阅读说明：本技术 开关电源装置 (Switching power supply device ) 是由 田崎慎太朗 望月贤人 于 2018-12-25 设计创作，主要内容包括：为了能对应多相交流,实现小型化并高效地进行发热电气部件的冷却,本发明提供一种开关电源装置,其是具有与多相电源连接的多个电源电路的开关电源装置,其具备：第一基板,安装有构成防止来自所述电源的噪声的侵入的滤波器电路的电气部件,所述滤波器电路的输出端设置于所述第一基板的第一方向上的一端侧；第二基板,载置于容纳所述开关电源装置的壳体的底壁部,且安装有构成设置于所述滤波器电路的后级的电路的功率半导体,设置于所述滤波器电路的后级的电路的输入端设置于所述第二基板的与所述第一方向交叉的第二方向上的一端侧；以及第三基板,配置于所述第一基板与所述第二基板之间,且形成有将所述输出端与所述输入端电连接的配线图案。(In order to achieve miniaturization and efficient cooling of heat-generating electrical components in response to multi-phase alternating current, the present invention provides a switching power supply device having a plurality of power supply circuits connected to a multi-phase power supply, the switching power supply device including: a first substrate on which an electric component constituting a filter circuit that prevents intrusion of noise from the power supply is mounted, an output end of the filter circuit being provided on one end side in a first direction of the first substrate; a second substrate that is placed on a bottom wall portion of a case that houses the switching power supply device, and on which a power semiconductor that constitutes a circuit provided in a subsequent stage of the filter circuit is mounted, an input terminal of the circuit provided in the subsequent stage of the filter circuit being provided on one end side of the second substrate in a second direction that intersects the first direction; and a third substrate disposed between the first substrate and the second substrate, and having a wiring pattern formed thereon to electrically connect the output terminal and the input terminal.)

1. A switching power supply device having a plurality of power supply circuits connected to a multiphase power supply, comprising:

a first substrate on which an electric component constituting a filter circuit that prevents intrusion of noise from the external power supply is mounted, an output end of the filter circuit being provided on one end side in a first direction of the first substrate;

a second substrate that is placed on a bottom wall portion of a case that houses the switching power supply device, and on which a power semiconductor that constitutes a circuit provided in a subsequent stage of the filter circuit is mounted, an input terminal of the circuit provided in the subsequent stage of the filter circuit being provided on one end side of the second substrate in a second direction that intersects the first direction; and

and a third substrate disposed between the first substrate and the second substrate, and having a wiring pattern formed thereon to electrically connect the output terminal and the input terminal.

2. The switching power supply device according to claim 1,

all power semiconductors constituting a circuit provided at a subsequent stage of the filter circuit are mounted on the second substrate.

3. The switching power supply device according to claim 1,

the power supply circuit includes a power factor correction circuit including a switching element, a diode, and a coil, the switching element and the diode being mounted on the second substrate, and the coil being mounted on the third substrate.

4. The switching power supply device according to claim 3,

the power supply circuit has a capacitor provided at a subsequent stage of the power factor correction circuit, and the capacitor is mounted on the third substrate.

5. The switching power supply device according to claim 1,

the second substrate is an aluminum substrate.

Technical Field

The present invention relates to a switching power supply device.

Background

In a switching power supply device for vehicle mounting, a substrate on which a power semiconductor for power conversion, a coil, a capacitor, a transformer, and the like are mounted is disposed in a case. The power semiconductor generates heat, and therefore, efficient cooling is required.

Patent document 1 discloses the following structure: the heat sink is built in the case, the substrates are disposed in the upper space and the lower space of the heat sink, respectively, the power semiconductors are mounted on the respective substrates, and the substrates are electrically connected to each other by wiring.

In patent document 1, the power semiconductors mounted on the respective substrates are directly brought into contact with the heat sink, thereby achieving a reduction in size of the switching power supply device and improving the cooling efficiency of the power semiconductors.

Disclosure of Invention

Problems to be solved by the invention

The switching power supply device described in patent document 1 is a switching power supply device for single-phase current. In order to construct a switching power supply device that can accommodate multi-phase alternating current with the configuration described in patent document 1, not only the phases need to be insulated from each other, but also wiring for electrically connecting the substrates to each other and wiring for electrically connecting the power semiconductor to the coil, the capacitor, the transformer, and the like become complicated, leading to an increase in size of the device.

The invention aims to provide a switching power supply device which can be used for multi-phase alternating current, realizes miniaturization and efficiently cools heat-generating electric components.

Means for solving the problems

One aspect of the present invention is a switching power supply device including a plurality of power supply circuits connected to a multiphase power supply, the switching power supply device including: a first substrate on which an electric component constituting a filter circuit that prevents intrusion of noise from the power supply is mounted, an output end of the filter circuit being provided on one end side in a first direction of the first substrate; a second substrate that is placed on a bottom wall portion of a case that houses the switching power supply device, and on which a power semiconductor that constitutes a circuit provided in a subsequent stage of the filter circuit is mounted, an input terminal of the circuit provided in the subsequent stage of the filter circuit being provided on one end side of the second substrate in a second direction that intersects the first direction; and a third substrate disposed between the first substrate and the second substrate, and having a wiring pattern formed thereon to electrically connect the output terminal and the input terminal.

Effects of the invention

According to the present invention, it is possible to efficiently cool heat-generating electric components while reducing the size thereof in response to a multiphase alternating current.

Drawings

Fig. 1 is a circuit block diagram showing a configuration of a switching power supply device according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view showing a configuration of a switching power supply device according to an embodiment of the present invention.

Fig. 3 is a vertical cross-sectional view showing a configuration of a switching power supply device according to an embodiment of the present invention.

Fig. 4 is a plan view of an AC filter substrate (AC filter substrate).

Fig. 5A is a plan view of a joint substrate (joint substrate).

Fig. 5B is a schematic diagram showing a wiring pattern on the first layer of the bonding substrate.

Fig. 5C is a schematic view showing a wiring pattern on the second layer of the bonding substrate.

Fig. 5D is a schematic diagram showing a wiring pattern on the third layer of the bonding substrate.

Fig. 5E is a schematic diagram showing a wiring pattern on the fourth layer of the bonding substrate.

Fig. 6 is a top view of the driver substrate.

Fig. 7 is a plan view of the power module substrate.

Fig. 8 is a plan view of the DC filter substrate (DC filter substrate).

Fig. 9 is a plan view of the control substrate.

Fig. 10A is a partially enlarged vertical cross-sectional view showing a connection structure of the AC filter substrate and the bonding substrate.

Fig. 10B is a partially enlarged vertical cross-sectional view showing a connection structure of the AC filter substrate and the bonding substrate.

Fig. 11A is a partially enlarged vertical cross-sectional view showing a connection structure of the bonding substrate and the actuator substrate.

Fig. 11B is a partially enlarged vertical cross-sectional view showing a connection structure between the bonding substrate and the actuator substrate.

Fig. 12A is a partially enlarged vertical cross-sectional view showing a connection structure between the driver board and the power module board.

Fig. 12B is a partially enlarged vertical cross-sectional view showing a connection structure between the driver board and the power module board.

Fig. 13 is a flowchart showing a manufacturing process of the switching power supply device.

Fig. 14 is a vertical cross-sectional view showing a configuration of a switching power supply device according to a modification of the embodiment of the present invention.

Detailed Description

A switching power supply device according to an embodiment of the present invention will be described in detail below with reference to the drawings. The embodiments described below are examples, and the present invention is not limited to these embodiments.

(Integrated configuration of switching power supply device)

Referring to fig. 1, the overall configuration of a switching power supply 1 (hereinafter, simply referred to as "power supply 1") will be described. Fig. 1 is a circuit block diagram showing the configuration of a power supply device 1. In fig. 1, a hollow triangular mark, a circular mark, and a square mark are shown on the power line. The hollow triangular mark indicates a coupling portion 29 described later. The hollow circular mark indicates a coupling portion 28 described later. The hollow square symbol indicates a coupling portion 27 described later.

The power supply device 1 is mounted on a vehicle such as an electric vehicle, and converts ac power from an external power supply 2, which is a three-phase ac power supply, into dc power and outputs the dc power to a battery 3. The battery 3 is, for example, a battery for driving a motor of a vehicle. The battery 3 is, for example, a lithium ion battery.

The power supply device 1 includes power supply circuits 4A, 4B, and 4C corresponding to the respective external power supplies 2, a DC filter circuit (DC filter circuit) 5, and a control circuit 6. The power supply circuits 4A, 4B, and 4C each include an AC filter circuit (AC filter circuit) 7, a single-phase full-wave rectifier circuit 8, a power factor correction circuit 9, a capacitor 10, and a DC/DC converter (DC/DC converter) 11.

The AC filter circuit 7 reduces noise entering from the external power supply 2 to the rear stage side of the AC filter circuit 7 and noise flowing from the rear stage side of the AC filter circuit 7 to the external power supply 2. The AC filter circuit 7 has a coil, a capacitor, and the like.

The single-phase full-wave rectifier circuit 8 full-wave rectifies the AC power input from the AC filter circuit 7, converts the rectified AC power into dc power, and outputs the dc power to the power factor correction circuit 9. The single-phase full-wave rectifier circuit 8 is a diode bridge circuit including four diodes 12 (not shown in fig. 1).

The power factor correction circuit 9 is a circuit having a function of correcting the power factor of the power input from the single-phase full-wave rectifier circuit 8 and increasing the voltage of the input power. The power factor correction circuit 9 includes a coil 13, a switching element 14, and a diode 15.

The power supply circuits 4A, 4B, and 4C each have two power factor correction circuits 9 connected in parallel between a single-phase full-wave rectifier circuit 8 and a capacitor 10. Thus, an interleaved power factor correction circuit is formed.

The capacitor 10 is connected to the output side of the power factor correction circuit 9, and smoothes the dc power output from the power factor correction circuit 9. Since the voltage of the dc power is increased by the power factor correction circuit 9, the capacitor 10 has a large capacitance.

The DC/DC converter 11 is a circuit that converts the output from the power factor correction circuit 9 into a voltage that can charge the battery 3. The DC/DC converter 11 includes an inverter 16, a transformer 17, a secondary-side rectifying circuit 18, and a capacitor 19.

The inverter 16 converts the dc power input from the power factor correction circuit 9 into ac power and outputs the ac power to the transformer 17. The inverter 16 has four switching elements 20.

The transformer 17 transforms the voltage of the ac power from the inverter 16 and outputs the transformed voltage to the secondary-side rectifier circuit 18. The transformer 17 has a power transmission coil 21 connected to the output side of the inverter 16, and a power reception coil 22 connected to the input side of the secondary side rectifier circuit 18.

The secondary-side rectifier circuit 18 is a circuit that converts ac power from the transformer 17 into dc power. The secondary side rectifier circuit 18 is a diode bridge circuit composed of four diodes 23 (not shown in fig. 1).

The capacitor 19 is connected to the output side of the secondary-side rectifier circuit 18, and smoothes the dc current output from the secondary-side rectifier circuit 18.

The DC filter circuit 5 is provided at the subsequent stage of the power supply circuits 4A, 4B, and 4C. The DC filter circuit 5 reduces noise flowing out from each power supply circuit to the battery 3 and noise entering from the battery 3 to each power supply circuit. The DC filter circuit 5 has a coil, a capacitor, and the like.

The control circuit 6 controls the operation of each power supply circuit by on-off controlling the switching element 14 of the power factor correction circuit 9 or the switching element 20 of the DC/DC converter 11 in each power supply circuit.

That is, under the control of the control circuit 6, the battery 3 is charged with the electric power supplied from the external power supply 2 via each power supply circuit. The control circuit 6 is constituted by a microcomputer, an integrated circuit, and the like mounted on the substrate.

(Structure of switching Power supply device)

Next, the structure of the power supply device 1 will be described with reference to fig. 2 to 12. Fig. 2 is an exploded perspective view showing the structure of the power supply device 1. Fig. 3 is a vertical sectional view showing the structure of the power supply device 1. Fig. 4 is a plan view of the AC filter substrate 100. Fig. 5A is a top view of the bonding substrate 400. Fig. 5B to 5E are diagrams showing the wiring patterns of the first to fourth layers in the bonding substrate 400. Fig. 6 is a top view of the driver substrate 500. Fig. 7 is a top view of the power module substrate 600. Fig. 8 is a plan view of the DC filter substrate 200. Fig. 9 is a plan view of the control board 300. Fig. 2 to 9 are diagrams schematically showing the configuration of the power supply device 1, and parts and wirings not directly related to the description are omitted. In addition, the same X-axis, Y-axis, and Z-axis are depicted in fig. 2-9. The positive direction of the X axis is defined as the + X direction, the positive direction of the Y axis is defined as the + Y direction, and the positive direction of the Z axis is defined as the + Z direction (upward direction).

As shown in fig. 2, the power supply device 1 includes: AC filter substrate 100, DC filter substrate 200, control substrate 300, bonding substrate 400, driver substrate 500, and power module substrate 600. Each of these substrates is a substantially rectangular thin plate member extending in the XY plane.

As shown in fig. 3, AC filter substrate 100, DC filter substrate 200, control substrate 300, bonding substrate 400, driver substrate 500, and power module substrate 600 are accommodated in case 24.

The case 24 is formed of a side surface portion and a bottom surface portion, and has a box shape with an open upper surface. A water jacket 26 through which cooling water flows is formed in the bottom surface portion 25 of the housing 24. The power module board 600 is directly mounted on the bottom surface portion 25. A plurality of heat-generating electrical components are mounted on the upper surface of the power module board 600, and the heat-generating electrical components mounted on the upper surface of the power module board 600 can be efficiently cooled by directly mounting the power module board 600 on the bottom surface portion 25.

Although details will be described later, since the plurality of heat-generating electric components mounted on the power module board 600 are chip components, the contact area between the heat-generating electric components and the power module board 600 is large. This also enables efficient cooling of the heat-generating electrical component.

The driver board 500 is disposed above the power module board 600 with a gap from the power module board 600. The power module board 600 and the driver board 500 are mechanically and electrically connected to each other by a coupling portion 27 described later.

The bonding substrate 400 is disposed above the driver substrate 500 with a gap from the driver substrate 500. The actuator substrate 500 and the bonding substrate 400 are mechanically and electrically connected to each other through a coupling portion 28 described later.

The control board 300 is disposed above the bonding board 400 with a gap from the bonding board 400.

The AC filter substrate 100 and the DC filter substrate 200 are disposed above the control substrate 300 with a gap from the control substrate 300. The AC filter substrate 100 and the DC filter substrate 200 are mechanically and electrically connected to the bonding substrate 400 by a connection portion 29 described later.

(AC Filter substrate)

The AC filter substrate 100 will be described with reference to fig. 4. The AC filter substrate 100 is formed by forming a wiring pattern on an insulating plate as a base.

On the upper surface of the AC filter substrate 100, electrical components such as the connector 30, the coil constituting the AC filter circuit 7, and the capacitor are mounted, and these electrical components are connected to the wiring pattern, respectively. Specifically, the lead wire of each electrical component is inserted into and soldered to a lead through hole (not shown) provided in the AC filter substrate 100 so as to penetrate from the upper surface to the lower surface.

On the AC filter substrate 100, three AC filter circuits 7A, 7B, and 7C corresponding to U-phase, V-phase, and W-phase of three-phase alternating current are arranged in parallel along the X-axis. Specifically, the AC filter circuit 7A is disposed on the-X side of the AC filter substrate 100, the AC filter circuit 7B is disposed on the + X side of the AC filter circuit 7A, and the AC filter circuit 7C is disposed on the + X side of the AC filter circuit 7B. The AC filter circuits are insulated from each other.

The AC filter circuits 7A, 7B, and 7C are supplied with electric power via connectors 30 connectable to the external power supply 2, respectively. The connector 30 is provided on the-Y end side of the AC filter substrate 100, and the connector 30 and the input terminals of the AC filter circuits 7A, 7B, and 7C are electrically connected by wiring patterns, respectively. Fig. 4 schematically shows only the positive-side wiring patterns PA1, PB1, and PC1 among the wiring patterns that connect the connector 30 to the input terminals of the AC filter circuits 7A, 7B, and 7C, respectively.

As described above, each AC filter circuit is formed of electric components such as a coil and a capacitor mounted on the AC filter substrate 100. These electric components are arranged so as to be aligned substantially in the + Y direction from the input side (the external power supply 2 side) to the output side (the battery 3 side) of each AC filter circuit. Therefore, the output end of each AC filter circuit is located on the + Y end side of the AC filter substrate 100.

Wiring patterns PA2 (positive electrode) and PA3 (negative electrode) extending from the output terminal of the AC filter circuit 7A extend to the through holes HA1 and HA 2. Wiring patterns PB2 (positive electrode) and PB3 (negative electrode) extending from the output terminal of the AC filter circuit 7B extend to the through holes HB1 and HB 2. Wiring patterns PC2 (positive electrode) and PC3 (negative electrode) extending from the output terminal of the AC filter circuit 7C extend to the through holes HC1 and HC 2.

The through holes HA1, HA2, HB1, HB2, HC1, and HC2 are holes penetrating the AC filter substrate 100 in the Z direction, respectively. The through holes HA1, HA2, HB1, HB2, HC1, and HC2 are provided on the + Y end side of the AC filter substrate 100 so as to be aligned in the + X direction.

(bonding substrate)

Referring to fig. 5A, a bonded substrate 400 will be described. The bonded substrate 400 is formed by forming wiring patterns on respective layers of an insulating substrate having a multilayer structure.

Basically, the bonding substrate 400 functions as a wiring for connecting the electric components in the power supply circuits 4A, 4B, and 4C to each other.

At the + Y side end of the bonding substrate 400, through holes HA3, HA4, HB3, HB4, HC3, and HC4 corresponding to the through holes HA1, HA2, HB1, HB2, HC1, and HC2 are provided so as to be aligned in the + X direction.

Further, a plurality of through holes HA5, HA6, HB5, HB6, HC5, and HC6 are provided at positions closer to the-X end side than the through hole HA3 so as to be aligned in the + Y direction.

A plurality of terminals TA1, TA2, TA3, TA4, TA5, TA6, TA7, TA8, TA9, TA10, and TA11 associated with the power supply circuit 4A are provided to protrude in the-Z direction from the lower surface of the bonding substrate 400.

Further, a plurality of terminals TB1, TB2, TB3, TB4, TB5, TB6, TB7, TB8, TB9, TB10, and TB11 associated with the power supply circuit 4B are provided to protrude in the-Z direction from the lower surface of the junction substrate 400.

Further, a plurality of terminals TC1, TC2, TC3, TC4, TC5, TC6, TC7, TC8, TC9, TC10, and TC11 associated with the power supply circuit 4C are provided so as to protrude in the-Z direction from the lower surface of the bonding substrate 400.

These terminals provided to protrude from the lower surface of the bonding substrate 400 toward the-Z direction are all the same shape.

Further, on the lower surface of the junction substrate 400 on the-Y end side, a plurality of coils 13a1, 13a2, 13B1, 13B2, 13C1, and 13C2 are mounted so as to be aligned in the-X direction. Specifically, the lead of each coil is inserted into and soldered to a lead through hole (not shown) provided in the bonding substrate 400 so as to penetrate from the lower surface to the upper surface.

Capacitors 10A, 10B, and 10C are mounted on the upper surface of bonding substrate 400 on the-X end side so as to be aligned in the + Y direction. Specifically, the lead wire of each electrolytic capacitor is inserted into and soldered to a lead through hole provided in the bonding substrate 400 so as to penetrate from the upper surface to the lower surface.

(Wiring patterns on respective layers of a bonded substrate)

The wiring patterns on the respective layers of the bonding substrate 400 will be described with reference to fig. 5B to 5E. First, a wiring pattern on the first layer will be described. Fig. 5B is a diagram schematically showing a wiring pattern of the first layer of the bonding substrate 400.

In the first layer, as a configuration related to the power supply circuit 4A, the wiring pattern PA4 connects the via HA3 to the terminal TA 1. Specifically, the wiring pattern PA4 having one end connected to the via HA3 extends in the + X direction and the-Y direction to the terminal TA 1.

The wiring pattern PA5 connects the via HA4 to the terminal TA 2. Specifically, the wiring pattern PA5 having one end connected to the via HA4 extends in the + X direction and the-Y direction to the terminal TA 2.

The wiring pattern PA11 connects the terminal TA10 and the via HA 5. Specifically, the wiring pattern PA11 having one end connected to the terminal TA10 extends in the-X direction to the via HA 5.

The wiring pattern PA12 connects the terminal TA11 and the via HA 6. Specifically, the wiring pattern PA12 having one end connected to the terminal TA11 extends in the-X direction to the via HA 6.

The wiring pattern PA7 connects the output terminal of the coil 13a1 to the terminal TA 4. Specifically, the wiring pattern PA7 having one end connected to the output end of the coil 13a1 extends in the + Y direction to the terminal TA 4.

The wiring pattern PA8 connects the output terminal of the coil 13a2 to the terminal TA 5. Specifically, the wiring pattern PA8 having one end connected to the output end of the coil 13a2 extends in the + Y direction to the terminal TA 5.

As a configuration related to the power supply circuit 4B, the wiring pattern PB4 connects the through hole HB3 and the terminal TB 1. Specifically, the wiring pattern PB4 having one end connected to the via HB3 extends in the + X direction and the-Y direction to the terminal TB 1.

The wiring pattern PB5 connects the via HB4 to the terminal TB 2. Specifically, the wiring pattern PB5 having one end connected to the via HB4 extends in the + X direction and the-Y direction to the terminal TB 2.

The wiring pattern PB11 connects the terminal TB10 and the via HB 5. Specifically, the wiring pattern PB11 having one end connected to the terminal TB10 extends to the via HB5 in the-X direction.

The wiring pattern PB12 connects the terminal TB11 and the via HB 6. Specifically, the wiring pattern PB12 having one end connected to the terminal TB11 extends to the via HB6 in the-X direction.

As a configuration related to the power supply circuit 4C, the wiring pattern PC4 connects the via HC3 and the terminal TC 1. Specifically, the wiring pattern PC4 having one end connected to the via HC3 extends to the terminal TC1 in the + X direction and the-Y direction.

The wiring pattern PC5 connects the via HC4 and the terminal TC 2. Specifically, the wiring pattern PC5 having one end connected to the via HC4 extends to the terminal TC2 in the + X direction and the-Y direction.

In addition, the wiring pattern PC11 connects the terminal TC10 with the via HC 5. Specifically, the wiring pattern PC11 having one end connected to the terminal TC10 extends in the-X direction to the via HC 5.

In addition, the wiring pattern PC12 connects the terminal TC11 with the via HC 6. Specifically, the wiring pattern PC12 having one end connected to the terminal TC11 extends in the-X direction to the via HC 6.

Next, a wiring pattern on the second layer will be described. Fig. 5C is a diagram schematically showing a wiring pattern of the second layer of the bonding substrate 400.

In the second layer, as a configuration related to the power supply circuit 4A, the wiring pattern PA9 connects the terminal TA6 to the positive electrode terminal of the capacitor 10A and the terminal TA 8. Specifically, the wiring pattern PA9 having one end connected to the terminal TA6 extends in the-X direction to the terminal TA8 and the positive electrode terminal of the capacitor 10A.

In addition, as a configuration related to the power supply circuit 4B, the wiring pattern PB9 connects the terminal TB6 to the positive electrode terminal of the capacitor 10B and the terminal TB 8. Specifically, the wiring pattern PB9 having one end connected to the terminal TB6 extends in the-X direction to the terminal TB8 and the positive end of the capacitor 10B.

In addition, as a configuration related to the power supply circuit 4C, the wiring pattern PC9 connects the terminal TC6 to the positive terminal of the capacitor 10C and the terminal TC 8. Specifically, the wiring pattern PC9 having one end connected to the terminal TC6 extends in the-X direction to the terminal TC8 and the positive electrode end of the capacitor 10C.

Next, a wiring pattern on the third layer will be described. Fig. 5D is a diagram schematically showing a wiring pattern of the third layer of the bonding substrate 400.

In the third layer, as a configuration related to the power supply circuit 4A, the wiring pattern PA10 connects the terminal TA7 to the negative electrode terminal of the capacitor 10A and the terminal TA 9. Specifically, the wiring pattern PA10 having one end connected to the terminal TA7 extends in the-X direction to the terminal TA9 and the negative electrode end of the capacitor 10A.

In addition, as a configuration related to the power supply circuit 4B, the wiring pattern PB10 connects the terminal TB7 to the negative electrode terminal of the capacitor 10B and the terminal TB 9. Specifically, the wiring pattern PB10 having one end connected to the terminal TB7 extends in the-X direction to the terminal TB9 and the negative electrode end of the capacitor 10B.

In addition, as a configuration related to the power supply circuit 4C, the wiring pattern PC10 connects the terminal TC7 to the negative electrode terminal of the capacitor 10C and the terminal TC 9. Specifically, the wiring pattern PC10 having one end connected to the terminal TC7 extends in the-X direction to the terminal TC9 and the negative electrode end of the capacitor 10C.

Next, a wiring pattern on the fourth layer will be described. Fig. 5E is a diagram schematically showing a wiring pattern of the fourth layer of the bonding substrate 400.

In the fourth layer, as a configuration related to the power supply circuit 4A, the wiring pattern PA6 connects the terminal TA3 to the input terminal of the coil 13a1 and the input terminal of the coil 13a 2. Specifically, the wiring pattern PA6 having one end connected to the terminal TA3 extends in the-X direction and the-Y direction to the input end of the coil 13a1 and the input end of the coil 13a 2.

In the configuration related to the power supply circuit 4B, the wiring pattern PB6 connects the terminal TB3 to the input terminal of the coil 13B1 and the input terminal of the coil 13B 2. Specifically, the wiring pattern PB6 having one end connected to the terminal TB3 extends in the-X direction and the-Y direction to the input end of the coil 13B1 and the input end of the coil 13B 2.

The wiring pattern PB7 connects the output end of the coil 13B1 to the terminal TB 4. Specifically, the wiring pattern PB7 having one end connected to the output end of the coil 13B1 extends to the terminal TB4 in the + X direction and the + Y direction.

The wiring pattern PB8 connects the output end of the coil 13B2 to the terminal TB 5. Specifically, the wiring pattern PB8 having one end connected to the output end of the coil 13B2 extends to the terminal TB5 in the + X direction and the + Y direction.

As a configuration related to the power supply circuit 4C, the wiring pattern PC6 connects the terminal TC3 to the input terminal of the coil 13C1 and the input terminal of the coil 13C 2. Specifically, the wiring pattern PC6 having one end connected to the terminal TC3 extends in the-X direction and the-Y direction to the input end of the coil 13C1 and the input end of the coil 13C 2.

The wiring pattern PC7 connects the output end of the coil 13C1 to the terminal TC 4. Specifically, the wiring pattern PC7, one end of which is connected to the output end of the coil 13C1, extends to the terminal TC4 in the + X direction and the + Y direction.

The wiring pattern PC8 connects the output end of the coil 13C2 to the terminal TC 5. Specifically, the wiring pattern PC8, one end of which is connected to the output end of the coil 13C2, extends to the terminal TC5 in the + X direction and the + Y direction.

The types of the wiring patterns provided in the respective layers are not limited to the above examples.

(driver substrate)

The driver board 500 is explained with reference to fig. 6. The driver board 500 is formed by forming a wiring pattern on an insulating plate as a base.

A plurality of terminals TD1, TD2, TD3, TD4, TD5, TD6, TD7, TD8, TD9, TD10, and TD11 associated with the power supply circuit 4A are provided to protrude in the + Z direction from the upper surface of the driver substrate 500.

Further, a plurality of terminals TE1, TE2, TE3, TE4, TE5, TE6, TE7, TE8, TE9, TE10, and TE11 associated with the power supply circuit 4B are provided to protrude in the + Z direction from the upper surface of the driver substrate 500.

Further, a plurality of terminals TF1, TF2, TF3, TF4, TF5, TF6, TF7, TF8, TF9, TF10, and TF11 associated with the power supply circuit 4C are provided to protrude in the + Z direction from the upper surface of the driver substrate 500.

These terminals provided to protrude from the upper surface of the driver substrate 500 toward the + Z direction are all the same shape. Terminals TD1 to TD11, TE1 to TE11, and TF1 to TF11 correspond to terminals TA1 to TA11, TB1 to TB11, and TC1 to TC11 provided on bonding substrate 400, respectively.

The driver board 500 is provided with a plurality of through holes (not shown in fig. 6) penetrating the driver board 500 in the Z direction. As will be described later in detail, the pin terminals 31 provided so as to protrude from the power module board 600 in the + Z direction are inserted into the through holes.

The driver board 500 is connected to the transformer 17 via a wire. Further, as shown in fig. 3, since transformer 17 is disposed on the opposite side of capacitor 10 with bonding substrate 400 interposed therebetween, the vertical dimension of case 24 can be suppressed from increasing.

(Power Module substrate)

Referring to fig. 7, a power module board 600 will be described. The power module board 600 is formed by applying an insulating film made of, for example, epoxy resin to an aluminum plate as a base, and forming a wiring pattern on the insulating film.

Power semiconductors (also referred to as power modules, the same applies hereinafter) constituting the single-phase full-wave rectifier circuit 8, the power factor correction circuit 9, and the DC/DC converter 11 are mounted on the upper surface of the power module substrate 600. In the present specification, the term "power semiconductor" refers to a semiconductor that controls or supplies electric power.

Specifically, four diodes 12 in the single-phase full-wave rectifier circuit 8, two switching elements 14 and two diodes 15 in the power factor correction circuit 9, and four switching elements 20 and four diodes 23 in the DC/DC converter 11 are mounted corresponding to the power supply circuits, respectively.

The input end of the single-phase full-wave rectifier circuit 8 is located on the + X side of the power module board 600, and these power semiconductors are arranged so as to be aligned in the-X direction from the input side (the external power supply 2 side) to the output side (the battery 3 side) of each power supply device.

Further, a plurality of pin terminals 31 (not shown in fig. 7) for mechanically and electrically connecting the power semiconductors mounted on the power module board 600 to the driver board are mounted on the upper surface of the power module board 600.

In the present embodiment, the following power semiconductors that need to be insulated from each other are disposed on the power module substrate 600: a power semiconductor constituting the single-phase full-wave rectifier circuit 8 and the power factor correction circuit 9, a power semiconductor constituting the primary side of the DC/DC converter 11, and a power semiconductor constituting the secondary side of the DC/DC converter 11.

In this case, although noise is likely to be generated in each circuit due to interference between the AC system and the DC system, in the present embodiment, the AC filter circuit 7 is provided between the external power supply 2 and the DC filter circuit 5 is provided between the battery 3, and therefore, it is possible to appropriately suppress noise generated in each circuit from flowing out to the external power supply 2 or the battery 3.

(DC Filter substrate)

The DC filter substrate 200 will be described with reference to fig. 8. The DC filter substrate 200 is formed by forming a wiring pattern on an insulating plate as a base.

On the upper surface of the DC filter substrate 200, electrical components 38 such as a coil and a capacitor constituting the capacitor 19 and the DC filter circuit 5 are mounted, and these components are connected to the wiring pattern, respectively. Further, an output terminal 39 is provided on the-Y end side of the DC filter substrate 200, and the output terminal 39 is connected to a connector for connecting the battery 3.

On the-X end side of the DC filter substrate 200, through holes HA7, HA8, HB7, HB8, HC7, and HC8 corresponding to the through holes HA5, HA6, HB5, HB6, HC5, and HC6 are provided so as to be aligned in the + Y direction.

The through holes are one ends of wiring patterns PA12, PA13, PB12, PB13, PC12, and PC13, respectively, and the wiring patterns are connected to the capacitor 19 and the input end of the DC filter circuit 5.

The output terminal of the DC filter circuit 5 is connected to an output terminal 39 for connecting a connector, which is a connector for connecting the battery 3, through a wiring pattern.

(control substrate)

The control board 300 will be described with reference to fig. 9. The control board 300 is a printed circuit board having a wiring pattern formed on an insulating plate as a base.

Electrical components 40 such as a microcomputer and an integrated circuit constituting the control circuit 6 are mounted on the lower surface of the control board 300, and are connected to the wiring patterns, respectively.

Specifically, a lead of a microcomputer, an integrated circuit, or the like is inserted into a lead through hole (not shown) provided in the control board 300 so as to penetrate from the lower surface to the upper surface, and soldered.

(AC Filter substrate and DC Filter substrate and Joint substrate connection part structure)

The structure of the coupling portion 29 that couples the AC filter substrate 100 and the DC filter substrate 200 to the bonding substrate 400 will be described in detail with reference to fig. 10A and 10B. Fig. 10A and 10B are partially enlarged vertical sectional views showing a connection structure of the AC filter substrate 100 and the bonding substrate 400. Fig. 10A is a diagram showing a state in which the AC filter substrate 100 and the bonding substrate 400 are coupled by the coupling portion 29. Fig. 10B is a diagram illustrating a connection procedure of the AC filter substrate 100 and the bonding substrate 400.

As shown in fig. 10A, the bonding substrate 400 is located on the-Z direction side of the AC filter substrate 100 and the DC filter substrate 200 with the control substrate 300 interposed therebetween.

The AC filter substrate 100 and the DC filter substrate 200 are connected to the bonding substrate 400 by metal studs 32 extending along the Z-axis. Further, each metal stud electrically connects the AC filter substrate 100 and the DC filter substrate 200 to the bonding substrate 400.

Here, a structure in which the through hole HA1 provided in the AC filter substrate 100 and the through hole HA3 provided in the bonding substrate 400 are connected to each other by the metal stud 32 will be described as an example.

As shown in fig. 10B, a female screw portion 32a into which a male screw portion 33a of a screw 33 can be screwed is provided on one end surface and the other end surface of the metal stud 32.

In a state where the female screw portion 32a at one end surface of the metal stud 32 is aligned with the through hole HA1, the one end surface of the metal stud 32 is brought into contact with the lower surface of the AC filter substrate 100 as necessary, and the male screw portion 33a of the screw 33 is screwed into the female screw portion 32a, thereby fixing the AC filter substrate 100 and the metal stud 32.

In addition, in a state where the female screw portion 32a at the other end surface of the metal stud 32 is aligned with the through hole HA3, the other end surface of the metal stud 32 is brought into contact with the upper surface of the joint substrate 400 as necessary, and the male screw portion 33a of the screw 33 is screwed into the female screw portion 32a, thereby fixing the joint substrate 400 and the metal stud 32.

By connecting the AC filter substrate 100 and the bonding substrate 400 via the connection portion 29, the through hole HA1 and the through hole HA3 are electrically connected via the screw 33 and the metal stud 32.

(Structure of connecting portion between bonding substrate and actuator substrate)

The structure of the coupling portion 28 that couples the bonding substrate 400 and the actuator substrate 500 will be described in detail with reference to fig. 11A and 11B. Fig. 11A and 11B are partially enlarged vertical sectional views showing a connection structure between the bonding substrate 400 and the actuator substrate 500. Fig. 11A is a diagram showing a state in which the bonding substrate 400 and the actuator substrate 500 are coupled by the coupling portion 28. Fig. 11B is a diagram illustrating a connection procedure of the bonding substrate 400 and the driver substrate 500.

Here, a connection structure between the terminal TA1 provided on the bonding substrate 400 and the terminal TD1 provided on the driver substrate 500 will be described as an example.

The terminal TA1 has a leg portion 34 inserted into a through hole provided in the bonding substrate 400 and an opening portion 35 for connection with the terminal TD 1. By pressing or fitting the leg portion 34 into the through hole of the bonding substrate 400, the terminal TA1 is fixed with respect to the bonding substrate 400.

The terminal TD1 has a leg portion 36 inserted into a through hole provided in the driver board 500 and a tip portion 37 for connection to the terminal TA 1. By pressing or inserting the leg portion 36 into the through hole of the driver substrate 500, the terminal TD1 is fixed with respect to the driver substrate 500.

In a state where the terminal TA1 and the terminal TD1 are fixed to the junction board 400 and the driver board 500, respectively, the tip portion 37 of the terminal TD1 is press-fitted or fitted into the opening portion 35 of the terminal TA1, whereby the terminal TA1 and the terminal TD1 are coupled to each other. Further, the terminal TA1 may be provided with a tip end portion, and the terminal TD1 may be provided with an opening portion.

(Structure of connection part between actuator substrate and Power Module substrate)

The structure of the coupling portion 27 that couples the driver board 500 and the power module board 600 will be described in detail with reference to fig. 12A and 12B. Fig. 12A and 12B are partially enlarged vertical sectional views showing a coupling structure of the driver board 500 and the power module board 600. Fig. 12A is a diagram showing a state in which the actuator substrate 500 and the power module substrate 600 are coupled by the coupling portion 27. Fig. 12B is a diagram illustrating a connection procedure of the driver board 500 and the power module board 600.

The connection portion 27 includes a pin terminal 31 provided on the upper surface of the power module substrate 600 and extending in the + Z direction, and a through hole provided in the driver substrate 500.

Specifically, the driver substrate 500 and the power module substrate 600 are coupled and electrically connected by press-fitting or fitting the pin terminals 31 into the through holes of the driver substrate 500.

(connection structure of circuits constituting the Power supply device)

Here, as an example, a connection structure of each circuit from the external power supply 2 to the battery 3 via the power supply circuit 4A and the DC filter circuit 5 will be described.

The external power supply 2 is connected to an input terminal of the AC filter circuit 7A. The input end of the AC filter circuit 7A is provided on the-Y end side of the AC filter substrate 100, and the output end of the AC filter circuit 7A is provided on the + Y end side of the AC filter substrate 100. Therefore, the electric power flow in the AC filter circuit 7A is substantially from the-Y end side toward the + Y end side.

On the other hand, an input terminal of the single-phase full-wave rectifier circuit 8 provided at the subsequent stage of the AC filter circuit 7A is provided on the + X end side of the power module substrate 600. Therefore, the joint substrate 400 is used to electrically connect the output terminal of the AC filter circuit 7A provided on the + Y end side of the AC filter substrate 100 and the input terminal of the single-phase full-wave rectifier circuit 8 provided on the + X end side of the power module substrate 600.

Specifically, the output terminal (positive electrode) of the AC filter circuit 7A is connected to one end of the wiring pattern PA4 formed on the bonding substrate 400 via the wiring pattern PA2 and the connection portion 29 (via HA1, metal stud 32, and via HA 3).

The output terminal (negative electrode) of the AC filter circuit 7A is connected to one end of the wiring pattern PA5 formed on the bonding substrate 400 via the wiring pattern PA3 and the connection portion 29 (via HA2, metal stud 32, and via HA 4). One ends of the wiring patterns PA4 and PA5 are located on the + Y end side of the bonding substrate 400.

The wiring patterns PA4 and PA5 extend from one end to the other end in the + X direction and the-Y direction. The other ends of the wiring patterns PA4 and PA5 extend to terminals TA1 and TA2 located on the + X end side of the bonding substrate 400.

The terminal TA1 constitutes the coupling portion 28 together with the terminal TD1 provided on the driver board 500. The terminal TA2 constitutes the coupling portion 28 together with the terminal TD2 provided on the driver board 500. The driver board 500 and the power module board 600 are electrically connected by the connection portion 27.

Therefore, the output terminal of the AC filter circuit 7A provided on the + Y end side of the AC filter substrate 100 can be connected to the input terminal of the single-phase full-wave rectifier circuit 8 provided on the + X end side of the power module substrate 600 via the connection portion 29, the wiring pattern formed on the bonding substrate 400, the connection portion 28, and the connection portion 27.

The positive-side output terminal of the single-phase full-wave rectifying circuit 8 is connected to the terminal TA3 of the bonding substrate 400 via the connection portion 27 and the connection portion 28, and is connected to the input terminals of the coils 13a1 and 13a2 mounted on the-Y end side of the bonding substrate 400 via the wiring pattern PA 6.

The output terminals of the coils 13a1 and 13a2 are connected to terminals TA4 and TA5 via wiring patterns PA7 and PA8, respectively, and are connected to the positive electrode side of the switching element 14 mounted on the power module board 600 and the anode of the diode 15 via the connection portion 28 and the connection portion 27.

The cathode of the diode 15 is connected to the terminal TA6 of the bonding substrate 400 via the connection portion 27 and the connection portion 28, and is connected to the positive electrode side of the capacitor 10A mounted on the-X end side of the bonding substrate 400 via the wiring pattern PA9 extending in the-X direction.

The cathode of the diode 15 is connected from the wiring pattern PA9 to the positive-side input end of the inverter 16 mounted on the power module board 600 via the connection portion 28 and the connection portion 27.

The output terminal on the negative side of the single-phase full-wave rectifying circuit 8 is connected to the negative side of the switching element 14, is connected to the terminal TA7 of the junction board 400 via the connection portion 27 and the connection portion 28, and is connected to the negative side of the capacitor 10A mounted on the upper surface on the-X end side of the junction board 400 via the wiring pattern PA10 extending in the-X direction.

Further, from the wiring pattern PA10, the output terminal on the negative side of the single-phase full-wave rectifier circuit 8 is connected to the input terminal on the negative side of the inverter 16 mounted on the power module board 600 via the connection portion 28 and the connection portion 27.

The output end of the inverter 16 is connected to the power transmission coil 21 of the transformer 17 connected to the driver board 500 via the connection portion 27.

The power receiving coil 22 of the transformer 17 is connected to an input terminal of the secondary side rectifier circuit 18 mounted on the power module board 600 via a connection portion 27.

The output terminal (positive electrode) of the secondary-side rectifier circuit 18 is connected to the terminal TA10 of the junction board 400 via the connection portion 27 and the connection portion 28, and is connected to the positive electrode side of the capacitor 19 mounted on the DC filter substrate 200 and the input terminal of the DC filter circuit 5 via the wiring pattern PA11 and the connection portion 29 (the through hole HA5, the metal stud 32, and the through hole HA 7).

Similarly, the output terminal (negative electrode) of the secondary-side rectifier circuit 18 is connected to the terminal TA11 of the junction board 400 via the connection portion 27 and the connection portion 28, and is connected to the negative electrode side of the capacitor 19 mounted on the DC filter substrate 200 and the input terminal of the DC filter circuit 5 via the wiring pattern PA12 and the connection portion 29 (the through hole HA6, the metal stud 32, and the through hole HA 8). As described above, the output terminal of the DC filter circuit 5 is located on the-Y end side of the DC filter substrate 200 and connected to the battery 3.

As described above, the AC filter substrate 100 and the DC filter substrate 200 are electrically connected to the bonding substrate 400, the bonding substrate 400 is electrically connected to the driver substrate 500, and the driver substrate 500 is electrically connected to the power module substrate 600 along the Z axis. Then, electric power flows along the XY plane are formed in the respective substrates.

Therefore, the miniaturization can be achieved as compared with the case where the substrates are connected to each other with a wire harness. In addition, since the position of the wiring can be fixed, variation in EMC (electromagnetic compatibility) can be reduced.

(method of manufacturing Power supply device)

An example of a method for manufacturing the power supply device 1 will be described with reference to fig. 13. For example, after mounting electrical components on each of the AC filter substrate 100, the DC filter substrate 200, the control substrate 300, the bonding substrate 400, the driver substrate 500, and the power module substrate 600, the substrates are connected to each other to manufacture the power supply device 1.

As for the AC filter substrate 100, in step S11, the AC filter substrate 100 and each electrical component to be mounted on the AC filter substrate 100 are prepared.

In the next step S12, these electric components are mounted on the AC filter substrate 100. Specifically, the leads of the respective electrical components are inserted and soldered so as to penetrate through the corresponding through holes of the AC filter substrate 100 from the upper surface to the lower surface.

Similarly, in step S21, the DC filter substrate 200 and the electric components to be mounted on the DC filter substrate 200 are prepared for the DC filter substrate 200.

In the next step S22, these electric components are mounted on the DC filter substrate 200. Specifically, the leads of the electrical components are inserted and soldered so as to penetrate through the corresponding through holes of the DC filter substrate 200 from the upper surface to the lower surface.

In step S31, the control board 300 and the electric components such as a microcomputer and an integrated circuit to be mounted on the control board 300 are prepared as the control board 300.

In the next step S32, these electric components are mounted on the control board 300. Specifically, the leads of the respective electric components are inserted and soldered so as to penetrate through the corresponding through holes of the control board 300 from the lower surface to the upper surface.

The AC filter substrate 100, the DC filter substrate 200, and the control substrate 300 on which the electric components are mounted are preliminarily assembled in step S101 to form an upper substrate preliminary assembly 1000. Specifically, the AC filter substrate 100 and the DC filter substrate 200 are arranged with a gap therebetween on the upper side of the control substrate 300, and are fixed by screws or the like.

In step S41, the bonding substrate 400 and the capacitors, coils, and terminals TA1 to TA11, TB1 to TB11, and TC1 to TC11 to be mounted on the bonding substrate 400 are prepared.

In the next step S42, the capacitors and the coils are mounted on the bonding substrate 400. Specifically, the lead of each capacitor is inserted so as to penetrate through the corresponding through hole of the bonding substrate 400 from the upper surface to the lower surface. The lead of each coil is inserted so as to penetrate through the corresponding through hole of the bonding substrate 400 from the lower surface to the upper surface. Subsequently, each capacitor and each coil are soldered to the bonding substrate 400 by a dip-soldering (dip-soldering) method.

In step S43, terminals TA1 to TA11, TB1 to TB11, and TC1 to TC11 are fixed to bonding substrate 400, respectively. As described above, the leg portions of the terminals are press-fitted or fitted into the corresponding through holes of the bonding substrate 400, whereby the terminals are fixed to the bonding substrate 400.

In step S102, the bonded substrate 400 is fixed to the upper substrate preparation assembly 1000, and the upper substrate assembly 1100 is obtained. Specifically, the bonding substrate 400 and the AC filter substrate 100 and the DC filter substrate 200 in the upper substrate preliminary assembly 1000 are fixed to each other by using the metal studs 32 and the screws 33.

On the other hand, in step S51, the driver substrate 500 and the terminals TD1 to TD11, TE1 to TE11, and TF1 to TF11 are prepared.

In the next step S52, the terminals TD1 to TD11, TE1 to TE11, and TF1 to TF11 are fixed to the driver board 500, respectively. As described above, the legs of the terminals are press-fitted or fitted into the corresponding through holes of the driver board 500, whereby the terminals are fixed to the driver board 500.

In addition, regarding the power module board 600, in step S61, the power module board 600, a plurality of power semiconductors to be mounted on the power module board 600, and a plurality of pin terminals 31 are prepared.

In the next step S62, the power semiconductors and the pin terminals are mounted on the power module board 600. Specifically, each power semiconductor and each lead terminal are disposed on the upper surface of the power module board 600, and are soldered by a dip soldering method. Each power semiconductor is formed as a chip component, and can be soldered to the power module board 600 in a large area.

In step S103, the driver board 500 and the power module board 600 on which the electric components are mounted are preliminarily assembled into the lower board assembly 1200. Specifically, each pin terminal mounted on the upper surface of the power module substrate 600 is press-fitted or fitted into a corresponding through hole of the driver substrate 500, thereby fixing the driver substrate 500 and the power module substrate 600.

In step S104, the upper substrate assembly 1100, which has been preliminarily assembled in step S102, is coupled to the lower substrate assembly 1200, which has been preliminarily assembled in step S103, to form the substrate assembly 1300.

Specifically, the upper board assembly 1100 and the lower board assembly 1200 are fixed by press-fitting or fitting the tip end portions of the terminals TD1 to TD11, TE1 to TE11, and TF1 to TF11, which protrude upward from the driver board 500 in the lower board assembly 1200, into the openings of the terminals TA1 to TA11, TB1 to TB11, and TC1 to TC11, which protrude downward from the bonding board 400 in the upper board assembly 1100.

In step S105 following step S104, the substrate assembly 1300 is disposed in the housing 24. Specifically, the substrate assembly 1300 is placed on the bottom wall portion 25 of the case 24 so that the lower surface of the power module substrate 600 contacts the bottom wall portion 25, and the substrate assembly 1300 is fixed to the case 24 using screws or the like.

According to the present manufacturing method, the substrate assembly 1300 is configured by connecting the substrates with each other in a state where the electric components are mounted on the substrates, and the substrate assembly 1300 is disposed in the case 24. Therefore, the number of manufacturing steps can be reduced as compared with mounting the electric component to the substrate after disposing the substrate in the case. In particular, since the dip soldering method can be used when mounting the electric component on the substrate, the number of manufacturing steps can be significantly reduced.

(modification example)

In the configuration of the power supply apparatus 1 of the present embodiment, as shown in fig. 3, the case 24 is formed of a side surface portion and a bottom surface portion 25, and has a box-like shape with an open upper surface, and the water jacket 26 through which cooling water flows is formed in the bottom surface portion 25 of the case 24, but as shown in fig. 14, the water jacket 26 may be disposed so as to be adjacent to a plurality of surfaces. In this case, the power module board 600 may be disposed on the side surface portion. With such a configuration, the heat-generating electric components mounted on the power module board 600 can be efficiently cooled by the cooling water flowing through the water jacket 26. Although not shown, the same effect can be obtained by disposing the power module board 600 separately on the bottom surface portion 25 and the side surface portion.

As described above, the switching power supply device of the present embodiment is a switching power supply device having a plurality of power supply circuits connected to a multiphase power supply, and includes: a first substrate on which an electric component constituting a filter circuit that prevents intrusion of noise from the power supply is mounted, an output end of the filter circuit being provided on one end side in a first direction of the first substrate; a second substrate that is placed on a bottom wall portion of a case that houses the switching power supply device, and on which a power semiconductor that constitutes a circuit provided in a subsequent stage of the filter circuit is mounted, an input terminal of the circuit provided in the subsequent stage of the filter circuit being provided on one end side of the second substrate in a second direction that intersects the first direction; and a third substrate disposed between the first substrate and the second substrate, and having a wiring pattern formed thereon to electrically connect the output terminal and the input terminal.

Therefore, the heat generating electric component can be cooled efficiently while being miniaturized in response to the multi-phase alternating current.

The disclosures of the description, drawings and abstract contained in japanese patent application laid-open application No. 2017-251243, 12, 27, 2017 are incorporated in their entirety into this application.

Industrial applicability

According to the substrate structure of the present invention, it is possible to efficiently cool heat-generating electric components while achieving miniaturization in response to multi-phase alternating current, and it is suitable for use in a vehicle.

Description of the reference numerals

1 switching power supply device (Power supply device)

2 external power supply

3 Battery

4A, 4B, 4C power supply circuit

5 DC Filter Circuit (DC Filter Circuit)

6 control circuit

7. 7A, 7B, 7C AC filter circuit (AC filter circuit)

8 single-phase full-wave rectification circuit

9 power factor improving circuit

10. 10A, 10B, 10C capacitor

11 DC/DC converter (DC/DC converter)

12 diode

13. 13A1, 13A2, 13B1, 13B2, 13C1, 13C2 coil

14 switching element

15 diode

16 inverter

17 Transformer

18 secondary side rectifying circuit

19 capacitor

20 switching element

21 power transmission coil

22 power receiving coil

23 diode

24 casing

25 bottom surface part

26 water jacket

27 connecting part

28 connecting part

29 connecting part

30 connector

31 pin terminal

32 metal stud

32a internal thread part

33 screw

33a external thread part

34 foot part

35 opening part

36 feet

37 front end portion

38 electric component

39 output terminal

40 electric component

100 AC filter substrate (AC filter substrate)

200 DC filter substrate (DC filter substrate)

300 control substrate

400 bonding substrate

500 driver substrate

600 power module substrate

1000 upside substrate preparation assembly

1100 upper substrate assembly

1200 lower substrate assembly

1300 substrate assembly

HA1, HA2, HA3, HA4, HA5, HA6, HA7 and HA8 through holes

HB1, HB2, HB3, HB4, HB5, HB6, HB7 and HB8 through holes

HC1, HC2, HC3, HC4, HC5, HC6, HC7 and HC8 through holes

PA1, PA2, PA3, PA4, PA5, PA6, PA7, PA8, PA9, PA10, PA11, PA12, PA13 wiring pattern

PB1, PB2, PB3, PB4, PB5, PB6, PB7, PB8, PB9, PB10, PB11, PB12, PB13 wiring patterns

PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, PC10, PC11, PC12, PC13 wiring patterns

TA1, TA2, TA3, TA4, TA5, TA6, TA7, TA8, TA9, TA10 and TA11 terminals

TB1, TB2, TB3, TB4, TB5, TB6, TB7, TB8, TB9, TB10 and TB11 terminals

TC1, TC2, TC3, TC4, TC5, TC6, TC7, TC8, TC9, TC10 and TC11 terminals

TD1, TD2, TD3, TD4, TD5, TD6, TD7, TD8, TD9, TD10 and TD11 terminals

TE1, TE2, TE3, TE4, TE5, TE6, TE7, TE8, TE9, TE10 and TE11 terminals

TF1, TF2, TF3, TF4, TF5, TF6, TF7, TF8, TF9, TF10, TF11 terminals