Athermal arrayed waveguide grating using precision parallel moving module and method of fabricating the same
阅读说明:本技术 使用精确平行移动模块的无热阵列波导光栅及其制造方法 (Athermal arrayed waveguide grating using precision parallel moving module and method of fabricating the same ) 是由 金镇峰 于 2019-01-16 设计创作,主要内容包括:一种安装在阵列波导光栅(AWG)中以便手动补偿外部温度变化的温度补偿模块是基本类型或基板延伸类型,并且因此包含附接到AWG的基部和附接到基部的移动构件,其中基部包含:附接到AWG的第一子芯片的第一固定部件,第一固定部件包含输入波导;附接到AWG的第二子芯片的第二固定部件,包含输入平板波导;孔,所述孔是所述第一固定部件和所述第二固定部件之间的间隙,并且被布置为在所述间隙内包括用于将所述AWG分为所述第一子芯片和所述第二子芯片的切割面;以及<Image he="56" wi="124" file="DDA0002591712540000011.GIF" imgContent="drawing" imgFormat="GIF" orientation="portrait" inline="no"></Image>形弹性部件,其用于辅助所述第一固定部件的线性移动以及连接所述第一固定部件和所述第二固定部件,其中,所述移动构件附接到所述第一固定部件,以使所述AWG的所述第一子芯片在由温度变化引起的中心波长变化减小的方向上水平移动。另外,提供一种应用温度补偿模块的无热AWG的制造方法。(A temperature compensation module installed in an Arrayed Waveguide Grating (AWG) so as to manually compensate for external temperature variations is of a basic type or a substrate extension type, and thus includes a base attached to the AWG and a moving member attached to the base, wherein the base includes: a first stationary member attached to the first chiplet of the AWG, the first stationary member containing an input waveguide; a second fixed component attached to a second chiplet of the AWG containing an input slab waveguide; a hole that is a gap between the first fixing member and the second fixing member and is arranged to include a cut surface for dividing the AWG into the first sub-chip and the second sub-chip within the gap; and a shape elastic member for assisting a linear movement of the first fixing member and connecting the first fixing member and the second fixing member, wherein the moving member is attached to the first fixing member to horizontally move the first chiplet of the AWG in a direction in which a change in central wavelength caused by a change in temperature is reduced. In addition, a method for manufacturing the athermal AWG applying the temperature compensation module is provided.)
1. A temperature compensation module mounted in an arrayed waveguide grating to manually compensate for external temperature variations, the temperature compensation module comprising:
a base attached to the arrayed waveguide grating; and
a moving member attached to the base,
wherein the base comprises:
a first stationary member attached to a first sub-chip comprising input waveguides of the arrayed waveguide grating;
a second stationary member attached to a second sub-chip comprising an input slab waveguide of the arrayed waveguide grating;
a hole as a gap between the first fixing member and the second fixing member, the hole being arranged to include a cutting plane within the gap, the cutting plane being used to separate the arrayed waveguide grating into the first sub-chip and the second sub-chip; and
The moving member is attached to the first fixed member, and horizontally moves the first sub-chip of the arrayed waveguide grating in a direction in which a change in a center wavelength with a change in temperature is reduced.
2. The temperature compensation module of claim 1, wherein the base extends to a sufficient size to receive the entire arrayed waveguide grating chip.
3. The temperature compensation module of claim 1 or 2, wherein each of the first and second fixed components comprises:
a slit as a protruding plane for applying an adhesive to fix the arrayed waveguide grating; and
a dam having a concave shape to isolate the slit to prevent the adhesive from flowing.
4. The temperature compensation module of claim 1 or 2, wherein the base comprises:
an upper substrate attached to the arrayed waveguide grating; and
a lower substrate formed on a surface opposite to a surface of an upper substrate to which the arrayed waveguide grating is attached, the moving member having one end attached to the lower substrate.
5. The temperature compensation module of claim 4, wherein the upper substrate and the lower substrate are integrally formed.
6. The temperature compensation module according to claim 4, wherein the lower substrate includes a guide hole for guiding the linear movement of the moving member.
7. The temperature compensation module of claim 1 or 2, wherein the moving member is made of a material having a higher coefficient of thermal expansion than the base, and
the base is made of one of metal, plastic, silicon and silicon dioxide based materials having a lower coefficient of thermal expansion than the moving member.
8. An athermal arrayed waveguide grating, comprising:
the planar substrate of the arrayed waveguide grating comprises an input waveguide, an input slab waveguide, an arrayed waveguide, an output slab waveguide and an output waveguide;
wherein the temperature compensation module is mounted on or below the planar substrate,
the temperature compensation module includes a base attached to the arrayed waveguide grating and a moving member attached to the base,
the base includes: first and second fixing members each attached to the arrayed waveguide grating and separated from each other; a hole as a gap between the first fixing member and the second fixing member; and
the moving member is attached to the first fixed part to move horizontally in a direction such that a change in a center wavelength decreases with a change in temperature of the arrayed waveguide grating.
9. The athermal arrayed waveguide grating of claim 8, wherein the planar substrate is separated into a first chiplet comprising the input waveguides and a second chiplet comprising the input slab waveguides by a cut-plane formed between or inside the input slab waveguides.
10. The athermal arrayed waveguide grating of claim 9, wherein the first securing component is attached to the first sub-chip and the second securing component is attached to the second sub-chip, an
The moving member is attached to the first fixing part to allow the first sub-chip to perform parallel movement along the cutting plane.
11. A method of fabricating an athermal arrayed waveguide grating using a temperature compensation module, comprising:
preparing an array waveguide grating planar substrate, wherein the array waveguide grating planar substrate comprises an input waveguide, an input slab waveguide, an array waveguide, an output slab waveguide and an output waveguide;
placing the temperature compensation module on or below the arrayed waveguide grating; and
attaching the temperature compensation module to the arrayed waveguide grating,
wherein the temperature compensation module comprises a base attached to the arrayed waveguide grating and a moving member attached to the base,
the base includes: first and second fixing members each attached to the arrayed waveguide grating and separated from each other; a hole as a gap between the first fixing member and the second fixing member; anda resilient member for assisting the linear movement of the first fixing member and connecting the first fixing member and the second fixing member, and
the moving member is attached to the first fixed part to move horizontally in a direction such that a change in a center wavelength decreases with a change in temperature of the arrayed waveguide grating.
12. The method of fabricating an athermal arrayed waveguide grating of claim 11, wherein placing the temperature compensation module on or below the arrayed waveguide grating comprises:
placing a cutting plane within the aperture, the cutting plane for separating the arrayed waveguide grating into a first sub-chip comprising the input waveguide and a second sub-chip comprising the input slab waveguide.
13. The method of fabricating an athermal arrayed waveguide grating of claim 11, further comprising:
cutting or incising between an input waveguide and an input slab waveguide into the input slab waveguide to separate the arrayed waveguide grating into a first chiplet including the input waveguide and a second chiplet including the input slab waveguide.
14. The method of fabricating an athermal arrayed waveguide grating of claim 13, wherein attaching the temperature compensation module to the arrayed waveguide grating comprises:
attaching the first securing member to the first sub-chip and the second securing member to the second sub-chip.
15. The method of fabricating an athermal arrayed waveguide grating of claim 13, wherein attaching the temperature compensation module to the arrayed waveguide grating comprises:
applying the adhesive to a slit, wherein the slit is a plane protruding from each of the first and second fixing members; and
attaching the slit of the first fixing member to the first sub-chip and the slit of the second fixing member to the second sub-chip;
wherein each of the first and second fixing parts includes a dam having a concave shape to isolate the slit to prevent the adhesive from flowing.
Technical Field
The present invention relates to an athermal Arrayed Waveguide Grating (AWG) using a precisely parallel moving module and a method of manufacturing the same, and more particularly, to an athermal Arrayed Waveguide Grating (AWG) having a temperature compensation module capable of precisely moving horizontally to uniformly maintain a wavelength regardless of external temperature variation, and a method of manufacturing the same.
Background
Recently, with the rapid increase of different types of data services including the internet, it is required to expand the transmission capacity of the backbone network. To meet this demand, one solution is to increase the transmission capacity of optical fibers through Wavelength Division Multiplexing (WDM) optical communication systems that receive and transmit information of multiple channels through a single optical fiber.
In WDM, a Planar Lightwave Circuit (PLC) having an optical waveguide on a silica plate by a combination of an optical fiber technology and a Large Scale Integration (LSI) technology is used as a wavelength division multiplexer/demultiplexer. The refractive index n of a PLC (e.g., Arrayed Waveguide Grating (AWG), optical splitter) varies with changes in temperature T, and in the case of an AWG for wavelength division, the variation in refractive index n causes a variation in the path L of light of a certain wavelength, and a variation in wavelength λ occurs in a channel of each output port. Hereinafter, a general AWG will be described with reference to fig. 1.
Figure 1 shows the structure of a generic AWG. As shown in fig. 1, the AWG includes an input waveguide 1, an input slab waveguide 2, an arrayed waveguide 3, an output slab waveguide 4, and an output waveguide 5. In practice there is one input waveguide 1 defining an optical path, but at least one input waveguide 1 may be included to monitor performance during the manufacturing process. The optical signal input to the input waveguide 1 is separated at each wavelength λ 1, λ 2, …, λ n and output to the output waveguide 5. That is, when the wavelength λ 1 is allocated to the #1 channel, the wavelength λ 1 needs to be output to the output waveguide 5 despite the change in the surrounding environment. However, the refractive index changes with temperature, and as the refractive index changes, the wavelength of the AWG also changes. Although the wavelength λ 1 is allocated to the #1 channel, an error may occur as the temperature varies, for example, the wavelength λ 2 may be output.
In the case of using the AWG as a wavelength division multiplexer, in order to prevent errors caused by temperature variations, packaging has been used to maintain a uniform temperature using a precise heater at a high temperature higher than an operating temperature. However, due to problems of short product life caused by power consumption, outdoor power supply and high temperature, research has been conducted on athermal AWG structures to uniformly maintain the wavelength regardless of the temperature of the AWG itself.
Referring to fig. 1, a
The PLC, one of the optical communication components, requires very precise alignment with an alignment tolerance of 0.5 microns. Realigning the first and
Disclosure of Invention
Technical problem
The present disclosure is directed to providing athermal Arrayed Waveguide Gratings (AWGs) in which the cutting planes are aligned within tolerances using a temperature compensation module that can be precisely moved horizontally to facilitate alignment of the cutting planes of athermal AWGs, and methods of making the same.
Technical scheme
To achieve the above object, according to one aspect of the present disclosure, there is provided a temperature compensation module installed in an Arrayed Waveguide Grating (AWG) to manually compensate for external temperature variation, the temperature compensation module including a base attached to the AWG and a moving member attached to the base, wherein the base includes: a first fixed component attached to a first chiplet comprising input waveguides of an AWG; a second fixed component attached to a second chiplet comprising input slab waveguides of the AWG; an aperture as a gap between the first and second fixing members, the aperture being arranged to include a cutting plane within the gap, the cutting plane for separating the AWG into a first chiplet and a second chiplet; anda shape elastic member to assist the linear movement of the first fixing member and to connect the first fixing member with the second fixing member, and a moving member attached to the first fixing member to horizontally move the first sub-chip of the AWG in a direction to reduce a change in the central wavelength with a change in temperature.
In accordance with embodiments of the present disclosure, the base can be expanded to a size sufficient to accommodate the entire AWG chip. I.e., can be changed to a substrate integrated compensation module for receiving the entire AWG chip.
According to an embodiment of the present disclosure, each of the first and second fixing members may include a slit as a protruding plane to apply an adhesive for fixing the AWG and a dam having a concave shape to isolate the slit to prevent the adhesive from flowing.
According to an embodiment of the present disclosure, the base may include an upper substrate attached to the AWG and a lower substrate formed on a surface opposite to a surface of the upper substrate to which the AWG is attached, and one end of the moving member is attached to the lower substrate.
According to an embodiment of the present disclosure, the upper substrate and the lower substrate may be integrally formed.
According to an embodiment of the present disclosure, the lower substrate may include a guide hole for guiding the linear movement of the moving member.
According to an embodiment of the present disclosure, the moving member may be made of a material having a higher thermal expansion coefficient than the base, and the base may be made of one of metal, plastic, silicon, and silicon dioxide based materials having a lower thermal expansion coefficient than the moving member.
According to another aspect of the present disclosure, there is provided an athermal AWG comprising an AWG planar substrate, the AWG planar substrate comprising an input waveguide, an input slab waveguide, an arrayed waveguide, an output slab waveguide, and an output waveguide, wherein a temperature compensation module is mounted on or below the planar substrate, the temperature compensation module comprising a base attached to the AWG and a moving member attached to the base, the base comprising: a first fixing member and a second fixing member, each of which is attached to the AWG and separated from each other; a hole as a gap between the first fixing member and the second fixing member; and
a shape elastic member to assist the linear movement of the first fixing member and to connect the first fixing member and the second fixing member; and a moving member is attached to the first fixed part to move horizontally in a direction such that a change in the center wavelength decreases with a change in the temperature of the AWG.According to an embodiment of the present disclosure, the planar substrate may be separated into a first sub-chip including the input waveguide and a second sub-chip including the input slab waveguide by a cutting plane formed between the input waveguide and the input slab waveguide or inside the input slab waveguide.
According to an embodiment of the present disclosure, the first fixing member may be attached to the first sub-chip, the second fixing member may be attached to the second sub-chip, and the moving member may be attached to the first fixing member to allow the first sub-chip to make parallel movement along the cutting plane.
According to yet another aspect of the present disclosure, there is provided a method of manufacturing an athermal AWG using a temperature compensation module, the method comprising preparingAn AWG planar substrate comprising an input waveguide, an input slab waveguide, an arrayed waveguide, an output slab waveguide, and an output waveguide, a temperature compensation module being positioned on or below the AWG, and the temperature compensation module being attached to the AWG, wherein the temperature compensation module comprises a base attached to the AWG and a moving member attached to the base, the base comprising: a first fixing member and a second fixing member, each of which is attached to the AWG and separated from each other as a hole of a gap between the first fixing member and the second fixing member; and
a shape elastic member to assist the linear movement of the first fixing member and to connect the first fixing member and the second fixing member; and a moving member is attached to the first fixed part to move horizontally in a direction such that a change in the center wavelength decreases with a change in the temperature of the AWG.In accordance with an embodiment of the present disclosure, placing the temperature compensation module on or under the AWG may include placing a cutting plane within the bore, the cutting plane for separating the AWG into a first chiplet including an input waveguide and a second chiplet including an input slab waveguide.
According to an embodiment of the present disclosure, the method may further include: cutting or incising into the input slab waveguide between the input waveguide and the input slab waveguide to separate the AWG into a first chiplet including the input waveguide and a second chiplet including the input slab waveguide.
According to embodiments of the present disclosure, attaching the temperature compensation module to the AWG may include attaching a first fixed component to the first chiplet and a second fixed component to the second chiplet.
According to an embodiment of the present disclosure, attaching the temperature compensation module to the AWG may include applying an adhesive to the slit, wherein the slit is a plane protruding from each of the first fixing member and the second fixing member, and attaching the slit of the first fixing member to the first sub-chip and attaching the slit of the second fixing member to the second sub-chip, wherein each of the first fixing member and the second fixing member includes a dam having a recessed shape, the dam isolating the slit to prevent the adhesive from flowing.
Advantageous effects
The present disclosure provides athermal Arrayed Waveguide Gratings (AWGs) that facilitate alignment of the cutting plane of the AWGs and achieve precise horizontal movement without changing the differences in the vertical gap and the cutting plane through a temperature compensation module capable of precise horizontal movement. Thereby, it is possible to easily apply the thermal compensation material to the upper and lower ends in movement and uniformly maintain the center wavelength of the AWG device regardless of temperature change. In addition, the manufacturing process can be simplified by simply attaching one modular temperature compensation module to the chip, and ultimately the reliability and productivity of the product are increased.
Effects that can be obtained by the present disclosure are not limited to the above-described effects, and other effects not mentioned herein will be clearly understood by those of ordinary skill in the art from the following description.
Drawings
Fig. 1 shows a generic Arrayed Waveguide Grating (AWG) structure in accordance with an embodiment of the present disclosure.
Fig. 2 illustrates a basic structure of a temperature compensation module according to an embodiment of the present disclosure.
Fig. 3 illustrates the alignment of a temperature compensation module and an AWG, according to an embodiment of the present disclosure.
Fig. 4a to 4f illustrate the structure of a first modification of the temperature compensation module according to the embodiment of the present disclosure.
Fig. 5 illustrates a structure of a second modification of the temperature compensation module according to the embodiment of the present disclosure.
Fig. 6a to 6c illustrate top and side structures of a temperature compensation module according to an embodiment of the present disclosure.
Fig. 7a to 7c show examples of AWGs having temperature compensation modules of various structures, according to embodiments of the present disclosure.
Detailed Description
These and other advantages and features of the present disclosure, as well as methods for accomplishing the same, will become apparent by reference to the following detailed description of embodiments when taken in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below and will be embodied in many different forms, and these embodiments are provided only to complete the present disclosure and to assist those of ordinary skill in the art to which the present disclosure pertains to fully understand the scope of the present invention, and the present disclosure is limited only by the scope of the appended claims.
Shapes, sizes, proportions, angles, and numbers shown in the drawings for describing the embodiments of the present disclosure are provided by way of illustration, and the present disclosure is not limited thereto. In addition, in describing the present disclosure, when it is considered that some detailed description of well-known related art unnecessarily obscures the key subject matter of the present disclosure, the detailed description is omitted herein. The term "comprising" or "including" as used herein does not exclude the presence or addition of other components, unless "only" is used. As used herein, the singular forms also include the plural forms unless the context clearly dictates otherwise.
In interpreting the components, error ranges should be interpreted to be inclusive unless the context clearly dictates otherwise.
In the description of the positional relationship, for example, when the positional relationship of two components is described using "on.," above "," below "," beside., "unless" directly (indirectly) "or" directly (directly) "is used, at least one intermediate component may be present.
When an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening elements or layers may be present. Like reference numerals refer to like parts throughout the specification.
The terms "first", "second", etc. are used to describe various components, but it is apparent that these components are not limited by the terms. These terms are used to distinguish one element from another. Therefore, it is apparent that the first component as used herein may be the second component within the technical spirit of the present disclosure.
The size and thickness of each component in the drawings are shown for convenience of description, and the present disclosure is not necessarily limited to the size and thickness of the components shown in the drawings.
Each feature of the embodiments of the present disclosure may be partially or wholly combined or grouped together, and various technical connections and synergies are possible as well understood by those of ordinary skill in the art, and each embodiment may be performed independently of each other or in combination with each other.
The athermal AWG according to an embodiment of the present disclosure is cut or incised into the input slab waveguide 2 between the input waveguide 1 and the input slab waveguide 2 to compensate for the change in the center wavelength by changing the position of the incident light with the change in temperature. To this end, the structure of the temperature compensation module for easy alignment of the cutting plane of the athermal AWG and precise horizontal movement with expansion/contraction of the thermal compensation material is shown in fig. 2 to 5 below.
Fig. 2 shows a basic structure of a
Referring to fig. 2, a basic structure of a
The
The first and second fixing
The
Fig. 3 illustrates the alignment of the
Referring to fig. 3, when the
The
For example, as shown in fig. 3, when the center line of the
According to an embodiment of the present disclosure, the step of cutting the AWG into the
Fig. 4a and 4b illustrate upper and lower plate structures of a first modification of the
Referring to fig. 4a and 4b, the first modified form of the
Fig. 4c shows a variation of the first modified form of the
Fig. 4d to 4f show further variants of the first modified form of the
Referring to fig. 4d, the moving
Referring to fig. 4e, as shown in fig. 4d, the first fixing
Referring to fig. 4f, as shown in fig. 4e, the first fixing
For example, the first modified form of the
Fig. 5 shows a structure of a second modification of the
Referring to fig. 5, the second modified form of the
Fig. 6a to 6c illustrate the top and side structures of the
Referring to fig. 6a, the
Fig. 7a to 7c show examples of AWGs having
Referring to fig. 7a, an AWG is shown in basic form with a
Referring to fig. 7b, an AWG having a first modification of the
Referring to fig. 7c, an AWG having a second modified version of the
The
In the foregoing detailed description, components included in the present disclosure are represented in singular or plural forms according to the present detailed description. However, for convenience of description, the singular or plural form is appropriately selected for the context presented, and the above-described embodiments are not limited to the singular or plural form of components, and components expressed in the plural form may be singular and components expressed in the singular form may be plural.
Although specific embodiments have been described in the detailed description, various modifications may be made without departing from the technical spirit and scope covered by the various embodiments. Accordingly, the scope of the disclosure should not be limited to the disclosed embodiments, but should be defined by the appended claims and equivalents thereof.
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