Signal transmission circuit and electronic equipment

文档序号:138682 发布日期:2021-10-22 浏览:34次 中文

阅读说明:本技术 信号传输电路与电子设备 (Signal transmission circuit and electronic equipment ) 是由 罗勇进 于 2021-07-16 设计创作,主要内容包括:本发明提供了一种信号传输电路与电子设备,包括N路信号传输路径;所述信号传输路径包括两个信号传输端,以及连接于所述两个信号传输端之间的路径开关;所述信号传输电路还包括:升压控制模块与第一反馈模块;所述第一反馈模块用于:向所述升压控制模块反馈待叠加电压,所述待叠加电压匹配于所述M个信号传输端的电压中最高的电压;所述升压控制模块用于:对所述输入电压进行升压,并通过所述升压控制模块的第三端输出目标信号,以在所述输入电压为高电平时,利用所述目标信号驱动所述路径开关进入第一状态,其中,所述目标信号的电压适配于所述输入电压的升压后电压与所述待叠加电压之和,所述第一状态为导通状态或关断状态。(The invention provides a signal transmission circuit and electronic equipment, comprising N signal transmission paths; the signal transmission path comprises two signal transmission ends and a path switch connected between the two signal transmission ends; the signal transmission circuit further includes: the boost control module and the first feedback module; the first feedback module is to: feeding back a voltage to be superposed to the boost control module, wherein the voltage to be superposed is matched with the highest voltage in the voltages of the M signal transmission ends; the boost control module is used for: and boosting the input voltage, and outputting a target signal through a third end of the boosting control module, so that when the input voltage is at a high level, the target signal is used for driving the path switch to enter a first state, wherein the voltage of the target signal is adapted to the sum of the boosted voltage of the input voltage and the voltage to be superposed, and the first state is a conducting state or a switching-off state.)

1. A signal transmission circuit includes N signal transmission paths; the signal transmission path comprises two signal transmission ends and a path switch connected between the two signal transmission ends; wherein N is more than or equal to 1;

characterized in that the signal transmission circuit further comprises: the boost control module and the first feedback module;

the first end of the boost control module is connected with an input voltage, the second end of the boost control module is connected with the first feedback module, and the third end of the boost control module is also directly or connected to the control end of the path switch; the first feedback module is connected with M signal transmission ends, wherein M is less than or equal to 2N;

the first feedback module is to: feeding back a voltage to be superposed to the boost control module, wherein the voltage to be superposed is adapted to the highest voltage in the voltages of the M signal transmission ends;

the boost control module is used for: and boosting the input voltage, and outputting a target signal through a third end of the boosting control module, so that when the input voltage is at a high level, the target signal is used for driving the path switch to enter a first state, wherein the voltage of the target signal is matched with the sum of the boosted voltage of the input voltage and the voltage to be superposed, and the first state is a conducting state or a switching-off state.

2. The signal transmission circuit according to claim 1, wherein the highest voltage is higher than the voltage to be superimposed, and a difference between the highest voltage and the voltage to be superimposed is a fixed value.

3. The signal transmission circuit of claim 2, wherein the first feedback module comprises M diodes, a feedback capacitor;

the positive electrode of each diode is connected with a corresponding signal transmission end, the negative electrodes of the M diodes are connected with the first end of the feedback capacitor after being shorted together, the first end of the feedback capacitor is connected with the second end of the boost control module, and the second end of the feedback capacitor is grounded.

4. The signal transmission circuit according to any one of claims 1 to 3, further comprising a driving module, the driving module including N first driving switches;

the first end of the first driving switch is connected with the third end of the boost control module, the second end of the first driving switch is connected with the path switch in the corresponding signal transmission path, and the first driving switches are kept conducted and are matched in current;

the control end of the path switch is connected with a path capacitor; when the first driving switch is conducted, the path capacitor can be charged by the current of the first driving switch.

5. The signal transmission circuit of claim 4, wherein the driving module further comprises a current source and a reference driving switch;

the first end of the reference driving switch is connected with the third end of the boost control module, the second end of the reference driving switch is grounded through the current source, the control end of the reference driving switch is connected with the control end of each first driving switch, and the current of each first driving switch is matched with the current of the reference driving switch.

6. The signal transmission circuit according to any one of claims 1 to 3, further comprising a driving module, wherein the driving module comprises N second driving switches;

the first end of the second driving switch is connected with the control end of the path switch in the corresponding signal transmission path, and the second end of the second driving switch is grounded;

the second driving switch is configured to be capable of being turned on when the input voltage is at a low level to drive the path switch in the corresponding one path of signal transmission path to enter a second state;

if the first state is an on state, the second state is an off state;

and if the first state is an off state, the second state is an on state.

7. The signal transmission circuit of claim 6, further comprising a pull-down control module;

the first end of the pull-down control module is connected to the input voltage, and the second end of the pull-down control module is connected to the control end of the second drive switch;

the pull-down control module is configured to:

and when the input voltage is at a low level, controlling the second driving switch to be conducted.

8. The signal transmission circuit of claim 7, wherein a third terminal of the pull-down control module is connected to a reference voltage; the reference voltage is adapted to the highest voltage, the reference voltage originating from the first feedback module or another second feedback module;

the pull-down control module is specifically configured to:

and when the reference voltage is in a specified working voltage range and the input voltage is at a low level, driving the second driving switch to be conducted.

9. The signal transmission circuit of claim 8, wherein the reference voltage is lower than the voltage to be superimposed and lower than the highest voltage.

10. An electronic device characterized by comprising the signal transmission circuit according to any one of claims 1 to 9.

Technical Field

The present invention relates to the field of signal transmission, and in particular, to a signal transmission circuit and an electronic device.

Background

In electronic equipment, signal transmission can be realized by using a signal transmission circuit, the signal transmission circuit comprises one or more signal transmission paths, and when the voltage amplitude of a signal transmitted on the signal transmission path is far greater than the voltage amplitude of a power supply of a circuit framework, the power supply voltage is often required to be boosted.

In the prior art, a charge pump with a voltage boosted by more than multiple times is usually used to generate a higher voltage, part of the schemes further need to utilize a resistor to step down the higher voltage, and then utilize a signal after voltage reduction to control a path switch in a signal transmission path to enter a state (for example, to control the conduction of the path switch), wherein the charge pump with the voltage boosted by more than multiple times (and devices such as resistors and the like matched with the charge pump) causes problems of circuit area increase, cost increase, power consumption increase and the like.

In addition, another control signal is needed to control the path switch to enter another state (e.g., control it to turn off). Furthermore, two control signals increase pins, which leads to problems of increased area and high cost.

Disclosure of Invention

The invention provides a signal transmission circuit and electronic equipment, which aim to solve the problems of large circuit area and high cost.

According to a first aspect of the present invention, there is provided a signal transmission circuit including N signal transmission paths; the signal transmission path comprises two signal transmission ends and a path switch connected between the two signal transmission ends; wherein N is more than or equal to 1;

the signal transmission circuit further includes: the boost control module and the first feedback module;

the first end of the boost control module is connected with an input voltage, the second end of the boost control module is connected with the first feedback module, and the third end of the boost control module is also directly or connected to the control end of the path switch; the first feedback module is connected with M signal transmission ends, wherein M is less than or equal to 2N;

the first feedback module is to: feeding back a voltage to be superposed to the boost control module, wherein the voltage to be superposed is adapted to the highest voltage in the voltages of the M signal transmission ends;

the boost control module is used for: and boosting the input voltage, and outputting a target signal through a third end of the boosting control module, so that when the input voltage is at a high level, the target signal is used for driving the path switch to enter a first state, the voltage of the target signal is matched with the sum of the boosted voltage of the input voltage and the voltage to be superposed, and the first state is a conducting state or a switching-off state.

Optionally, the highest voltage is higher than the voltage to be superimposed, and a difference between the highest voltage and the voltage to be superimposed is a fixed value.

Optionally, the first feedback module includes M diodes and a feedback capacitor;

the positive electrode of each diode is connected with a corresponding signal transmission end, the negative electrodes of the M diodes are connected with the first end of the feedback capacitor after being shorted together, the first end of the feedback capacitor is connected with the second end of the boost control module, and the second end of the feedback capacitor is grounded.

Optionally, the signal transmission circuit further includes a driving module, where the driving module includes N first driving switches;

the first end of the first driving switch is connected with the third end of the boost control module, the second end of the first driving switch is connected with the path switch in the corresponding signal transmission path, and the first driving switches are kept conducted and are matched in current;

the control end of the path switch is connected with a path capacitor; when the first driving switch is conducted, the path capacitor can be charged by the current of the first driving switch.

Optionally, the driving module further includes a current source and a reference driving switch;

the first end of the reference driving switch is connected with the third end of the boost control module, the second end of the reference driving switch is grounded through the current source, the control end of the reference driving switch is connected with the control end of each first driving switch, and the current of each first driving switch is matched with the current of the reference driving switch.

Optionally, the driving module includes N second driving switches;

the first end of the second driving switch is connected with the control end of the path switch in the corresponding signal transmission path, and the second end of the second driving switch is grounded;

the second driving switch is configured to be capable of being turned on when the input voltage is at a low level to drive the path switch in the corresponding one path of signal transmission path to enter a second state;

if the first state is an on state, the second state is an off state;

and if the first state is an off state, the second state is an on state.

Optionally, the signal transmission circuit further includes a pull-down control module;

the first end of the pull-down control module is connected to the input voltage, and the second end of the pull-down control module is connected to the control end of the second drive switch;

the pull-down control module is configured to:

and when the input voltage is at a low level, controlling the second driving switch to be conducted.

Optionally, a third terminal of the pull-down control module is connected to a reference voltage; the reference voltage is matched to the highest voltage, the reference voltage originating from the first feedback module or another second feedback module;

the pull-down control module is specifically configured to:

and when the reference voltage is in a specified working voltage range and the input voltage is at a low level, driving the second driving switch to be conducted.

Optionally, the reference voltage is lower than the voltage to be superimposed and lower than the highest voltage.

According to a second aspect of the present invention, there is provided an electronic device including the signal transmission circuit according to the first aspect and its alternatives.

In the signal transmission circuit and the electronic equipment provided by the invention, the voltage to be superposed is superposed on the boosted voltage of the input voltage by the boost control module, and the voltage to be superposed is matched with the highest voltage in the voltages of the signal transmission ends, so that the voltage output by the boost control module can accurately and fully meet the driving requirement of the path switch when the input voltage is at a high level (for example, the requirement of source-drain opening threshold voltage is met), and under the condition, the scheme that a charge pump with many times of boosting is used for boosting (further, the resistance is possibly used for reducing the voltage) is avoided, and the circuit area, the cost and the power consumption are effectively reduced.

In the alternative scheme of the invention, through the introduction of the second drive switch and the pull-down control module, the pull-down control module can control the pull-down of the second drive switch based on the input voltage, so that the effective control of the path switch when the input voltage is at a low level is realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a first schematic diagram illustrating a signal transmission circuit according to an embodiment of the present invention;

FIG. 2 is a second schematic diagram illustrating a signal transmission circuit according to an embodiment of the present invention;

FIG. 3 is a third schematic diagram of a signal transmission circuit according to an embodiment of the present invention;

FIG. 4 is a fourth schematic diagram of a signal transmission circuit according to an embodiment of the present invention;

FIG. 5 is a fifth schematic diagram illustrating a signal transmission circuit according to an embodiment of the present invention;

fig. 6 is a sixth schematic diagram of a signal transmission circuit according to an embodiment of the present invention.

Description of reference numerals:

1-a boost control module;

2-a first feedback module;

3-a signal transmission path;

4-a drive module;

41-a current source;

5-a pull-down control module;

6-a second feedback module;

q0-reference drive switch;

q1-first drive switch;

q2-second drive switch;

QA, QB-path switches;

cgs-path capacitance;

d1 — first capacitance;

d2 — second capacitance;

c0 — first feedback capacitance;

cx-second feedback capacitance;

rx-feedback resistance;

zx-zener diodes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "upper surface", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the description of the present invention, "a plurality" means a plurality, e.g., two, three, four, etc., unless specifically limited otherwise.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and the like are to be construed broadly, e.g., as meaning fixedly attached, detachably attached, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

Referring to fig. 1 to 6, an embodiment of the invention provides a signal transmission circuit, which includes N signal transmission paths 3, where N is greater than or equal to 1; namely: the number of the signal transmission paths 3 is at least one, and hereinafter, N may also be represented by N.

The signal transmission path comprises two signal transmission ends and a path switch connected between the two signal transmission ends; the two signal transmission terminals of each signal transmission path can be characterized as An a terminal and a B terminal, and further, when there are more signal transmission paths, the a1 terminal, the a2 terminal, the An terminal, the B1 terminal, the B2 terminal, and the Bn terminal can be used to characterize the signal transmission terminals; the number of path switches in a single signal transmission path may be one or more. When the number of the path switches in the signal transmission terminal may be two, the terminal a, the first terminal and the second terminal of the path switch QA, the first terminal and the second terminal of the path switch QB are sequentially connected to the terminal B.

In the illustrated example, the path switch may be an NMOS transistor, and further, when the control terminal inputs a high level, the path switch may be turned on, and when the control terminal inputs a low level, the path switch may be turned off, at this time, the drain of the path switch QA is connected to (or used as) the signal transmission terminal (i.e., terminal a), the drain of the path switch QB is connected to (or used as) the signal transmission terminal (i.e., terminal B), and the source of the path switch QA is connected to the source of the path switch QB. In other examples, the path switch may also be a PMOS transistor, a triode, any other transistor, or any other electronic device.

In addition, in the case of using an NMOS transistor as the path switch, as shown in fig. 6, the path switch may also be characterized as: NMOS _ A1, NMOS _ A2, NMOS _ An, NMOS _ B1, NMOS _ B2, and NMOS _ Bn.

In a further example, the control terminal of the path switch is connected to a path capacitor Cgs, further, one end of the path capacitor Cgs may be connected to the control terminal of the path switch, and the other end of the path capacitor Cgs may be connected between two path switches (i.e., the path switch QA and the path switch QB). When the gate-source voltage VGS of the NMOS transistor is greater than a certain voltage value, the drain-source electrode of the NMOS transistor is conducted, and the voltage value is the turn-on threshold voltage of the transistor, and further, the charged voltage of the path capacitor Cgs can reach or be higher than the turn-on threshold voltage.

In addition, in the case where the path switch in one signal transmission path includes the path switch QA and the path switch QB, the corresponding may have path capacitances Cgs _ a1, Cgs _ a2, Cgs _ A3 connected to the path switch QA, and path capacitances Cgs _ B1, Cgs _ B2, Cgs _ B3 connected to the path switch QB.

By way of further example, the signal transmission path 3 further includes a zener diode (e.g., zener diode Z1, zener diode Z2, zener diode Zn shown in fig. 6), the anode of the zener diode is connected between the path switch QA and the path switch QB (i.e., the source of the path switch using an NMOS transistor), and the cathode of the zener diode is connected to the control terminal of the path switch (i.e., the gate of the path switch using an NMOS transistor or a PMOS transistor).

The zener diode therein may have a reverse breakdown voltage: it is understood that a Zener diode (i.e., a Zener diode) maintains a substantially constant voltage across the diode after the reverse voltage has increased to a certain value.

The signal transmission path referred to above may, for example, include at least one of: the signal transmission path of the audio signal, the signal transmission path of the detection signal, and the signal transmission path of the application control signal may be any other signal transmission path.

When the boost control module in the embodiment of the present invention is not used, but a charge pump (charge pump) with multiple boosting is used, the charge pump may boost the voltage of the supply voltage VCC (or VCC is output through an internal LDO, which is not described herein) to the output voltage of the charge pump module, where the output voltage is equal to the multiple supply voltage VCC (i.e., equal to k × VCC), where k is a multiple value taken according to a specific application. For example, in the audio signal switching application of some consumer electronics products, the supply voltage VCC may be 1.2V at the lowest, and a peak value of some audio signal may be as high as 16V, in order to let the 16V audio signal pass through the signal transmission path (in fig. 6, it may be understood that k is a fixed value, and in view of that the audio signal may vary between 0-16V when the signal amplitude is small, k may need to be more than 15 when k is a fixed value in order to let the 16V audio signal pass through the signal transmission path (in the example of fig. 6, it may be understood that a1 end is connected to a B1 end, a2 end is connected to a B2 end, and An end is connected to a Bn end), so that when the signal amplitude is small, the resistance between the charge pump and the path switch has a large voltage drop, which results in power loss.

Therefore, when the boost control module of the embodiment of the invention is not adopted, the charge pump is firstly utilized to realize multiple times of boost, then the resistor is utilized to carry out voltage reduction, and finally the voltage is output to the path switch.

In an embodiment of the present invention, the signal transmission circuit further includes: the boost control module 1 and the first feedback module 2.

A first end of the boost control module 1 is connected to an input voltage, which can be regarded as a supply voltage or an enable signal, and therefore the input voltage can be characterized as an input voltage VCCEN, a second end of the boost control module 1 is connected to the first feedback module 2, and a third end of the boost control module 1 is further connected to control ends of the path switches (e.g., a path switch QA and a path switch QB) directly or in a connected manner; the first feedback module 2 is connected with M signal transmission ends, wherein M is less than or equal to 2N; in the illustrated example, M is 2N, and in other examples, M may be less than 2N, for example: it is also possible to select only a part of the signalling terminals in the known manner which voltage(s) of the signalling terminals is/are higher and which voltage(s) is/are lower.

The first feedback module 2 is configured to: a voltage to be superimposed (which may be characterized as a voltage to be superimposed V0 shown in fig. 6) adapted to the highest voltage Vmax among the voltages of the M signal transmission terminals is fed back to the boost control module 1. The adaptation can be understood as: when the highest voltage Vmax becomes a larger value, the voltage to be superimposed also becomes adaptive larger, and when the highest voltage Vmax becomes a smaller value, the voltage to be superimposed also becomes adaptive smaller, and the magnitudes of the changes are the same or proportional; when the highest voltage Vmax is not changed, the voltage to be superimposed may also be kept unchanged, and for example, the difference between the voltage to be superimposed V0 and the highest voltage Vmax may be within a certain range.

The boost control module 1 is configured to: and boosting the input voltage VCCEN to obtain a boosted voltage VC correspondingly, and outputting a target signal through a third end of the boost control module, so that when the input voltage VCCEN is at a high level, the target signal is used to drive the path switch to enter a first state, and the voltage VCP of the target signal is matched with the sum of the boosted voltage VC of the input voltage VCCEN and the voltage V0 to be superimposed.

In addition, in some embodiments, when the input voltage VCCEN is at a low level, the voltage of the target signal may not turn on the path switch, and further, it can be understood that: the target signal is used to directly or indirectly drive the path switch into a second state (e.g., an off state). It can be seen that, in some examples of the embodiments of the present invention, the pull-down control module may not be introduced.

The boost control module 1 may employ a charge pump to boost the input voltage VCCEN to the boosted voltage VC, and may superimpose the boosted voltage VC output after boosting with the voltage V0 to be superimposed by using a circuit, for example, the boosted voltage VC may be realized by connecting a capacitor of the output node of the charge pump (or other capacitors that may form the boosted voltage VC) and a first feedback capacitor in series, without excluding other schemes, and any scheme that may realize voltage superimposition may be used as an alternative scheme.

The first state is a conducting state or a switching-off state, wherein if the path switch adopts an NMOS tube, the first state directs the conducting state.

The input voltage VCCEN may be a voltage signal capable of forming a high level and a low level (which may be a ground level or a GND level).

It can be seen that, in the above scheme, the boost control module superimposes a to-be-superimposed voltage on the basis of the boosted voltage of the input voltage, and since the to-be-superimposed voltage is matched with the highest voltage in the voltages of the signal transmission ends, further, the voltage output by the boost control module can accurately and fully meet the driving requirement (for example, the requirement of source-drain opening threshold voltage) of the path switch when the input voltage is at a high level, under this condition, the scheme of boosting by using a charge pump with multiple boosting (further possibly using a resistor for voltage reduction) is avoided, and the circuit area, the cost and the power consumption are effectively reduced.

Specifically, compared with a scheme that voltage is boosted firstly and then reduced by using a resistor, the voltage boosting control module has the advantages that the voltage boosting multiple is small when the voltage is boosted, the voltage is reduced without using the resistor, and the power consumption, the circuit area and the cost can be effectively reduced.

In one embodiment, the highest voltage Vmax is higher than the voltage to be superimposed V0, and the difference between the highest voltage Vmax and the voltage to be superimposed V0 is a fixed value VF, that is: v0 is Vmax-VF. In addition, the voltage VCP of the target signal is equal to V0+ VC, and in other examples, the voltage VCP of the target signal may form a certain difference with (V0+ VC).

Further, the fixed value VF may be implemented based on a forward voltage drop of a diode, in which case the fixed value VF may be, for example, 0.7V, and in other examples, the fixed value VF may also be implemented based on other circuits (such as a combination of a current source and a resistor).

Referring to fig. 2, the first feedback module 2 includes M first diodes D1 and a first feedback capacitor C0.

The positive electrode of each first diode D1 is connected to a corresponding signal transmission terminal, the negative electrodes of the M first diodes are connected to the first terminal of the first feedback capacitor C0 after being shorted together, the first terminal of the first feedback capacitor C0 is connected to the second terminal of the boost control module 1, and the second terminal of the first feedback capacitor C0 is grounded.

The first diode D1 can also be understood as the diode D _ a1 connected to the terminal a1, the diode D _ a2 connected to the terminal a2, the diode D _ An connected to the terminal An, the diode D _ B1 connected to the terminal B1, the diode D _ B2 connected to the terminal B2, and the diode D _ Bn connected to the terminal Bn in the first feedback module 2 shown in fig. 6.

The first feedback capacitor C0 and each first diode may be directly connected to each other or indirectly connected to each other (for example, connected via a resistor or the like) between the first feedback capacitor C0 and ground.

In one embodiment, the signal transmission circuit further includes a driving module 4. The driving module 4 can drive the path switches (e.g., the path switch QA and the path switch QB) to be turned on and off.

Referring to fig. 3 and 4, the driving module 4 includes N first driving switches Q1.

The first driving switch Q1 may be a PMOS transistor, and further, in the example shown in fig. 6, the first driving switch may also be characterized as PMOS _1, PMOS _2, … …, PMOS _ n. A first end of the first driving switch Q1 is connected to the 1 st third end of the boost control module, and a second end of the first driving switch Q1 is connected to a path switch (for example, a pair of path switches QA and QB are connected to each other) in the corresponding one of the signal transmission paths 3. In other examples, the first driving switch does not exclude a transistor, an NMOS transistor, other transistors or other circuit devices.

Wherein, each first driving switch Q1 keeps conducting and the currents are matched; when the first driving switch is turned on, the path capacitor can be charged by the current (i.e. the matched current) of the first driving switch, and then the path switch can be turned on after charging. The matching may mean the same, may mean a certain fixed ratio, and may mean within a certain current interval.

Further, referring to fig. 3 and fig. 4, in order to match the currents of the first driving switches, the driving module 4 further includes a current source 41 and a reference driving switch Q0; the current source 41 therein may also be characterized as the current source I0 shown in fig. 6 (the current thereof may also be characterized as I0); the reference driving switch Q0 may be of the same type as the first driving switch Q1, and in the illustrated example, the reference driving switch Q0 and the first driving switch Q1 may both be PMOS transistors.

The first terminal of the reference driving switch Q0 is connected to the third terminal of the boost control module 1, the second terminal of the reference driving switch Q0 is grounded via the current source 41, the control terminal of the reference driving switch Q0 is connected to the control terminal (e.g., gate) of each first driving switch Q1, and the current of each first driving switch Q1 is matched to the current of the reference driving switch Q0.

In a further aspect, the reference drive switch Q0 forms a pair of current mirrors with each first drive switch Q1. Wherein the sizes of each of the first driving switch Q1 and the reference driving switch Q0 may be the same. Furthermore, the same current can be used to charge each path capacitor.

In other examples, the size of each switch may be different, so as to form different currents, for example, different signal transmission paths, and the path capacitance may be charged with different currents.

In one embodiment, in order to enable the path switch to enter the second state, referring to fig. 3 and 4, the driving module 4 further includes N second driving switches Q2; the second driving switch Q2 may be an NMOS transistor, which does not exclude the possibility of using a transistor, other transistor or other devices.

A first end of the second driving switch Q2 is connected to a control end of a path switch in a corresponding signal transmission path, that is, connected to a second end of the first driving switch Q1, and a second end of the second driving switch Q2 is grounded; further, other circuit devices (e.g., resistors) may be provided between the second driving switch and the path switch and between the second driving switch and the ground.

The second driving switch Q2 is configured to be turned on when the input voltage is at a low level, so as to drive the path switch in the corresponding one of the signal transmission paths to enter a second state; the path capacitance Cgs can be discharged when the second drive switch is turned on;

wherein:

if the first state is an on state, the second state is an off state;

and if the first state is an off state, the second state is an on state.

In a further scheme, the signal transmission circuit further comprises a pull-down control module 5;

a first end of the pull-down control module 5 is connected to the input voltage VCCEN, and a second end of the pull-down control module 5 is connected to a control end of the second driving switch Q2;

the pull-down control module 5 is configured to:

when the input voltage is at a low level, controlling the second driving switch Q2 to be conducted;

in addition, when the input voltage is at a high level, the second driving switch Q2 may also be controlled to be turned off.

In the above scheme, due to the introduction of the second driving switch and the pull-down control module, the pull-down control module can control the pull-down of the second driving switch based on the input voltage, so that the effective control of the path switch when the input voltage is at a low level is realized.

Further, the second driving switch Q2 may be an NMOS transistor;

in the example shown in fig. 6, the second driving transistor Q2 using an NMOS transistor can also be characterized as: NMOS _ X1, NMOS _ X2.. NMOS _ Xn;

the third end of the pull-down control module 5 is connected with a reference voltage Vz; the reference voltage Vz is adapted to the highest voltage Vmax. The adaptation can be understood as: when the highest voltage Vmax becomes a larger value, the reference voltage also becomes adaptive larger, and when the highest voltage Vmax becomes a smaller value, the reference voltage also becomes adaptive smaller, and the magnitude of the change is the same or proportional; when the maximum voltage Vmax is not changed, the reference voltage may also be kept unchanged, and for example, the difference between the reference voltage V0 and the maximum voltage Vmax may be within a certain range.

Referring to fig. 3, in some examples, the reference voltage Vz may be derived from the first feedback module 2, for example, the voltage Vx forming the reference voltage Vz may be formed by a circuit such as a resistor divider or an LDO circuit on the basis of the voltage V0 to be superimposed.

Referring to fig. 4, in another example, the reference voltage Vz may be derived from another second feedback module 6, and the circuit configuration of the second feedback module 6 may refer to the idea of the first feedback module 6, or may adopt a different idea.

The pull-down control module 5 is specifically configured to:

when the reference voltage Vz is in a specified working voltage range and the input voltage is at a low level, driving the second driving switch to be conducted;

in addition, when the reference voltage Vz is not in the designated operating voltage range or the input voltage is at a high level although in the designated operating voltage range, the second driving switch may be turned off. The specified operating voltage range may be, for example, a range higher than a lower limit of an operating voltage, and further, when the reference voltage Vz is not higher than the lower limit of the operating voltage, it may be understood as not being in the specified operating voltage range, and when the reference voltage Vz is higher than the lower limit of the operating voltage, it may be understood as being in the specified operating voltage range.

In other examples, the specified operating voltage range may be configured with an upper operating voltage limit.

In one example, the reference voltage Vz may be, for example, supplied to an enable terminal or a power supply terminal of the pull-down control module 5 (that is, the third terminal of the pull-down control module is the enable terminal or the power supply terminal), so long as the pull-down control module 5 can normally operate when it reaches a specified operating voltage range, and during normal operation, the second driving switch may be driven based on a level of the input voltage, for example, when the input voltage is a high level, the second driving switch is driven to be turned off, and when the input voltage is a low level, the second driving switch is driven to be turned on.

For example, when the pull-down control module 5 does not work normally, the output of the signal for turning off the second driving switch may be maintained, and correspondingly, the second driving switch may be configured to be controlled to turn off, and/or: remains off when the control terminal (e.g., gate) does not receive a signal.

For another example, when the pull-down control module 5 does not normally operate, if the input voltage VCCEN is at a low level, the voltage VCP of the target signal output by the boost control module may not be enough to turn on the path switch, and at this time, the state (and the control mode) of the second driving switch may not be limited to being turned off when the pull-down control module 5 does not normally operate.

In the example shown in fig. 5, the second feedback module 6 comprises M second diodes D2, a second feedback capacitance Cx.

The anode of each second diode D2 is connected to a corresponding signal transmission terminal, the cathodes of the M second diodes are shorted together and then connected to the first terminal of the second feedback capacitor Cx through the feedback resistor Rx, the first terminal of the second feedback capacitor Cx is connected to the third terminal of the pull-down control module 5, and the second terminal of the second feedback capacitor Cx is grounded.

The second diode D2 can also be understood as the diode D _ A1x connected to the terminal A1, the diode D _ A2x connected to the terminal A2, the diode D _ Anx connected to the terminal An, the diode D _ B1x connected to the terminal B1, the diode D _ B2x connected to the terminal B2, and the diode D _ Bnx connected to the terminal Bn in the second feedback module 6 shown in fig. 6.

The second feedback capacitance Cx may be directly connected to each of the second diodes or indirectly connected to ground (for example, may be connected via a resistor or the like).

In addition, the second feedback module may further include a zener diode Zx, an anode of the zener diode Zx is connected to the second end of the second feedback capacitor Cx, and a cathode of the zener diode Zx is connected to the first end of the second feedback capacitor Cx.

The operation of an exemplary embodiment of the present invention will be described with reference to the specific circuit of fig. 6:

the boost control module 1 may also adopt a charge pump, which may superimpose a boosted voltage VC of the input voltage VCCEN with a voltage V0 to be superimposed, so that a voltage VCP of a target signal at a third terminal of the boost control module 1 is V0+ VC;

assuming that the maximum of the signal voltages appearing at the terminals a1, B1, a2, B2,. An, and Bn is the highest voltage Vmax, then: the voltage V0 obtained by the maximum input voltage selection circuit (which may be understood as the first feedback module) of the combination of the diode D _ a1, the diode D _ B1, the diode D _ a2, the diode D _ B2, the diode D _ An, and the diode D _ Bn is obtained by subtracting the forward voltage drop (i.e., the fixed voltage VF, which may be 0.7V) of one diode from Vmax, then: v0 ═ Vmax-VF;

based on the circuit shown in fig. 6, when the input voltage VCCEN is set to a voltage value within a normal operating voltage range of the circuit, the circuit operates, and the signal transmission paths from the a1 terminal to the B1 terminal, from the a2 terminal to the B2 terminal, and from the.. An terminal to the Bn terminal are turned on, and when the input voltage VCCEN is at the GND level (i.e., the ground level and the low level), the signal transmission paths from the a1 terminal to the B1 terminal, from the a2 terminal to the B2 terminal, and from the.. An terminal to the Bn terminal are turned off.

It can be seen that the circuit replaces the VCC pin and the EN pin of the existing scheme with only one input pin (i.e., the pin connected to the input voltage VCCEN).

Wherein the driving of the path switches by the voltage VCP of the target signal may be implemented by a current mirror circuit composed of the current source I0 (i.e. the current source 41) and each of the first driving switches (i.e. the switches identified as PMOS _0 and PMOS _1, PMOS _2,. PMOS _ n), wherein the current mirror circuit generates currents I1, I2,. In to charge the gates of the back-to-back NMOS of each of the signal transmission paths from the a1 terminal to the B1 terminal, the a2 terminal to the B2 terminal, and the.. An terminal to the Bn terminal, respectively, i.e. to charge the corresponding respective path capacitors Cgs, when the gate-source voltage of the corresponding path switches (i.e. the path switches labeled as NMOS _ a1 and NMOS _ B1, NMOS _ a2 and NMOS _ B2,. NMOS _ An and NMOS _ Bn) exceeds the turn-on voltage, i.e. the gate-source voltage of the corresponding path switches from the a1 terminal to the B3 terminal, the a2 terminal, the corresponding NMOS _ An and NMOS _ Bn terminal is effectively turned on, the gate-source voltage of the corresponding path transmission path switches are limited by the zener diodes, furthermore, the gate-source voltage does not exceed the reverse breakdown voltage of the corresponding zener diode (such as zener diode Z1, zener diode Z2.. zener diode Zn) at the highest for protection.

Wherein the voltage Vx in the second feedback module 6, which can be generated in a similar way to the voltage V0 to be superimposed, is also equal to Vmax-VF, in the example of fig. 6, the voltage V0 and the voltage Vx to be superimposed are generated by two separate sets of diode combining circuits (the combination of diodes identified as D _ A1, D _ B1, D _ A2, D _ B2,. D _ An, D _ Bn and the combination of diodes identified as D _ A1x, D _ B1x, D _ A2x, D _ B2x,. D _ Anx, D _ Bnx), respectively, compared to a scheme where only one set of diode combining circuits is used to short the voltage V0 and the voltage Vx together to be superimposed, the arrangement shown in fig. 6 can ensure that the stability of the voltage V0 to be superimposed is not affected by the charging of the second feedback capacitor Cx or the breakdown of the zener diode Zx by the circuit consisting of the feedback resistor Rx, the zener diode Zx and the second feedback capacitor Cx after the pin of the voltage Vx.

The voltage Vx generates a reference voltage Vz through a circuit composed of a feedback resistor Rx, a zener diode Zx, and a second feedback capacitor Cx, where the reference voltage Vz and the input voltage VCCEN are both input to the pull-down control module 5, and when the reference voltage Vz can support the normal operation of the pull-down control module 5, if a pin connected to the input voltage VCCEN is connected to a logic zero level (i.e., the input voltage is zero level, and the zero level can also be understood as a ground level and a low level), the pull-down control module 5 outputs a logic high level signal (the voltage of which is VCCEN _ invaid), where VCCEN _ invaid is higher than a gate-source voltage of NMOS _ X1, NMOS _ X2, NMOS _ Xn.

Furthermore, with the circuit shown in fig. 6, if the input voltage VCCEN has 1.5V, the signal transmission path from the a1 end to the B1 end, from the a2 end to the B2 end, and from the a end to the Bn end can be basically turned on, and generally, considering the better performance of turning on the signal transmission path, the boosted voltage VC may be about 5V, even so, in many applications where the voltage amplitude of the signal to be passed far exceeds the input voltage VCCEN, the required boosted voltage VC can be achieved by only boosting the input voltage VCCEN or the voltage of the input voltage VCCEN output through the internal LDO by a small multiple (for example, 3 to 4 times), and then the voltage VCP of the appropriate target signal can be obtained. Further, the amplification factor of the boosted voltage VC with respect to the input voltage VCCEN may be, for example, less than 5 times (e.g., may be 3 to 4 times).

In addition, the reference voltage Vz, formed therein, may be such that: when the input voltage VCCEN is logic zero (i.e., a ground level or a low level), the pull-down control module 5 may further determine and output a logic high level to turn off the signal transmission path from the a1 end to the B1 end, from the a end 2 end to the B2 end, and from the a end to the Bn end. Of course, if the input voltage VCCEN is logic zero and the reference voltage Vz is too low to enable the pull-down control module 5 to operate normally, the voltage VCP of the target signal is not enough to turn on the signal transmission path from the a1 terminal to the B1 terminal, from the a2 terminal to the B2 terminal, and from the a terminal to the Bn terminal, which also ensures the turn-off of the signal transmission path.

The working principle is as follows:

1. the boost control module 1 superimposes a voltage boosted by a small multiple (i.e., the boosted voltage VC) on the input voltage VCCEN on the basis of the voltage V0 to be superimposed, so that VCP is V0+ VC, instead of directly boosting the input operating voltage VCC to a required voltage by many times.

2. In the above scheme, two groups of independent maximum input voltage selection circuits (i.e., the first feedback module and the second feedback module are used in combination) of diode combinations are added to respectively obtain the voltage V0 to be superimposed and the voltage Vx.

3. In the above scheme, a pull-down control module is added to determine whether the input voltage VCCEN is valid, and if the input voltage VCCEN is low (which can also be understood as a ground level), the signal transmission path can be turned off.

4. The scheme adds a current mirror circuit consisting of a current source I0 and PMOS tubes PMOS _0 and PMOS _1, PMOS _2 and p-channel metal oxide semiconductor transistor PMOS _ n to generate currents I1, I2 and p-channel In to charge the gates of back-to-back NMOSs of each signal path from the A1 end to the B1 end, the A2 end to the B2 end and the p-channel An end to the Bn end respectively, namely charge corresponding path capacitors Cgs so as to better control the conduction of the signal transmission path.

The embodiment of the invention also provides electronic equipment comprising the signal transmission circuit related to the alternative scheme.

In the description herein, reference to the terms "an implementation," "an embodiment," "a specific implementation," "an example" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

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