Electronic equipment and manufacturing method thereof, unmanned aerial vehicle, remote controller and mobile terminal

文档序号:1256933 发布日期:2020-08-21 浏览:7次 中文

阅读说明:本技术 电子设备及其制造方法、无人机、遥控器和移动终端 (Electronic equipment and manufacturing method thereof, unmanned aerial vehicle, remote controller and mobile terminal ) 是由 田川 刘双 陈涛 于 2019-07-18 设计创作,主要内容包括:一种电子设备及其制造方法、无人机、遥控器和移动终端,电子设备、无人机、遥控器或移动终端包括:电路板、壳体和功率放大器。壳体罩设在电路板上并与电路板共同围设出腔体;功率放大器设置在电路板上,并位于腔体内,功率放大器包括金属封装,金属封装与壳体短路连接,从而破坏功率放大器附近的场分布,抑制功率放大器输入和输出的空间耦合或破坏由结构件、电路等的自身寄生参数引入的反馈网络,避免由此引发的正反馈所导致的包括但不限于功率放大器潜在不稳定、自激、频谱凸包或杂散增益大于功率放大器增益等问题,且金属封装与壳体短路连接的方式结构简单、成本低。(An electronic device and a manufacturing method thereof, an unmanned aerial vehicle, a remote controller and a mobile terminal are provided, wherein the electronic device, the unmanned aerial vehicle, the remote controller or the mobile terminal comprises: circuit board, casing and power amplifier. The shell is covered on the circuit board and encloses a cavity together with the circuit board; the power amplifier is arranged on the circuit board and positioned in the cavity, the power amplifier comprises a metal package, the metal package is in short-circuit connection with the shell, so that field distribution near the power amplifier is damaged, spatial coupling of input and output of the power amplifier is inhibited or a feedback network introduced by self parasitic parameters of a structural member, a circuit and the like is damaged, the problems of potential instability, self excitation, spectrum convex hull or stray gain larger than the gain of the power amplifier and the like of the power amplifier caused by positive feedback caused by the damage are avoided, and the mode of short-circuit connection of the metal package and the shell is simple in structure and low in cost.)

1. An electronic device, comprising:

a circuit board;

the shell is covered on the circuit board and encloses a cavity together with the circuit board; and

the power amplifier is arranged on the circuit board and positioned in the cavity, and comprises a metal package, and the metal package is in short-circuit connection with the shell.

2. The electronic device of claim 1,

the metal package with be equipped with electrically conductive connecting piece between the casing, electrically conductive connecting piece with the metal package with the casing is all connected, in order to pass through electrically conductive connecting piece realizes the metal package with the short circuit of casing is connected.

3. The electronic device of claim 2,

a gap is formed between the metal package and the shell, and the conductive connecting piece comprises conductive filler filled in the gap.

4. The electronic device of claim 3,

the conductive filler comprises at least one of conductive foam, carbon fiber and conductive adhesive.

5. The electronic device of claim 2,

the metal package has a gap with the housing, and the conductive connector includes an elastic member supported between the metal package and the housing.

6. The electronic device of claim 2,

the conductive connecting piece and one of the shell and the metal package are of an integrated structure.

7. The electronic device of claim 6,

the conductive connecting piece comprises a bulge part formed by protruding one of the inner wall surface of the shell and the outer wall surface of the metal package towards the other direction; alternatively, the first and second electrodes may be,

one of the shell and the metal package is provided with a punching tongue, one end of the punching tongue is a free end, the other end of the punching tongue is connected with one of the shell and the metal package, and the punching tongue is punched towards the other direction of the shell and the metal package to form the conductive connecting piece.

8. The electronic device of claim 2,

the conductive connecting piece is made of conductive and heat-conducting materials.

9. The electronic device of claim 8,

the conductive connecting piece comprises a heat conduction gasket, and conductive particles are filled in the heat conduction gasket; alternatively, the first and second electrodes may be,

the conductive connecting piece comprises a conductive shell, and a heat conduction material is wrapped in the conductive shell.

10. The electronic device of any of claims 1-9,

the metal package comprises a first area, the shell comprises a second area, the distance between the first area and the second area is the minimum distance between the metal package and the shell, and the first area and the second area are in short circuit connection.

11. The electronic device of any of claims 1-9,

the wall surface of the shell facing the circuit board is in short circuit connection with the wall surface of the metal package, which is far away from the circuit board.

12. The electronic device of any of claims 1-9,

a magnetic material is disposed between the housing and the metal encapsulation.

13. The electronic device of any of claims 1-9,

the metal package is grounded.

14. An unmanned aerial vehicle, comprising:

a circuit board;

the shell is covered on the circuit board and encloses a cavity together with the circuit board; and

the power amplifier is arranged on the circuit board and positioned in the cavity, and comprises a metal package, and the metal package is in short-circuit connection with the shell.

15. A remote controller, wherein,

a circuit board;

the shell is covered on the circuit board and encloses a cavity together with the circuit board; and

the power amplifier is arranged on the circuit board and positioned in the cavity, and comprises a metal package, and the metal package is in short-circuit connection with the shell.

16. A mobile terminal, comprising:

a circuit board;

the shell is covered on the circuit board and encloses a cavity together with the circuit board; and

the power amplifier is arranged on the circuit board and positioned in the cavity, and comprises a metal package, and the metal package is in short-circuit connection with the shell.

17. A manufacturing method for manufacturing the electronic device according to any one of claims 1 to 13, wherein the manufacturing method includes:

providing a circuit board;

coupling a power amplifier to the circuit board;

providing a shell covering the circuit board;

short-circuiting the housing to the metal package of the power amplifier.

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