阅读说明：本技术 一种高速探针卡测试方法及测试系统 (High-speed probe card test method and test system ) 是由 梁建 罗雄科 于 2020-03-13 设计创作，主要内容包括：本发明提供了一种高速探针卡测试方法及测试系统,包括步骤：将母板、第一基板组件、高速探针、第二基板组件依次进行叠加组装形成待测高速探针卡；所述母板上至少设置有一个测试单元,每个测试单元至少包括两个接口模块和收发模块,所述接口模块之间直接连接或通过收发模块连接；当测试信号对所述待测高速探针进行性能测试时,所述测试信号通过测试头的信号输入端依次通过所述第二基板组件、高速探针、第一基板组件的信号输入端进入所述母板,进行所述待测高速探针卡的测试。本发明提高测试的效率和准确性,并且避免直接连接传统探针卡内测试头中pitch在60um-150um之间的探针,不易连接进行测试的问题。(The invention provides a high-speed probe card test method and a test system, which comprises the following steps: sequentially overlapping and assembling the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly to form a high-speed probe card to be tested; the motherboard is at least provided with one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module; when the test signal tests the performance of the high-speed probe to be tested, the test signal enters the motherboard through the signal input end of the test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly, and the test of the high-speed probe card to be tested is carried out. The invention improves the efficiency and the accuracy of the test, and avoids the problem that the probes with pitch between 60um and 150um in the test head in the traditional probe card are not easy to connect for testing.)

1.A high speed probe card testing method, comprising the steps of:

sequentially overlapping and assembling the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly to form a high-speed probe card to be tested; the motherboard is at least provided with one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module;

when a test signal carries out performance test on the high-speed probe card to be tested, the test signal enters the motherboard through a signal input end of a test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly;

when the test signal enters the transceiver module through one interface module, an alternating current signal in the test signal flows out of the transceiver module to the other interface module and returns to the signal output end of the test head through the signal output ends of the first substrate assembly, the high-speed probe and the second substrate assembly in sequence, so that the performance test of the high-speed probe card to be tested is completed.

2. The method as claimed in claim 1, wherein before the motherboard, the first substrate assembly, the high speed probe and the second substrate assembly are sequentially stacked and assembled to form the high speed probe card to be tested, the method further comprises:

the type of high speed probe and the number of high speed probes that meet the current carrying capability, high speed signal rate requirements are identified.

3. The method of claim 1, further comprising the steps of:

and when the performance of the high-speed probe card to be tested is tested by the test signal, obtaining test data and performing de-embedding on the test data.

4. The method as claimed in any one of claims 1 to 3, wherein the step of sequentially stacking and assembling the motherboard, the first substrate assembly, the high-speed probe, and the second substrate assembly to form the high-speed probe card to be tested comprises:

determining the losses of the motherboard, a first substrate in the first substrate assembly and a second substrate in the second substrate assembly according to the pinmap, and calculating the length of the routing;

and designing the motherboard, the first substrate and the second substrate according to the losses of the motherboard, the first substrate and the second substrate and the length of the routing.

5. A high speed probe card test system, comprising:

the high-speed probe card to be tested comprises a mother board, a first substrate assembly, a high-speed probe and a second substrate assembly which are sequentially superposed;

the motherboard is at least provided with one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module;

a test head connected to the second substrate assembly;

and the test equipment is connected with the high-speed probe card to be tested through the test head and is used for performing performance test on the high-speed probe card to be tested.

6. The high speed probe card test system of claim 5, wherein the transceiver module comprises:

the high-frequency signal transmission unit is connected with the interface module and is used for transmitting alternating current signals in the test signals;

and the filtering unit is connected with the high-frequency signal transmission unit and used for blocking and transmitting the alternating current signals in the test signals and measuring the direct current signals.

7. The high-speed probe card test system of claim 6, wherein the high frequency signal transmission unit comprises:

the receiving end is connected with the first interface module and used for receiving the signal of the first interface module;

the transmitting end is connected with the second interface module and used for transmitting the high-frequency signal to the second interface module;

and the capacitor is connected with the receiving end and the transmitting end and is used for transmitting the high-frequency signal.

8. The high speed probe card testing system of claim 5, wherein the first substrate assembly comprises:

a first substrate positioned at a side close to the high speed probe,

the first thickened plate is welded on the first substrate and is positioned at one side close to the motherboard; the high-speed probe penetrates through the first substrate and the first thickened plate to be connected with the motherboard.

9. The high speed probe card testing system of claim 5, wherein the second substrate assembly comprises:

a second substrate positioned at a side close to the high speed probe,

the second thickened plate is welded on the second substrate and is positioned at one side close to the test head; and the high-speed probe penetrates through the second substrate and the second thickened plate and is connected with the test head.

10. The high speed probe card test system of any one of claims 5 to 9, further comprising:

and the guide plate is provided with a mounting hole for the high-speed probe to pass through in a penetrating manner, so that the high-speed probe is convenient to fix.

Technical Field

The invention relates to the technical field of probe card testing, in particular to a high-speed probe card testing method and a high-speed probe card testing system.

Background

The probe card is a test interface, and is mainly used for testing a bare chip, and testing parameters of the chip by connecting a test machine and the chip and transmitting signals.

The high-speed probe on the probe card belongs to a micro probe, which is generally invisible to naked eyes, and the pitch is generally between 60um and 150um, so that the test is inconvenient; the measurement of electrical performance of high speed probe cards has also been a challenge in the industry.

Disclosure of Invention

The invention aims to provide a high-speed probe card testing method and a high-speed probe card testing system, which can effectively evaluate the high-speed performance of a high-speed probe card, effectively reduce the debugging cost and realize the effect of improving the working efficiency.

The technical scheme provided by the invention is as follows:

the invention provides a high-speed probe card testing method, which comprises the following steps:

sequentially overlapping and assembling the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly to form a high-speed probe card to be tested; the motherboard is at least provided with one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module.

When the test signal carries out performance test on the high-speed probe card to be tested, the test signal enters the motherboard through the signal input end of the test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly.

When the test signal enters the transceiver module through one interface module, an alternating current signal in the test signal flows out of the transceiver module to the other interface module and returns to the signal output end of the test head through the signal output ends of the first substrate assembly, the high-speed probe and the second substrate assembly in sequence, so that the performance test of the high-speed probe card to be tested is completed.

Further, before the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly are sequentially stacked and assembled to form the high-speed probe card to be tested, the method further comprises the following steps:

the type of high speed probe and the number of high speed probes that meet the current carrying capability, high speed signal rate requirements are identified.

Furthermore, when the performance of the high-speed probe card to be tested is tested by the test signal, test data is obtained, and the test data is de-embedded.

Further, the step of sequentially stacking and assembling the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly to form the high-speed probe card to be tested comprises the following steps:

determining the losses of the motherboard, a first substrate in the first substrate assembly and a second substrate in the second substrate assembly according to the pinmap, and calculating the length of the routing; and designing the motherboard, the first substrate and the second substrate according to the losses of the motherboard, the first substrate and the second substrate and the length of the routing.

The invention provides a high-speed probe card test system, which is characterized by comprising:

the high-speed probe card to be tested comprises a mother board, a first substrate assembly, a high-speed probe and a second substrate assembly which are sequentially superposed; the motherboard is at least provided with one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module; a test head connected to the second substrate assembly; and the test equipment is connected with the high-speed probe through the test head and is used for performing performance test on the high-speed probe card to be tested.

Further, the transceiver module includes:

the high-frequency signal transmission unit is connected with the interface module and is used for transmitting alternating current signals in the test signals;

and the filtering unit is connected with the high-frequency signal transmission unit and used for blocking and transmitting the alternating current signals in the test signals and measuring the direct current signals.

Further, the high frequency signal transmission unit includes:

the receiving end is connected with the first interface module and used for receiving the signal of the first interface module; the transmitting end is connected with the second interface module and used for transmitting the high-frequency signal to the second interface module; and the capacitor is connected with the receiving end and the transmitting end and is used for transmitting the high-frequency signal.

Further, the first substrate assembly includes: the first substrate is positioned at one side close to the high-speed probe; the first thickened plate is welded on the first substrate and is positioned at one side close to the motherboard; the high-speed probe penetrates through the first substrate and the first thickened plate to be connected with the motherboard.

Further, the second substrate assembly includes:

the second substrate is positioned at one side close to the high-speed probe; the second thickened plate is welded on the second substrate and is positioned at one side close to the test head; and the high-speed probe penetrates through the second substrate and the second thickened plate and is connected with the test head.

Further, still include: and the guide plate is provided with a mounting hole for the high-speed probe to pass through in a penetrating manner, so that the high-speed probe is convenient to fix.

The high-speed probe card test method and the test system provided by the invention have the following beneficial effects:

1) according to the use requirement, sequentially stacking and assembling the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly to form a high-speed probe card to be tested; the test head with the pitch basically ranging from 0.35 mm to 1.0mm is connected with the high-speed probe card to be tested to test the electrical performance of the high-speed probe card, so that the problem that the probe with the pitch ranging from 60um to 150um in the traditional probe card is not easy to connect for testing is solved.

2) The motherboard is provided with at least one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module. Because the testing requirements are different, two different channels are arranged for testing, and the testing approaches are increased.

3) In the invention, when a test signal tests the performance of the high-speed probe card, the test signal enters the motherboard through the signal input end of the test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly. When the test signal enters the transceiver module through one interface module, an alternating current signal in the test signal flows out of the transceiver module to the other interface module and returns to the signal output end of the test head through the signal output ends of the first substrate assembly, the high-speed probe and the second substrate assembly in sequence, so that the performance test of the high-speed probe card is completed. Due to the fact that the transceiver module is added, the same kind of test can be conducted on a plurality of signals, and the test efficiency is improved in the mode.

4) The method comprises the steps of planning a design layout, optimizing structures such as via holes and bonding pads, calculating the length of wiring, designing a substrate and a motherboard, determining a test head according to current carrying capacity and high-speed signal rate, confirming the correctness of design through full-link simulation rechecking, and improving the accuracy of test by combining with a chip pin map which needs to be tested actually.

5) The substrate and the thickened plate and the mother board are welded in a furnace returning welding mode, and the structure and the loss introduced during the test are removed in a de-embedding mode, so that the accuracy of the test data is further improved.

Drawings

The above features, technical features, advantages and implementations of a high speed probe card test method will be further described in the following detailed description of preferred embodiments in a clearly understandable manner, in conjunction with the accompanying drawings.

FIG. 1 is a flow chart of one embodiment of a high speed probe card testing method of the present invention;

FIG. 2 is a flow chart of another embodiment of a high speed probe card testing method of the present invention;

FIG. 3 is a flow chart of another embodiment of a high speed probe card testing method of the present invention;

FIG. 4 is a flow chart of yet another embodiment of a high speed probe card testing method of the present invention;

FIG. 5 is a flow chart of yet another embodiment of a high speed probe card testing method of the present invention;

FIG. 6 is a schematic structural diagram of a high-speed probe card to be tested according to a high-speed probe card testing method of the present invention;

FIG. 7 is a schematic structural diagram of a high speed probe according to a high speed probe card testing method of the present invention;

FIG. 8 is a schematic structural diagram of a high speed probe according to a high speed probe card testing method of the present invention;

FIG. 9 is a schematic diagram of a high speed probe according to a high speed probe card testing method of the present invention;

FIG. 10 is a wear-test table of the substrate and motherboard of the present invention;

FIG. 11 is a schematic view of the structure of the substrate of the present invention;

FIG. 12 is a schematic structural diagram of the motherboard of the present invention;

FIG. 13 is a diagram of simulation results of a high speed probe card testing method of the present invention;

FIG. 14 is a schematic diagram of a high speed probe card under test according to the present invention;

FIG. 15 is a schematic diagram of a high speed probe card test method using net component measurement according to the present invention;

FIG. 16 is a schematic diagram of a high-speed probe card to be tested using a test head according to a high-speed probe card testing method of the present invention;

FIG. 17 is a data diagram of a high speed probe card testing method of the present invention;

FIG. 18 is a diagram of de-embedded data for a high speed probe card testing method according to the present invention;

FIG. 19 is a second data diagram after de-embedding for a high speed probe card testing method according to the present invention;

FIG. 20 is a third data diagram after de-embedding of a high speed probe card testing method according to the present invention;

FIG. 21 is a schematic diagram of a transceiver module of a high speed probe card test system according to the present invention;

FIG. 22 is a schematic diagram of a transceiver module of a high speed probe card test system according to the present invention;

FIG. 23 is a block diagram of an interface module of a high speed probe card test system according to the present invention;

FIG. 24 is a schematic diagram of a five-interface module of a high speed probe card test system according to the present invention;

FIG. 25 is a schematic diagram of a transceiver module of five interface modules of a high speed probe card test system according to the present invention;

FIG. 26 is a block diagram of four sets of interface modules of a high speed probe card test system according to the present invention;

fig. 27 is a schematic structural diagram of transceiver modules of four sets of interface modules of a high-speed probe card test system according to the present invention.

Detailed Description

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.

For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".

In one embodiment of the present invention, as shown in fig. 1 and fig. 6 to 27, a high speed probe card testing method includes the steps of:

s110, the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly are sequentially stacked and assembled to form the high-speed probe card to be tested.

The motherboard is provided with at least one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module.

Specifically, the type of probe to be used on the high-speed probe card is determined according to project requirements, and as shown in fig. 7, the high-speed probe is a plurality of high-speed probes commonly used, wherein the long bar shape in the figure represents the needle, and the other rectangle is a guide plate of the needle, which is used for fixing the needle, and is provided with a plurality of empty holes, and the needle is arranged in the hole. The main factors that determine the type of high speed probe in the high speed probe card to be tested are the current carrying capacity CCC and the high speed signal rate requirement. Current carrying capacity is a project requirement, and as only one needle (error-proof needle) is used in one project, the current requirement of a large power supply is considered firstly, and if the power supply current is 100A and the power supply uses 100 needles, one needle needs to meet at least 1A current. The high speed signal rate is an item required to confirm the requirements of the signal on the insertion loss and the return loss, and a needle with the insertion loss and the return loss meeting the requirements is selected.

Specifically, the substrate, the thickened plate and the mother plate are welded together by a reflow process, the substrate and the thickened plate are separately welded together, and the mother plate, the first thickened plate, the first substrate, the test head, the second substrate and the second thickened plate are sequentially welded and assembled from top to bottom to form the high-speed probe card to be tested as shown in fig. 14.

The substrate and the thickened plate are used for signal fan-out, in the simulation software powerPCB, the pin wiring of the chip is always wired from an element layer, and holes are punched into an inner layer signal layer when necessary, and the mode of leading wires from the chip pins to other directions is called fan-out. The specific process is to lead a pin of a certain component out of a small section of line and then to punch a via hole, wherein the via hole is usually connected to a plane layer, and can be a signal line. On the bypass capacitor element, manual fan-out is generally performed, but for some special packages (such as BGA), the density is high, and when the pins are numerous, the advantage of using automatic fan-out is obvious, and the method is not only fast, but also neat. The base plate and the thickened plate are used for automatically fanning out, and the testing efficiency is improved.

And S120, when the performance of the high-speed probe card to be tested is tested by a test signal, the test signal enters the motherboard through the signal input end of the test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly.

S130, when the test signal enters the transceiver module through one interface module, an alternating current signal in the test signal flows out of the transceiver module to the other interface module and returns to the signal output end of the test head through the signal output ends of the first substrate assembly, the high-speed probe and the second substrate assembly in sequence, so that the performance test of the high-speed probe card to be tested is completed.

Specifically, the motherboard comprises a PCB circuit board, and signal wires on the back of the PCB circuit board are connected to the front of the PCB circuit board to form bonding pads, so that the test ports are arranged at preset positions.

For example, as shown in fig. 14, the test head is connected to the probe card to test the wear of the high-speed probe card to be tested. The test head is GGB high speed probe, which is a probe of PCB level, the probe is used for point measurement of high speed probe card, as shown in FIG. 15, the pitch of the high speed probe is basically 0.35-1.0mm, while the test head needle on the probe card is a micro probe, which is generally invisible to naked eye, and the pitch is generally between 60um-150 um. According to the using requirement, the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly are sequentially overlapped and assembled to form the high-speed probe card to be tested, the high-speed probe with the pitch basically ranging from 0.35 mm to 1.0mm is connected with the probe card, the electrical performance of the probe card is tested, and the problem that the probe with the pitch ranging from 60um to 150um in the traditional probe card is directly connected and is not easily connected for testing is solved.

Another embodiment of the present invention, as shown in fig. 2 and 6-27, is a high speed probe card testing method comprising the steps of:

s210 identifies the type of high speed probes and the number of high speed probes that meet the current carrying capability, high speed signal rate requirements.

Specifically, the current carrying capacity is a project requirement, and since only one needle (error-proof needle) is used in one project, the current requirement of a large power supply is considered first, and if the power supply current is 100A and 100 needles are used in the power supply, one needle needs to meet at least 1A current. The high speed signal rate is an item required to confirm the requirements of the signal on the insertion loss and the return loss, and a needle with the insertion loss and the return loss meeting the requirements is selected.

S220, determining the losses of the motherboard, the first substrate in the first substrate assembly and the second substrate in the second substrate assembly according to the pinmap, and calculating the length of the routing.

Specifically, the chip pin map used by the test scheme is designed by combining the chip pin map actually required to be tested, and the chip pin map is generally directly copied, so that the consistency of actual test and the actual link of the high-speed probe card is ensured.

After the pinpap is determined, a design layout needs to be planned, structures such as via holes and bonding pads need to be optimized, the loss condition of the structures is evaluated according to a loss table shown in fig. 10, loss values of other structures except the routing are subtracted according to a required value of signal to link loss, so that a loss value of the routing is obtained, and the length of the routing is calculated according to the unit loss of the routing.

S230, designing the motherboard, the first substrate and the second substrate according to the losses of the motherboard, the first substrate and the second substrate and the length of the routing. Specifically, after determining the losses of the motherboard, the first substrate, and the second substrate and the length of the trace, the substrate shown in fig. 11 is designed, and the motherboard shown in fig. 12 is designed, where the first substrate and the second substrate have the same structure.

S240, the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly are sequentially stacked and assembled to form the high-speed probe card to be tested.

The motherboard is provided with at least one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module.

Specifically, the type of the high-speed probe, i.e., the type of the probe to be used on the high-speed probe card, is determined according to project requirements, as shown in fig. 7, the high-speed probe is a few types of high-speed probes commonly used, in the figure, a long bar shape represents a needle, and other rectangles are guide plates of the needle and are used for fixing the needle, and the guide plates are too many empty needles are arranged in holes. The main factors that determine the test head type are the current carrying capability CCC and the high speed signal rate requirements. Current carrying capacity is a project requirement, and as only one needle (error-proof needle) is used in one project, the current requirement of a large power supply is considered firstly, and if the power supply current is 100A and the power supply uses 100 needles, one needle needs to meet at least 1A current. The high speed signal rate is an item required to confirm the requirements of the signal on the insertion loss and the return loss, and a needle with the insertion loss and the return loss meeting the requirements is selected.

And S250, when the performance of the high-speed probe card to be tested is tested by a test signal, the test signal enters the motherboard through the signal input end of the test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly.

And S260, when the test signal enters the transceiver module through one interface module, the alternating current signal in the test signal flows out of the transceiver module to the other interface module and returns to the signal output end of the test head through the signal output ends of the first substrate assembly, the high-speed probe and the second substrate assembly in sequence, so that the performance test of the high-speed probe card to be tested is completed.

Illustratively, when a signal of the first interface module passes through the transceiver module, the receiving end of the transceiver module receives the signal, and when the signal is a high-frequency signal, the signal is output from the high-frequency transmission unit to the second interface module; and when the signal is a direct current signal, the signal is output to the second interface module from the filtering unit. The filtering unit may be connected to the high-frequency signal transmission unit, and is configured to block an ac signal in a transmission test signal and measure a dc signal.

Illustratively, the first interface module and the second interface module are directly connected without connecting the transceiver module.

In this embodiment, a chip pin map to be actually tested is combined, a design layout is planned, structures such as via holes and pads are optimized, the length of a routing line is calculated, a substrate and a motherboard are designed, a test head is determined according to current carrying capacity and high-speed signal rate, the correctness of design is confirmed through full-link simulation recheck, and the accuracy of testing is improved.

In still another embodiment of the present invention, as shown in fig. 3, 4, 5 and 6-27, a high speed probe card testing method includes the steps of:

s310, designing a motherboard, a first substrate assembly, a high-speed probe and a second substrate assembly.

Specifically, the method comprises the following steps:

s410 designs a motherboard.

S420, designing a first thickened plate according to the first substrate.

Specifically, the structure of the surface of the first thickened plate connected with the first substrate is matched with the first substrate.

S420, designing a second thickened plate according to the second substrate.

Specifically, the structure of the surface of the second thickened plate connected with the second substrate is matched with the second substrate.

S430, simulation optimization is carried out on the motherboard, the first substrate and the second substrate.

Specifically, after the design of the mother board, the first thickened plate, the first substrate, the high-speed probe, the second substrate and the second thickened plate is completed, the correctness of the design is confirmed through full-link simulation rechecking.

S320, sequentially stacking and assembling the motherboard, the first substrate assembly, the high-speed probe and the second substrate assembly to form the high-speed probe card to be tested, and specifically comprises the following steps:

s510, welding the first substrate and the first thickened plate.

Preferably, one side of the first substrate is welded to one side of the first thickened plate by reflow soldering.

S520, welding the first thickened plate and the motherboard.

Preferably, the other side of the first thickened plate is welded with one side of the mother plate by a reflow welding method.

S530, welding the second substrate and the second thickened plate.

Preferably, one side of the second substrate is welded with one side of the second thickened plate by a reflow soldering method.

Specifically, the substrate, the thickened plate and the mother plate are welded together by a reflow process, the substrate and the thickened plate are separately welded together, and the mother plate, the first thickened plate, the first substrate, the second substrate and the second thickened plate are sequentially welded and assembled from top to bottom to form the high-speed probe card to be tested as shown in fig. 14. The GGB HS Diff Probe in fig. 6 is a test head, and may specifically include GGB high-speed probes, Substrate, Interposer, Probe head (Needle) to be tested, and PCB as a motherboard.

S330, when the performance of the high-speed probe card to be tested is tested by a test signal, the test signal enters the motherboard through the signal input end of the test head in sequence through the signal input ends of the second substrate assembly, the high-speed probe and the first substrate assembly.

And S340. when the test signal enters the transceiver module through one interface module, an alternating current signal in the test signal flows out of the transceiver module to the other interface module and returns to the signal output end of the test head through the signal output ends of the first substrate assembly, the high-speed probe and the second substrate assembly in sequence, so that the performance test of the high-speed probe card to be tested is completed.

S350, when the performance of the high-speed probe card is tested by the test signal, obtaining test data and performing de-embedding on the test data.

In particular, these structures introduce losses due to unnecessary structures introduced during testing, and these structures, losses, are removed by de-embedding.

In this embodiment, the substrate is welded to the thickened plate and the thickened plate is welded to the motherboard by reflow soldering, and the structure and loss introduced during the test are removed by de-embedding, thereby further improving the accuracy of the test data.

In another embodiment of the present invention, a high speed probe card testing method includes the steps of:

s10 designing and processing the base plate, the thickened plate and the pcb.

S20 designing high speed probe and assembling.

S30 bonding the base plate, the thickening plate, and the mother plate together, and simultaneously bonding the base plate and the thickening plate together separately.

S40, assembling the mother board, the substrate, the reinforcing board, the high speed probe and the substrate in sequence according to the structure shown in the figure.

S50 finally completes the test and data analysis.

The method comprises the following specific steps:

s1 determines the type of high speed probe for testing.

Specifically, this step is to determine the probes (needles) to be used, i.e., the probes to be used on the high-speed probe card, according to the requirements. The main factors that determine the pin selection are the current carrying capacity CCC and the high speed signal rate requirements, and finally the pin. Current carrying capacity is a project requirement, and as only one needle (error-proof needle) is used in one project, the current requirement of a large power supply is considered firstly, and if the power supply current is 100A and the power supply uses 100 needles, one needle needs to meet at least 1A current. The high speed signal rate is an item required to confirm the requirements of the signal on the insertion loss and the return loss, and a needle with the insertion loss and the return loss meeting the requirements is selected.

S2 combines with the chip pin map to be tested, the pin map used by the test scheme is designed, and the chip pin map is generally directly copied, so as to ensure the consistency of the actual test and the actual link of the high-speed probe card. The lower diagram shows the pinmap of a project.

S3, determining the loss condition of the substrate and the motherboard according to the pin map, and deducing the information such as the required wire length.

Specifically, after the Pin map is determined, a design layout needs to be planned, structures such as via holes and bonding pads need to be optimized, the loss condition of the structures is evaluated, loss values of other structures except for the routing are subtracted according to a signal requirement value for link loss, so that a loss value of the routing is obtained, and the length of the routing is calculated according to the unit loss of the routing. After the step is finished, the correctness of the design needs to be confirmed through full link simulation recheck.

S4 designing the substrate.

S5 designing the motherboard.

Preferably, the substrate and the motherboard are designed by utilizing layout, and signals are connected, and the part is determined to be a reasonable size or a design scheme according to simulation.

After the design of S6 is completed, simulation optimization is needed.

S7 designing corresponding structures and assemblies.

S8 measurements of the high speed probe card were made using a test head that was a GGB high speed probe.

In particular, the high-speed probe of the test head is a PCB level probe, the probe is used for point-testing a probe card, and the pitch of the probe is basically 0.35-1.0 mm; the high-speed probes on the probe card belong to micro probes, which are generally invisible to naked eyes, and the pitch is generally between 60um and 150 um.

After the data is measured in S9, data de-embedding is required.

Specifically, unnecessary structures are introduced during testing, which may introduce losses, and de-embedding is to remove the effects of these structures, including losses.

One embodiment of the present invention, shown in fig. 6-27, is a high speed probe card test system comprising:

the high-speed probe card to be tested comprises a mother board, a first substrate assembly, a high-speed probe and a second substrate assembly which are sequentially superposed; the motherboard is at least provided with one test unit, each test unit at least comprises two interface modules and a transceiver module, and the interface modules are directly connected or connected through the transceiver module; a test head connected to the second substrate assembly; and the test equipment is connected with the high-speed probe card through the test head and is used for performing performance test on the high-speed probe.

Specifically, the transceiver module further includes: the high-frequency signal transmission unit is connected with the interface module and is used for transmitting alternating current signals in the test signals; and the filtering unit is connected with the high-frequency signal transmission unit and used for blocking and transmitting the alternating current signals in the test signals and measuring the direct current signals.

Wherein the high frequency signal transmission unit includes:

the receiving end is used for receiving the high-frequency signal of the interface module; the transmitting end is used for transmitting the high-frequency signal to the interface module; and the capacitor is connected with the receiving end and the transmitting end and is used for transmitting the high-frequency signal.

Illustratively, when a signal of the first interface module passes through the transceiver module, the receiving end of the transceiver module receives the signal, and when the signal is a high-frequency signal, the signal is output from the high-frequency transmission unit to the second interface module; and when the signal is a direct current signal, the signal is output to the second interface module from the filtering unit. The filtering unit may be connected to the high-frequency signal transmission unit, and is configured to block an ac signal in a transmission test signal and measure a dc signal.

Illustratively, the first interface module and the second interface module are directly connected without connecting the transceiver module.

Specifically, the first substrate assembly includes:

the first substrate is positioned at one side close to the high-speed probe; the first thickened plate is welded on the first substrate and is positioned at one side close to the motherboard; the high-speed probe penetrates through the first substrate and the first thickened plate to be connected with the motherboard.

Specifically, the second substrate assembly includes:

the second substrate is positioned at one side close to the high-speed probe; the second thickened plate is welded on the second substrate and is positioned at one side close to the test head; and the high-speed probe penetrates through the second substrate and the second thickened plate and is connected with the test head.

Illustratively, as shown in fig. 23-27, a connection relationship (net pins) of devices is shown, wherein ground pins are required to be connected together to short GND, wherein the name of pin, such as BGA. a1, represents a1 pin of BGA of the device; in the signal section, the net pins with the signal name P07_ P70_ R _ S1_ N is BGA. af3 DIE11.AM3, and includes two pins, BGA. af3 and DIE11.AM3, respectively, indicating that the two pins are connected, i.e., the AF3 pin of BGA and the AM3 pin of DIE11 are connected. Each interface module corresponds to one transceiver module, and the interface modules may include three groups, four groups, five groups, and the like.

The method specifically comprises the following steps: and the guide plate is provided with a mounting hole for the high-speed probe to pass through in a penetrating manner, so that the high-speed probe is convenient to fix.

Specifically, still include:

and the simulation optimization module is connected with the high-speed probe card to be tested and used for carrying out simulation optimization on the motherboard, the first substrate and the second substrate.

And the de-embedding module is connected with the test equipment and used for de-embedding the test data.

The invention has the advantages of solving the problem of testing the electrical appliance performance of the probe card and improving the accuracy of test data.

It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.