阅读说明：本技术 多频复合大功率瓦片式有源相控阵天线 (Multi-frequency composite high-power tile type active phased array antenna ) 是由 周沛翰 薛伟 冯琳 符博 丁卓富 于 2020-07-03 设计创作，主要内容包括：本发明公开了一种多频复合大功率瓦片式有源相控阵天线,包括逐层设置的波控供电层、盖板层、低频供电转接层、射频层、射频转接层、模块腔体和阵列天线层。波控供电层用于获取电源、向下层供电和发送数字信号,低频供电转接层用于向下层供电和发送数字信号,各射频子层和射频转接层分别通过对应的高频连接器接收对应的激励信号,并根据数字信号对接收的激励信号进行预处理；各射频子层将对激励信号的预处理结果引入射频转接层；射频转接层还将本层对激励信号的预处理结果,以及各层射频子层引入的预处理结果,分别传输到设置于阵列天线层上对应的天线单元,模块腔体层内设置有散热结构。本发明具备多频率、多通道、多极化、高集成的特点。(The invention discloses a multi-frequency composite high-power tile type active phased array antenna which comprises a wave control power supply layer, a cover plate layer, a low-frequency power supply switching layer, a radio frequency switching layer, a module cavity and an array antenna layer which are arranged layer by layer. The wave control power supply layer is used for obtaining a power supply, supplying power to the lower layer and sending digital signals, the low-frequency power supply switching layer is used for supplying power to the lower layer and sending the digital signals, and each radio frequency sub-layer and each radio frequency switching layer respectively receive corresponding excitation signals through corresponding high-frequency connectors and preprocess the received excitation signals according to the digital signals; each radio frequency sublayer introduces a preprocessing result of the excitation signal into the radio frequency switching layer; the radio frequency switching layer also transmits the pretreatment result of the layer to the excitation signal and the pretreatment result introduced by each radio frequency sublayer to the corresponding antenna unit arranged on the array antenna layer, and a heat dissipation structure is arranged in the module cavity layer. The invention has the characteristics of multi-frequency, multi-channel, multi-polarization and high integration.)

1. A multi-frequency composite high-power tile-type active phased-array antenna is characterized by comprising a wave control power supply layer (7), a cover plate layer (6), a low-frequency power supply switching layer (5), a radio frequency layer (4), a radio frequency switching layer (3), a module cavity (2) and an array antenna layer (1), wherein the wave control power supply layer, the cover plate layer, the low-frequency power supply switching layer and the radio frequency switching layer are arranged layer by layer from a radio frequency signal excitation end to an antenna radiation end; the radio frequency layer (4) comprises at least one radio frequency sublayer; the cover plate layer (6) seals the opening of the module cavity (2);

the wave control power supply layer (7) is used for acquiring an external power supply, supplying power to the low-frequency power supply switching layer (5) and sending a digital signal;

the low-frequency power supply switching layer (5) is connected with the wave control power supply layer (7) and is used for respectively acquiring power supply and digital signals and respectively supplying power to each radio frequency sublayer and each radio frequency switching layer (3) and transmitting the digital signals;

each radio frequency sublayer and each radio frequency switching layer (3) are respectively connected with a corresponding high-frequency connector (44), each radio frequency sublayer and each radio frequency switching layer (3) respectively receive an excitation signal with corresponding frequency through the corresponding high-frequency connector (44), and the received excitation signal is preprocessed according to the received digital signal; each radio frequency sublayer also respectively introduces the preprocessing result of the excitation signal into a radio frequency switching layer (3) in a radio frequency vertical transmission mode; the radio frequency switching layer (3) also transmits the pretreatment result of the layer on the excitation signal and the pretreatment result introduced by each radio frequency sub-layer to corresponding antenna units arranged on the array antenna layer (1) through corresponding radio frequency interfaces respectively;

and a heat dissipation structure is arranged in the module cavity (2).

2. The multi-frequency composite high power tile active phased array antenna of claim 1, wherein said radio frequency interface is air coaxial (34).

3. The multi-frequency composite high-power tile type active phased array antenna according to claim 1, wherein the radio frequency switching layer (3) is provided with a multifunctional chip set for preprocessing an excitation signal, the radio frequency switching layer (3) is provided with a heat conducting structure, and two ends of the heat conducting structure are respectively in contact with the module cavity (2) and a high-power chip in the multifunctional chip set.

4. The multi-frequency composite high-power tile-type active phased array antenna according to claim 1, wherein each high-frequency connector (44) sequentially penetrates through the wave control power supply layer (7), the cover plate layer (6) and the low-frequency power supply switching layer (5) and is connected to the radio frequency sub-layer on the uppermost layer; each radio frequency sub-layer and the radio frequency switching layer (3) which are positioned on the non-uppermost layer are respectively connected to the corresponding high-frequency connector (44) through the corresponding radio frequency vertical connecting structure; each radio frequency sub-layer introduces the preprocessing result into the radio frequency switching layer (3) through a corresponding radio frequency vertical connection structure.

5. The multi-frequency composite high-power tile active phased array antenna according to claim 4, wherein the radio frequency vertical connection structure is formed by a coaxial-like transition interface (36) or a dielectric waveguide (43).

6. The multi-frequency composite high-power tile-type active phased array antenna according to claim 5, wherein for transmitting signals in lower frequency bands, the corresponding radio frequency vertical connection structure is formed by a quasi-coaxial transition interface (36), and for transmitting signals in higher frequency bands, the corresponding radio frequency vertical connection structure is formed by a dielectric waveguide (43).

7. The multi-frequency composite high-power tile-type active phased array antenna according to claim 1, wherein the heat dissipation structure is a microchannel (21).

8. The multi-frequency composite high-power tile active phased array antenna according to claim 2, wherein each of said air coax (34) is connected to a corresponding antenna element by a corresponding first radio frequency connection structure (22) and a corresponding second radio frequency connection structure (13); the first radio frequency connecting structure (22) is arranged on the module cavity (2), and a needle head of the first radio frequency connecting structure (22) extends into the corresponding air coaxial line (34) and is bonded with the radio frequency switching layer (3); the second radio frequency connection structure (13) is arranged on the antenna array layer (1), and a needle head of the second radio frequency connection structure (13) is connected with the corresponding antenna unit.

9. The multi-frequency composite high-power tile type active phased array antenna according to claim 1, wherein a copper-based heat sink is arranged in the low-frequency power supply transition layer (5).

10. The multi-frequency composite high-power tile type active phased array antenna according to claim 1, wherein each radio frequency sub-layer and the radio frequency switching layer (3) are provided with power supply pads corresponding to each other, the power supply pads of each radio frequency sub-layer and the radio frequency switching layer (3) are sequentially connected, and the power supply pad of the radio frequency sub-layer at the uppermost layer is connected to the low-frequency power supply switching board (5) to obtain power supply.

Technical Field

The invention relates to the field of microwave wireless communication, in particular to a multi-frequency composite high-power tile type active phased array antenna.

Background

The front-end technology of the active phased-array antenna gradually develops towards double-frequency compounding, small volume and high integration along with the improvement of the system performance of the phased-array antenna, the development of high-frequency materials and processes and the progress of a micro-assembly technology. At present, the structure of an active phased-array antenna is mainly divided into brick type integration and tile type integration, the brick type integration mode is mostly used for a high-power active phased-array antenna, and the tile type integration mode is mostly used for a low-power active phased-array antenna. Along with the gradual complexity of wireless communication scenes, the performance requirements of an active phased array antenna system are more rigorous, the active phased array antenna is changed from a previous single-frequency working mode to a double-frequency or even multi-frequency working mode, the power density requirement under the same volume is greatly improved, the existing double-frequency working mode is easier to realize in a brick-type active phased array antenna, but the double-frequency (or multi-frequency) tile-type active phased array antenna is fresh and smells. And the existing tile-type active phased-array antenna is basically in a low-power single-frequency working mode, so that high-integration high-power dual-frequency (multi-frequency) compounding is difficult to achieve.

Disclosure of Invention

The invention aims to: in view of the above problems, a multi-frequency composite high-power tile-type active phased array antenna is provided to provide a multi-frequency, multi-polarization, multi-channel, high-power, high-integration tile-type active phased array antenna with the same or smaller size.

The technical scheme adopted by the invention is as follows:

a multi-frequency composite high-power tile-type active phased-array antenna comprises a wave control power supply layer, a cover plate layer, a low-frequency power supply switching layer, a radio frequency switching layer, a module cavity and an array antenna layer, wherein the wave control power supply layer, the cover plate layer, the low-frequency power supply switching layer, the radio frequency switching layer, the module cavity and the array antenna layer are arranged layer by layer from; the radio frequency layer comprises at least one radio frequency sublayer; the cover plate layer seals the opening of the module cavity;

the wave control power supply layer is used for acquiring an external power supply, supplying power to the low-frequency power supply switching layer and sending a digital signal;

the low-frequency power supply switching layer is connected with the wave control power supply layer, is used for respectively acquiring power supply and digital signals, and is also used for respectively supplying power to each radio frequency sublayer and each radio frequency switching layer and transmitting the digital signals;

each radio frequency sub-layer and each radio frequency switching layer are respectively connected with corresponding high-frequency connectors, and each radio frequency sub-layer and each radio frequency switching layer respectively receive excitation signals with corresponding frequencies through the corresponding high-frequency connectors and preprocess the received excitation signals according to received digital signals; each radio frequency sublayer also introduces the preprocessing result of the excitation signal into the radio frequency switching layer in a radio frequency vertical transmission mode; the radio frequency switching layer also transmits the pretreatment result of the layer to the excitation signal and the pretreatment result introduced by each radio frequency sublayer to corresponding antenna units arranged on the array antenna layer through corresponding radio frequency interfaces respectively;

a heat dissipation structure is arranged in the module cavity layer.

Different high-frequency connectors respectively receive excitation signals of different frequency bands, and each radio-frequency sub-layer and each radio-frequency switching layer respectively process the excitation signal of one frequency. Each radio frequency sub-layer respectively introduces the processing result of the excitation signal to the radio frequency switching layer, and the radio frequency switching layer respectively transmits the processing results of each path (including the layer) to the corresponding antenna unit, thereby realizing multi-frequency compounding. The size, the number and the frequency band of the excitation signal of the antenna channels can be flexibly designed, thereby realizing the functions of multi-channel and multi-polarization. The module cavity of the cavity structure can lead out heat of each layer in the cavity (including the cover plate layer) and conduct quick heat dissipation, so that the bearing capacity of the multifunctional chip to high power can be improved, and high-power output of signals is achieved. The antenna has the characteristics of compact structure among all layers, improved integration level and small size.

Further, the radio frequency interface is coaxial with the air. The air coaxial cable allows the rf connector to pass through to be bonded to the rf terminal of the rf interposer, which facilitates the connection of the interlayer structure and improves the continuity of the rf signal between the layers (especially between the ports) (compared to the contact connection).

Furthermore, the radio frequency switching layer is provided with a multifunctional chip set used for preprocessing the excitation signal, the radio frequency switching layer is provided with a heat conduction structure, and two ends of the heat conduction structure are respectively contacted with the module cavity and the high-power chip of the multifunctional chip set. The heat generated by the high-power chip can be quickly conducted into the module cavity through the heat conduction structure to be radiated, so that the heat bearing capacity of the multifunctional chip set is improved, and the antenna has the characteristic of high power.

Furthermore, each high-frequency connector sequentially penetrates through the wave control power supply layer, the cover plate layer and the low-frequency power supply switching layer and is connected to the radio frequency sub-layer on the uppermost layer; each radio frequency sub-layer and the radio frequency switching layer which are positioned on the non-uppermost layer are respectively connected to the corresponding high-frequency connector through the corresponding radio frequency vertical connection structure; and each radio frequency sub-layer introduces the preprocessing result into the radio frequency switching layer through a corresponding radio frequency vertical connection structure. Each high-frequency connector is connected to the uppermost radio-frequency sublayer, one high-frequency connector provides an excitation signal for the uppermost radio-frequency sublayer, and the other high-frequency connectors provide high-frequency signals for the other radio-frequency sublayers and the radio-frequency switching layer. For the non-uppermost radio frequency sub-layer, the non-uppermost radio frequency sub-layer needs to be connected to a corresponding high-frequency connector through a radio frequency vertical connection structure, and a preprocessing result is transmitted to a radio frequency switching layer through another radio frequency vertical connection structure; the radio frequency sub-layer on the uppermost layer transmits the preprocessing result to the radio frequency switching layer through the radio frequency vertical connecting structure, and the radio frequency switching layer is connected to the corresponding high-frequency connector through the radio frequency vertical connecting structure. I.e. whether receiving the excitation signal or transmitting the pre-processing result downwards, is realized by a corresponding radio frequency vertical connection structure.

Furthermore, the radio frequency vertical connection structure is formed by a quasi-coaxial transition interface or a dielectric waveguide. Specifically, the radio frequency sub-layer is formed by sequentially connecting quasi-coaxial transition interfaces or dielectric waveguides which are respectively arranged on the corresponding radio frequency sub-layers. The design can also reduce the interdigitation of the interlayer structure.

Further, the waveguide transition structure is:

for transmitting signals of lower frequency wave band, the corresponding radio frequency vertical connection structure is composed of similar coaxial transition interfaces, and for transmitting signals of higher frequency wave band, the corresponding radio frequency vertical connection structure is composed of dielectric waveguides. That is, when the rf sub-layer or the rf switching layer operates at a lower frequency, it is connected to the high frequency connector through the coaxial-like transition interface, and transmits the preprocessing result to the rf switching layer (for the rf sub-layer) through the coaxial-like transition interface, and similarly operates at a higher frequency.

Furthermore, the heat dissipation structure is a micro channel. The micro-channel structure is convenient for simplifying the structure of the module cavity and has good heat dissipation effect.

Further, each air is coaxially and respectively connected to the corresponding antenna unit through the corresponding first radio frequency connection structure and the corresponding second radio frequency connection structure; the first radio frequency connecting structure is arranged on the module cavity, and a needle head of the first radio frequency connecting structure extends into the corresponding air coaxial and is bonded with the radio frequency switching layer (bonded to the corresponding radio frequency end); the second radio frequency connection structure is arranged on the antenna array layer, and a needle head of the second radio frequency connection structure is connected with the corresponding antenna unit. The module cavity and the antenna array layer are mutually independent and have no structure interpenetration.

Furthermore, a copper-based heat sink is arranged in the low-frequency power supply switching layer. Through this design, the low frequency power supply switching layer can transmit the heat on radio frequency layer (the heat that the chip produced) to apron layer fast, and then conducts the module cavity and dispels the heat fast to the bearing capacity of chip to the heat has been improved, antenna power has further been improved.

Furthermore, each radio frequency sub-layer and each radio frequency switching layer are provided with power supply pads corresponding to each other, the power supply pads of the radio frequency sub-layers and the radio frequency switching layers are sequentially connected, and the power supply pad of the radio frequency sub-layer on the uppermost layer is connected to the low-frequency power supply switching board so as to obtain power supply. The design reduces interlayer wiring, simplifies the antenna structure and improves the integration level of the antenna.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

1. compared with a brick-type phased array antenna and an existing tile-type antenna, the multi-frequency composite high-power tile-type active phased array antenna has the characteristics of multiple frequencies, multiple channels, multiple polarizations and high integration.

2. The multi-frequency composite high-power tile type active phased array antenna has the advantages of compact structure, low complexity, extremely small volume and weight.

3. The multi-frequency composite high-power tile type active phased array antenna has independent interlayer structure and is convenient to assemble.

4. The radio frequency circuits processed in all frequency bands are integrated on the same layer, and are directly assembled after being tested to be qualified through the test fixture, so that the production and assembly efficiency is improved.

5. The interlayer radio frequency signal of the invention adopts a vertical transition mode, thus improving the tolerance of assembly alignment and improving the transmission effectiveness of the radio frequency signal (especially a high frequency signal).

6. The invention adopts the transition mode of the radio frequency switching layer, ensures the signal continuity from the signals of each radio frequency sub-layer to the radio frequency path of the antenna unit, ensures the stable performance of the multi-frequency multi-polarization radio frequency channel and realizes the product engineering.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

fig. 1 is a hierarchical structure diagram of a multi-frequency (dual-frequency) composite high-power tile-type active phased array antenna.

Fig. 2 is a structural diagram of a multi-frequency (dual-frequency) composite high-power tile-type active phased array antenna.

Fig. 3 (a) to (c) are plan views of the wave control power supply layer 7, the cover plate layer 6, and the low-frequency power supply adapter layer 5 in this order.

Fig. 4 (a) and (b) are circuit structure diagrams of the rf layer 4 and the rf relay layer 3, respectively.

Fig. 5 (a) and (b) are a bottom structure diagram of the module cavity and a bottom view of the array antenna layer, respectively.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.