阅读说明：本技术 一种大靶面探测器阵列式多级半导体制冷方法 (Large-target-surface detector array type multi-stage semiconductor refrigeration method ) 是由 王建立 陈涛 刘昌华 曹景太 李洪文 刘洋 张恒 于 2020-03-23 设计创作，主要内容包括：一种大靶面探测器阵列式多级半导体制冷装置,涉及光电成像探测器真空制冷封装领域,解决现有探测器制冷装置结构复杂,体积较大,进而影响探测器的制冷效果等问题,包括大靶面探测器、冷板、阵列多级半导体制冷器和热沉；所述大靶面探测器与冷板之间采用高导热的环氧树脂胶粘接,所述阵列多级半导体制冷器冷端与冷板之间、阵列多级半导体制冷器热端与热沉之间均采用低温焊料焊接。本发明的阵列式多级半导体制冷为热电制冷方式,无噪声、无振动、不使用制冷剂,多级半导体可以实现探测器成像大温差的需求,阵列式半导体可以实现探测器发热量大的需求,本发明能够很好的应用在当前大靶面(像素6K×6K)CMOS探测器中。(The invention discloses an array type multistage semiconductor refrigeration device of a large-target-surface detector, which relates to the field of vacuum refrigeration packaging of photoelectric imaging detectors and solves the problems that the existing detector refrigeration device is complex in structure and large in size, and further influences the refrigeration effect of the detector and the like.)

1. The utility model provides a large target surface detector array multistage semiconductor refrigerating plant which characterized by: the device comprises a large target surface detector (1), a cold plate (2), an array type multistage semiconductor refrigerator (3) and a heat sink (4);

the large target surface detector (1) and the cold plate (2) are bonded by high-heat-conductivity epoxy resin glue, and the cold ends of the array type multistage semiconductor refrigerators (3) and the cold plate (2) and the hot ends of the array type multistage semiconductor refrigerators (3) and the heat sink (4) are welded by low-temperature solders.

2. The large target surface detector array type multistage semiconductor refrigerating device according to claim 1, wherein: after the molten low-temperature solder is cooled, a metallographic structure is formed at a welding seam, so that gapless metal connection is formed between the array type multistage semiconductor refrigerator (3) and the cold plate (2) and the heat sink (4).

3. The large target surface detector array type multistage semiconductor refrigerating device according to claim 2, wherein: the low temperature solder refers to solder with melting point <200 ℃.

4. The large target surface detector array type multistage semiconductor refrigerating device according to claim 1, wherein: the material of the cold plate (2) is the same as the substrate material of the large target surface detector (1), and the cold plate and the substrate material are both aluminum nitride.

5. The large target surface detector array type multistage semiconductor refrigerating device according to claim 1, wherein 2 × 2 array multistage semiconductor refrigerators are adopted to refrigerate the large target surface detector, and the semiconductor refrigerators are connected in series, in parallel or in a combination of series and parallel.

Technical Field

The invention relates to the field of vacuum refrigeration packaging of photoelectric imaging detectors, in particular to a method for refrigerating a 6K large-target-surface detector array type multistage semiconductor.

Background

In order to inhibit the influence of the dark current noise of the detector on imaging, the detector needs to be refrigerated, common refrigeration methods include semiconductor refrigeration, Stirling refrigeration, pulse tube refrigeration and the like, the semiconductor refrigeration utilizes the working principle of thermoelectric effect to refrigerate, and the refrigeration has no noise, no vibration, no need of refrigerant, small volume, light weight, reliable work, simple and convenient operation, is easy to regulate the refrigerating capacity and becomes the main means of the refrigeration of the current detector. Stirling refrigeration is an electrically driven mechanical refrigerator, and the working principle of the Stirling refrigeration is that gas does work by adiabatic expansion, namely, the gas works according to a reverse Stirling cycle to realize refrigeration. The Stirling refrigerator has a large volume and certain vibration, is usually used for deep refrigeration such as liquid nitrogen preparation and the like, and has certain influence on detector imaging; the pulse tube refrigeration is realized by utilizing high-pressure gas to be evacuated in an insulated mode, during inflation, a temperature gradient is formed in the pulse tube due to compression, the temperature of the closed end is highest, and compression heat is carried away by cooling water. Therefore, when high-pressure gas in the pulse tube is exhausted, a low-temperature refrigerating area is formed at the outlet end of the tube, and the refrigerating mode is complex in structure, large in size and not suitable for refrigerating of an imaging detector.

With the maturity of semiconductor process technology and the continuous development of the demand of astronomical observation application, the size of the detector is larger and larger, and the imaging area of the first few millimeters is gradually developed to the imaging area of the present dozens of millimeters, which provides a new challenge for the refrigeration of the detector. Firstly, the heat productivity of the detector is increased, the refrigeration coefficient of the semiconductor is smaller, and the pressure of the increase of the refrigeration capacity on the refrigeration of a single semiconductor is huge; secondly, the size of the detector is increased, the semiconductor refrigeration module is made of ceramic materials, and the single semiconductor refrigeration module with larger size can increase the mismatch of the thermal expansion coefficients between the semiconductor module and the vacuum Dewar metal cavity, so that the damage of the module or the disconnection of a heat transfer link can be caused, and the refrigeration effect of the detector is influenced.

Disclosure of Invention

The invention provides an array type multistage semiconductor refrigerating device for a large-target-surface detector, which aims to solve the problems that the existing detector refrigerating device is complex in structure and large in size, so that the refrigerating effect of a detector is influenced and the like.

An array type multistage semiconductor refrigerating device of a large target surface detector comprises the large target surface detector, a cold plate, an array multistage semiconductor refrigerator and a heat sink;

the large target surface detector and the cold plate are bonded by high-heat-conductivity epoxy resin glue, and the cold end of the array multistage semiconductor refrigerator and the cold plate, and the hot end of the array multistage semiconductor refrigerator and the heat sink are welded by low-temperature solders.

The invention has the beneficial effects that the requirement of semiconductor refrigeration of a large-target-surface detector is met, the large-target-surface detector refers to a detector of a pixel 6K × 6K, multistage semiconductor refrigeration array arrangement is used for meeting the refrigeration requirements of large refrigeration capacity and large temperature difference of the detector, the semiconductor hot end and the heat sink as well as the semiconductor hot end and the cold plate are connected in a low-temperature welding manner, and the cold plate and the detector are bonded by high-heat-conductivity epoxy resin.

The invention uses the refrigeration mode of the large target surface (pixel 6K × K) detector of the array type multistage semiconductor, the small volume of the multistage semiconductor can enable the multistage semiconductor to be directly attached to the rear end of the detector by a unit device, the compact design is realized, the large temperature difference refrigeration can be realized by the multistage semiconductor, the requirement of the detector for inhibiting dark current noise is met, and the requirement of the larger refrigeration capacity can be realized by the array type semiconductor refrigeration.

The array type multistage semiconductor refrigeration is a thermoelectric refrigeration mode, is free of noise and vibration, does not use a refrigerant, can meet the requirement of large imaging temperature difference of the detector, can meet the requirement of large heat productivity of the detector, and can be well applied to the current large-target-surface (pixel 6K × 6K) CMOS detector.

Drawings

FIG. 1 is a front view of an array type multistage semiconductor refrigeration device for a large target surface detector according to the present invention;

fig. 2 is an exploded view of fig. 1.

In the figure, 1, a large target surface detector; 2. a cold plate; 3. an array type multistage semiconductor refrigerator; 4. a heat sink.

Detailed Description