阅读说明：本技术 用于保护印刷电路板中的电子元件的光导板 (Light guide plate for protecting electronic components in printed circuit board ) 是由 R·G·吉普森 B·维拉甘哈姆 于 2019-07-19 设计创作，主要内容包括：模制元件总成,包括具有第一面和相反朝向的第二面的印刷电路板。多个发光二极管安装在第一面的第一部分上。多个电子元件安装在所述第一面的第二部分上。半透光聚合材料的光导位于所述发光二极管和所述电子元件上。光导包括：接触面,除了在发光二极管的位置以外直接接触所述第一面的第一部分；腔,创建在所述接触面,当所述接触面直接接触所述第一面的第一部分时,电子元件位于所述腔内部；以及通孔,延伸通过所述光导主体并开设进腔中。(A molded component assembly includes a printed circuit board having a first side and an oppositely facing second side. A plurality of light emitting diodes are mounted on a first portion of the first face. A plurality of electronic components are mounted on the second portion of the first face. A light guide of a semi-light transmissive polymeric material is positioned over the light emitting diode and the electronic component. The light guide includes: a contact surface directly contacting a first portion of the first surface except at a location of the light emitting diode; a cavity created at the contact surface, an electronic component being located inside the cavity when the contact surface is in direct contact with the first portion of the first surface; and a through hole extending through the light guide body and opening into the cavity.)

1. A molded component assembly, comprising:

a printed circuit board having a first side and an oppositely facing second side;

a light emitting diode mounted on a first portion of the first face;

an electronic component mounted on a second portion of the first face;

a light guide of a semi-light-transmissive polymeric material adjacent to a light emitting diode, the light guide comprising:

a contact face directly contacting a first portion of the first face; and

a cavity created in the contact face, the cavity being located above the electronic component.

2. The molded element assembly of claim 1, wherein the light guide comprises a through hole extending through the light guide body and opening into the cavity.

3. The molding element assembly of claim 2, wherein the light guide further comprises:

a light outlet aligned to receive visible light emitted from the light emitting diode; and

an integrally formed light reflector adjacent the light outlet.

4. The molding element assembly of claim 3, wherein:

the printed circuit board includes a through hole extending from the first face to the second face, the light outlet being aligned with the through hole; and

a distal end of the light reflector defines a substantially planar surface having a geometry that substantially matches the geometry of the through-hole, the distal end being positioned substantially flush with the second side of the printed circuit board.

5. The molded element assembly of claim 3, further comprising a low pressure molded polymeric material injected through the through-hole, filling the cavity and the light outlet and encapsulating the electronic element.

6. The molding element assembly of claim 2, further comprising:

a layer of polymeric material over the light guide; and

an alignment hole extending completely through the layer, the alignment hole being aligned with the through hole.

7. The molding element assembly of claim 6, further comprising a patch of polymeric material covering the alignment hole, in turn covering the through hole.

8. The molding element assembly of claim 7, wherein the patch is an expanded polytetrafluoroethylene material that repels liquid water but allows moisture and air to pass through to allow air to enter and escape from the cavity, but prevents liquid water from entering the alignment and through holes.

9. The molding element assembly of claim 1, further comprising:

a through hole extending through the body of the light guide and opening into the cavity; and

a conformal fill layer of low temperature, low pressure molded polymeric material is formed by injecting the polymeric material through the through-holes into the partial cavities.

10. The molding element assembly of claim 9, wherein the conformal fill layer comprises an overmolded portion that is overmolded over and covers the electronic element and is in direct contact with the first face of the body.

11. The molding element assembly of claim 10, wherein the conformal fill layer comprises a fill member co-molded with the overmolded portion and identically connected thereto by a bridge member, the fill member back filling a cavity defining the light outlet.

12. The molding element assembly of claim 9, wherein the conformal fill layer is white to reflect visible light generated when the light emitting diode is energized, thereby preventing the visible light from escaping from the light guide.

13. The molded element assembly of claim 1, wherein said light guide comprises a light emitting diode receiving pocket recessed into said contact surface, said pocket having a shape corresponding to a shape of said light emitting diode and sized to receive said light emitting diode when said contact surface directly contacts a first portion of said first face.

14. The molding element assembly of claim 13, wherein the box comprises an entrance face comprising a texture that controls transmission of visible light emitted by the light emitting diode to a light guide.

15. A molded component assembly, comprising:

a printed circuit board having a first side and an oppositely facing second side;

a plurality of light emitting diodes mounted on a first portion of the first face;

a plurality of electronic components mounted on a second portion of the first face;

a light guide of a semi-light transmissive polymeric material over the light emitting diode and the electronic component, the light guide comprising:

a contact surface directly contacting a first portion of the first face except at the location of the light emitting diode;

a cavity created in the contact face, the electronic component being located inside the cavity when the contact face is in direct contact with the first portion of the first face; and

a through hole extending through the body of the light guide and opening into the cavity.

16. The molding element assembly of claim 15, wherein the light guide further comprises a plurality of light outlets, each of the light outlets aligned with one of the light emitting diodes to receive visible light emitted from the light emitting diode, each light outlet defining an aperture having a substantially U-shaped inner wall oriented substantially perpendicular to the light guide outer surface.

17. The molding element assembly of claim 16, wherein the light guide further comprises a plurality of integrally formed light reflectors, each adjacent one of the light outlets, each of the plurality of light reflectors being identically connected to the light guide and each including a neck portion extending the light reflector at least partially into one of a plurality of through holes created in the printed circuit board.

18. The molding element assembly of claim 15, further comprising:

a layer of polymeric material on the light guide;

an alignment hole extending completely through the layer, the alignment hole aligned with the through-hole; and

a patch of polymeric material covering the alignment holes, whereby the patch also covers the through holes, the patch being of expanded polytetrafluoroethylene material that repels liquid water but allows moisture and air to pass through to allow air to enter and escape from the cavity, but prevents liquid water from entering the alignment holes and through holes.

19. The molding element assembly of claim 15, further comprising:

a first polymeric material injected through the through-hole and overmolding a second portion of the first face to encapsulate the electronic component; and

a second polymeric material positioned over a second side of the printed circuit board, the second side having a translucent opening on each of the through-holes, the translucent openings defining a continuous number pair.

20. A molded component assembly, comprising:

a printed circuit board having a first side and an oppositely facing second side;

a plurality of light emitting diodes mounted on a first portion of the first face, each of the light emitting diodes defined as a side-emitting diode such that visible light emitted from the light emitting diode is directed substantially parallel to the first face;

a plurality of electronic components mounted on a second portion of the first face;

a light guide of a semi-transparent material on the light emitting diode and the electronic component, the light guide comprising:

a contact surface directly contacting a first portion of the first face except for the location of the light emitting diode.

A cavity created at the contact face, the electronic component being located inside the cavity when the contact face is in direct contact with the first portion of the first face;

a through hole extending through the body of the light guide and opening into the cavity;

a plurality of light outlets, each aligned with one of the light emitting diodes to receive visible light generated from the light emitting diode, each of the light outlets defining an aperture; and

a plurality of integrally formed light reflectors, each adjacent one of the light outlets, each of the light reflectors including a plurality of angled surfaces to reflect the visible light to the light outlet.

Technical Field

The present disclosure generally relates to a printed circuit board having at least one light generating element and a light guide.

Background

The statements in this section merely provide background information related to the present disclosure and may or may not constitute prior art.

Electronic components with backlit visual elements can be manufactured using several processes. Most commonly, plastic parts of polymeric material resins are molded into plastic parts that are partially transparent or translucent, wherein electronic components including one or more light sources are mechanically attached to the parts after molding so that light is visible through the transparent or translucent portions, thereby creating a backlighting effect. More recently, methods have been developed to embed one or more light sources in a molded plastic part. One such method is: the light source and associated electronics (collectively "package") are encapsulated in a transparent resin by low pressure molding, and then plastic is injection molded over or around the encapsulating package. Thus, the packaging enclosure is embedded in the plastic, and certain portions of the plastic are transparent or translucent, such that light from the packaging enclosure can be visible through the transparent or translucent plastic, thereby creating a backlighting effect.

Another such method is: the light source and associated electronics ("package") are mounted on a polymeric film, the film is formed into a desired shape, and the formed film is then inserted into an injection mold having substantially the same shape. Next, the plastic is injection molded onto the film such that the package is embedded between the film (the package is mounted on the film) and the plastic (the plastic has been molded onto the package), wherein a portion of the film and/or the plastic is transparent or translucent such that light from the light source is visible from outside the component, thereby creating a backlighting effect.

Electronic components may also be printed on the film. The film is then inserted into an injection mold; in an injection mould, plastic is moulded onto the film and the electronic components are embedded in the moulded plastic, so that when the plastic part is removed from the mould, the film is also peeled off the plastic part, leaving the electronic components embedded in or attached to the surface of the plastic part.

When injection of plastic resin is performed at high temperature and pressure for overmolding, air trapped within the cavity of the assembly can cause many failures in the system design. These faults can be electrical, mechanical and surface quality faults.

Thus, while current printed film assemblies achieve their intended purpose, there is a need for a new and improved system and manner for making light guides with film assemblies having light emitting diodes.

Disclosure of Invention

According to aspects, a molded component assembly includes a printed circuit board having a first face and an oppositely facing second face. A light emitting diode mounted on a first portion of the first face. An electronic component is mounted on the second portion of the first face. A light guide of a semi-transparent polymeric material is adjacent the light emitting diode. The light guide includes: a contact face directly contacting a first portion of the first face; a cavity created in the contact face and located above the electronic component.

In another aspect of the present disclosure, the light guide includes a through hole extending through the light guide body and opening into the cavity.

In another aspect of the present disclosure, the light guide further comprises: a light outlet aligned to receive visible light emitted from the light emitting diode; an integrally formed light reflector adjacent the light outlet.

In another aspect of the disclosure, the printed circuit board includes a through hole extending from the first face to the second face, the light outlet being aligned with the through hole. The distal end of the light reflector defines a substantially planar surface having a geometry that substantially matches the geometry of the respective through-hole, the distal end being positioned such that the second side of the printed circuit board is substantially flush.

In another aspect of the present disclosure, a low pressure molded polymeric material is injected through the through-hole, the fill cavity, and the light outlet and encapsulates the electronic component.

In another aspect of the present disclosure, a layer of polymeric material is positioned over the light guide. An alignment hole extends completely through the layer, aligned with the through hole.

In another aspect of the present disclosure, a patch of polymeric material covers the alignment hole, and the patch therefore also covers the through hole.

In another aspect of the present disclosure, the patch is an expanded polytetrafluoroethylene material that repels liquid water but allows water vapor and air to pass through to allow air to enter and escape from the cavity, but prevents liquid water from entering the alignment holes and through holes.

In another aspect of the disclosure, a through hole extends through the body of the light guide and opens into the cavity. A conformal fill layer of low temperature, low pressure molded polymeric material is formed by injecting the polymeric material through the through-holes into the partial cavities.

In another aspect of the disclosure, the conformal fill layer includes an overmold portion that overmold and overlies the electronic element and directly contacts the first face of the body.

In another aspect of the present disclosure, the conformal fill layer includes a fill member co-molded with the overmolded portion, the fill member likewise connected to the overmolded portion by a bridge member, and the fill member backfilling a cavity defining the light outlet.

In another aspect of the disclosure, the conformal fill layer is white to reflect visible light generated when the light emitting diode is energized, thereby preventing the visible light from escaping the light guide.

In another aspect of the disclosure, the light guide includes a light emitting diode receiving pocket recessed into the contact surface, the pocket having a shape corresponding to a shape of the light emitting diode and sized to receive the light emitting diode when the contact surface directly contacts the first portion of the first face.

In another aspect of the disclosure, the box includes an entrance face having a texture that transmits visible light control to the light guide.

According to aspects, a molded component assembly includes a printed circuit board having a first face and an oppositely facing second face. A plurality of light emitting diodes are mounted on a first portion of the first face. A plurality of electronic components are mounted on the second portion of the first face. A light guide of semi-transparent material is positioned over the light emitting diode and the electronic component. The light guide includes: a contact surface directly contacting a first portion of the first surface except for a position of the light emitting diode; a cavity created in the contact face, the electronic component being located inside the cavity when the contact face directly contacts the first portion of the first face. A through hole extending through the light guide body and opening into the cavity.

In another aspect of the present disclosure, the light guide further includes a plurality of light outlets each aligned with one of the light emitting diodes to receive visible light emitted from the light emitting diode, each light outlet defining an aperture, and each light outlet having a substantially U-shaped inner wall oriented substantially perpendicular to the outer surface of the light guide.

In another aspect of the disclosure, the light guide further includes a plurality of integrally formed light reflectors, each adjacent one of the light outlets, and each of the plurality of light reflectors is identically coupled to the light guide and each includes a neck portion that extends the light reflector at least partially into one of the plurality of through holes in the printed circuit board.

In another aspect of the present disclosure, a layer of polymeric material is positioned over the light guide. An alignment hole extends completely through the layer, aligned with the through hole. The patch of polymeric material covers the alignment holes and thus also the through holes. The patch is an expanded polytetrafluoroethylene material that repels liquid water but allows moisture and air to pass through to allow air to enter and escape from the cavity, but prevents liquid water from entering the alignment holes and through holes.

In another aspect of the present disclosure, a first polymeric material is injected through the through-hole and over a second portion of the first face to encapsulate the electronic component. The second polymeric material is positioned over a second side of the printed circuit board, the second side having a translucent opening over each of the through holes. The translucent openings define pairs of consecutive numbers.

According to aspects, a molded component assembly includes a printed circuit board having a first face and an oppositely facing second face. A plurality of light emitting diodes are mounted on a first portion of the first face. Each of the light emitting diodes is defined as a side emitting type diode such that visible light emitted from the light emitting diode is substantially parallel to the first face. A plurality of electronic components are mounted on the second portion of the first face. A light guide of a semi-light-transmissive polymeric material is positioned over the light emitting diode and the electronic component. The light guide includes: a contact surface directly contacting a first portion of the first surface except for the location of the light emitting diode; a cavity created in the contact face, the electronic component being located inside the cavity when the contact face directly contacts the first portion of the first face; a through hole extending through the light guide body and opening into the cavity; a plurality of light outlets, each aligned with one of the light emitting diodes to receive visible light emitted from the light emitting diode, each light outlet defining an aperture; a plurality of integrally formed light reflectors, each adjacent to one of the light outlets, each light reflector comprising a plurality of angled surfaces to reflect visible light to the light outlet.

Further areas of applicability will become apparent from the description provided herein. It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.

FIG. 1 is a front perspective assembly view of a molding element assembly according to an exemplary embodiment;

FIG. 2 is a top plan view of the molding element assembly of FIG. 1 assembled;

FIG. 3 is a bottom plan view of the molded component assembly of FIG. 1 after assembly;

FIG. 4 is a cross-sectional end sectional view taken at section 4 of FIG. 2;

FIG. 5 is a front perspective assembly view of a molding element assembly according to another exemplary embodiment;

FIG. 6 is a top plan view of the molding element assembly of FIG. 5;

FIG. 7 is a cross-sectional end sectional view taken at section 7 of FIG. 6; and

fig. 8 is a bottom plan view of the fig. 1 molded component after assembly.

Detailed Description

The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses.

Referring to fig. 1, a molded component assembly 10 defined by a laminated light guide and component carrier includes a molded polymeric material or metal body 12 (e.g., a printed circuit board on which a plurality of electronic components are mounted). According to several aspects, the body 12 defines a rectangle, however any desired geometry may be used. The body 12 includes a first side or face 14 and an oppositely facing second face 15. A plurality of electronic components 16 including capacitors are located on the first side 14 of the body 12, the plurality of electronic components being electrically connected to a plurality of first electrical traces 18, 19 (only partially shown for clarity) that are printed onto the first side 14 by, for example, a screen printing process.

A plurality of light emitting diodes 20, 20', 20 "', 20" ", respectively, are also mounted on the first portion 21 of the first face 14 and connected to the electrical traces 18, 19. An additional light emitting diode 22 can optionally be provided at one end of the first portion 21 of the first side 14 of the body 12 to provide a light indication that electrical power is available for the molding element assembly 10. According to several aspects, a plurality of electronic components 16 are disposed on the second portion 23 of the first side 14 of the body 12. According to several aspects, the light emitting diodes 20, 20', 20 "' 20" ", 22 are defined as side emitting diodes such that visible light from the light emitting diodes is directed substantially parallel to the first face 14.

A plurality of through holes 24, 24', 24 "', 24" ", formed in the body 12, are each adjacent each of the light emitting diodes 20, 20', 20"', 20 "", 22. According to aspects, the shape of each through-hole 24, 24', 24 "', 24" ", is square or rectangular, but any geometric shape may be chosen. A separate through hole 26 may also be provided adjacent to the light emitting diode 22, which is functionally similar to the through holes 24, 24', 24 "', 24" ", but which may have a smaller cross section. Also located on the first face 14 of the body 12 are connectors 28 that connect to the electrical traces 18, 19. A plurality of capacitive touch membrane contacts 30 are disposed in the space envelope adjacent the connector 28. A plurality of through holes 32 are provided through the body 12 that frictionally receive pins as will be discussed below.

The light guide 34 is injection molded in a single shot from an optically transparent polymeric material, such as transparent or translucent Polymethylmethacrylate (PMMA), to allow light to pass through the light guide 34. A plurality of substantially U-shaped cavities defining light outlets 36, 36', 36 "', 6" ", each of which is aligned with a respective one of the through holes 24, 24', 24"', 24 "", when a contact face 38 of the light guide 34 is placed in direct contact with the first face 14 of the body 12, is created by the light guide 34. A plurality of light lenses or light reflectors 40, 40', 40 "', 40" ", co-molded from PMMA material with the light guide 34, and likewise connected to the light guide 34, and each extending over or into one of the light outlets 36, 36', 36"', 36 "". Each of the light reflectors 40, 40', 40 "', 40" ", includes a planar reflective surface 42 oriented generally parallel to the contact surface 38. When the light guide 34 is positioned on the body 12, each of the light reflectors 40, 40', 40 "', 40" ", substantially overlaps one of the through holes 24, 24', 24"', 24 "", the male pin of the light guide 34 being press fit into the hole 32 extending through the first face 14 of the body 12 as described above. A portion of the light guide 34, a separate light reflector 46, is also co-molded with the light guide 34 from the PMMA material and is likewise connected to the light guide 34 and overlaps the through hole 26 when the light guide 34 is placed on the body 12.

According to several aspects, the light guide 34 covers a majority of the first face 14 of the body 12, and the shape of the light guide 34 is similar to the shape of the first face 14 to allow for large area coverage. The light guide 34 also includes an outer surface (not numbered) that is generally planar and aligned with the first face 14.

As shown in fig. 1, a plurality of male protrusions defining first pins 48, co-molded with the light guide 34 from a PMMA material and likewise connected to the light guide 34, extend upwardly away from an outer surface 50 of the light guide 34. A separate male protrusion may also be provided that defines a locating pin 52 that is longer than the first pin 48. In addition to the first pin 48 extending from the outer surface 50, a plurality of male protrusions (two of which are only partially visible in this view) defining second pins 54 extend downwardly away from the contact face 38. Each of the second pins 54 is frictionally received in one of the through holes 32 formed in the body 12 when the light guide 34 is press-fit on the first face 14 of the body 12.

The aperture defined by each light outlet 36, 36', 36 "', 36" "'has a substantially U-shaped inner wall 56, 56"' oriented generally perpendicular to the outer surface 50. Openings 58, 58', 58 "', 58" ", are formed in each of the interior walls 56, 56', 56", 56 "', 56" ", to provide clearance for a power source, such as electrical traces 19, to provide power to the light emitting diodes 20, 20', 20", 20 "', 20" ", when the contact surface 38 of the light guide 34 is press fit on the first face 14 of the body 12. As shown in fig. 1, a partial cavity 60 is also provided downwardly in the light guide 34, defining a recess shaped relative to the contact surface 38. According to aspects, after frictionally mounting the light guide 34 on the first face 14 of the body 12 with the second pin 54, a conformal fill layer 62 of low temperature, low pressure molded polymeric material is created by injecting the polymeric material through the through-holes 64 substantially filling the partial cavity 60, wherein the through-holes 64 extend through the light guide 34 into the partial cavity 60.

The conformal fill layer 62 is formed of a low temperature, low pressure molding polymeric material, such as a Low Pressure Molding (LPM) resin, an epoxy-based resin, or a conformal fill material, that backfills each of the light outlets 36, 36', 36 "', 36" ", when the low temperature, low pressure molding polymeric material is injected through the through-hole 64. The lower first surface 66 of the conformal fill layer 62 is in direct contact with the first side 14 of the body 12, while the relatively higher second surface 68 of the conformal fill layer 62 is in direct contact with the inner wall 70 of the light guide 34 in the partial cavity 60. An overmolded portion 72 of conformal fill layer 62 is overmolded over electronic component 16 and covers electronic component 16 and directly contacts portion 23 of the first side of body 12. According to aspects, the conformal fill layer 62 is white for reflecting visible light (that otherwise escapes through the light guide 34) generated upon energization of the light emitting diodes 20, 20', 20 "', 20" ", 22 back to the light guide 34.

Conformal fill layer 62 also includes a plurality of fill members 74, 74', 74 "', 74" ", which are co-molded with overmolded portion 72 and identically connected to overmolded portion 72 by respective bridge members 76. To save weight and material costs and reduce light or heat transfer, the bridge member 76 has a width that is less than the width of any of the overmolded portions 72 or the filler members 74, 74', 74 "', 74" ", and a thickness that is less than the thickness of the filler members 74, 74', 74"', 74 "". Each filler member 74, 74', 74 "', 74" ", backfills one of the cavities defining the light outlets 36, 36', 36"', 36 "", extending through the light guide 34. Each of the filler members 74, 74', 74 "', 74" ", includes a U-shaped opening 78, the U-shaped opening 78 conforming to the geometry of the planar reflective surface 42 of each of the light reflectors 40, 40', 40"', 40 "", and to the bevel reflector surface shape described in detail below. The outward face 80 of each of the filler members 74, 74', 74 "', 74" ", may be coplanar with the outer surface 50 of the light guide 34. Plug 82 is formed when the polymeric material of conformal fill layer 62 solidifies in via 64. The outward face 84 of the plug 82 is also coplanar with the outer surface 50 of the light guide 34. Neck portions 86, 86', 86 "', 86" "" of light guide material likewise connect the light guide 34 to each of the light reflectors 40, 40', 40 "', 40" ".

With continued reference to fig. 1, light (e.g., visible light) emitted from the light emitting diodes 20, 20', 20 ", 20'" and 20 "", is reflected by the plurality of angled surfaces of each light reflector 40, including a first reflective surface 88, a second reflective surface 90, and a third reflective surface 92, oriented non-orthogonally to the contact surface 38, and directed out of the through-holes 24, 24', 24 ", 24'" and 24 "". Light emitted from the light emitting diode 22 is guided through the through hole 26. Light (e.g., visible light) passes through the graphics (shown and described with reference to fig. 8) created on the Acrylonitrile Butadiene Styrene (ABS) plastic decorative layer of the molded component assembly 10. The angle of each of the beveled surfaces 88, 90 and 92 is oriented at an angle of approximately 45 degrees relative to the contact surface 38, with the contact surface 38 oriented parallel to the outer surface 50 of the light guide 34. The beveled surfaces 88, 90, 92 reflect and direct light to enhance the light toward the center of each of the light reflectors 40. Visible light emanating from the light emitting diodes 20, 20', 20 "', 20" ", 22 is also reflected from each filler member 74, 74', 74"', 74 "", back to the light guide 34 and the body 12, and thus can be reflected by the plurality of beveled surfaces 88, 90 and 92 and out of the through holes 24, 24', 24 "', and 24" ".

Referring to fig. 2 and again to fig. 1, the complete assembly of the molded element assembly 10 provides for the light guide 34 to be frictionally coupled on the first face 14 of the body 12 using the second pin 54. The polymeric material is low pressure injection molded to form conformal fill layer 62, with fill members 74, 74', 74 "", surrounding each of the light reflectors 40, 40', 40 "', 40" ", except at neck portions 86, 86', 86', 86', 86" ', 86 "", which likewise connect light guide 34 to each of the light reflectors 40, 40', 40 "', 40" ". Each neck portion 86, 86', 86 "', 86" ", has a smaller width and/or smaller cross-sectional area than the body 94 of the light guide 34, and transmits visible light generated by the light emitting diodes 20, 20', 20"', 20 "", to one of the light reflectors 40, 40', 40 "', 40" ". In the assembled condition, the visible light generated by each light emitting diode 20, 20', 20 "', 20" ", is substantially directed into the light reflector 40, 40', 40"', 40 "".

Each light reflector 40 scatters light out via one of the through holes 24, 24', 24 "', 24" ". For example, light from the light emitting diode 20 is scattered out through the through hole 24 by the light reflector 40. The opening provided in the light guide 34, which is filled by the filling member 74 surrounding the light reflector 40, helps to limit light scattering through only one through hole via only one light reflector, e.g. through the through hole 24 via the light reflector 40.

Referring to fig. 3 and again to fig. 1-2, a portion of each of the light reflectors 40, 40', 40 "' and a portion of each of the filler members 74, 74', 74"', 74 "", which partially surround each of the light reflectors 40, 40', 40 "', are visible at each of the through holes 24, 24', 24"', 24 "", when viewed toward the second face 15 of the body 12. According to aspects, a portion of each of the light reflectors 40, 40', 40 "', 40" ", which extends into each of the through holes 24, 24', 24"', 24 "", is positioned substantially flush with the second face 15. According to other aspects, the portion of each light reflector 40, 40', 40 "', 40" ", which extends into each through hole 24, 24', 24" ", is located within the thickness of the body 12, and is therefore spaced from the second face 15.

Referring to fig. 4 and again to fig. 1-3, one example of a plurality of filler members 74 "and one example of a reflector 40'" are shown in an installed position. Thus, the following discussion of the filler member 74 "and the light reflector 40" applies equally to all filler members and light reflectors. The filling member 74 "substantially fills around the through hole 24 '", except for the position of the reflector 40' ". Light emitted by the light emitting diode 20 "'enters the light reflector 40"' in the direction of the viewer of fig. 4 and is thus parallel to each of the contact face 38 of the light guide 34 and the second face 15 of the body 12. The distal end 96 of the light reflector 44 "' defines a substantially plane surface having a geometry substantially matching the geometry of the through-hole 24" ' thereby covering the through-hole 24 "' to create a light outlet. According to several aspects, the distal end 96 is positioned flush with the second face 15 of the body 12. According to other aspects, the distal end 96 is positioned at least partially within the through-hole 24 "' spaced from the second face 15 of the body 12. Light generated from the light emitting diode 20' "enters the light reflector 44 '", is reflected by each of the angled surfaces 88 (not visible in this view), 90, 92, and is scattered out of a distal end 96 defining a light outlet in the through hole 24' "in the direction of arrow 98.

Referring generally to FIG. 5, and again to FIG. 1, in accordance with other aspects, the molding element assembly 100 is modified from the molding element assembly 10 to include similar components, such as the body 12 'and the light guide 34', indicated by prime notation. A layer 102 of polymeric material, such as Acrylonitrile Butadiene Styrene (ABS), is disposed over and in direct contact with the light guide 34'. The layer 102 is held in contact with the light guide 34 'using a friction fit of a plurality of pins 48', the pins 48 'being received by opposing holes 104 created in the layer 102, or the layer 102 may be overmolded onto the light guide 34'. According to aspects, the layer 102 is black, substantially opaque, and opaque. Part of cavity 60 of light guide 34 is replaced with cavity 106, cavity 106 being of similar size and not filled with conformal fill layer 62, thus leaving air behind. To keep air within the cavity 106 between the light guide 34 'and the body 12', a patch 108, discussed in detail in fig. 7, is placed over the through-hole 64 'and a similar hole (described with reference to fig. 7) created through the layer 102 and coaxially aligned with the through-hole 64'. According to aspects, the cavity 106 also includes the light emitting diodes 20, 20', 20 "', 20" ", 22, or the light emitting diodes 20, 20', 20"', 20 "", 22 may be located in separate cavities within the light guide 34.

Referring to fig. 6 and again to fig. 5, the assembled molded component assembly 100 with the patch 108 covering the holes allows air cavitation over the electronic component 16 'within the cavity 106 and prevents exposure of the electronic component 16' to the high temperature, high pressure resins typically used for component packaging. To reduce damage caused by thermal air expansion within cavity 106, through-holes 64 'act as vent holes, allowing the thermally expanded air to escape cavity 106 during molding, thereby protecting electronic component 16' during the molding process.

Referring to fig. 7 and again to fig. 5 and 6, during molding of the layer 102, hollow pins (not shown) used in molding are inserted into the through holes 64 'and withdrawn after injection molding or overmolding the layer 102, thereby forming aligned holes 110 through the layer 102 in coaxial alignment with the through holes 64'. To prevent water or moisture from flowing back into the cavity 106 via the alignment holes 110 and the through holes 64 'when the assembly 100 is subjected to external environmental conditions, a patch 108 is placed over the alignment holes 110, thereby covering the through holes 64' in turn. According to aspects, the patch 108 is an expanded polytetrafluoroethylene material that repels liquid water but allows the passage of water vapor and air to allow air to enter and escape the cavity 106, but prevents water or moisture from entering the alignment holes 110 or through holes 64', which can damage the electronic components 16' inside the cavity 106.

With continued reference to fig. 7, a film 112 of opaque or opaque material may be placed, for example, adhered by adhesive to a surface 114 of the printed circuit board or body 12'. The membrane 112 is provided with locations that are informative through the backlight when a respective one of the light emitting diodes is energized, as described in detail with reference to fig. 8. According to aspects, the opaque film 112 can be Acrylonitrile Butadiene Styrene (ABS) plastic. A coating 116 of a substantially transparent or translucent polymeric material, such as PMMA, is applied to the membrane 110 to provide a transparent protective coating on the face of the body 12'.

Referring to fig. 8 and again to fig. 1-7, except for the respective positions of the plurality of indicia 118, light generated by any of the light emitting diodes 20, 20', 20 "', 20" ", of the body 12' is blocked from passing through the opaque film 112, the indicia 118 defining a translucent opening that defines a continuous number pair that is also visible through the substantially transparent coating 116. Indicia 118 are light-transmissive portions on opaque film 112 that may represent successive pairs of numbers and are each aligned with one of through-holes 24, 24', 24 "', 24" ", wherein light enhancement is maximized by light reflectors 40, 40', 40"' and 40 "". A separate window area 120 through the opaque film 112 may be provided for light generated by the light emitting diodes 22.

The molding elements defining the molding element assembly 10 of the present disclosure provide several advantages. These advantages include a transparent polymeric material light guide covering a printed circuit board, where the light guide has cavities over a plurality of electronic components mounted on the printed circuit board. A through hole is created in the light guide leading to the cavity. The through-holes may be used to inject a polymeric material to fill the cavity, thereby encapsulating the electronic component. The through-hole may also serve as a vent for the cavity, leaving an air volume in the cavity after the light guide is installed. To prevent water from entering the cavity, patches of polymeric material are provided on the through-holes.

The description of the disclosure is merely exemplary in nature and variations that do not depart from the gist of the disclosure are intended to be within the scope of the disclosure. Such variations are not to be regarded as a departure from the spirit and scope of the disclosure.