applied to the external Circuit board bound by the Flexible Printed Circuit board in a bending operation, so that the external Circuit board is easily peeled (peeled) from other plate-shaped structures arranged thereon.

Disclosure of Invention

The invention provides a flexible circuit board, a display module, a terminal, a binding system and a binding method, aiming at overcoming the defect that the bound external circuit board is easy to be stripped from other plate-shaped structures arranged on the external circuit board when the flexible circuit board is bound in a whole surface mode in the prior art.

The invention solves the technical problems through the following technical scheme:

a flexible wiring board comprising: the connecting device comprises a main body part, a bending part and a plurality of connecting parts; wherein:

one side of the main body part is provided with the bending part, and the other side of the main body part is provided with a plurality of connecting parts;

gaps are arranged among the connecting parts, and the connecting parts are respectively used for being electrically connected with an external circuit.

Optionally, the main body portion, the bending portion, and the plurality of connecting portions are integrally formed.

A display module, comprising: a Thin Film Transistor (TFT) layer and any of the above flexible wiring boards; wherein:

at least one of the plurality of connections is for electrically connecting to the thin-film-transistor layer.

Optionally, the thin-film transistor layer comprises a test signal line;

at least one of the connection portions electrically connected to the thin-film transistor layer is used for electrically connecting to the test signal line.

Optionally, the display module further includes an Integrated Circuit (IC);

at least one of the other connection portions of the plurality of connection portions except the connection portion electrically connected to the thin-film transistor layer is used for electrically connecting to the integrated circuit.

Optionally, the integrated circuit comprises a power line and a signal line;

at least one of the connection portions electrically connected to the integrated circuit is for electrical connection to the power supply line;

at least one of the other connecting portions electrically connected to the integrated circuit, except for the connecting portion electrically connected to the power supply line, is used for electrical connection to the signal line.

Optionally, the display module further includes a Backlight (BL) layer and a Color Filter (CF) layer; wherein:

the backlight layer is arranged below the thin film transistor layer;

the integrated circuit and the color filter layer are arranged above the thin film transistor layer.

A terminal comprises any one of the display modules.

A binding system comprises a multi-pressure head device, a thin film transistor layer and any one of the flexible circuit boards; wherein:

the multi-pressure head equipment is used for adsorbing a plurality of connecting parts, aligning the connecting parts with pins of the thin film transistor layer, and simultaneously binding the adsorbed pins of the connecting parts to the pins of the thin film transistor layer.

A binding method is realized by the binding system, and the binding method comprises the following steps:

the multi-pressure head equipment adsorbs a plurality of connecting parts;

the multi-pressure head equipment is aligned with the plurality of connecting parts and the pins of the thin film transistor layer;

and the multi-pressure head equipment simultaneously binds the adsorbed pins of the plurality of connecting parts to the pins of the thin film transistor layer.

The positive progress effects of the invention are as follows: the part of the flexible circuit board electrically connected with the external circuit board is not a whole surface any more, but a plurality of adjacent subsections with intervals are arranged, so that the binding mode of the flexible circuit board and the external circuit board is not whole surface binding but subsection binding, which is beneficial to dispersing the bending force applied to the external circuit board when the flexible circuit board is bound with the external circuit board, and further beneficial to avoiding the peeling phenomenon of the external circuit board and other plate-shaped structures arranged on the external circuit board caused by the binding of the flexible circuit board.

Drawings

Fig. 1 is a schematic structural diagram of a flexible printed circuit in the prior art.

Fig. 2 is a schematic diagram illustrating a flexible printed circuit board and an external circuit board in the prior art.

Fig. 3 is a schematic diagram illustrating a peeling phenomenon caused by the binding of a flexible printed circuit board in the prior art.

Fig. 4 is a schematic structural view of a flexible wiring board according to embodiment 1 of the present invention.

Fig. 5 is a schematic structural diagram of a display module according to embodiment 2 of the invention.

Fig. 6 is a schematic circuit diagram of a flexible printed circuit board in a display module according to embodiment 2 of the invention.

Fig. 7 is a flowchart of a binding method according to embodiment 5 of the present invention.

Detailed Description

The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.