Micro-fluidic chip and detection system
阅读说明：本技术 微流控芯片和检测系统 (Micro-fluidic chip and detection system ) 是由 徐为峰 于 2020-04-27 设计创作，主要内容包括：本申请涉及微流控芯片技术领域,公开了一种微流控芯片和检测系统,目的是改善微流控芯片的流体控制方案,提高微流控芯片的流体控制效率和良率。一种微流控芯片,包括流体进入通道和微阀,所述微阀包括磁性阀芯、阀芯运动通道和磁性控制装置；其中：所述阀芯运动通道设有至少两个转接开口,且至少一个所述转接开口与所述流体进入通道相连；所述磁性阀芯位于所述阀芯运动通道内且可在所述阀芯运动通道内移动,且所述磁性阀芯的径向尺寸大于每个所述转接开口的径向尺寸；所述磁性控制装置位于所述阀芯运动通道外部,被配置为沿所述阀芯运动通道移动以驱动所述磁性阀芯在所述阀芯运动通道内移动。(The application relates to the technical field of micro-fluidic chips, and discloses a micro-fluidic chip and a detection system, aiming at improving a fluid control scheme of the micro-fluidic chip and improving the fluid control efficiency and yield of the micro-fluidic chip. A micro-fluidic chip comprises a fluid inlet channel and a micro valve, wherein the micro valve comprises a magnetic valve core, a valve core movement channel and a magnetic control device; wherein: the valve core movement channel is provided with at least two switching openings, and at least one switching opening is connected with the fluid inlet channel; the magnetic valve core is positioned in the valve core moving channel and can move in the valve core moving channel, and the radial dimension of the magnetic valve core is larger than that of each transfer opening; the magnetic control device is located outside the spool movement channel and is configured to move along the spool movement channel to drive the magnetic spool to move within the spool movement channel.)
1. A micro-fluidic chip comprises a fluid inlet channel and a micro valve, wherein the micro valve comprises a magnetic valve core, a valve core movement channel and a magnetic control device; wherein:
the valve core movement channel is provided with at least two switching openings, and at least one switching opening is connected with the fluid inlet channel;
the magnetic valve core is positioned in the valve core moving channel and can move in the valve core moving channel, and the radial dimension of the magnetic valve core is larger than that of each transfer opening;
the magnetic control device is located outside the spool movement channel and is configured to move along the spool movement channel to drive the magnetic spool to move within the spool movement channel.
2. The microfluidic chip according to claim 1, wherein the microvalve further comprises a positioning magnetic body located at the transfer opening configured to position the magnetic spool by magnetic force when the magnetic spool is moved to the transfer opening position.
3. The microfluidic chip according to claim 1, wherein the magnetic valve core is a ball type; the section of the valve core movement channel is circular, and the section size of the valve core movement channel is matched with that of the magnetic valve core.
4. The microfluidic chip according to claim 3, wherein the valve element moving channel comprises one or more branches, and the end of each branch is provided with one of the transfer openings.
5. The microfluidic chip according to claim 4, wherein the end of each of the branches has a radial dimension greater than the radial dimension at other locations.
6. The microfluidic chip according to claim 4, wherein the side wall of the valve element moving channel is provided with an outwardly protruding receiving portion configured to receive the magnetic valve element.
7. The microfluidic chip according to claim 1, wherein the magnetic control device comprises:
a driving magnetic body configured to drive the magnetic spool to move within the spool movement passage by a magnetic force;
and the mechanical arm is connected with the driving magnetic body and is configured to drive the driving magnetic body to move along the valve core motion channel.
8. The microfluidic chip according to any one of claims 1 to 7, further comprising a liquid supply device comprising a liquid storage mechanism and a liquid release mechanism; the liquid storage mechanism is configured to store a liquid, and the liquid release mechanism is configured to be coupled to the liquid release mechanism and the fluid inlet channel and to release the liquid in the liquid storage mechanism into the fluid inlet channel when triggered.
9. The microfluidic chip according to claim 8, wherein the liquid storage mechanism has a liquid storage container and a sealing layer for sealing a lower outlet of the liquid storage container; the liquid storage container is made of a tough material which can deform under stress;
the liquid releasing mechanism comprises an accommodating cavity communicated with the fluid inlet channel, the opening of the accommodating cavity is opposite to the sealing layer, and the edge of the sealing layer is hermetically connected with the edge of the opening of the accommodating cavity; the edge of the opening of the accommodating cavity is provided with a protruding part protruding towards the center of the opening, and the orthographic projection of the protruding part on the sealing layer is positioned in the non-sealing connection area of the sealing layer and is configured to puncture the sealing layer when an interaction force is generated with the sealing layer.
10. The microfluidic chip according to claim 9, wherein the sealing layer is a brittle material that can be broken by force.
11. The microfluidic chip according to claim 9, wherein the material of the sealing layer comprises aluminum foil; the material of the liquid storage container comprises plastic.
12. The microfluidic chip according to claim 9, wherein the microfluidic chip comprises a chip body; the chip body is provided with the containing cavity and the fluid inlet channel; the liquid storage mechanism is fixed on the chip body.
13. The microfluidic chip according to claim 12, wherein the liquid supply device further comprises a connection layer located between the sealing layer of the liquid storage mechanism and the receiving cavity of the liquid release mechanism, and configured to hermetically connect the sealing layer with an opening edge of the receiving cavity.
14. The microfluidic chip according to claim 13, wherein the connection layer is provided with a hollowed-out portion; the orthographic projection of the extending end of the protruding part on the sealing layer is located in the orthographic projection of the hollow part on the sealing layer.
15. The microfluidic chip according to claim 8, wherein the liquid storage mechanism comprises a liquid storage container and a movable part located in the liquid storage container, the movable part having a size larger than that of a lower outlet of the liquid storage container and configured to close the outlet; the self gravity of the movable part is smaller than the buoyancy of the liquid in the liquid storage container to the movable part;
the liquid release mechanism is located at an outlet of the liquid storage container and is configured to: and generating an adsorption force on the movable part to enable the movable part to seal the outlet of the liquid storage container, or releasing the adsorption force on the movable part to enable the movable part to leave the outlet of the liquid storage container under the action of buoyancy.
16. The microfluidic chip according to claim 15, wherein the top of the reservoir container has a gas outlet, and the liquid storage mechanism further comprises a gas-permeable membrane for closing the gas outlet on the top of the reservoir container; or the liquid storage container is made of a tough material which can deform under stress.
17. The microfluidic chip according to claim 15, wherein the liquid release mechanism comprises:
and the heat-sensitive viscous structure is positioned at the outlet of the liquid storage container and is configured to be bonded with the movable part, when the temperature is lower than a set temperature, the sum of the adhesion force of the heat-sensitive viscous structure to the movable part and the self-gravity of the movable part is larger than the buoyancy force of the movable part in the liquid, and when the temperature is higher than or equal to the set temperature, the sum of the adhesion force of the heat-sensitive viscous structure to the movable part and the self-gravity of the movable part is smaller than the buoyancy force of the movable part in the liquid.
18. The microfluidic chip according to claim 17, wherein the material of the heat-sensitive adhesive structure comprises a linear alkane, a branched alkane, or a mixture thereof.
19. The microfluidic chip according to claim 17, wherein the liquid release mechanism further comprises an electro-thermal structure located at the outlet of the reservoir vessel configured to generate heat when energized to warm the heat-sensitive adhesive structure.
20. The microfluidic chip according to claim 19, wherein the electrocaloric structure comprises an electrocaloric material layer and an electrode layer sequentially stacked in an outlet direction away from the liquid reservoir, the electrocaloric material layer being electrically connected to the electrode layer; and the electric heating structure is provided with a through hole penetrating through each layer of structure, and the through hole is opposite to the outlet of the liquid storage container.
21. The microfluidic chip according to claim 20, wherein the material of the electrocaloric material layer comprises indium tin oxide, nichrome, ferrochromium alloy, barium titanate ceramic, silicon carbide, lanthanum chromate, zirconium oxide, molybdenum disilicide.
22. The microfluidic chip according to claim 20, wherein the electrothermal structure further comprises one or more of an insulating layer, a protective layer, a substrate layer, and a thermal insulating layer;
the insulating layer is positioned between the electric heating material layer and the electrode layer, and is provided with a through hole allowing the electric heating material layer to be electrically connected with the electrode layer;
the protective layer is positioned on one side of the electrothermal material layer, which faces away from the electrode layer, and is configured to protect the electrothermal material layer;
the base layer is positioned on one side of the electrode layer, which faces away from the electrothermal material layer, and is configured to bear a film layer;
the heat insulation layer is positioned on one side of the substrate layer, which faces away from the electrode layer.
23. The microfluidic chip according to claim 20, wherein the movable part is a ball type; the heat-sensitive viscous structure is positioned between the electric heating structure and the outlet of the liquid storage container and is tangent to the surface of the movable part.
24. A detection system comprising a microfluidic chip according to any one of claims 1 to 23.
Technical Field
The application relates to the technical field of microfluidic chips, in particular to a microfluidic chip and a detection system.
Background
Microfluidic systems have been applied in various fields, such as genetic analysis, clinical diagnosis, drug screening, and environmental detection, and the final solution of such systems is to implement integrated one-stop detection of "sample in-result out", which usually involves adding required fluid reagents at various stages and fluid control problems such as fluid circulation and switching in one or more fluid channels, and how to implement fluid control in a microfluidic system is the key to the development of microfluidic chips.
Disclosure of Invention
The application discloses a micro-fluidic chip and a detection system, and aims to improve a fluid control scheme of the micro-fluidic chip and improve the fluid control efficiency and yield of the micro-fluidic chip.
In order to achieve the purpose, the application provides the following technical scheme:
a micro-fluidic chip comprises a fluid inlet channel and a micro valve, wherein the micro valve comprises a magnetic valve core, a valve core movement channel and a magnetic control device; wherein:
the valve core movement channel is provided with at least two switching openings, and at least one switching opening is connected with the fluid inlet channel;
the magnetic valve core is positioned in the valve core moving channel and can move in the valve core moving channel, and the radial dimension of the magnetic valve core is larger than that of each transfer opening;
the magnetic control device is located outside the spool movement channel and is configured to move along the spool movement channel to drive the magnetic spool to move within the spool movement channel.
Optionally, the microvalve further includes a positioning magnetic body located at the transfer opening and configured to position the magnetic valve element by magnetic force when the magnetic valve element is moved to the transfer opening position.
Optionally, the magnetic valve core is spherical; the section of the valve core movement channel is circular, and the section size of the valve core movement channel is matched with that of the magnetic valve core.
Optionally, the valve core moving channel comprises one or more branches, and the end of each branch is provided with one switching opening.
Optionally, the radial dimension of the end of each branch is larger than the radial dimension at other positions.
Optionally, the side wall of the valve core moving channel is provided with an accommodating part protruding outwards, and the accommodating part is configured to accommodate the magnetic valve core.
Optionally, the magnetic control device includes:
a driving magnetic body configured to drive the magnetic spool to move within the spool movement passage by a magnetic force;
and the mechanical arm is connected with the driving magnetic body and is configured to drive the driving magnetic body to move along the valve core motion channel.
Optionally, the microfluidic chip further comprises a liquid supply device, wherein the liquid supply device comprises a liquid storage mechanism and a liquid release mechanism; the liquid storage mechanism is configured to store a liquid, and the liquid release mechanism is configured to be coupled to the liquid release mechanism and the fluid inlet channel and to release the liquid in the liquid storage mechanism into the fluid inlet channel when triggered.
Optionally, the liquid storage mechanism is provided with a liquid storage container and a sealing layer for sealing a lower outlet of the liquid storage container; the liquid storage container is made of a tough material which can deform under stress;
the liquid releasing mechanism comprises an accommodating cavity communicated with the fluid inlet channel, the opening of the accommodating cavity is opposite to the sealing layer, and the edge of the sealing layer is hermetically connected with the edge of the opening of the accommodating cavity; the edge of the opening of the accommodating cavity is provided with a protruding part protruding towards the center of the opening, and the orthographic projection of the protruding part on the sealing layer is positioned in the non-sealing connection area of the sealing layer and is configured to puncture the sealing layer when an interaction force is generated with the sealing layer.
Optionally, the sealing layer is a brittle material which can be broken by force.
Optionally, the material of the sealing layer comprises an aluminum foil; the material of the liquid storage container comprises plastic.
Optionally, the microfluidic chip comprises a chip body; the chip body is provided with the containing cavity and the fluid inlet channel; the liquid storage mechanism is fixed on the chip body.
Optionally, the liquid supply device further includes a connecting layer located between the sealing layer of the liquid storage mechanism and the accommodating cavity of the liquid release mechanism, and configured to connect the sealing layer with the opening edge of the accommodating cavity in a sealing manner.
Optionally, the connecting layer is provided with a hollow part; the orthographic projection of the extending end of the protruding part on the sealing layer is located in the orthographic projection of the hollow part on the sealing layer.
Optionally, the liquid storage mechanism includes a liquid storage container and a movable part located in the liquid storage container, and the size of the movable part is larger than that of a lower outlet of the liquid storage container and is configured to close the outlet; the self gravity of the movable part is smaller than the buoyancy of the liquid in the liquid storage container to the movable part;
the liquid release mechanism is located at an outlet of the liquid storage container and is configured to: and generating an adsorption force on the movable part to enable the movable part to seal the outlet of the liquid storage container, or releasing the adsorption force on the movable part to enable the movable part to leave the outlet of the liquid storage container under the action of buoyancy.
Optionally, the top of the liquid storage container is provided with an air outlet, and the liquid storage mechanism further comprises an air permeable membrane for closing the air outlet at the top of the liquid storage container; or the liquid storage container is made of a tough material which can deform under stress.
Optionally, the liquid release mechanism comprises:
and the heat-sensitive viscous structure is positioned at the outlet of the liquid storage container and is configured to be bonded with the movable part, when the temperature is lower than a set temperature, the sum of the adhesion force of the heat-sensitive viscous structure to the movable part and the self-gravity of the movable part is larger than the buoyancy force of the movable part in the liquid, and when the temperature is higher than or equal to the set temperature, the sum of the adhesion force of the heat-sensitive viscous structure to the movable part and the self-gravity of the movable part is smaller than the buoyancy force of the movable part in the liquid.
Optionally, the material of the heat-sensitive adhesive structure includes a linear alkane, a branched alkane, or a mixture of both.
Optionally, the liquid release mechanism further comprises an electrothermal structure located at the outlet of the liquid storage container and configured to generate heat when energized to heat the heat-sensitive adhesive structure.
Optionally, the electrothermal structure includes an electrothermal material layer and an electrode layer sequentially stacked along an outlet direction away from the liquid storage container, and the electrothermal material layer is electrically connected to the electrode layer; and the electric heating structure is provided with a through hole penetrating through each layer of structure, and the through hole is opposite to the outlet of the liquid storage container.
Optionally, the material of the electric heating material layer includes indium tin oxide, nickel-chromium alloy, iron-chromium-aluminum alloy, barium titanate ceramic, silicon carbide, lanthanum chromate, zirconium oxide, and molybdenum disilicide.
Optionally, the electrothermal structure further includes one or more layers of an insulating layer, a protective layer, a substrate layer, and a thermal insulating layer;
the insulating layer is positioned between the electric heating material layer and the electrode layer, and is provided with a through hole allowing the electric heating material layer to be electrically connected with the electrode layer;
the protective layer is positioned on one side of the electrothermal material layer, which faces away from the electrode layer, and is configured to protect the electrothermal material layer;
the base layer is positioned on one side of the electrode layer, which faces away from the electrothermal material layer, and is configured to bear a film layer;
the heat insulation layer is positioned on one side of the substrate layer, which faces away from the electrode layer.
Optionally, the movable part is a ball; the heat-sensitive viscous structure is positioned between the electric heating structure and the outlet of the liquid storage container and is tangent to the surface of the movable part.
A detection system comprising a microfluidic chip as claimed in any one of the preceding claims.
Drawings
Fig. 1 is a schematic partial structural diagram of a microfluidic chip according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a micro valve of a microfluidic chip according to an embodiment of the present disclosure;
FIG. 3a is a schematic view of a microvalve according to one embodiment of the present application in one state;
FIG. 3b is a schematic view of the microvalve of FIG. 3a in another state;
FIG. 4a is a schematic view of a microvalve according to another embodiment of the present application in one state;
FIG. 4b is a schematic view of the microvalve of FIG. 4a in another state;
fig. 5 is a schematic view of a partial structure of a microfluidic chip according to another embodiment of the present disclosure;
FIG. 6 is a schematic cross-sectional view illustrating a liquid storing mechanism of a liquid supply apparatus according to an embodiment of the present disclosure;
FIG. 7a is a schematic cross-sectional view illustrating a liquid supply apparatus according to an embodiment of the present disclosure in a non-liquid-releasing state;
FIG. 7b is a schematic cross-sectional view of the liquid supply apparatus of FIG. 7a in a liquid release state;
FIG. 8 is a schematic cross-sectional view of a liquid supply apparatus according to another embodiment of the present disclosure;
FIG. 9 is a schematic cross-sectional view of a liquid supply apparatus according to another embodiment of the present disclosure;
fig. 10 is a block diagram of a detection system according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 and fig. 2, an embodiment of the present application provides a microfluidic chip, including a fluid inlet channel 21 and a microvalve 1, where the microvalve 1 includes a magnetic valve core 12, a valve core movement channel 11, and a magnetic control device 13; wherein:
the spool movement channel 11 is provided with at least two transfer openings 111, and at least one transfer opening 111 is connected with the fluid inlet channel 21;
the magnetic valve core 12 is positioned in the valve core moving channel 11 and can move in the valve core moving channel 11, and the radial dimension of the magnetic valve core 12 is larger than that of each adapter opening 111;
the magnetic control device 13 is located outside the spool movement channel 11 and is configured to move along the spool movement channel 11 to drive the magnetic spool 12 to move within the spool movement channel 11.
In the microfluidic chip provided in the embodiment of the present application, a fluid inlet channel 21 and a microvalve 1 for controlling switching of a path switch of a fluid in the chip are provided, the microvalve 1 is provided with a valve element moving channel 11, at least one of the switching openings 111 of the valve element moving channel 11 is connected to the fluid inlet channel 21, a fluid reagent to be added in each stage of the microfluidic chip can enter the valve element moving channel 11 through the switching opening 111 connected to the fluid inlet channel 21, and enter the downstream channel 22 through other switching openings 111, so as to finally reach a reaction detection area of the microfluidic chip.
Specifically, the plurality of transfer openings 111 of the spool movement passage 11 may be respectively connected to a plurality of passages including the fluid inlet passage 21 and the downstream passage 22, and the fluid movement path is sequentially through the fluid inlet passage 21, the spool movement passage 11, and the downstream passage 22; for example, the spool movement passage 11 shown in fig. 1 has three transfer openings 111, and the three transfer openings 111 are connected to two fluid inlet passages 21 and one downstream passage 22, respectively. The flow and switching of the fluid in one or more channels can be controlled by means of the microvalve 1.
Specifically, the control process of the microvalve 1 is substantially as follows: the magnetic valve core 12 is driven to move in the valve core moving channel 11 by the magnetic control device 13, and because the radial dimension of the magnetic valve core 12 is larger than the radial dimension of each of the transfer openings 111, when the magnetic valve core 12 moves to a certain transfer opening 111, the transfer opening 111 can be blocked, so that the transfer opening 111 is closed, and further, the fluid in the valve core moving channel 11 cannot enter the connected downstream channel 21 through the transfer opening 111, or the fluid in the fluid entering channel 21 cannot enter the valve core moving channel 11 through the transfer opening 111; accordingly, the magnetic valve core 12 can also be driven away from the transfer opening 111 by the magnetic control device 13, so that the transfer opening 111 is opened, and fluid can enter and exit the valve core movement channel 11 through the transfer opening 111. Through the arrangement, the circulation and the switching of the fluid in each channel of the microfluidic chip can be controlled, and the fluid control efficiency and the yield of the microfluidic chip are improved.
Specifically, as shown in fig. 1 and fig. 2, the embodiment of the present application provides a microfluidic chip having a chip body 10, and a fluid inlet channel 21 and a microvalve 1 are both disposed in the chip body 10.
Specifically, as shown in fig. 1 and 2, the magnetic control device is located outside the valve core movement channel 11, and specifically may be located outside the chip body 10, and is not required to be integrated with the chip body 10, so that the driving structure of the microvalve is simple and the driving yield is high, and any influence on the movement of the fluid in the chip body 10 is not generated, and further, the sealing effect of the chip body 10 may be improved, and the miniaturization design of the chip body 10 is facilitated.
In some embodiments, as shown in fig. 2, the microvalve 1 further includes a positioning magnetic body (not shown) located at the transfer opening 111 and configured to position the magnetic spool 12 by magnetic force when the magnetic spool 12 moves to the transfer opening 111 position.
For example, the positioning magnetic body may be a permanent magnet.
For example, the chip body is generally in a sheet shape, and the positioning magnetic body can be arranged independently of the chip body and detachably mounted on the surface of the chip body; when the magnetic control device drives the magnetic valve core to move, the positioning magnetic body is not connected with the chip body, so that the influence on the movement of the magnetic valve core is avoided; when the magnetic valve core reaches the switching opening to be closed and blocks the opening, a positioning magnetic body can be arranged on the surface of the chip body close to the switching opening, so that the magnetic valve core is positioned at the switching opening. Furthermore, when the positions of other parts in the chip body need to be changed in a complex way, such as centrifugation, rotation, oscillation, inversion and the like, the magnetic valve core can be kept unchanged by positioning the magnetic body, and the opening and closing control of the fluid channel switching opening is further ensured.
Alternatively, the positioning magnetic body may be disposed inside the chip body, for example, directly fixed to the edge of the transfer opening of the spool movement channel. At this time, the magnetism of the positioning magnetic body is small, and the acting force on the magnetic valve core is far smaller than the driving force of the magnetic control device on the magnetic valve core.
In some embodiments, as shown in fig. 1 and 2, the radial dimension of the magnetic spool 12 is greater than the radial dimension of each of the transfer openings 111; alternatively, the largest dimension of the transfer opening 111 is smaller than the diameter of the magnetic spool 12.
Illustratively, the radial dimension of the transfer opening 111 is less than 1/2 of the diameter of the magnetic spool 12.
Illustratively, the central cross section of the transfer opening 111 may be in the same plane as the central cross section of the spool movement passage 11, or may be lower than the central cross section of the spool movement passage 11, for example, the position of the transfer opening 111 may be at 1/2 of the height of the spool movement passage 11, or may be lower than 1/2 of the height of the spool movement passage 11, so as to facilitate the fluid flowing out through the transfer opening 111 into other passages. Optionally, a sealing ring may be added to the outer edge of the transfer opening 111 to increase the sealing control effect of the microvalve 1.
In some embodiments, the material of the magnetic valve core may be a permanent magnet, such as a neodymium-iron-boron magnet, a samarium-cobalt magnet, an alnico magnet, or a substance having ferromagnetism, such as iron, cobalt, or nickel. The magnetic valve core can be hollow or solid.
Furthermore, in order to increase the sealing effect of the micro valve or avoid the reaction between the reagent and the magnetic valve core material, a layer of elastic material or sealing material can be uniformly coated on the surface of the magnetic valve core. The elastic material can be a corrosion-resistant and elastic high polymer such as Polydimethylsiloxane (PDMS), Polytetrafluoroethylene (PTFE) and the like, and can also be an inert metal with stable chemical properties; the sealing material may be vaseline, paraffin, etc. The cladding should be as thin as possible and should have a thickness less than 1/4, and optionally less than 1/8, the diameter of the magnetic core.
In some embodiments, as shown in fig. 1 and 2, the magnetic spool 12 is of a ball type; the section of the valve core movement channel 11 is circular, and the size of the section of the valve core movement channel 11 is matched with that of the section of the magnetic valve core 12.
Illustratively, the material of the spool movement channel may be a non-metallic material including but not limited to PC, PS, PMMA, COC, COP, PDMS, etc. Specifically, the material of the valve core movement channel is a material which does not react with the circulated liquid reagent and does not generate interaction force with the magnetic valve core.
Further, the position and shape of the spool movement path may be determined according to the position and number of fluid paths to be switched. Specifically, on the magnetic spool movement path in the spool movement passage, the longitudinal section of each position is circular, the circular diameter of which is substantially the same as the diameter of the magnetic spool, and the diameter of the circular longitudinal section of the spool movement passage may be slightly larger than the diameter of the magnetic spool, for example, 5/4 whose diameter is the diameter of the magnetic spool, alternatively 9/8 whose diameter is the diameter of the magnetic spool, or 17/16 whose diameter is the diameter of the magnetic spool.
In some embodiments, the valve element moving passage comprises one or more branches, and the end of each branch is provided with one of the transfer openings.
For example, the radial dimension of the end of each branch may be larger than the radial dimension at other positions, i.e. the radial dimension of the spool movement passage near the transfer opening (at the magnetic spool stop point) is larger than the radial dimension at other positions.
Specifically, the longitudinal cross-section at the magnetic spool stop location is circular, and the diameter of the circular longitudinal cross-section at the magnetic spool stop location may be slightly larger than the diameter of the magnetic spool, for example, 5/4, optionally 9/8, or 17/16. Furthermore, the diameter of the longitudinal section of the stop position of the magnetic valve core can be changed to be slightly larger than the diameter of the longitudinal section of the valve core movement channel at other positions, for example, the diameter of the longitudinal section of the stop position of the magnetic valve core is 17/16-5/4 of the diameter of the longitudinal section of the valve core movement channel at other positions, so that the magnetic valve core is fixed and cannot move due to different depths of the positions when the magnetic valve core is static at the stop position of the magnetic valve core.
In some embodiments, as shown in fig. 3a and 3b, the sidewall of the valve element moving channel 11 is provided with an outwardly protruding receiving portion 112, and the receiving portion 112 is configured to receive the magnetic valve element 12.
Illustratively, the receiving portion 112 is sized to receive at least a portion of the magnetic spool 12, and may also receive the entire magnetic spool 12; specifically, the accommodating portion 112 may be a hemisphere shape matching the shape of the magnetic valve element 12, or may have another shape, which is not limited herein.
Specifically, the magnetic spool 12 has a blocking effect on the fluid when it is in the spool movement passage 11. When the magnetic spool 12 is not required to be arranged at the transfer opening 111 at the end of the branch, that is, when the magnetic spool 12 is not used for closing the transfer opening 111, as shown in fig. 3a, the accommodating part 112 is arranged on the side wall of the spool movement channel 11, so that the magnetic spool 12 is accommodated in the accommodating part 112, thereby avoiding the fluid in the spool movement channel 11, and making it easier for the fluid to pass through the branch where the section of the side wall is located.
For example, as shown in fig. 3a and 3b, the spool movement passage 11 includes a branch, the end of which is provided with one of the transfer openings 111, and the transfer opening 111 is connected to the downstream passage 22; when the magnetic spool is driven by the magnetic control means 13 to the transfer opening 111 at the end of the branch, as shown in fig. 3b, the transfer opening 111 is closed and fluid cannot enter the downstream channel 22 through the spool movement channel 11; as shown in fig. 3a, when the magnetic spool 12 is driven out of the changeover opening 111 into the accommodating portion 112 by the magnetic control device 13, the changeover opening 111 is opened, and the fluid can smoothly enter the downstream passage 22 through the spool movement passage 11.
Alternatively, for example, as shown in fig. 4a and 4b, the spool movement passage 11 includes two branches, each branch end is provided with one of the transfer openings 111, and each transfer opening 111 is connected with one of the fluid inlet passages 21; as shown in fig. 4a, when the magnetic valve spool 12 is driven by the magnetic control device 13 to reach the transfer opening 111 at the end of the first branch, the transfer opening 111 is closed, and the fluid in the fluid inlet passage 21 connected to the transfer opening 111 cannot enter the spool moving passage 11 through the transfer opening 111; as shown in fig. 4b, when the magnetic spool 12 is driven to the transfer opening 111 of the second branch end by the magnetic control device 13, the transfer opening 111 of the first branch end is opened, and the fluid in the fluid inlet passage 21 connected to the first branch enters the spool movement passage 11, whereas the fluid in the fluid inlet passage 21 connected to the second branch cannot enter the spool movement passage 11. Of course, when the side wall of the valve core movement channel 11 is provided with the accommodating portion 112, the magnetic valve core 12 can be moved into the accommodating portion 112, and at this time, both the two transfer openings 111 are in the open state, and the fluid in the two fluid inlet channels 21 can simultaneously enter the valve core movement channel 11 through two branches respectively.
Illustratively, a plurality of magnetic spools 12 may be disposed in the spool movement passage 11, and correspondingly, a plurality of receiving portions 112 may be disposed on a side wall of the spool movement passage 11.
In some embodiments, as shown in fig. 3a and 3b, the magnetic control device 13 may include a driving magnetic body 131 and a robot arm 132; wherein: a driving magnetic body 131 configured to drive the magnetic spool 12 to move within the spool movement passage 11 by a magnetic force; the mechanical arm 132 is connected to the driving magnetic body 131 and configured to drive the driving magnetic body 131 to move along the valve element moving channel 11.
For example, the driving magnetic body may be a permanent magnet, the material of the permanent magnet may be neodymium iron boron magnet, samarium cobalt magnet, alnico magnet, etc., and the driving magnetic body may also be an electromagnet that generates magnetism when energized. The mechanical arm can be driven by a motor and can also be controlled by a person to generate relative displacement with the chip body. The relative displacement specifically comprises horizontal displacement above or below the plane of the valve core motion channel so as to drive the magnetic valve core; of course, the displacement in the vertical direction may be included so that the driving magnetic body is away from the chip body and there is no driving force on the magnetic valve element. Specifically, when the driving magnetic body applies acting force to the magnetic valve core, the force is larger than other forces acting on the magnetic valve core, and the position of the magnetic valve core can be changed; when the force applied by the driving magnetic body to the magnetic valve core disappears or is smaller than the force capable of displacing the magnetic valve core, the position of the magnetic valve core is not changed.
For example, the driving magnetic body may be a sphere, a rectangular parallelepiped, or another shape convenient for installation and control, and may have a size smaller than or equal to the diameter of the magnetic valve core. In some embodiments, a plurality of magnetic valve cores are arranged in the valve core movement channel, the distance between the through openings in the valve core movement channel is relatively long, and the size of the driving magnetic body can be larger than the diameter of the magnetic valve cores under the condition that the driving magnetic body does not interfere with the magnetic valve cores at different through openings.
As shown in fig. 1, fig. 5 to fig. 9, in some embodiments, the microfluidic chip provided in the embodiments of the present application further includes a liquid supply device 3, where the liquid supply device 3 includes a liquid storage mechanism 31 and a liquid release mechanism 32; the liquid storage mechanism 31 is configured to store liquid, and the liquid release mechanism 32 is configured to be connected to the liquid release mechanism 32 and the fluid inlet channel 21 and to release the liquid in the liquid storage mechanism 31 into the fluid inlet channel 21 when triggered.
In a specific embodiment, as shown in fig. 5 to 8, the liquid storage mechanism 31 has a liquid storage container 311 and a sealing layer 312 for sealing a lower outlet of the liquid storage container 311; the liquid storage container 311 is made of a flexible material that can deform under stress.
The liquid releasing mechanism 32 comprises a containing cavity 321 communicated with the fluid inlet channel 21, the opening of the containing cavity 321 is opposite to the sealing layer 312, and the edge of the sealing layer 312 is connected with the edge of the opening of the containing cavity 321 in a sealing way; the edge of the opening of the accommodating cavity 321 is provided with a protrusion 322 protruding toward the center of the opening, and an orthographic projection of the protrusion 322 on the sealing layer 312 is located at the non-sealing connection region of the sealing layer 312, and is configured to puncture the sealing layer 312 when an interaction force is generated with the sealing layer 312.
Specifically, the fluid resistance is relatively large in the downstream area through which liquid flows, especially when the downstream is in a sealed environment, the gas originally existing in the downstream cavity is extruded by the entering liquid, and is easy to reversely enter the liquid storage mechanism through gas-liquid exchange. And, because of the deformability and toughness of the liquid holding cavity material, it can offset the increased air pressure to some extent, so that the air pressure in the whole system will not increase. Even when the product is heated, the increase of the air pressure in the sealing pipeline can be well relieved, so that the use stability of the whole disk or chip system is improved.
Illustratively, the material of the liquid storage container comprises plastics, which can be PVC, PP, PE, PET and other plastic films coated with aluminum foil, and PVC, PP, PE, PET and other plastic films, the thickness of which is within 50-150 μm, and the required shape and size, such as hemispherical shape, semi-ellipsoidal shape and the like, are formed by corresponding forming technology.
Illustratively, the sealing layer is a brittle material that can be broken by force. For example, aluminum foil is usually used, and the thickness is 10 μm to 100. mu.m. The shape of the sealing layer can be approximately the same as the horizontal projection shape of the liquid storage container, and the sealing layer is packaged at the edge of the opening of the containing cavity.
Illustratively, as shown in fig. 5, fig. 7a, fig. 7b and fig. 8, the liquid supply apparatus 3 further includes a connection layer 33, the connection layer 33 is located between the sealing layer 312 of the liquid storage mechanism 31 and the accommodating cavity 321 of the liquid release mechanism 32, and is configured to connect the sealing layer 312 with the opening edge of the accommodating cavity 321 in a sealing manner. Of course, the sealing layer 312 can be sealed to the edge of the accommodating cavity 321 by other methods, such as welding, clamping, etc., as long as the sealing effect is satisfied.
For example, the material of the connecting layer may be double-sided adhesive, ultraviolet curing adhesive, epoxy adhesive, or the like. The thickness of the connecting layer is 20-1000 μm, specifically 100-500 μm, the external dimension of the connecting layer is approximately consistent with that of the sealing layer, one side of the connecting layer is fixedly bonded with the edge of the containing cavity, and the other side of the connecting layer is fixedly bonded with the sealing layer. Besides connecting the layers, the connecting layer can also play a role in buffering and protecting the sealing layer.
Exemplarily, as shown in fig. 5, 7a, 7b and 8, the microfluidic chip comprises a chip body 10, the chip body 10 is provided with the accommodating cavity 321 and the fluid inlet channel 21; the liquid storage mechanism 31 is fixed to the chip body 10. In other words, the liquid releasing mechanism 32 is formed on a disk or a cartridge (chip body 10) of the microfluidic chip, and the liquid storing mechanism 31 is fixed to an upper surface of the disk or the cartridge.
Specifically, the receiving cavity 321 may be a pit or a hole formed on the upper surface of the chip body 10, and is connected to the downstream fluid inlet channel 21. The outer edge of the pit or hole can be completely covered by the liquid storage mechanism 31 to ensure that the pit or hole is isolated from the external environment and sealed, and the volume of the pit or hole can be larger than, smaller than or equal to the volume of the liquid contained in the liquid storage mechanism 31 and is used for fully or partially accommodating the liquid released from the liquid storage mechanism 31. The protrusion 322 is a structure protruding into the cavity on the wall of the containing cavity 321, and the protruding end (liquid releasing site) is located in the horizontal projection area of the non-thermal pressure sealing area on the sealing layer 312, and the shape and size thereof can be any form convenient for placement or integral processing, as long as it is ensured that the pressure is transmitted to the sealing layer 312 through the liquid storage container 211, so that when the sealing layer 312 expands downward and contacts with the liquid releasing site, the sealing layer 312 can be ruptured by the reaction force of the liquid releasing site on the sealing layer 312, and no liquid leakage or rupture occurs at other positions.
For example, FIG. 7a shows a state before the liquid storage mechanism 31 and the liquid release mechanism 32 release the liquid; when the liquid in the liquid storage container 311 needs to be released, a certain pressure is applied to the liquid storage container 311, which causes a change in air pressure in the liquid storage container 311, so that the sealing layer 312 expands toward the accommodating cavity 321, so that an interaction force is generated between the sealing layer 312 and the protruding portion 322 at the edge of the accommodating cavity 321, and further the sealing layer 312 is broken by force at the protruding end (liquid releasing site) of the protruding portion 322, thereby releasing the liquid, as shown in fig. 7b, a state of the liquid storage mechanism 31 and the liquid release mechanism 32 after releasing the liquid is performed, wherein an area surrounded by an oval dotted line is an opening of the sealing layer 312 broken by force, and the liquid flows into the accommodating cavity 321 from this position.
Specifically, the pressure applied to the reservoir 311 can rupture the seal layer 312 in contact with the fluid release site and can be removed without the need for a continuous application. The pressure may be derived from manual pressure or mechanical pressure, which is not sufficient to irreversibly deform the reservoir 311, i.e. the volume of the reservoir 311 is hardly changed after the external force has been removed. The released liquid flows out from the contact breakage point of the sealing layer 312 and the projection 322 based on its own weight, and enters the liquid containing chamber 321. As shown in fig. 5, the liquid flow may also be matched with the driving force commonly used in vitro diagnostic products, such as centrifugation, chromatography, hydrophilic-hydrophobic modification, etc., to drive the liquid through the fluid inlet channel 21 to the downstream sealed or open chamber. For example, the position of the fluid inlet channel 21 connected to the receiving chamber 321 may be away from the central axis of the centrifugal operation in cooperation with the centrifugal force, and may be particularly located at the radially outermost end of the chip body 10, so that the fluid can smoothly enter the downstream channel by the centrifugal force.
For example, as shown in fig. 5, 7a, 7b and 8, the connection layer 33 is provided with a hollow-out portion (missing area) 330, and the shape of the hollow-out portion 330 may be circular, semicircular or elliptical; the orthographic projection of the protruding end of the protruding part 322 on the sealing layer 312 is located in the orthographic projection of the hollow part 330 on the sealing layer 312. In other words, the connection layer 33 is hollowed out at the liquid release site region and overlapped with the sealing layer 312 at other regions, so that the sealing layer 312 at the liquid release site region is exposed on one hand, and the sealing layer 312 at the liquid release site region is easily broken by force, and on the other hand, the sealing layer 312 at the non-liquid release site region can be protected, so that the sealing layer 312 at the non-liquid release site region is not easily broken, and the accuracy of fixed-point release is improved.
Illustratively, in order to ensure that the non-liquid release site areas of the receiving cavities 321 will not cause the sealing layer 312 to crack, as an alternative, the edges of the receiving cavities 321 in these areas are designed to be rounded, and the overall height thereof is the same as the height of the cartridge (chip body 10), and the non-liquid release site areas can be obtained by conventional injection molding or machining during the process molding without increasing the process complexity. Further, as shown in fig. 7a and 7b, the sidewall of the accommodating chamber 321 in the non-liquid release site region may be provided with an inclined arc S, so that the sealing layer 312 is not easily broken by force. Alternatively, as shown in fig. 8, the connecting layer 33 covers the entire edge of the containing cavity 321 except for the protrusion 322 to increase the elastic buffer in the non-liquid releasing site area and avoid the sealing layer 312 from being broken by force.
Illustratively, as shown in fig. 5, the chip body 10 of the microfluidic chip provided by the present application may be integrated with a plurality of the above-mentioned liquid storage devices.
In the liquid storage device provided in the embodiment, the liquid storage mechanism and the liquid release mechanism are good in sealing effect, small in volatilization amount, space-saving and simple in processing and assembling procedures; and, the liquid release mode is ingenious, requires to cooperate mode and cooperation device lowly, can accurately and completely release the liquid of storage to the low reaches in specific position through simple operation. Especially for the application of sequentially releasing a plurality of liquids, the stability and the reliability of the application can be improved. In addition, the deformation of the liquid storage container is extremely small in the liquid release process, and the air pressure balance in the closed system cannot be influenced. The in-vitro diagnosis micro-fluidic chip integrated with the scheme does not need to manually add all required reagents in each stage of the detection process, and is expected to realize the integrated one-stop detection of physiological and pathological indexes of sample input-result output.
In a specific embodiment, as shown in fig. 9, the liquid storage mechanism 31 includes a liquid storage container 313 and a movable part 314 located in the liquid storage container 313, wherein the movable part 314 has a size larger than that of a lower outlet of the liquid storage container 313 and is configured to close the outlet; the self-gravity of the movable part 314 is smaller than the buoyancy of the liquid in the liquid storage container 313 to the movable part 314. In particular, the liquid release mechanism 32 is located at the outlet of the liquid storage vessel 313 and is configured to: the suction force to the movable member 314 is generated so that the movable member 314 closes the outlet of the liquid storage container 313, or the suction force to the movable member 314 is released so that the movable member 314 leaves the outlet of the liquid storage container 313 under the action of the buoyancy.
Illustratively, the shape and height of the reservoir vessel 313 may be any condition that facilitates the up-and-down movement of the movable member 314, and the volume thereof is equal to or greater than the volume of at least one liquid reagent required for performing in vitro diagnosis. Optionally, the cross-section of the reservoir vessel 313 is circular.
Illustratively, as shown in fig. 9, the liquid storage container 313 has a vent at the top, and the liquid storage mechanism 31 further includes a gas permeable membrane 315 for closing the vent at the top of the liquid storage container 313; or, the liquid storage container 313 is made of a flexible material which can deform under stress. With the arrangement, the problem that negative pressure is generated in the liquid storage container 313 to cause liquid discharge failure or liquid suck-back after discharge can be prevented, and the liquid can easily flow out of the liquid storage container 313 and be completely released.
For example, the gas permeable membrane may be a microporous membrane having water transport properties, which is a porous membrane of PTFE or PVDF having a high gas permeability and a low water permeability, measured as gas permeability, which may be 100mL/cm2·min·7kpa-3000mL/cm2Min 7kpa, optionally with an air permeability of 300mL/cm2·min·7kpa-1000mL/cm2Min.7 kpa. The air permeable membrane can tightly and completely cover the exhaust hole by means of bonding or welding.
Illustratively, the material of the movable part does not react with the liquid reagent in the liquid storage container biologically or chemically, and the physical properties of the movable part are not changed after the movable part is soaked in the liquid reagent for a long time. Another requirement of the movable part material is that it has a density less than the stored liquid reagent. As a possible solution, the material of the movable part may be a high molecular polymer, such as plastic, in particular, PMMA, PC, PS, PP, etc. The volume of the movable part is smaller than that of the liquid storage cavity.
In a specific embodiment, as shown in fig. 9, the liquid release mechanism 32 includes a heat-sensitive adhesive structure 323, the heat-sensitive adhesive structure 323 is located at the outlet of the liquid storage container 313, and is configured to be bonded to the movable component 314, and when the temperature is lower than a set temperature, the sum of the adhesion force of the heat-sensitive adhesive structure 323 to the movable component 314 and the self-gravity of the movable component 314 is greater than the buoyancy force to which the movable component 314 is subjected in the liquid, and when the temperature is higher than or equal to the set temperature, the sum of the adhesion force of the heat-sensitive adhesive structure 323 to the movable component 314 and the self-gravity of the movable component 314 is less than the buoyancy force to which the movable component 314 is subjected in the liquid.
Specifically, the heat-sensitive adhesive structure 323 has an adhesive effect at normal temperature, and the sum of the adhesive force generated by the heat-sensitive adhesive structure 323 to the movable member 314 and the gravity of the movable member 314 needs to be greater than or equal to the buoyancy force applied to the movable member 314 in the liquid reagent. The placement position of the heat-sensitive adhesive structure 323 at least comprises the position where the movable part 314 is tangent to the lower outlet of the liquid storage container 313 so as to be in adhesive contact with the movable part 314. The property of the heat-sensitive adhesive structure 323 can be changed when being heated, and the adhesion force to the movable part 314 is reduced or disappeared, so that the sum of the adhesion force to the movable part 314 and the gravity of the movable part 314 is smaller than the buoyancy force of the movable part 314 in the liquid reagent, and the movable part 314 is separated from the bonding constraint of the heat-sensitive adhesive structure 323 and leaves the lower opening of the liquid storage container 313 under the buoyancy force of the liquid reagent, thereby achieving the effect of releasing the liquid.
Illustratively, the material of the heat-sensitive adhesive structure includes a linear alkane, a branched alkane, or a mixture of both. For example, a mixture of hydrocarbons having about 18 to about 30 carbon atoms.
In one specific embodiment, as shown in fig. 9, the liquid release mechanism 32 further comprises an electric heating structure at the outlet of the liquid storage container 313 configured to generate heat when energized to heat the heat sensitive adhesive structure 323.
Illustratively, as shown in fig. 9, the electrothermal structure comprises an electrothermal material layer 324 and an electrode layer 325 which are sequentially laminated in the direction of an outlet away from the liquid storage container 313, wherein the electrothermal material layer 324 is electrically connected with the electrode layer 325. Specifically, the electric heating structure is provided with a through hole 320 penetrating through each layer of structure, and the through hole is opposite to the outlet of the liquid storage container 313; alternatively, the through hole 320 extends through the electrothermal structure and is opposite to the lower outlet of the reservoir container 313 for allowing the liquid reagent in the reservoir container 313 to flow out.
Illustratively, the material of the electrode layer is a conductive metal or metal alloy, including but not limited to Cu, Ag, Au, Al, Al-Nd, Mo-Al-Mo, Mo-Al-Nd-Mo, etc., and the thickness thereof may be any uniform thickness that can be achieved by conventional processing techniques in the art. The electrode layer is discontinuous, specifically, the electrode layer at least comprises two independent areas, the two independent areas are respectively connected with the positive electrode and the negative electrode of the same power supply, and when voltage is applied, no current passes through the two independent areas; alternatively, two separate regions of the electrode layer are used as the positive and negative electrodes, respectively, which are electrically connected to the electrocaloric material layer.
Illustratively, the electrocaloric material layer is a material layer having an electrocaloric effect, including but not limited to indium tin oxide, nickel-chromium alloy, iron-chromium-aluminum alloy, barium titanate ceramic, silicon carbide, lanthanum chromate, zirconium oxide, molybdenum disilicide, and the like, and the thickness thereof may be any thickness that can be achieved by a conventional processing technique in the art. The electric heating material layer is positioned on one side of the electrode layer facing the liquid storage container, and the horizontal projection of the electric heating material layer needs to cover two independent areas (a positive electrode and a negative electrode) of the electrode layer and is electrically connected with the two independent areas of the electrode layer. Specifically, when voltage is applied to two independent regions (positive and negative electrodes) of the electrode layer, the two independent regions are conducted through the electric heating material layer so that current passes through the electric heating material layer, and the electric heating material layer is heated by the electric heating effect and conducts heat to the thermosensitive adhesive structure.
Illustratively, the electrode layer and the electrocaloric material layer may be formed by sputtering, deposition, etc., or may be formed by other conventional processing means known to those skilled in the art.
In a specific embodiment, as shown in fig. 9, the electrothermal structure may further include one or more of an insulating layer 327, a protective layer 328, a base layer 326, and a thermal insulating layer (not shown).
Illustratively, the substrate layer 326 is located on a side of the electrode layer 325 facing away from the electrocaloric material layer 324 and is configured to support a film layer. The material of the base layer 326 should be easy to process, be perforated, and have a specific material deposited or sputtered on its surface, which may be one of glass, plastic, and metal, and optionally the material of the base layer 326 may be glass, and have a thickness ranging from 0.1mm to 5mm, and may specifically be 0.5 mm.
Illustratively, the insulating layer 327 is disposed between the electrocaloric material layer 324 and the electrode layer 325, and is provided with a via hole allowing the electrocaloric material layer 324 to be electrically connected to the electrode layer 325. Specifically, the material of the insulating layer 327 is a non-metal substance with insulating property, including but not limited to SiO2，Si3N4PI, PTFE, PVDF, PDMS, etc., and the thickness thereof may be any thickness that can be achieved by conventional processing techniques in the art. The insulating layer 327 covers at least a portion of the electrode layer 325, and two separate openings are disposed at two separate regions of the electrode layer 325. The electrocaloric material layers 324 are in communication with two separate regions of the electrode layer 325 through openings in the insulating layer 327. It should be noted that in some embodiments, the insulating layer 327 may not be between the electrode layer 325 and the electrocaloric material layer 324.
Illustratively, the protection layer 328 is located on a side of the electrocaloric material layer 324 facing away from the electrode layer 325 and is configured to protect the electrocaloric material layer 324. The material of the protective layer 328 is a non-metallic substance with insulating property, and the material includes but is not limited to SiO2，Si3N4Etc. which may be deposited by a thin film deposition to cover the surface of the electrocaloric material layer 324, and may have any thickness, such as 10, that can be achieved by conventional processing techniques in the art-4Micron to 1 micron, and generally, the thickness of the protective layer 328 can be selected from 10-2Micron to 10-3On the order of microns. The protective layer 328 may have an opening, where the electrode layer 325 may be directly exposed for contacting with an external power source, or a connection lead may be led out from the opening to connect the electrode layer 325 with the external power source.
For example, the thermal insulation layer is located on a side of the substrate layer 326 away from the electrode layer 325, and is used for preventing heat of the electrothermal structure from being conducted to a side of the chip body, so that on one hand, the heat of the electrothermal structure can be conducted to the heat-sensitive adhesive structure 323 on a side of the liquid storage container 313 as much as possible, and on the other hand, the heat generated by the electrothermal structure can be prevented from affecting functions of structural parts in the chip body.
In a specific embodiment, as shown in fig. 9, the electrothermal structure includes, from the base layer 326 to the top, a base layer 326, an electrode layer 325, an insulating layer 327, an electrothermal material layer 324, and a protective layer 328; in addition, a thermal barrier layer may be included on the lower surface of the base layer 326.
Specifically, the electric heating structure is provided with through holes 320 penetrating through each layer of the structure, that is, each layer of the structure in the electric heating structure is provided with through holes, and the center positions of the through holes of each layer of the structure are consistent. Illustratively, the shape of the through hole of each layer structure may be arbitrary, and may be specifically selected to be circular.
In a specific embodiment, as shown in fig. 9, the movable part 314 is a ball type; the heat-sensitive adhesive structure 323 is located between the electric heating structure and the outlet of the liquid storage vessel 313, and is tangential to the surface of the movable part 314. It can also be said that the heat-sensitive adhesive structure 323 is located between the through hole 320 of the electric heating structure and the outlet of the liquid reservoir 313, so as to be in adhesive contact with the movable part 314 on the one hand, and to receive the heat transferred by the electric heating structure on the other hand, so as to change the viscosity of itself until the viscosity is insufficient to stick the movable part 314, so as to detach the movable part 314.
For example, in the through holes of each layer structure of the electrothermal structure, the size of the through hole of the electrothermal material layer can be slightly smaller than that of the through holes of other layers, that is, the horizontal projection of other layers is totally positioned in the range of the electrothermal material layer, so that the heat generated by the electrothermal material layer can be uniformly distributed around the through holes and can be rapidly transferred to the heat-sensitive adhesive structure at the through holes.
For example, the liquid releasing mechanism may further include a protective cover, the protective cover is located between the electrothermal structure and the liquid storage container, the material of the protective cover may be the same as that of the base layer of the electrothermal structure, and the protective cover is attached to the electrothermal structure and contacts the protective layer. The protective cover is provided with an opening, the opening is the same as the center of the through hole of the electric heating structure, the horizontal projection of the opening and the through hole of the electric heating structure is a similar graph, and the size of the graph is slightly larger than that of the through hole. The movable part may be tangent to a side of the opening of the protective cover away from the electric heating structure. According to this embodiment, the movable element, the position of the movable element in tangent to the through hole and the position of the movable element in tangent to the opening in the protective cover may enclose a separate area in which the heat-sensitive adhesive structure may be filled, such that the temperature response of the heat-sensitive adhesive structure to the electro-thermal effect of the layer of electro-thermal material is more sensitive.
Specifically, as shown in fig. 1, which is a schematic structural diagram of the liquid storage container 3 provided in this embodiment connected to the chip body 10, as shown in fig. 1 and fig. 9, in the liquid storage container 3 provided in this embodiment of the present application, the liquid release mechanism 32 has two functions, one of which is connected and fixed with the liquid storage mechanism 31, and realizes sealing of the liquid reagent contained in the liquid storage container 313 by cooperation with the movable part 314, and the other of which is to control opening of the liquid reagent release port (an opening below the liquid storage container 313) so that the liquid flows into the liquid inlet channel 21 of the chip body 10. Specifically, the liquid release mechanism 32 and the liquid storage mechanism 31 can be fixed and sealed by conventional techniques known to those skilled in the art, such as adhesion, welding, etc., to form a complete structure.
In the embodiment of the application, the switch structure (movable part) for controlling the release of the reagent is arranged inside the liquid storage container, and the control of the switch structure and the release of the liquid reagent are realized in a heat energy conversion mode. The electric energy required by the heat energy generated by the external diagnostic device can be uniformly provided by a power supply required by the operation of the driving chip device, so that devices such as a mechanical ejector rod, a heating film, a centrifugal drive and the like used in the existing reagent release scheme are omitted, the cost and the volume of the external diagnostic device can be obviously reduced, and the external diagnostic device has the characteristics of simple release mode, sensitive and quick response and easiness in integration. The in-vitro diagnosis micro-fluidic chip integrated with the scheme does not need to manually add all required reagents in each stage of the detection process, and is expected to realize the integrated one-stop detection of physiological and pathological indexes of sample input-result output.
In addition, as shown in fig. 10, the present application also provides a detection system including the microfluidic chip 100 according to any one of the above descriptions.
In some embodiments, as shown in fig. 10, the detection system further includes a control device 200, wherein the control device 200 is electrically connected to the microfluidic chip 100 and configured to apply an electrical signal to the microfluidic chip 100 to drive the microfluidic chip 100 to operate.
In some embodiments, as shown in fig. 10, the detection system may further include an optical unit 300 configured to optically detect the microfluidic chip 100.
Illustratively, the optical unit may include a fluorescence detection device, which may include, for example, a fluorescence light source and an image sensor (e.g., a Charge Coupled Device (CCD) image sensor). Illustratively, the optical unit may further include an image processing device configured to process a detection picture output by the fluorescence detection device. For example, the image processing apparatus may include a Central Processing Unit (CPU), a Graphic Processing Unit (GPU), or the like. For example, the control means is further configured to control the fluorescence detection means and the image processing means to perform the respective functions.
It should be noted that, in some embodiments of the present disclosure, the microfluidic chip and the detection system may further include other functional structures, which may be determined according to practical needs, and the embodiments of the present disclosure are not limited thereto. In addition, the descriptions of the shapes and the sizes of the structures of the portions in the microfluidic chip provided by the embodiments of the present disclosure are merely illustrative examples of some embodiments, and the shapes and the sizes of the structures of the portions in actual design are not limited to the above embodiments, and are not repeated herein. In addition, the drawings in the present application are only schematic, and the specific size and proportion of each structure in the drawings do not represent the actual size proportion of each structure.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
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