Stack temperature monitoring method, device, equipment and readable storage medium

文档序号:1227768 发布日期:2020-09-08 浏览:26次 中文

阅读说明:本技术 一种堆放物温度监控方法、装置、设备及可读存储介质 (Stack temperature monitoring method, device, equipment and readable storage medium ) 是由 田鹏路 魏庆波 袁俊 曾骥敏 宋亚杰 张少男 李志超 任新宇 陈家熠 于 2020-05-29 设计创作,主要内容包括:本申请公开了一种堆放物温度监控方法、装置、设备及计算机可读存储介质,其中,该方法包括:利用设置在堆放物内部不同位置处的温度元件获取对应位置处的温度值;根据各测温元件的位置及各测温元件测量的温度值,确定堆放物内部的温度分布;将堆放物内部的温度分布与正常堆放温度进行实时比较,若存在温度分布中的温度值大于正常堆放温度,则进行提示。本申请公开的上述技术方案,可以通过测温元件的位置和测温元件测量的温度值得到堆放物内部的温度分布,以实现对堆放物内部各处温度的监控,并能够在监控过程中通过比较和提示及时且准确地发现温度超限这一安全隐患,从而便于提高堆放物堆放的安全性。(The application discloses a method, a device, equipment and a computer readable storage medium for monitoring temperature of stacked objects, wherein the method comprises the following steps: acquiring temperature values at corresponding positions by using temperature elements arranged at different positions in the stack; determining the temperature distribution in the stacking object according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element; and comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature. The above-mentioned technical scheme that this application discloses, the temperature value that can measure through temperature element's position and temperature element obtains the inside temperature distribution of stack to the realization is to the inside control of temperature everywhere of stack, and can in time and accurately discover this potential safety hazard of temperature overrun through comparison and suggestion in the monitoring process, thereby is convenient for improve the security that the stack was stacked.)

1. A method for monitoring temperature of a stack, comprising:

acquiring temperature values at corresponding positions by using temperature measuring elements arranged at different positions in the stack;

determining the temperature distribution in the stack according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element;

and comparing the temperature distribution in the stacked object with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature.

2. The method for monitoring temperature of stacks according to claim 1, further comprising, before determining the temperature distribution inside the stacks based on the position of each temperature measuring element and the temperature value measured by each temperature measuring element:

and cleaning the data of the temperature values measured by the temperature measuring elements.

3. The method for monitoring the temperature of the stacks according to claim 2, wherein determining the temperature distribution inside the stacks according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements comprises:

calculating the average temperature of two adjacent temperature values, and taking the average temperature as the temperature value of the corresponding position; the corresponding position is the middle position of the position corresponding to each of the two adjacent temperature values;

and obtaining the temperature distribution in the stacking object by using the temperature values.

4. The method for monitoring the temperature of the stacks according to claim 2, wherein obtaining the temperature distribution inside the stacks comprises:

and obtaining a temperature distribution map of the interior of the stacking object.

5. The method for monitoring the temperature of the stacked objects according to claim 4, wherein if the temperature value in the temperature distribution is higher than the normal stacking temperature, prompting comprises:

if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is greater than a first preset value, determining the temperature value as a first prompt level, and alarming;

if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than the first preset value and is more than a second preset value, determining the temperature distribution to be a second prompt level, and displaying a preset first color corresponding to the second prompt level;

and if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than the second preset value and is more than a third preset value, determining the temperature distribution to be a third prompt level, and displaying a preset second color corresponding to the third prompt level.

6. The temperature monitoring method for stacks according to claim 4, further comprising:

and if the temperature distribution map determines that the temperature mutation occurs in the area larger than the preset area, alarming.

7. A temperature monitoring device for a stack, comprising:

the acquisition module is used for acquiring temperature values at corresponding positions by utilizing temperature measuring elements arranged at different positions in the stack;

the determining module is used for determining the temperature distribution in the stacking object according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element;

and the comparison module is used for comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is greater than the normal stacking temperature.

8. The temperature monitoring device for stacked objects according to claim 7, further comprising:

and the cleaning module is used for cleaning data of the temperature values measured by the temperature measuring elements before determining the temperature distribution in the stack according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements.

9. A temperature monitoring apparatus for a stack, comprising:

a memory for storing a computer program;

a processor for implementing the steps of the method for monitoring temperature of stack of claims 1 to 6 when executing the computer program.

10. A computer-readable storage medium, having stored thereon a computer program which, when executed by a processor, implements the steps of the method for monitoring temperature of stacked objects according to any one of claims 1 to 6.

Technical Field

The present disclosure relates to the field of stack temperature monitoring technologies, and in particular, to a method, an apparatus, a device, and a computer-readable storage medium for monitoring stack temperature.

Background

With the development of modern science and technology and living standard, various products and intermediate substances inevitably have a large amount of mining and stacking demands, such as coal, ore and the like, and the stacking quality is large, the temperature condition of the deep part of the stacking substance can not be controlled in real time, and the great safety and economic loss risks are provided, so that the temperature of the deep part of the stacking substance needs to be monitored, the potential safety hazard can be found in time, and the stacking safety of the stacking substance is improved.

At present, the temperature monitoring of the stacked objects is usually realized in a manual mode, specifically, a temperature detector is manually inserted into the stacked objects to acquire the temperature value in the deep position of the stacked objects, and whether the stacked objects have the potential safety hazard of temperature overrun is judged manually according to the acquired temperature value, the temperature monitoring mode has randomness and untimely property, the temperature condition inside the stacked objects with larger size cannot be acquired, and therefore the potential safety hazard of temperature overrun cannot be timely and accurately found in the conventional temperature monitoring mode.

In summary, how to timely and accurately find the potential safety hazard of the temperature of the stacked objects exceeding the limit, so as to improve the safety of stacking the stacked objects, is a technical problem to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, an object of the present application is to provide a method, an apparatus, a device and a computer-readable storage medium for monitoring temperature of stacked objects, which are used to timely and accurately detect a potential safety hazard of temperature overrun of the stacked objects, so as to facilitate improvement of safety of stacking of the stacked objects.

In order to achieve the above purpose, the present application provides the following technical solutions:

a temperature monitoring method for a stack, comprising:

acquiring temperature values at corresponding positions by using temperature measuring elements arranged at different positions in the stack;

determining the temperature distribution in the stack according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element;

and comparing the temperature distribution in the stacked object with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature.

Preferably, before determining the temperature distribution inside the stack according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element, the method further comprises:

and cleaning the data of the temperature values measured by the temperature measuring elements.

Preferably, the determining the temperature distribution inside the stack according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element includes:

calculating the average temperature of two adjacent temperature values, and taking the average temperature as the temperature value of the corresponding position; the corresponding position is the middle position of the position corresponding to each of the two adjacent temperature values;

and obtaining the temperature distribution in the stacking object by using the temperature values.

Preferably, obtaining the temperature distribution inside the stack includes:

and obtaining a temperature distribution map of the interior of the stacking object.

Preferably, if the temperature value in the temperature distribution is greater than the normal stacking temperature, prompting is performed, including:

if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is greater than a first preset value, determining the temperature value as a first prompt level, and alarming;

if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than the first preset value and is more than a second preset value, determining the temperature distribution to be a second prompt level, and displaying a preset first color corresponding to the second prompt level;

and if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than the second preset value and is more than a third preset value, determining the temperature distribution to be a third prompt level, and displaying a preset second color corresponding to the third prompt level.

Preferably, the method further comprises the following steps:

and if the temperature distribution map determines that the temperature mutation occurs in the area larger than the preset area, alarming.

A temperature monitoring device for a stack, comprising:

the acquisition module is used for acquiring temperature values at corresponding positions by utilizing temperature measuring elements arranged at different positions in the stack;

the determining module is used for determining the temperature distribution in the stacking object according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element;

and the comparison module is used for comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is greater than the normal stacking temperature.

Preferably, the method further comprises the following steps:

and the cleaning module is used for cleaning data of the temperature values measured by the temperature measuring elements before determining the temperature distribution in the stack according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements.

A temperature monitoring apparatus for a stack, comprising:

a memory for storing a computer program;

a processor for implementing the steps of the method for monitoring temperature of a stack as described in any one of the above when the computer program is executed.

A computer-readable storage medium having stored thereon a computer program which, when executed by a processor, carries out the steps of a method of temperature monitoring of a stack as claimed in any one of the preceding claims.

The application provides a method, a device, equipment and a computer-readable storage medium for monitoring temperature of stacked objects, wherein the method comprises the following steps: acquiring temperature values at corresponding positions by using temperature elements arranged at different positions in the stack; determining the temperature distribution in the stacking object according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element; and comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature.

The above-mentioned technical scheme that the application discloses, utilize the temperature value that sets up the inside temperature element measurement of stack thing corresponds position department, obtain the inside temperature distribution of stack thing according to temperature element's position and temperature value, with comprehensive and the accuracy that the inside temperature of realization stack thing acquireed, after acquireing the inside temperature distribution of stack thing, carry out real-time comparison and suggestion when appearing unusually with this temperature distribution and normal stack temperature, with the realization to the inside control everywhere of stack thing, and can in time and accurately discover this potential safety hazard of temperature overrun through comparison and suggestion in the monitoring process, thereby be convenient for improve the security that the stack thing was stacked.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a flowchart of a method for monitoring temperature of a stack according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the arrangement of temperature measuring elements within a stack according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a device for monitoring temperature of stacked objects according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a device for monitoring temperature of stacked objects according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, which shows a flowchart of a method for monitoring temperature of a stack provided in an embodiment of the present application, the method for monitoring temperature of a stack provided in an embodiment of the present application may include:

s11: and acquiring temperature values at corresponding positions by using temperature measuring elements arranged at different positions in the stack.

In view of the problems of randomness, inaccuracy and the like in the conventional manual monitoring of the temperature of the stacked objects, temperature measuring elements (such as temperature sensing elements) can be arranged at different positions in the stacked objects in advance, specifically, the temperature measuring elements can be arranged in a layer and matrix manner in the stacking process of the stacked objects, and the temperature measuring elements can be connected through hardware materials such as plastic pipes or can be connected through soft materials such as nylon. In addition, the temperature measuring elements can be arranged in a layer at intervals of D meters (the size of D can be specifically set as required) according to the height of the stacked object, and the interval between two adjacent temperature measuring elements on each layer can be D meters (the size of D can be specifically set as required), specifically, see fig. 2, which shows a distribution schematic diagram of the temperature measuring elements in the stacked object provided by the embodiment of the present application, and here, the stacked object is in a pyramid form, and three temperature measuring element layers are arranged in the stacked object for example, and in fig. 2, lines on each layer of temperature measuring elements represent connectors between the temperature measuring elements, and the intersection parts of the lines are the temperature measuring elements.

After the temperature measuring elements are arranged, the temperature measuring elements can be marked, the positions of the temperature measuring elements can be obtained, and the positions of the temperature measuring elements can be arranged to obtain a temperature measuring element monitoring matrix:

wherein x isnIndicating a temperature measuring element located at the n-th layer, ynRepresenting the nth temperature sensing element of the corresponding layer. It should be noted that the temperature measuring elements may also be arranged in other manners, and the arrangement manner of the temperature measuring elements is not limited in this application.

After the temperature measuring elements are arranged, the temperature values of the positions where the temperature measuring elements are located can be measured by the aid of the temperature measuring elements, the temperature values measured by the temperature measuring elements can be numbered, the temperature values measured by the temperature measuring elements can be sequentially acquired according to the arrangement sequence of the temperature measuring elements, and after the temperature measuring elements are arranged in the above mode, the corresponding measured temperature values can be expressed as follows:

Figure BDA0002516148840000052

in the above-described representation, it is,

Figure BDA0002516148840000053

is shown at xnynMeasured by a temperature-measuring element at the locationThe temperature value obtained. It should be noted that the temperature measuring element may be used to obtain the temperature value at the corresponding position in real time, and of course, the temperature value at the corresponding position may also be obtained at regular time according to the requirement of the worker.

S12: and determining the temperature distribution in the stacking object according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements.

After the temperature values at the corresponding positions are obtained through the temperature measuring elements, the temperature distribution in the stacked object can be determined according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements, namely the temperature values at other positions in the stacked object can be obtained through the measured temperature values, and the temperature distribution in the stacked object can be obtained.

S13: and comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature.

After obtaining the inside temperature distribution of stack thing, can compare in real time with normal temperature of stacking the inside temperature distribution of stack thing, specifically can utilize the mode of ratio to compare in real time, compare through the mode of k being YX promptly, wherein, Y is the temperature value in the inside temperature distribution of stack thing, and X is normal temperature of stacking. During real-time comparison, if the temperature value in the temperature distribution is not greater than the normal stacking temperature (specifically, the temperature may be room temperature or may be a temperature set according to the property of the stacked objects), that is, if k is less than or equal to 1, a normal color, for example, blue may be displayed on the foreground, and of course, other colors may also be preset as normal colors and displayed, so that the worker can know that the stacked objects do not have the potential safety hazard of temperature overrun through the displayed colors; if the temperature value in the temperature distribution is higher than the normal stacking temperature, the potential safety hazard that the temperature of the stacked objects is out of limit is indicated, and at the moment, the prompt can be performed, so that the worker can timely know the situation through the prompt, and the worker can take preventive measures in time to improve the stacking safety of the stacked objects.

Compared with the prior art that the temperature measurement is carried out by inserting a manual handheld temperature detector into the deep position of the stacked object, randomness and limitation to the size of the stacked object can exist, the temperature measurement device can directly measure the temperature value of the corresponding position by utilizing the temperature measuring element arranged in the stacked object in advance and acquire the temperature distribution in the stacked object by determination, so that the accuracy and timeliness of the temperature measurement in the stacked object can be improved, the limitation of the size of the stacked object is avoided, in addition, whether the temperature of the stacked object exceeds the limit or not can be timely and accurately found by comparing the temperature distribution in the stacked object with the normal stacking temperature, a prompt can be timely sent out when the temperature exceeds the limit, the potential safety hazard that the temperature of the stacked object exceeds the limit can be timely and accurately found, and the stacking safety of the stacked object can be conveniently improved. In addition, the process of monitoring the temperature of the piled materials is simple and does not need to be participated manually, so that the temperature monitoring cost is low.

The above-mentioned technical scheme that the application discloses, utilize the temperature value that sets up the inside temperature element measurement of stack thing corresponds position department, obtain the inside temperature distribution of stack thing according to temperature element's position and temperature value, with comprehensive and the accuracy that the inside temperature of realization stack thing acquireed, after acquireing the inside temperature distribution of stack thing, carry out real-time comparison and suggestion when appearing unusually with this temperature distribution and normal stack temperature, with the realization to the inside control everywhere of stack thing, and can in time and accurately discover this potential safety hazard of temperature overrun through comparison and suggestion in the monitoring process, thereby be convenient for improve the security that the stack thing was stacked.

The method for monitoring the temperature of the stacked objects provided by the embodiment of the application can further include, before determining the temperature distribution inside the stacked objects according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements:

and cleaning the data of the temperature values measured by the temperature measuring elements.

Before the temperature distribution in the stacked object is determined, data cleaning such as drying removal and missing value processing can be carried out on the temperature values measured by the temperature measuring elements, so that the accuracy of the finally obtained temperature distribution in the stacked object is improved.

According to the method for monitoring the temperature of the stacked objects, provided by the embodiment of the application, the temperature distribution in the stacked objects is determined according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements, and the method can comprise the following steps:

calculating the average temperature of two adjacent temperature values, and taking the average temperature as the temperature value of the corresponding position; wherein, the corresponding position is the middle position of the position corresponding to the two adjacent temperature values respectively;

and obtaining the temperature distribution inside the stack by using the temperature values.

The specific process of determining the temperature distribution in the stacking object according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements is as follows: making two adjacent temperature values in uniform distribution, that is, calculating an average temperature of the two adjacent temperature values, and taking the average temperature as a temperature value at a middle position of a position corresponding to each of the two adjacent temperature values, and then, returning to the step of calculating an average value of the two adjacent temperature values to obtain a plurality of temperature values, for example: can be paired withAndaveraging to obtain

Figure BDA0002516148840000073

Then, can be paired withAndthe average value … … and so on are obtained to obtain temperature values at a plurality of positions, and then the temperature distribution inside the stack can be obtained using all the obtained temperature values (including those measured by the temperature measuring element and those calculated by averaging).

The above manner of acquiring the temperature distribution inside the stacked object is simple and convenient, and therefore, the efficiency of acquiring the temperature distribution inside the stacked object can be improved. Of course, the temperature distribution inside the stack may be obtained by other methods, such as fitting the temperature values measured by the temperature measuring elements to obtain the temperature distribution inside the stack.

The method for monitoring the temperature of the stacked object provided by the embodiment of the application obtains the temperature distribution inside the stacked object, and can include the following steps:

and obtaining a temperature distribution diagram of the interior of the stacking object.

When the temperature distribution inside the stacked object is obtained, the temperature distribution map inside the stacked object can be specifically obtained, so that the temperature distribution inside the stacked object can be intuitively obtained through the temperature distribution map.

According to the method for monitoring the temperature of the stacked objects provided by the embodiment of the application, if the temperature value in the temperature distribution is larger than the normal stacking temperature, the prompt is performed, and the method can include the following steps:

if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is greater than a first preset value, determining the temperature value as a first prompt level, and alarming;

if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than the first preset value and is more than the second preset value, determining the temperature distribution as a second prompt level, and displaying a preset first color corresponding to the second prompt level on the foreground;

and if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than the second preset value and is more than a third preset value, determining the temperature distribution as a third prompt level, and displaying a preset second color corresponding to the third prompt level on the foreground.

In the monitoring of stack temperature that this application provided, if there is the temperature value in the temperature distribution and is greater than normal stack temperature, then the concrete mode that carries out the suggestion can be: if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is greater than a first preset value (the first preset value can be a numerical value greater than 2, and certainly can also be other numerical values greater than 1), determining the temperature distribution as a first prompt level, and at the moment, alarming can be performed so that a worker can take preventive measures in time; if the temperature value in the temperature distribution is not greater than the first preset value and is greater than a second preset value (the second preset value is smaller than the first preset value, and the second preset value is greater than 1), determining the temperature value as a second prompt level, displaying a preset first color corresponding to the second prompt level, so that a worker can know that the temperature value is at the second prompt level currently through the displayed first color, and taking measures corresponding to the second prompt level; if the temperature value in the temperature distribution is not greater than the second preset value and is greater than a third preset value (the third preset value is smaller than the second preset value and is greater than 1), determining the temperature value as a third prompt level, and adopting a second color corresponding to the third prompt level, so that a worker can know that the temperature value is currently at the third prompt level through the displayed second color and adopt measures corresponding to the third prompt level, thereby being convenient for improving the stacking safety of stacked objects.

In the above process, the severity of the first prompt level, the second prompt level and the third prompt level decreases in sequence, and the first color is different from the second color. In addition, it should be noted that, the above description is given by taking three prompt levels as an example, and of course, a plurality of different prompt levels may be set according to the ratio of the temperature value to the normal stacking temperature, so that the worker can know the current situation of the stacked objects according to the prompt corresponding to each prompt level, and can conveniently and accurately take the corresponding measures corresponding to the prompt levels according to the prompt, thereby improving the safety of stacking the stacked objects.

The method for monitoring the temperature of the stacked objects provided by the embodiment of the application can further comprise the following steps:

and if the temperature distribution map determines that the temperature mutation occurs in the area larger than the preset area, alarming.

In the control of stack thing temperature that this application provided, if confirm through the temperature distribution diagram that finally obtains that there is the area to be greater than the regional sudden change of temperature that takes place of predetermineeing the area, then can report to the police to whether the staff can in time look over the stack thing and exist unusually, and the staff of being convenient for in time take measures to deal with when the stack thing is unusual, thereby guarantee the security of stack thing.

An embodiment of the present application further provides a temperature monitoring device for stacked objects, and referring to fig. 3, it shows a schematic structural diagram of the temperature monitoring device for stacked objects provided in the embodiment of the present application, and the temperature monitoring device for stacked objects may include:

the acquisition module 31 is used for acquiring temperature values at corresponding positions by using temperature measuring elements arranged at different positions in the stack;

the determining module 32 is configured to determine a temperature distribution inside the stack according to a position of each temperature measuring element and the temperature value measured by each temperature measuring element;

and the comparison module 33 is configured to compare the temperature distribution inside the stacked object with the normal stacking temperature in real time, and prompt if the temperature value in the temperature distribution is greater than the normal stacking temperature.

The temperature monitoring device for the stacked objects provided by the embodiment of the application can further comprise:

and the cleaning module is used for cleaning data of the temperature values measured by the temperature measuring elements before determining the temperature distribution in the stacking object according to the positions of the temperature measuring elements and the temperature values measured by the temperature measuring elements.

In an embodiment of the present application, the determining module 32 may include:

the calculation unit is used for calculating the average temperature of the two adjacent temperature values and taking the average temperature as the temperature value of the corresponding position; wherein, the corresponding position is the middle position of the position corresponding to the two adjacent temperature values respectively;

and the temperature distribution unit is used for obtaining the temperature distribution in the stacked object by using the temperature values.

In an embodiment of the present application, the determining module 32 may include:

and obtaining a temperature distribution diagram unit for obtaining the temperature distribution diagram inside the stacking object.

In the device for monitoring temperature of stacked objects provided by the embodiment of the present application, the comparing module 33 may include:

the alarm unit is used for determining a first prompt level and giving an alarm if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is greater than a first preset value;

the first display unit is used for determining the temperature distribution as a first prompt grade if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than a first preset value and is more than a second preset value, and displaying a preset first color corresponding to the first prompt grade on the foreground;

and the second display unit is used for determining a third prompt grade if the ratio of the temperature value in the temperature distribution to the normal stacking temperature is not more than a second preset value and is more than a third preset value, and displaying a preset second color corresponding to the third prompt grade on the foreground.

The device for monitoring the temperature of the stacked objects provided by the embodiment of the application can also comprise a temperature sensor;

and the alarm module is used for giving an alarm if the temperature distribution map determines that the temperature mutation occurs in the area larger than the preset area.

An embodiment of the present application further provides a stack temperature monitoring device, and referring to fig. 4, a schematic structural diagram of the stack temperature monitoring device provided in the embodiment of the present application is shown, and the stack temperature monitoring device may include:

a memory 41 for storing a computer program;

the processor 42, when executing the computer program stored in the memory 41, may implement the following steps:

acquiring temperature values at corresponding positions by using temperature elements arranged at different positions in the stack; determining the temperature distribution in the stacking object according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element; and comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature.

An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, can implement the following steps:

acquiring temperature values at corresponding positions by using temperature elements arranged at different positions in the stack; determining the temperature distribution in the stacking object according to the position of each temperature measuring element and the temperature value measured by each temperature measuring element; and comparing the temperature distribution in the stacked objects with the normal stacking temperature in real time, and prompting if the temperature value in the temperature distribution is higher than the normal stacking temperature.

For a description of relevant parts in the device, the equipment and the computer-readable storage medium for monitoring the temperature of the stacked object provided in the embodiment of the present application, reference may be made to the detailed description of corresponding parts in the method for monitoring the temperature of the stacked object provided in the embodiment of the present application, and details are not repeated here.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include elements inherent in the list. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. In addition, parts of the above technical solutions provided in the embodiments of the present application, which are consistent with the implementation principles of corresponding technical solutions in the prior art, are not described in detail so as to avoid redundant description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

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