阅读说明：本技术 一种毫米波与非毫米波天线整合模块 (Millimeter wave and non-millimeter wave antenna integration module ) 是由 黄奂衢 刘俊永 林虹 孙浩 漆知行 曾敏慧 周彦超 李靖巍 马涛 于 2020-04-01 设计创作，主要内容包括：本发明公开一种毫米波与非毫米波天线整合模块,包括模块载体、一支以上毫米波天线、一支以上非毫米波天线、射频集成电路；所述射频集成电路与毫米波天线电连接；所述射频集成电路与非毫米波天线在模块载体的同一平面,或者,非平行空间设置。本发明移动通信设备,能充分利用设备侧边的高度空间,从而不需要占据大量水平面积,从而降低了天线模块对移动通信设备的整机尺寸要求,进而减少成本及提升产品竞争力。(The invention discloses a millimeter wave and non-millimeter wave antenna integration module, which comprises a module carrier, more than one millimeter wave antenna, more than one non-millimeter wave antenna and a radio frequency integrated circuit, wherein the module carrier is provided with a plurality of millimeter wave antennas; the radio frequency integrated circuit is electrically connected with the millimeter wave antenna; the radio frequency integrated circuit and the non-millimeter wave antenna are arranged on the same plane of the module carrier or in a non-parallel space. The mobile communication equipment can fully utilize the height space of the side edge of the equipment, so that a large amount of horizontal area is not required to be occupied, the requirement of the antenna module on the size of the whole mobile communication equipment is reduced, the cost is reduced, and the product competitiveness is improved.)

1. The utility model provides a millimeter wave and non-millimeter wave antenna integration module which characterized in that: the antenna comprises a module carrier, more than one millimeter wave antenna, more than one non-millimeter wave antenna and a radio frequency integrated circuit; the radio frequency integrated circuit is electrically connected with the millimeter wave antenna; the radio frequency integrated circuit and the non-millimeter wave antenna are arranged on the same plane of the module carrier or in a non-parallel space.

2. The millimeter-wave and non-millimeter-wave antenna integration module of claim 1, wherein: each millimeter wave antenna can be any one of single-frequency or multi-frequency single-linear polarization, dual-linear polarization, single circular polarization or dual circular polarization type antennas.

3. The millimeter-wave and non-millimeter-wave antenna integration module of claim 2, wherein: the number of the millimeter wave antennas is multiple, and more than one millimeter wave antenna array is formed;

each millimeter wave antenna array is any one of a linear array, a square array, a rectangular array, a triangular array, a circular array and a non-equidistant array.

4. The millimeter-wave and non-millimeter-wave antenna integration module of claim 3, wherein: the number of the millimeter wave antenna arrays is one, the millimeter wave antenna arrays are one-dimensional linear arrays, and the size of each millimeter wave antenna unit is less than or equal to 2 equivalent guided wave wavelengths (guided wavelengthh) of the lowest working frequency point of each millimeter wave antenna unit; the distance between two adjacent millimeter wave antennas is less than or equal to 2 free-space wavelengths (free-space wavelengths) of the lowest working frequency point.

5. The millimeter-wave and non-millimeter-wave antenna integration module of claim 1, wherein: each of the non-millimeter wave antennas is in the form of any one of a monopole antenna (monopole antenna), a dipole antenna (dipole antenna), a patch antenna (patch antenna), a stacked patch antenna (stacked patch antenna), an inverted-F antenna (IFA), a planar inverted-F antenna (PIFA), a Yagi-Uda antenna (Yagi-Uda antenna), a slot antenna (slot antenna), a magneto-electric dipole antenna (magnetic-electric dipole antenna), a horn antenna (horn antenna), a loop antenna (loop antenna), a grid antenna (grid antenna), a cavity-backed antenna (cavity-backed antenna), and a leaky-wave antenna (leaky-wave antenna).

6. The millimeter-wave and non-millimeter-wave antenna integration module of claim 1, wherein: the number of the non-millimeter wave antennas is two, and the total length of each non-millimeter wave antenna 3a is 1/4 of the equivalent guided wave wavelength (guided wavelength) corresponding to the working frequency point; the distance between the two non-millimeter wave antennas 3a is larger than 0.01 free space wavelength of the lowest working frequency point.

7. The millimeter-wave and non-millimeter-wave antenna integration module of claim 1, wherein: the chip also comprises other chips, and the other chips are selected from any one or more of a power management chip, an operation processing chip and a data storage chip.

8. The millimeter-wave and non-millimeter-wave antenna integration module of claim 1, wherein: the module carrier is provided with a ground plane, and the non-millimeter wave antenna is connected with the ground plane.

9. The millimeter wave and non-millimeter wave antenna integration module according to claim 1, wherein the shape of the module carrier is any one of square, rectangle, triangle, trapezoid, C-shaped, E-shaped, F-shaped, L-shaped, T-shaped, V-shaped, U-shaped, W-shaped, X-shaped, Y-shaped, Z-shaped, concave-shaped, convex-shaped, square-shaped, round-shaped, oval-shaped, and arc-shaped.

10. The integrated module of millimeter wave and millimeter wave antenna according to claim 1, wherein the module carrier is made of any one of low-temperature co-fired ceramic (L TCC), high-temperature co-fired ceramic (HTCC), ceramic, Printed Circuit Board (PCB), flexible printed circuit board (FPC), Modified PI (MPI, Modified PI), liquid crystal polymer (L CP), and fluorine-containing material.

Technical Field

The invention relates to the technical field of antennas, in particular to a millimeter wave and non-millimeter wave antenna integration module.

Background

With the advent of the 5G era, the requirement for higher-order MIMO (multi-input and multi-output) communication, the requirement for coverage of more new frequency bands, and even the addition of millimeter wave bands, has created a demand for more antennas (including millimeter wave and non-millimeter wave antennas), and the space of the whole antenna cannot be significantly increased, which has led to higher antenna design difficulty, and even increased size of the whole antenna due to less compact antenna placement or design, which leads to reduced product competitiveness, whereas the 5G band is divided into millimeter wave bands and non-millimeter wave bands, and the mainstream antenna design scheme for the non-millimeter wave bands is a discrete antenna, and the mainstream implementation schemes include stamping iron sheet, fpc (flexible printed circuits), L ds (direct structure), pds (printed direct structure), etc., while the mainstream antenna design scheme for the millimeter wave bands is a package antenna AiP (for fpc) (which is a millimeter-wave integrated antenna module), and thus the number of millimeter-wave integrated antenna modules (i.e., as a millimeter-wave integrated antenna module (rf-antenna) is increased, and thus the number of the antenna modules (rf-integrated antenna) in the 5G) is increased.

Because the space of the whole machine cannot be obviously increased, but the communication requirement of more 5G (millimeter wave and non-millimeter wave) antennas needs to be accommodated, the design difficulty and the cost of the antennas are higher, and even the size of the whole machine is increased due to the arrangement or the design of the antennas which are not compact enough, so that the competitiveness of products is reduced.

Therefore, it is to be proposed to solve the problems in the prior art.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a millimeter wave and non-millimeter wave antenna integration module, which has the following specific scheme:

the antenna comprises a module carrier, more than one millimeter wave antenna, more than one non-millimeter wave antenna and a radio frequency integrated circuit; the radio frequency integrated circuit is electrically connected with the millimeter wave antenna; the radio frequency integrated circuit and the non-millimeter wave antenna are arranged on the same plane of the module carrier or in a non-parallel space.

In the invention, the radio frequency integrated circuit and the non-millimeter wave antenna are arranged on the same plane of the module carrier, or arranged in a non-parallel space, especially arranged in a non-parallel space, so that the height space of the side edge of the mobile phone can be fully utilized, a larger horizontal area can not be occupied, a more compact antenna design can be obtained without increasing the size and the cost of the whole mobile phone, and the competitiveness of the product is improved.

Preferably, each millimeter wave antenna may be any one of a single-frequency or multi-frequency single-linear polarization, dual-linear polarization, single circular polarization or dual circular polarization type antenna.

Preferably, the number of the millimeter wave antennas is multiple, and more than one millimeter wave antenna array is formed;

each millimeter wave antenna array is any one of a linear array, a square array, a rectangular array, a triangular array, a circular array and a non-equidistant array.

Preferably, the number of the millimeter wave antenna arrays is one, the millimeter wave antenna arrays are one-dimensional linear arrays, and the size of each millimeter wave antenna unit is less than or equal to 2 equivalent guided wave wavelengths of the lowest working frequency point of each millimeter wave antenna unit; the distance between two adjacent millimeter wave antennas is less than or equal to 2 free space wavelengths of the lowest working frequency point.

Preferably, each of the non-millimeter wave antennas is in the form of any one of a monopole antenna (monopole antenna), a dipole antenna (dipole antenna), a patch antenna (patch antenna), a stacked patch antenna (stacked patch antenna), an inverted-F antenna (IFA), a planar inverted-F antenna (PIFA), a Yagi-Uda antenna, a slot antenna (slot antenna), a magneto-electric dipole antenna (magnetic-electric dipole antenna), a horn antenna (horn antenna), a loop antenna (loop antenna), a grid antenna (grid antenna), a cavity-backed antenna (cavity-backed antenna), and a leaky-wave antenna (leaky-wave antenna).

Preferably, the number of the non-millimeter wave antennas is two, and the total length of each non-millimeter wave antenna 3a is 1/4 of the equivalent guided wave wavelength corresponding to the working frequency point; the distance between the two non-millimeter wave antennas 3a is larger than 0.01 free space wavelength of the lowest working frequency point.

Preferably, the chip further comprises other chips, and the other chips are selected from any one or more of a power management chip, an arithmetic processing chip and a data storage chip.

Preferably, the module carrier is provided with a ground plane, and the non-millimeter wave antenna is connected to the ground plane.

Preferably, the implementation process of the millimeter wave antenna and the non-millimeter wave antenna may be silver paste routing, L DS (laser direct structuring), PDS (printed direct structuring), FPC, or stamped metal sheet.

Preferably, the shape of the module carrier can be any one of square, rectangle, triangle, trapezoid, C-shaped, E-shaped, F-shaped, L-shaped, T-shaped, V-shaped, U-shaped, W-shaped, X-shaped, Y-shaped, Z-shaped, concave-shaped, convex-shaped, square-shaped, round-shaped, oval-shaped and arc-shaped.

Preferably, the module carrier is made of any one of low-temperature co-fired ceramic (L TCC, low-temperature co-fired ceramic), high-temperature co-fired ceramic (HTCC), ceramic, Printed Circuit Board (PCB), flexible printed circuit board (FPC), Modified PI (MPI), liquid crystal polymer (L CP, liquid crystal polymer mer), and fluorine-containing material.

The millimeter wave and non-millimeter wave antenna integration module provided by the invention has the following beneficial effects:

the antenna module is applied to mobile communication equipment, can fully utilize the height space of the side edge of the equipment, and therefore does not need to occupy a large amount of horizontal area, reduces the requirement of the antenna module on the size of the whole mobile communication equipment, and further reduces the cost and improves the product competitiveness.

Drawings

Fig. 1 is a schematic perspective view of a first embodiment of the present invention;

FIG. 2 is a schematic perspective view of another embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a system configuration according to a first embodiment of the present invention;

FIG. 4 is another angular view of FIG. 3;

FIG. 5 is a schematic perspective view illustrating a second embodiment of the present invention;

FIG. 6 is a schematic perspective view of another embodiment of the present invention;

FIG. 7 is a schematic perspective view of a third embodiment of the present invention;

FIG. 8 is a schematic perspective view of another embodiment of the present invention;

FIG. 9 is a schematic perspective view of a fourth embodiment of the present invention;

FIG. 10 is a schematic perspective view of another embodiment of the present invention;

fig. 11 is a schematic perspective view of a fifth embodiment of the present invention;

FIG. 12 is a schematic perspective view of another embodiment of the present invention;

FIG. 13 is a schematic structural diagram of a system configuration according to a fifth embodiment of the present invention;

FIG. 14 is another angular view of FIG. 13;

FIG. 15 is a schematic perspective view of a sixth embodiment of the present invention;

FIG. 16 is a schematic perspective view of another embodiment of the present invention;

FIG. 17 is a schematic structural diagram of a system according to a sixth embodiment of the present invention;

FIG. 18 is another angular view of FIG. 13;

FIG. 19 is a schematic perspective view of a seventh embodiment of the present invention;

FIG. 20 is a schematic perspective view of a seventh embodiment of the present invention;

fig. 21 is a schematic perspective view of an eighth embodiment of the present invention;

FIG. 22 is a schematic perspective view of an eighth embodiment of the present invention;

FIG. 23 is a schematic structural diagram of a system configuration according to an eighth embodiment of the present invention;

FIG. 24 is another angular view of FIG. 23;

FIG. 25 is a schematic perspective view of a ninth embodiment of the present invention;

fig. 26 is a schematic perspective view of another angle according to an embodiment of the present invention.

Detailed Description

The invention is further described below with reference to the following figures and specific examples.