阅读说明：本技术 半导体和磁控管混合源加热系统 (Semiconductor and magnetron hybrid source heating system ) 是由 殷为民 虢超 于 2019-02-18 设计创作，主要内容包括：本发明提供一种半导体和磁控管混合源加热系统,至少包括：控制单元；高压供电模块,所述高压供电模块与所述控制单元连接；低压供电模块,所述低压供电模块与所述控制单元连接；第一功率产生机构,所述第一功率产生机构与所述高压供电模块连接；第二功率产生机构,所述第二功率产生机构与所述控制单元连接；其中所述第一功率产生机构包括依次连接的磁控管及第一辐射组件,所述磁控管与所述高压供电模块连接；屏蔽腔体,所述第一辐射组件设置在所述屏蔽腔体内,所述屏蔽腔体为金属材质或者包含金属。与现有技术相比,本发明半导体和磁控管混合源加热系统具有以下优点：缩短食物加热的时间,提高食物加热的均匀性,改善食物的口感。(The invention provides a semiconductor and magnetron mixed source heating system, at least comprising: a control unit; the high-voltage power supply module is connected with the control unit; the low-voltage power supply module is connected with the control unit; the first power generation mechanism is connected with the high-voltage power supply module; a second power generation mechanism connected to the control unit; the first power generation mechanism comprises a magnetron and a first radiation assembly which are sequentially connected, and the magnetron is connected with the high-voltage power supply module; the first radiation assembly is arranged in the shielding cavity, and the shielding cavity is made of metal or contains metal. Compared with the prior art, the semiconductor and magnetron mixed source heating system has the following advantages: the heating time of the food is shortened, the heating uniformity of the food is improved, and the mouthfeel of the food is improved.)

1. A semiconductor and magnetron hybrid source heating system comprising at least:

a control unit;

the high-voltage power supply module is connected with the control unit;

the low-voltage power supply module is connected with the control unit;

the first power generation mechanism is connected with the high-voltage power supply module;

a second power generation mechanism connected to the control unit; wherein

The first power generation mechanism comprises a magnetron and a first radiation assembly which are sequentially connected, and the magnetron is connected with the high-voltage power supply module;

the first radiation assembly is arranged in the shielding cavity, and the shielding cavity is made of metal or contains metal.

2. The semiconductor and magnetron hybrid source heating system as claimed in claim 1, wherein said second power generation mechanism comprises:

the signal source, the solid-state power amplifier, the measuring unit and the second radiation component are connected in sequence;

the control unit is respectively connected with the signal source, the solid-state power amplifier and the measuring unit;

the second radiation assembly is arranged in the shielding cavity;

and the low-voltage power supply module is connected with the solid-state power amplifier.

3. The semiconductor and magnetron hybrid source heating system as claimed in claim 2, wherein the low voltage power supply module comprises a first power supply and a second power supply;

the first power supply is connected with the control unit, and the second power supply is connected with the solid-state power amplifier.

4. The semiconductor and magnetron hybrid source heating system as claimed in claim 3 wherein said first power supply and said second power supply are DC low voltage power supplies.

5. The semiconductor and magnetron hybrid source heating system as claimed in claim 1 wherein said high voltage power supply module is a dc high voltage power supply.

6. The semiconductor and magnetron hybrid source heating system of claim 2 wherein said solid state power amplifier is a semiconductor power amplifier.

7. The semiconductor and magnetron hybrid source heating system as claimed in claim 1, wherein said control unit comprises at least a microcontroller and a UI interaction module in communication with each other.

8. The semiconductor and magnetron hybrid source heating system as defined in claim 2 wherein the signal source is a frequency tunable signal source.

Technical Field

The invention relates to a semiconductor and magnetron mixed source heating system.

Background

At present, the microwave oven is utilized to cook or heat food materials, so that the conditions of uneven cooling and heating after the food is heated and poor taste of the food are easy to occur, and the use requirements of users cannot be well met.

Disclosure of Invention

In view of the drawbacks of the prior art, the present invention aims to provide a semiconductor and magnetron hybrid source heating system that solves the above mentioned technical problems.

In order to solve the above technical problem, the present invention provides a semiconductor and magnetron hybrid source heating system, at least comprising: a control unit; the high-voltage power supply module is connected with the control unit; the low-voltage power supply module is connected with the control unit; the first power generation mechanism is connected with the high-voltage power supply module; a second power generation mechanism connected to the control unit; the first power generation mechanism comprises a magnetron and a first radiation assembly which are sequentially connected, and the magnetron is connected with the high-voltage power supply module; the first radiation assembly is arranged in the shielding cavity, and the shielding cavity is made of metal or contains metal.

Preferably, the second power generation mechanism includes: the signal source, the solid-state power amplifier, the measuring unit and the second radiation component are connected in sequence; the control unit is respectively connected with the signal source, the solid-state power amplifier and the measuring unit; the second radiation assembly is arranged in the shielding cavity;

and the low-voltage power supply module is connected with the solid-state power amplifier.

Preferably, the low voltage power supply module comprises a first power supply and a second power supply; the first power supply is connected with the control unit, and the second power supply is connected with the solid-state power amplifier.

Preferably, the first power supply and the second power supply are direct current low voltage power supplies.

Preferably, the high-voltage power supply module is a direct-current high-voltage power supply.

Preferably, the solid-state power amplifier is a semiconductor power amplifier.

Preferably, the control unit at least comprises a microcontroller and a UI interaction module which communicate with each other.

Preferably, the signal source is a frequency-adjustable signal source.

Compared with the prior art, the semiconductor and magnetron mixed source heating system has the following advantages: the heating time of the food is shortened, the heating uniformity of the food is improved, and the mouthfeel of the food is improved.

Drawings

Other characteristic objects and advantages of the invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following figures.

FIG. 1 is a schematic diagram of a first power generation mechanism of a semiconductor and magnetron hybrid source heating system according to the present invention;

FIG. 2 is a schematic diagram of a second power generation mechanism of the semiconductor and magnetron hybrid source heating system of the present invention;

FIG. 3 is a block diagram of a semiconductor and magnetron hybrid source heating system of the present invention.

In the figure:

1-control unit 2-low voltage power supply module 3-magnetron

4-first radiation component 5-signal source 6-solid state power amplifier

7-measuring cell 8-input 9-second radiating element

10-shielded cavity 11-high voltage power supply module 12-food

Detailed Description

The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention.

Fig. 1 is a first power generation mechanism of a semiconductor and magnetron hybrid source heating system according to the present invention. The first power generating mechanism comprises a control unit 1, a high voltage power supply module 11, a magnetron 3 and a first radiation assembly 4.

The high-voltage power supply module 11 is connected with the control unit 1 and the magnetron 3, the magnetron 3 can generate a first group of heating power required by the system when heating food 12, the magnetron 3 with frequency about 2.45GHz or 915MHz can be selected to be generated, the magnetron 3 needs the high-voltage power supply module 11 to provide direct current high voltage when working, the control unit 1 can control whether the power of the magnetron 3 is output or not by controlling whether the direct current high voltage of the high-voltage power supply module 11 is output or not, and the control unit 1 can also control the output power of the magnetron 3 by controlling the output size or the average voltage size of the direct current high voltage of the high-voltage power supply module 11. The magnetron heating mode can better save cost and is convenient to popularize.

The first radiation assembly 4 is used for radiating a first set of frequency power energy generated by the magnetron 3 into the shielded cavity 10, which is made of metal or comprises metal, so as to heat the food 12.

Fig. 2 is a second power generation mechanism of a semiconductor and magnetron hybrid source heating system according to the present invention. The second power generation mechanism comprises a signal source 5, a solid-state power amplifier 6, a control unit 1, a measuring unit 7, a low-voltage power supply module 2 and a second radiation component 9.

The solid-state power amplifier 6 is connected between the signal source 5 and the measuring unit 7, the solid-state power amplifier 6 is a power amplifier adopting a semiconductor power device, and devices such as LDMOS or GaN can be adopted generally; the control unit 1 is also connected with a signal source 5, a solid-state power amplifier 6 and a measuring unit 7 respectively.

The control unit 1 can control the on and off of the signal source 5 and can also control the output frequency of the signal source 5; the signal source 5 can generate a second group of heating power required by the system when heating the food 12, the second group of heating power can be selected from frequency groups of 2450MHz, 915MHz, 433MHz, 40.68MHz, 27MHz and the like, and the second group of frequency power output by the signal source 5 module is very small; the solid-state power amplifier 6 can amplify the second group of frequency signals with small power to generate high-power energy which can be rapidly heated. The solid state power amplifier 6 is used to amplify the second set of frequency signals generated by the signal source 5 to a suitable power and to transfer this part of the power to the measurement unit 7. The control unit 1 may make the food heating more uniform by controlling the output frequency of the signal source 5.

The measuring unit 7 is connected between the solid-state power amplifier 6 and the second radiation component 9, and the measuring unit 7 is also connected with the control unit 1; the measuring unit 7 is used for measuring the matching state and the output power of the output end of the solid-state power amplifier 6 and transmitting the information of the matching state and the power to the control unit 1; the measuring unit 7 also delivers a second set of frequency power signals of the output of the solid state power amplifier 6 to the second radiating element 9.

The low-voltage power supply module 2 is connected with the control unit 1 and the solid-state power amplifier 6, and the low-voltage power supply module 2 provides direct-current electric energy for the control unit 1 and the solid-state power amplifier 6.

The second radiation assembly 9 is used for radiating the second group of frequency power energy generated by the solid-state power amplifier 6 into the shielding cavity 10, so as to heat the food 12.

The input end 8 is connected with commercial power, such as 220V or 110V, and inputs electric energy for the low-voltage and high-voltage power supply module.

FIG. 3 is a block diagram of a semiconductor and magnetron hybrid source heating system. The semiconductor and magnetron hybrid source heating system incorporates a first power generation mechanism and a second power generation mechanism that heat the food 12 together with two sets of power, which may be the same frequency or different frequencies. The first radiation assembly 4 and the second radiation assembly 9 are arranged in the shielding cavity 10, and the food 12 is placed in the shielding cavity 10 for heating. The body of the shielding cavity 10 is connected with the ground, and the body of the shielding cavity 10 plays a role in preventing radio frequency power from leaking to the outside of the cavity. The benefits of heating using a mixing source are reduced heating time of the food 12, improved uniformity of heating of the food 12, and improved mouthfeel of the food 12.

At least one power supply for converting commercial power into direct current high voltage output is arranged in the high voltage power supply module 11, the power supply provides electric energy for the magnetron 3, and the control unit 1 can control the on-off and the output power of the direct current high voltage power supply. The low-voltage power supply module 2 is provided with at least two low-voltage direct current power supplies which are a first power supply and a second power supply respectively, wherein the first power supply supplies power to the control unit 1, the second power supply supplies power to the solid-state power amplifier 6, and the control unit 1 controls the on-off state and the output voltage of the second power supply.

The control unit 1 is a control center of the whole system, and the control unit 1 at least comprises a microcontroller and a UI interaction module which are communicated with each other. The microcontroller can control whether the first group of frequency power and the second group of frequency power are output or not and control the output power, control the output frequency of the signal source 5, acquire radio frequency measurement parameters and monitor the matching state of the output end of the solid-state power amplifier 6. The UI interaction module in the control unit 1 may include a display module, a key module, a sound module, and the like, and a user may perform operations such as function selection and setup through the UI interaction module.

The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.