Hot melt adhesive film composition and method for manufacturing shoe sole
阅读说明:本技术 热熔胶膜组成物与鞋底的制作方法 (Hot melt adhesive film composition and method for manufacturing shoe sole ) 是由 陈志勇 黄晟维 吴孟衡 赖昭谕 舒俞宁 王振乾 于 2019-08-22 设计创作,主要内容包括:本发明有关于一种热熔胶膜组成物与鞋底的制作方法。此热熔胶膜组成物包含热熔胶材与电磁辐射吸收材。热熔胶材包含乙烯醋酸乙烯酯与热塑性材料。电磁辐射吸收材是均匀分布于热熔胶材中,且电磁辐射吸收材可吸收电磁辐射的能量,而产生热能,进而可提升热熔胶膜的温度与其粘结性质。故,此热熔胶膜可用以粘结鞋底的中底与大底。其次,此热熔胶膜是以可回收材料所制得,故此热熔胶膜是全可回收的。(The invention relates to a hot melt adhesive film composition and a method for manufacturing a sole. The hot melt adhesive composition comprises a hot melt adhesive material and an electromagnetic radiation absorbing material. The hot melt adhesive material comprises ethylene vinyl acetate and a thermoplastic material. The electromagnetic radiation absorbing material is uniformly distributed in the hot melt adhesive material, and the electromagnetic radiation absorbing material can absorb the energy of electromagnetic radiation to generate heat energy, so that the temperature and the bonding property of the hot melt adhesive film can be improved. Therefore, the hot melt adhesive film can be used for bonding the middle sole and the large sole of the sole. Secondly, the hot melt adhesive film is made of recyclable materials, so that the hot melt adhesive film is fully recyclable.)
1. A hot melt adhesive film composition, comprising:
a hot melt adhesive material, comprising: ethylene vinyl acetate; and a thermoplastic material comprising a first polyurethane material and/or a thermoplastic rubber; and
an electromagnetic radiation absorbing material uniformly dispersed in the hot melt adhesive material, wherein the electromagnetic radiation absorbing material comprises a microwave absorbing material and/or an infrared absorbing material.
2. The hot melt adhesive film composition as claimed in claim 1, wherein the first polyurethane material is a thermoplastic polyurethane.
3. The hot melt adhesive composition as claimed in claim 1, wherein the electromagnetic radiation absorber comprises a second polyurethane material.
4. The hot melt adhesive film composition as claimed in claim 3, wherein the second polyurethane material is the same as the first polyurethane material.
5. The hot melt adhesive film composition as claimed in claim 1, wherein the thermoplastic material comprises a rosin compound.
6. The hot melt adhesive film composition as claimed in claim 1, wherein the ethylene vinyl acetate is used in an amount of 60 to 100 parts by weight, the thermoplastic material is used in an amount of more than 0 to 40 parts by weight, and the electromagnetic radiation absorber is used in an amount of 0.5 to 40 parts by weight, based on 100 parts by weight of the hot melt adhesive material.
7. A method of making a shoe sole, the method comprising:
providing a middle sole and a big sole;
providing a hot melt adhesive film, wherein the hot melt adhesive film is formed by the hot melt adhesive film composition of any one of claims 1 to 6;
placing the hot melt adhesive film between the middle sole and the big sole to form a sole material; and
placing the sole material between a polypropylene upper plate and a polypropylene lower plate, and carrying out an adhesion process, wherein the adhesion process comprises applying electromagnetic radiation to the sole material to heat the hot melt adhesive film, and adhering the middle sole and the big sole by using the hot melt adhesive film to obtain the sole, wherein the polypropylene upper plate is arranged under a pressurizing piece of an adhering device, and the polypropylene lower plate is placed on a rotating disc of the adhering device.
8. The method of claim 7, wherein a thickness of the polypropylene upper plate is not less than a thickness of the polypropylene lower plate.
9. The method of claim 7, wherein the pressing member is spaced from the turntable by a distance of 4.5 cm to 7.5 cm.
10. The method of claim 7, further comprising, before the bonding step:
placing the sole material in a mold, wherein the mold is positioned between the polypropylene upper plate and the polypropylene lower plate.
11. The method of claim 7, wherein the sole material is placed at a center of the turntable or the sole material is placed at an eccentric position of the turntable.
12. The method of claim 11, wherein the polypropylene lower plate is placed at the center of the turntable or the polypropylene lower plate is placed at the eccentric position of the turntable.
13. The method of claim 7, wherein when a distance between the pressing member and the turntable is smaller than a height of the sole material and the hot melt adhesive film is heated, the bonding process further comprises:
applying a pressure to the sole material by using the polypropylene upper plate and the polypropylene lower plate.
Technical Field
The invention relates to a sole, in particular to a hot melt adhesive film of the sole and a manufacturing method of the sole.
Background
With the improvement of the properties of polymer materials and the improvement of mixing technology, the production of shoe soles and the materials thereof are also increasingly improved. The sole is generally composed of a midsole and an outsole. Since the outsole should contact the ground to provide friction force to allow the human body to move easily, the outsole should have excellent abrasion resistance. Moreover, the midsole is used as a support body of the shoe to absorb and buffer the reaction force during movement, thereby protecting the human body. Accordingly, the midsole and outsole have distinct properties and different functions.
Therefore, the midsole and the outsole cannot be integrally formed, and must be bonded by a paste. However, when too much paste is applied, the bonded soles tend to have adhesive residue, which can be aesthetically undesirable. When too little paste is applied, the adhesive property between the midsole and the outsole is too poor, which tends to cause separation of the two, thereby reducing the user's feeling. Furthermore, since the paste has adhesiveness, it is easily adhered to equipment or other materials, thereby reducing the convenience of handling.
In addition, due to the rising awareness of environmental protection, the recycling property of articles is also regarded as an important property. However, the conventional sole is not made of recyclable materials, so that the sole cannot be recycled and is difficult to be further processed by other processing methods. Therefore, the conventional shoe sole has no good reusability, and thus the burden on the environment is increased.
In view of the above, it is desirable to provide a hot melt adhesive composition and a method for manufacturing a shoe sole to improve the conventional method for manufacturing a shoe sole.
Disclosure of Invention
Therefore, an aspect of the present invention is to provide a hot melt adhesive composition, which has a specific composition, and can effectively bond the midsole and outsole of a shoe sole, and improve the convenience of manufacturing the shoe sole. Secondly, the hot melt adhesive film composition can be effectively heated by irradiating electromagnetic radiation, and has better adhesive property.
The present invention also provides a method for manufacturing a shoe sole, which uses the hot melt adhesive film made from the hot melt adhesive film composition irradiated by electromagnetic radiation to bond the middle sole and the big sole of the shoe sole.
According to one aspect of the present invention, a hot melt adhesive composition is provided. The hot melt adhesive composition comprises a hot melt adhesive material and an electromagnetic radiation absorbing material. The hot melt adhesive material comprises ethylene vinyl acetate and a thermoplastic material, and the thermoplastic material comprises a first polyurethane material and/or a thermoplastic rubber. The electromagnetic radiation absorbing material is uniformly dispersed in the hot melt adhesive material, wherein the electromagnetic radiation absorbing material comprises a microwave absorbing material and/or an infrared absorbing material. The electromagnetic radiation absorbing material can absorb the energy of the electromagnetic radiation to generate heat energy.
According to an embodiment of the invention, the first polyurethane material is thermoplastic polyurethane.
According to another embodiment of the present invention, the electromagnetic radiation absorbing material comprises a second polyurethane material.
According to another embodiment of the present invention, the second polyurethane material is the same as the first polyurethane material.
According to yet another embodiment of the present invention, the thermoplastic material comprises a rosin compound.
According to still another embodiment of the present invention, the amount of the ethylene vinyl acetate used is 60 to 100 parts by weight, the amount of the thermoplastic material used is greater than 0 part by weight and less than or equal to 40 parts by weight, and the amount of the electromagnetic radiation absorbing material used is 0.5 to 40 parts by weight, based on 100 parts by weight of the aforementioned hot melt adhesive material.
According to another aspect of the present invention, a method for manufacturing a shoe sole is provided. The manufacturing method comprises providing a middle sole, a big sole and a hot melt adhesive film. Wherein the hot melt adhesive film is formed by the hot melt adhesive film composition. Then, the hot melt adhesive film is placed between the middle sole and the big sole to form a sole material, the sole material is placed between the polypropylene upper plate and the polypropylene lower plate, and an adhesion process is carried out, wherein the adhesion process comprises applying electromagnetic radiation to the sole material to heat the hot melt adhesive film, and the middle sole and the big sole can be adhered by the hot melt adhesive film to form the sole. The polypropylene upper plate is arranged below a pressurizing piece of the laminating equipment, and the polypropylene lower plate is placed on a turntable of the laminating equipment. When electromagnetic radiation is applied, the electromagnetic radiation absorbing material in the hot melt adhesive film can absorb the energy of the electromagnetic radiation and generate heat energy so as to increase the temperature of the hot melt adhesive film, and then the hot melt adhesive film can be used for bonding the middle sole and the outsole to prepare the sole.
According to an embodiment of the present invention, the thickness of the polypropylene upper plate is not less than the thickness of the polypropylene lower plate.
According to another embodiment of the present invention, the distance between the pressing member and the turntable can be 4.5 cm to 7.5 cm.
According to another embodiment of the present invention, before the bonding process is performed, the method can place the sole material in a mold, wherein the mold is located between the polypropylene upper plate and the polypropylene lower plate.
According to another embodiment of the present invention, the sole material is placed at a central position of the turntable, or the sole material is placed at an eccentric position of the turntable.
According to still another embodiment of the present invention, the polypropylene lower plate is placed at a central position of the turntable, or the polypropylene lower plate is placed at an eccentric position of the turntable.
According to another embodiment of the present invention, when the distance between the pressing member and the turntable is smaller than the height of the sole material and the hot melt adhesive film is heated, the bonding process can apply pressure to the sole material by using the upper polypropylene plate and the lower polypropylene plate.
By applying the hot melt adhesive film composition and the manufacturing method of the sole, the hot melt adhesive film prepared by the hot melt adhesive film composition can effectively absorb electromagnetic radiation energy and convert the electromagnetic radiation energy into heat energy, and can be used for effectively bonding the middle sole and the large sole of the sole, so the manufacturing convenience of the sole can be improved. Secondly, the hot melt adhesive film of the invention is made of recyclable materials, so the prepared hot melt adhesive film is fully recyclable and has better resource utilization.
Drawings
For a more complete understanding of the embodiments of the present invention and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. It must be emphasized that the various features are not drawn to scale and are for illustrative purposes only. The content of the related figures is explained as follows:
FIG. 1 is a schematic cross-sectional view illustrating a sole according to an embodiment of the present invention;
FIG. 2 is a flow chart illustrating a method for manufacturing a sole according to an embodiment of the present invention;
FIG. 3A is a cross-sectional side view of a bonding apparatus according to some embodiments of the invention;
FIG. 3B is a cross-sectional side view of a bonding apparatus according to some embodiments of the invention;
FIGS. 4A-4G are top views of the sole material, the lower polypropylene plate and the turntable, respectively, as viewed from the lower surface of the upper polypropylene plate during a bonding process according to some embodiments of the present invention;
FIG. 5A is a line graph showing the temperature change of the sole material according to example 1 of the present invention, wherein the sole material is placed between the pressing members and the turntable at different intervals;
FIG. 5B is a line graph showing the temperature variation of the sole material according to
FIG. 5C is a line graph showing the temperature variation of the sole material according to
FIGS. 6(A) to 6(F) are photographs showing thermal images of the hot melt adhesive films produced when the sole material and the polypropylene lower plate according to example 6 of the present invention are placed at different positions;
FIGS. 7(A) to 7(E) are photographs showing thermal images of the hot melt adhesive films manufactured according to example 7 of the present invention, when the sole material and the polypropylene lower plate are at different positions and at different pitches;
fig. 8A and 8B are graphs showing the results of the tests of peel strength of the sole according to embodiment 8 of the present invention.
[ notation ] to show
100: sole of shoe
110: middle sole
120: outsole
130: hot melt adhesive film
200: method of producing a composite material
210/220/230/240/250: operation of
310: sole material
311: outsole
312: middle sole
313: hot melt adhesive film
321/323: board
331: pressure piece
333: rotary disc
333 a: center of circle
340: die set
341: lower die
343: upper die
811/812/813/814/821/822/823: thread
D: distance between each other
Detailed Description
The making and using of embodiments of the present invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative and do not limit the scope of the invention.
Fig. 1 is a schematic cross-sectional view illustrating a sole according to an embodiment of the invention. In the sole 100, the sole 100 includes a
Hot melt adhesive film composition
The hot melt adhesive molding composition may comprise a hot melt adhesive material and an electromagnetic radiation absorbing material. The hot melt adhesive material comprises ethylene vinyl acetate and a thermoplastic material. Wherein the ethylene vinyl acetate may have a vinyl acetate group content of 9% to 40%. When the vinyl acetate group content is within the above range, the ethylene vinyl acetate and the thermoplastic material may have better mixing uniformity and better compatibility with the midsole. The Thermoplastic material may include, but is not limited to, a first polyurethane material, Thermoplastic Rubber (TPR), other suitable Thermoplastic materials, or any mixture of the above. Wherein the first Polyurethane material is a Thermoplastic Polyurethane (TPU). In some embodiments, the thermoplastic rubber may be a copolymer of a styrenic elastomer (e.g., styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene/butadiene-styrene block copolymer (SEBS), styrene-isoprene block copolymer (SIS), or styrene-ethylene/propylene-styrene block copolymer (SEPS), etc.).
The ethylene vinyl acetate may be used in an amount of 60 parts by weight to 100 parts by weight, and the thermoplastic material may be used in an amount of more than 0 part by weight and less than or equal to 40 parts by weight, based on 100 parts by weight of the hot melt adhesive material. Preferably, the ethylene vinyl acetate may be used in an amount of 75 to 95 parts by weight and the thermoplastic material may be used in an amount of 0.5 to 25 parts by weight, based on 100 parts by weight of the hot melt adhesive material. When the amount of the ethylene vinyl acetate and the thermoplastic material is within the above range, the two materials can be uniformly mixed, thereby improving the adhesive property.
In some embodiments, the thermoplastic material may optionally comprise a rosin compound. For example, the rosin-based compound may comprise pentaerythritol ester of rosin, and the like. In some embodiments, the hot melt adhesive material may include a material of a midsole material composition of the midsole and a material of an outsole material composition to be bonded, so as to improve compatibility of the prepared hot melt adhesive film with the midsole and the outsole, and further improve the adhesive property of the hot melt adhesive film to the midsole and the outsole.
In some embodiments, the hot melt adhesive material may optionally include other additives (e.g., tackifiers, etc.). In some embodiments, the tackifier may include, but is not limited to, natural resinous compounds. The natural resin compound may be used in an amount of more than 0 part by weight and 40 parts by weight or less based on 100 parts by weight of the hot melt adhesive material. For example, the natural resinous compound may be a lacquer (lacquer) type compound, shellac (shellac) type compound, rosin polyol ester, maleic anhydride rosin ester, other suitable natural resins, or any mixture of the foregoing.
The electromagnetic radiation absorbing material is uniformly dispersed in the hot melt adhesive material, and the electromagnetic radiation absorbing material may include a microwave absorbing material, an infrared absorbing material, other suitable electromagnetic radiation absorbing materials, or any mixture thereof. The microwave absorbing material and the infrared absorbing material are not particularly limited, and only need to absorb the energy of electromagnetic radiation (i.e., microwave and/or infrared rays) and convert the energy into heat energy. In some embodiments, the electromagnetic radiation absorber can comprise a second polyurethane material. The second polyurethane material may be the same as or different from the first polyurethane material. In some embodiments, the second polyurethane material may be a thermoplastic material and/or a thermoset material. In some embodiments, the second polyurethane material is preferably a thermoplastic polyurethane, which may have better recyclability. In some embodiments, the microwave absorbing material may include, but is not limited to, carbon black, silicon carbide, metal oxides (e.g., iron oxide, manganese dioxide, etc.), carbon fibers, inorganic clays, nano-nickel materials, other suitable microwave absorbing materials, or any combination thereof. In some embodiments, the infrared absorbing material includes absorbing materials capable of absorbing infrared such as ultra short wave (NIR), short wave (short wave), fast medium wave (fast medium wave), carbon medium wave (CIR), standard medium wave (MIR), black iron pipe, and the like. For example, the infrared absorbing material may include, but is not limited to, carbon black, silicon carbide, metal oxides (e.g., iron oxide, manganese dioxide, etc.), carbon fibers, nano-nickel materials, other suitable infrared absorbing materials, or any combination thereof.
It can be understood that when the second polyurethane material is the same as the first polyurethane material, the thermoplastic material only contains the first polyurethane material, and the electromagnetic radiation absorbing material only contains the second polyurethane material, the hot melt adhesive film composition is composed of ethylene vinyl acetate and the polyurethane material. The polyurethane material can be used as a film body material of the hot melt adhesive film, and can also absorb the energy of irradiated electromagnetic radiation and convert the energy into heat energy so as to improve the temperature of the hot melt adhesive film and further improve the bonding property of the hot melt adhesive film. Furthermore, the polyurethane materials of the first polyurethane material and the second polyurethane material are thermoplastic polyurethane, and the thermoplastic polyurethane can be well mixed with ethylene vinyl acetate, so that the adhesive property of the hot melt adhesive film can be improved, and the recyclability is better.
The nano nickel material may comprise nano nickel wires, nano nickel spheres, other suitable nano nickel materials, or any mixture thereof. In some embodiments, the nano nickel material may be, for example, a nano nickel wire having a one-dimensional nanowire (nanowire) structure. In such embodiments, the specific surface area of the nano-nickel wire may be greater than or equal to 0.29m2(ii) in terms of/g. In some embodiments, the ratio of the nano-nickel wiresThe surface area may be 0.30m2/g、0.32m2G or 0.35m2/g。
The preparation method of the nano nickel material can firstly prepare the nickel ion aqueous solution, and then add the reducing agent into the nickel ion aqueous solution to form the reaction solution. The nickel ion aqueous solution can be prepared by dissolving nickel ion salts in deionized water. In some embodiments, the nickel ion salts may include, but are not limited to, nickel chloride, nickel nitrate, nickel hydroxide, other suitable nickel ion salts, or any mixture thereof. In some embodiments, the aqueous nickel ion solution may optionally include an adjuvant. In such embodiments, the adjuvants may include, but are not limited to, carboxymethylcellulose (CMC), sodium citrate, sodium hydroxide, or any mixture of the above. In some embodiments, the carboxymethyl cellulose is used in an amount of 4 to 6 parts by weight, based on 100 parts by weight of the aqueous nickel ion solution. For example, the carboxymethyl cellulose may be used in an amount of, for example, 4.5 parts by weight, 5 parts by weight, or 6 parts by weight, based on 100 parts by weight of the aqueous nickel ion solution. In some embodiments, the sodium citrate is used in an amount of 5 to 9 parts by weight based on 100 parts by weight of the aqueous nickel ion solution. In some embodiments, the sodium hydroxide is used in an amount of 0.5 to 2 parts by weight based on 100 parts by weight of the aqueous nickel ion solution. In other embodiments, the aforementioned adjuvant may be a solid. When the solid adjuvant is added to the nickel ion aqueous solution, the nickel ion aqueous solution may be heated and stirred so that the adjuvant is completely dissolved in the nickel ion aqueous solution.
The reducing agent may include, but is not limited to, hydrazine, hydrogen peroxide, other suitable reducing agents, or any mixture of the foregoing materials. In some embodiments, the reducing agent may be used in an amount of 3 to 9 parts by weight, based on 100 parts by weight of the aqueous nickel ion solution. For example, the reducing agent may be used in an amount of 3 parts by weight, 6 parts by weight, or 9 parts by weight, based on 100 parts by weight of the aqueous nickel ion solution.
And then, applying a magnetic field to the prepared reaction solution to react to prepare the nano nickel material. Wherein the applied magnetic field may be 500 gauss (G) to 5000 gauss, and the application time of the magnetic field may be 1 hour to 3 hours. For example, the magnetic field may be applied for 1 hour, 1.5 hours, 2 hours, or 2.5 hours.
The electromagnetic radiation absorbing material may be used in an amount of 0.5 to 40 parts by weight, preferably 0.5 to 30 parts by weight, and more preferably 0.5 to 20 parts by weight, based on 100 parts by weight of the hot melt adhesive material. When the amount of the electromagnetic radiation absorbing material is within the above range, the electromagnetic radiation absorbing material is not easily agglomerated and can be more uniformly dispersed in the hot melt adhesive material, so that the inside of the hot melt adhesive material can be uniformly heated when microwave energy is applied.
When the hot melt adhesive film of the invention is manufactured, the hot melt adhesive material and the electromagnetic radiation absorbing material can be uniformly mixed by a mixing extruder, and the hot melt adhesive film of the invention is manufactured after extrusion molding.
Accordingly, the hot melt adhesive film of the invention can absorb the applied electromagnetic radiation through the electromagnetic radiation absorbing material, and can effectively heat the hot melt adhesive film, so that the hot melt adhesive film has good bonding property. Secondly, because the hot melt adhesive film which is not irradiated with the electromagnetic radiation has no adhesive property, the hot melt adhesive film is not easy to stick on equipment or other materials when being laid or applied, and has good operation convenience.
Method for making shoe sole
Referring to fig. 2 and fig. 3A, fig. 2 is a schematic flow chart illustrating a method for manufacturing a sole according to an embodiment of the invention, and fig. 3A is a schematic side sectional view illustrating a bonding process performed by a bonding apparatus according to some embodiments of the invention. In the
After
Although the
It is understood that when the
Secondly, when the
In some embodiments, as shown in fig. 3B, before the
In some embodiments, the material of the
When the
Therefore, according to the method for manufacturing a shoe sole of the present invention, the hot melt
Fig. 4A to 4F are top views respectively illustrating relative positions of the
In fig. 4A and 4C, the
In fig. 4A, 4B, 4E and 4F, the
Next, as shown in fig. 4E and 4F, the
Since the typical shoe sole is rectangular with a length greater than a width, as shown in fig. 4G, the
As can be seen from the above description of fig. 4A to 4G, in the present method for manufacturing a sole, the relative positions of the sole material 310 (or the mold 340), the polypropylene
In some application examples, in the hot melt adhesive prepared from the hot melt adhesive film composition, the electromagnetic radiation absorbing material can absorb the energy of the electromagnetic radiation applied in the bonding process and convert the energy into heat energy, so that the hot melt adhesive film can be effectively heated and the middle sole and the big sole can be bonded. Furthermore, the hot melt adhesive film composition can also optionally comprise an electromagnetic radiation absorbing material, so that the absorption of electromagnetic radiation can be further improved, and the heating uniformity of the hot melt adhesive film can be further improved.
In other application examples, the manufacturing method of the sole can adjust the placement position of the sole material or the mold according to the design of the sole, so as to heat the hot melt adhesive film in the sole material more effectively and uniformly. Secondly, through adjusting the interval of the pressurization piece and the carousel of laminating equipment, the sole material also can effectively be heated. The peel strength of the sole prepared by the invention is preferably not less than 2 kg/cm.
The following examples are provided to illustrate the present invention, but not to limit the invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention.
Preparation of Hot melt adhesive film
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