阅读说明：本技术 一种水凝胶界面粘接强度的调控方法 (Method for regulating and controlling hydrogel interface bonding strength ) 是由 黄建永 汪溥頔 刘雅倩 苏醒 冀国俊 于 2021-08-02 设计创作，主要内容包括：本公开提供一种水凝胶界面粘接强度的调控方法,包括：结合有限元模拟和实验测量的水凝胶内离子含量,得到水凝胶内离子扩散系数；将离子浓度饱和的第一水凝胶与无可自由移动离子的第二水凝胶粘接,并建立相应的电路模型；根据扩散系数、电路模型结合实验测量的电流数据、粘接强度数据,得到不同电场作用下水凝胶粘接强度与电流的关系；根据电流数据计算得到水凝胶界面的离子等效电荷量,从而得到水凝胶粘接界面区域离子等效电荷量与粘接强度的调控关系。本公开通过将理论模拟与实验数据结合,最终得到水凝胶粘接区域内离子含量与粘接强度的关系,进而指导精准控制水凝胶粘接强度,在水凝胶智能粘附、微结构精准控制等领域具有潜在应用价值。(The invention provides a method for regulating and controlling the bonding strength of a hydrogel interface, which comprises the following steps: combining the ion content in the hydrogel measured by finite element simulation and experiment to obtain the ion diffusion coefficient in the hydrogel; bonding the first hydrogel with saturated ion concentration with the second hydrogel without freely movable ions, and establishing a corresponding circuit model; obtaining the relationship between the hydrogel bonding strength and the current under the action of different electric fields according to the diffusion coefficient, current data measured by a circuit model in combination with experiments and bonding strength data; and calculating the ion equivalent charge quantity of the hydrogel interface according to the current data so as to obtain the regulation and control relation between the ion equivalent charge quantity and the bonding strength of the hydrogel bonding interface region. According to the method, theoretical simulation and experimental data are combined, the relation between the ion content and the bonding strength in the hydrogel bonding area is finally obtained, and then the hydrogel bonding strength is guided to be accurately controlled, so that the method has potential application values in the fields of hydrogel intelligent adhesion, microstructure accurate control and the like.)

1. A method for regulating and controlling the interface bonding strength of hydrogel is characterized by comprising the following steps:

combining the ion content in the hydrogel measured by finite element simulation and experiment to obtain the ion diffusion coefficient in the hydrogel;

bonding the first hydrogel with saturated ion concentration with the second hydrogel without freely movable ions, and establishing a corresponding circuit model;

obtaining the relationship between the hydrogel bonding strength and the current under the action of different electric fields according to the diffusion coefficient, the current data measured by the circuit model in combination with experiments and the bonding strength data;

and calculating the ion equivalent charge quantity of the hydrogel interface according to the current data so as to obtain the regulation and control relation between the ion equivalent charge quantity and the bonding strength.

2. A method as claimed in claim 1, wherein the step of combining the ion content in the finite element simulated hydrogel comprises:

and (3) calculating the change of the total ion amount in the hydrogel region in the saturated ion solution with time by using a finite element method.

3. A method for manipulating hydrogel interfacial adhesion strength as recited in claim 2, wherein said using finite element modeling comprises:

the diffusion process of the ions from the saturated solution into the hydrogel region is described as:

wherein t represents time, c_ionDenotes the concentration of freely mobile ions at a point within the hydrogel, D_ionThe diffusion coefficient of freely mobile ions in the hydrogel.

4. A method as claimed in claim 3, wherein the using finite element modeling further comprises: calculating the ion concentration data c in the hydrogel at the corresponding time points using formula II_i(i＝1，2，3...N)：

Wherein Ω represents a hydrogel region, V_gelRepresents the hydrogel volume.

5. A method for regulating and controlling hydrogel interfacial adhesion strength according to claim 4, wherein the obtaining of the ion diffusion coefficient in the hydrogel comprises:

comparing the ion content in the hydrogel obtained by finite element simulation and experimental measurement when

Then ions can be respectively obtained in the first waterDiffusion coefficient D in gel, second hydrogel_ionA、D_ionB，

Wherein the content of the first and second substances,

represents the average value of the ion concentration in the water determined by the experiment; c_i(i ═ 1, 2, 3.. N) is data for experimentally measured concentrations within the hydrogel; argmax represents that the function expression in the brackets at the back is calculated for different ion concentrations and the maximum value is obtained; r²The evaluation value of the goodness of fit of the finite element data and the experimental measurement data is shown.

6. A method for controlling hydrogel interfacial adhesion strength as claimed in claim 1, wherein the establishing of the corresponding circuit model comprises:

and establishing a corresponding time domain and pull-domain circuit model, wherein the circuit model comprises the self-resistance of the first hydrogel, the self-resistance of the second hydrogel, and the resistance and the capacitance of the hydrogel interface.

7. The method for regulating the hydrogel interfacial adhesion strength according to claim 6, wherein the obtaining of the current data according to the diffusion coefficient and the circuit model comprises:

establishing an expression through a pull-type domain circuit model according to kirchhoff's law, and calculating to obtain:

wherein, I_s(s) andrespectively is main circuit current I (t) and local current of the combined structure of the first hydrogel and the second hydrogelAn expression in a pull-field; e is the equivalent electromotive force of the circuit model; s is a complex parameter of the pull-type domain, Q_C0Representing the initial charge of the capacitance of the bonded portion of the first hydrogel and the second hydrogel; r_AIs the first hydrogel equivalent resistance, R_BIs the second hydrogel equivalent resistance, R_CAnd C is the equivalent resistance of the hydrogel interface, and C is the equivalent capacitance of the hydrogel interface.

8. The method for regulating hydrogel interfacial adhesion strength according to claim 7, wherein the obtaining current data according to the diffusion coefficient and the circuit model further comprises:

performing pull-type inverse transformation according to the formula V and the formula VI to obtain the current I (t) in the time domain space,Thereby obtaining a capacitor charging current I_C(t) is:

where t is the time counted from the start of bonding.

9. The method for regulating and controlling hydrogel interfacial adhesion strength according to claim 8, wherein obtaining the relationship between hydrogel adhesion strength and current under different electric field effects comprises:

and (3) combining the experimentally measured bonding strength and the calculation result of the capacitor charging current obtained in the formula VII to obtain the relationship between the hydrogel bonding strength and the current under the action of different electric fields.

10. The method for controlling hydrogel interfacial adhesion strength according to claim 9, wherein the ion equivalent charge amount is expressed as:

and obtaining the regulation and control relation between the ion equivalent charge amount and the bonding strength according to the relation between the hydrogel bonding strength and the current under the action of different electric fields.

Technical Field

The disclosure relates to the technical field of biological materials, in particular to a method for regulating and controlling the bonding strength of a hydrogel interface.

Background

Adjustable hydrogels that are capable of responding to external stimuli have attracted considerable attention in the fields of industrial, biomedical, and robotic applications. Electrically controlled hydrogel adhesion has heretofore provided a highly efficient and accurate means of controlling the attractive forces between two hydrogel surfaces under the influence of an electric field. Compared with the existing mechanism for regulating and controlling hydrogel interfacial adhesion, the electric control adhesion has several advantages, such as precise control of interfacial adhesion, quick response, no residual stress, no noise in operation, low energy consumption and the like. The electric control bonding has the characteristics of high sensitivity and programmable automatic regulation and control, and has wide application potential in the fields of soft material clamps, climbing robots, touch sensors and the like by combining the advantages of small size and light weight.

However, current electrically controlled adhesives based on electrical conductors and insulating layers typically require voltages applied in the range of several kilovolts, which, in addition to safety issues and the need for dedicated circuit components compatible with high voltages, are prone to dielectric breakdown and corresponding irreversible device failure. In order to reduce the operating voltage of the electrically controlled adhesive, the main technical means is to reduce the thickness of the dielectric layer of the electric adhesive. However, as the thickness of the dielectric layer is reduced, it is very difficult to reliably manufacture a hydrogel adhesive structure having high adhesive strength and no structural defects, and the voltage cannot be reduced to a voltage range safe to the human body by using the conventional dielectric adhesive.

Disclosure of Invention

Technical problem to be solved

In order to solve the problems, the disclosure provides a method for regulating and controlling the bonding strength of a hydrogel interface, which is used for at least partially solving the technical problems of high working voltage, limited use scene and the like of the traditional electric control hydrogel method.

(II) technical scheme

The invention provides a method for regulating and controlling the bonding strength of a hydrogel interface, which comprises the following steps: combining the ion content in the hydrogel measured by finite element simulation and experiment to obtain the ion diffusion coefficient in the hydrogel; bonding the first hydrogel with saturated ion concentration with the second hydrogel without freely movable ions, and establishing a corresponding circuit model; obtaining the relationship between the hydrogel bonding strength and the current under the action of different electric fields according to the diffusion coefficient, current data measured by a circuit model in combination with experiments and bonding strength data; and calculating the ion equivalent charge quantity of the hydrogel interface according to the current data so as to obtain the regulation and control relation between the ion equivalent charge quantity and the bonding strength.

Further, simulating the ion content within the hydrogel in combination with the finite elements includes: and (3) calculating the change of the total ion amount in the hydrogel region in the saturated ion solution with time by using a finite element method.

Further, using finite element modeling includes: the diffusion process of ions from the saturated solution into the hydrogel region is described as:

wherein t represents time, c_ionDenotes the concentration of freely mobile ions at a point within the hydrogel, D_ionThe diffusion coefficient of freely mobile ions in the hydrogel.

Further, using finite element modeling further comprises: calculating the ion concentration data c in the hydrogel at the corresponding time points using formula II_i(i＝1，2，3...N)：

Wherein Ω represents a hydrogel region, V_gelRepresents the hydrogel volume.

Further, obtaining the ion diffusion coefficient in the hydrogel comprises: comparing the ion content in the hydrogel obtained by finite element simulation and experimental measurement when

Then the diffusion coefficients D of the ions in the first hydrogel and the second hydrogel can be obtained respectively_ionA、D_ionB，

Wherein the content of the first and second substances,

represents the average value of the ion concentration in the water determined by the experiment; c_i(i ═ 1, 2, 3.. N) is data for experimentally measured concentrations within the hydrogel; argmax represents that the function expression in the brackets at the back is calculated for different ion concentrations and the maximum value is obtained; r²The evaluation value of the goodness of fit of the finite element data and the experimental measurement data is shown.

Further, establishing the corresponding circuit model includes: and establishing a corresponding time domain and pull domain circuit model, wherein the circuit model comprises the self-resistance of the first hydrogel, the self-resistance of the second hydrogel, and the resistance and the capacitance of a hydrogel interface.

Further, obtaining the current data according to the diffusion coefficient and the circuit model comprises: establishing an expression through a pull-type domain circuit model according to kirchhoff's law, and calculating to obtain:

wherein, I_s(s) andrespectively, the main circuit current I (t) and the first currentCombined structure local current of hydrogel and second hydrogelAn expression in a pull-field; e is the equivalent electromotive force of the circuit model; s is a complex parameter of the pull-type domain, Q_C0Representing the initial charge of the capacitance of the bonded portion of the first hydrogel and the second hydrogel; r_AIs the first hydrogel equivalent resistance, R_BIs the second hydrogel equivalent resistance, R_CThe equivalent resistance of the hydrogel interface, and the equivalent capacitance of the hydrogel interface.

Further, obtaining the current data according to the diffusion coefficient and the circuit model further comprises: performing pull-type inverse transformation according to the formula V and the formula VI to obtain the current I (t) in the time domain space,Thereby obtaining a capacitor charging current I_C(t) is:

where t is the time counted from the start of bonding.

Further, obtaining the relationship between the hydrogel adhesion strength and the current under different electric field effects comprises: and (3) combining the bonding strength measured by the experiment and the calculation result of the capacitor charging current obtained in the formula VII to obtain the relationship between the hydrogel bonding strength and the current under the action of different electric fields.

Further, the expression of the ion equivalent charge amount is:

and obtaining the regulation and control relation between the ion equivalent charge quantity and the bonding strength according to the relation between the hydrogel bonding strength and the current under the action of different electric fields.

(III) advantageous effects

According to the method for regulating and controlling the bonding strength of the hydrogel interface, theoretical simulation and experimental data are combined, a circuit model describing migration of ions in the bonding hydrogel under the drive of a concentration gradient field and an electric field is established, current and bonding strength data obtained through experimental measurement are compared with theoretical model calculation results, and finally a relation curve of the ion content and the bonding strength in a hydrogel bonding area is obtained, so that accurate control of the bonding strength of the hydrogel is guided, and the method has potential application values in the fields of intelligent adhesion of the hydrogel, accurate control of microstructures and the like. Provides a new fundamental insight for electroadhesion, provides a simple way to rapidly and reversibly control adhesion using an applied potential, and has broad application potential in the fields of soft material fixtures, climbing robots, tactile sensors, and the like.

Drawings

FIG. 1 schematically illustrates a flow chart of a method for controlling hydrogel interfacial adhesion strength according to an embodiment of the present disclosure;

FIG. 2 schematically shows a complete flow diagram of a hydrogel interfacial adhesion modulation method based on an electrically driven ion diffusion effect according to an embodiment of the present disclosure;

FIG. 3 schematically shows a schematic graph of permeability coefficient measurements for ion migration in a hydrogel according to an embodiment of the disclosure;

FIG. 4 is a graph schematically illustrating the determination of the diffusion coefficient of ions in a hydrogel according to an embodiment of the present disclosure;

FIG. 5 schematically illustrates a schematic view of an electrically controlled adhesive hydrogel according to an embodiment of the disclosure;

FIG. 6 schematically shows results of experimentally measuring hydrogel bond strength under different energization conditions in accordance with an embodiment of the present disclosure;

FIG. 7 schematically illustrates a hydrogel bonding electrical control circuit in accordance with an embodiment of the present disclosure;

FIG. 8 schematically illustrates a graph comparing experimentally measured current with theoretical model calculations in accordance with an embodiment of the present disclosure;

figure 9 schematically illustrates a plot of charge versus bond strength for a hydrogel bonding ion affected zone in accordance with an embodiment of the present disclosure.

Detailed Description

For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.

The present disclosure provides a method for regulating and controlling hydrogel interfacial adhesion strength, please refer to fig. 1, which includes: s1, combining the ion content in the hydrogel measured by finite element simulation and experiment to obtain the ion diffusion coefficient in the hydrogel; s2, bonding the first hydrogel with saturated ion concentration with the second hydrogel without freely movable ions, and establishing a corresponding circuit model; s3, obtaining the relationship between the hydrogel bonding strength and the current under the action of different electric fields according to the diffusion coefficient, the current data measured by the circuit model in combination with the experiment and the bonding strength data; and S4, calculating the ion equivalent charge quantity of the hydrogel interface according to the current data, and obtaining the regulation and control relation between the ion equivalent charge quantity and the bonding strength.

The experimental data were compared with theoretical simulations in S1 to obtain the corresponding diffusion coefficients, where: the ions are ions capable of freely migrating in the hydrogel, the hydrogel is obtained through a monomer polymerization means, the hydrogel can be used for a subsequent hydrogel interface bonding experiment in the disclosure and also can be used as a medium for ion migration in the disclosure, experimental data is obtained by soaking the hydrogel without the freely-moving ions in an ion saturated solution, calculating the content of the ions absorbed in the hydrogel under different time nodes through weighing and the like, and theoretical simulation is that finite element software is used for calculating the situation that the total amount of the ions in the hydrogel region changes along with time in the saturated ion solution. The diffusion coefficient of the ions in the hydrogel obtained by theoretical fitting is used as a basic parameter for regulating and controlling the subsequent hydrogel bonding strength of the hydrogel.

The hydrogel bonding in S2 is the same as the hydrogel in S1, and comprises two hydrogel colloids of a first hydrogel A and a second hydrogel B, wherein the hydrogel A is soaked in a saturated ionic solution and has a certain content of ions capable of freely migrating, the hydrogel B is not soaked in an ionic solution and does not contain ions capable of freely migrating, an electrochemical workstation applies voltage to a bonding area of the hydrogel, the voltage is loaded on a combined body of the hydrogel A and the hydrogel B through electrodes loaded at two ends of the hydrogel, the electric field is a uniform electric field generated in a hydrogel bonding area under the loading voltage of the electrochemical workstation and can influence the migration of charged ions, the hydrogel bonding strength refers to the strength value obtained by measuring the peeling of the two hydrogels under the action of external force, the unit is Pascal, and the bonding hydrogel current value refers to the current measurement value in the hydrogel under the action of the voltage, in amperes.

In S3, the experimental measurement results of the hydrogel bonding strength and the bonding hydrogel current value under the action of different electric fields are used for the structural feasibility verification of the basic circuit for regulating and controlling the hydrogel bonding strength and the basis for establishing a reference curve function for regulating and controlling the bonding strength. The circuit model is a simplified circuit model for accelerating migration of charged ions in a hydrogel area under the action of an electric field under the condition that two ends of two pieces of bonded hydrogel have voltages, and comprises the self resistance of the hydrogel, and the resistance and the capacitance of the ion-action bonded area. The hydrogel bonding model is used for controlling ion migration subsequently, regulating and controlling the bonding strength of hydrogel and establishing a main theoretical framework of a curve of the charge amount and the bonding strength of a hydrogel bonding area.

Comparing the calculation of the circuit model with the experimental result, wherein the calculation result refers to the current expression obtained under the framework of the circuit model, the experimental result refers to the current data obtained by applying voltage measurement, and the comparison of the calculation result and the experimental result refers to the comparison of the current data obtained by calculating according to the circuit with the data obtained by experimental measurement. Evaluating the reliability of the circuit model for describing hydrogel electric control bonding in the disclosure by comparing experimental data with theoretical calculation data; will be used to verify the reliability of the theoretical framework of the present disclosure for subsequently establishing hydrogel bond region charge and bond strength curves.

S3, further includes a method of measuring circuit parameters of an ion action region affecting hydrogel adhesion, wherein: the circuit parameters of the ion action zone affecting hydrogel adhesion refer to the interface resistance and interface capacitance of hydrogel interface adhesion in the previously validated circuit model of the present disclosure. The circuit parameters of the ion action area are used for controlling ion migration subsequently, regulating and controlling the bonding strength of the hydrogel, establishing a main theoretical basis of a curve of the charge quantity and the bonding strength of the hydrogel bonding area, and playing a key role in regulating and controlling the interface bonding of the hydrogel.

A method for obtaining a hydrogel adhesion strength versus ionic charge in the interfacial adhesion region in S4, wherein: the ionic charge amount in the interface bonding area refers to the ionic equivalent charge amount stored on the bonding interface capacitor in the hydrogel electric control bonding circuit model, and the relation curve refers to the correlation curve of the hydrogel bonding strength and the ionic equivalent charge amount stored on the interface capacitor under the action of an electric field, which is measured by experiments. The relation curve is suitable for the hydrogel interface bonding regulation and control model under the circuit model framework and has good universality.

The present disclosure provides a new fundamental insight for electroadhesion, provides a simple way to rapidly and reversibly control adhesion using applied potentials, and has broad application potential in the fields of soft material fixtures, climbing robots, tactile sensors, etc.

Fig. 2 is a schematic view of a complete flow of a hydrogel interfacial adhesion control method based on an electrically driven ion diffusion effect according to an embodiment of the present disclosure, including the following steps:

step 1, measuring the ion diffusion coefficient in the hydrogel by comparing experimental and theoretical simulation results, namely S1;

step 2, applying voltage to the bonding area of the hydrogel through an electrochemical workstation to obtain the hydrogel bonding strength and the bonding hydrogel current value under the action of different electric fields;

step 3, establishing a corresponding circuit model for the two pieces of bonded hydrogel under the action of the electric field, which is equivalent to S2;

step 4, comparing the calculation of the circuit model with the experimental result, and verifying the reliability of the circuit model, which is equivalent to S3;

and step 5, measuring circuit parameters of the ion action area influencing the hydrogel adhesion to obtain a relation curve of the hydrogel adhesion strength and the ionic charge amount in the interface adhesion area, which is equivalent to S4.

Specifically, first, the present disclosure measures the diffusion coefficient of ions in the hydrogel, and its model is shown in fig. 3. A piece of hydrogel, 1.5mm in radius and 5mm in length, cylindrical in shape and free of freely mobile ions, was soaked in a saturated ionic solution, and the diffusion of ions from the saturated solution into the hydrogel area can be described as:

wherein t represents time, c_ionDenotes the concentration of freely mobile ions at a point within the hydrogel, D_ionThe diffusion coefficient of freely mobile ions in the hydrogel.

In the experiment, the ion content in the hydrogel after soaking the hydrogel in different time is measured, and N groups of data C of ion concentration in the aqueous solution can be obtained_i(i ═ 1, 2, 3.. N), by theoretical model calculation, data c of ion concentration in hydrogel at corresponding time points can be extracted as well_i(i ═ 1, 2, 3.. N), wherein:

wherein Ω represents a hydrogel region, V_gelRepresents the hydrogel volume.

Next, the present disclosure compares the experimental data obtained from the A, B hydrogels used for bonding with the results obtained from theoretical model calculations, when

Then, the diffusion coefficients D of the ions in A, B hydrogel can be measured in situ respectively_ionA、D_ionBWherein, in the step (A),

the mean values of the experimentally determined ion concentrations in water are indicated. The experimental results and theoretical model results are shown in FIG. 4.

The present disclosure next applies a voltage to the bonding area of the hydrogel through the electrochemical workstation to obtain the hydrogel bonding strength and the bonding hydrogel current value under different electric field effects, as shown in fig. 5 and 6. The electrically controlled hydrogel bonding of the present disclosure is now simplified in FIG. 4, which is a circuit diagram of FIG. 7, wherein R is shown_AAnd R_BRespectively A, B hydrogel equivalent resistance, R_CA, B ion action area equivalent resistance of hydrogel bonding structure, C A, B ion action area equivalent capacitance of hydrogel bonding structure, E represents equivalent electromotive force of the circuit structure, i (t) is trunk circuit current in the circuit, i_Rc(t) is the local current for A, B hydrogel adhesive structures. FIG. 7 of the present disclosure is a circuit model in the pull-down domain on the right, where s is a complex parameter of the pull-down domain, i(s) and i_Rc(s) represents a main circuit current of a pull-type domain and a local current of an A, B hydrogel adhesive structure, respectively.

Wherein u is_C(O^-) Representing the initial voltage of the capacitance, Q, at the bonding portion of hydrogels A and B of the present disclosure_C0The initial charge of the capacitor at the bonding portion of hydrogels a and B of the present disclosure is shown.

It should be noted that, as shown in fig. 5, in the bonding of the present disclosure, a hydrogel a needs to be soaked in a saturated solution for 24 hours, so that the ion concentration in the hydrogel a reaches saturation, and then a hydrogel B without freely movable ions is bonded, because the difference of the ion concentration between the hydrogels a and B and the effect of an electric field exist, the control equation (1) of ion migration can be rewritten as follows:

wherein J is the diffusion flux of ions in the hydrogels A and B, and Z_ionDenotes the number of charges of the ion, F denotes the Faraday constant, V denotes the electric potential field in the combined structure of hydrogels A and B, U_ionThe mobility of the ions is shown, and the following relationship exists with the diffusion coefficient of the hydrogel obtained through experimental measurement in the disclosed embodiment:

where R represents the ideal gas diffusion constant and T represents the absolute temperature.

Thus, the circuit structure in the present disclosure, as shown in fig. 7, can be expressed by kirchhoff's law as:

wherein, I_s(s) andthe main circuit current i (t) and the combined structure local current of the hydrogel A and the hydrogel BExpressions in a pull-field.

By solving equations (9) and (10), one can obtain:

by performing pull-type inverse transformation on equations (11) and (12), an expression of the current in the time domain space can be obtained

The capacitor charging current is:

further, an expression of the capacitor charge amount can be obtained:

in this embodiment, the applied voltage is 1.6V, and the reliability and accuracy of the circuit model of the adhesive hydrogel constructed by the present disclosure can be verified by comparing the experimental measurement with the calculation result obtained in the above formula (15), as shown in fig. 8.

In further implementation, the charge quantity of the structure bonded by the hydrogels a and B calculated by equation (16) is compared with the bonding strength obtained by experimental measurement, and the regulation and control relationship between the charge quantity and the strength of the ion action region of the electrically controlled bonding of the hydrogels can be obtained, as shown in fig. 9. This relationship in the present disclosure can be used as a basis for the rapid and reversible controlled adhesion of such electrically controlled adhesive structures of hydrogels a and B.

According to the method, theoretical simulation and experimental data are combined, a circuit model describing migration of ions in the bonding hydrogel under the drive of a concentration gradient field and an electric field is established, current and bonding strength data obtained through experimental measurement are compared with theoretical model calculation results, and finally a relation curve of ion content and bonding strength in a hydrogel bonding area is obtained, so that the bonding strength of the hydrogel is guided to be accurately controlled, and the method has potential application value in the fields of intelligent adhesion of the hydrogel, accurate control of microstructures and the like.

The above-mentioned embodiments are intended to illustrate the objects, aspects and advantages of the present disclosure in further detail, and it should be understood that the above-mentioned embodiments are only illustrative of the present disclosure and are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.