阅读说明：本技术 具有散热功能的存储装置及硬盘 (Storage device with heat dissipation function and hard disk ) 是由 郭宗兴 潘仁杰 于 2018-08-31 设计创作，主要内容包括：本发明公开一种具有散热功能的存储装置及硬盘。具有散热功能的硬盘包括：一壳体、一存储模块以及一工作液体。壳体包括一容置空间。存储模块设置在壳体的容置空间中。工作液体设置在壳体的容置空间中。存储模块浸没在工作液体中,以使得存储模块所产生的热量可由工作液体传导至壳体。借此,本发明达到了提升存储装置或硬盘的散热效率的效果。(The invention discloses a storage device with a heat dissipation function and a hard disk. The hard disk with the heat dissipation function includes: the device comprises a shell, a storage module and working liquid. The shell comprises an accommodating space. The storage module is arranged in the accommodating space of the shell. The working liquid is arranged in the accommodating space of the shell. The storage module is immersed in the working liquid so that heat generated by the storage module can be conducted by the working liquid to the housing. Therefore, the invention achieves the effect of improving the heat dissipation efficiency of the storage device or the hard disk.)

1. The utility model provides a hard disk with heat dissipation function which characterized in that, hard disk with heat dissipation function includes:

the shell comprises an accommodating space;

the storage module is arranged in the accommodating space of the shell; and

the working liquid is arranged in the accommodating space of the shell, and the storage module is immersed in the working liquid, so that the heat generated by the storage module can be conducted to the shell by the working liquid.

2. The hard disk with heat dissipation function as claimed in claim 1, wherein the housing includes a body portion and a cover portion disposed on the body portion, and the receiving space is formed between the body portion and the cover portion.

3. The hard disk with the heat dissipation function as recited in claim 2, wherein the cover portion includes a slot, and a transmission port of the storage module is disposed in the slot.

4. The hard disk with the heat dissipation function as claimed in claim 3, wherein the cover further comprises a first cover plate and a second cover plate, the first cover plate comprises a slot, the second cover plate is disposed in the slot, and the second cover plate has the slot.

5. The hard disk with heat dissipation function of claim 3, wherein said hard disk with heat dissipation function further comprises: and a transmission end of the transmission line passes through the groove body and is connected to the storage module.

6. The hard disk with heat dissipation function of claim 5, wherein said hard disk with heat dissipation function further comprises: and the packaging body covers the transmission end of the transmission line and the groove body, so that the transmission line is arranged on the cover body part.

7. The hard disk with the heat dissipation function as recited in claim 1, wherein the storage module includes a transmission port, the housing includes a slot, and the transmission port of the storage module is exposed through the slot of the housing.

8. The hard disk with heat dissipation function of claim 7, wherein the transmission port is a connector conforming to SATA, mSATA, PCI-E, NVMe, M.2, M.3, ZIF, IDE, U.2, CF, CFast or type-C specification interface.

9. The hard disk with heat dissipation function of claim 8, wherein the memory module further comprises a circuit board coupled to the transmission port.

10. The hard disk with heat dissipation function of claim 1, wherein the hard disk with heat dissipation function is a 2.5-inch hard disk, a 3.5-inch hard disk, an internal hard disk or a portable external hard disk.

11. The hard disk with the heat dissipation function according to claim 1, wherein the storage module is a specification interface of a solid state disk or a specification interface of a hard disk drive.

12. The hard disk with a heat dissipation function according to claim 1, wherein the working liquid is an insulating liquid.

13. The hard disk with the heat dissipation function according to claim 1, wherein at least a portion of the memory module is disposed in the accommodating space of the housing.

14. A storage device having a heat dissipation function, characterized in that the storage device having a heat dissipation function comprises:

the shell comprises an accommodating space;

the storage module is arranged in the accommodating space of the shell; and

the working liquid is arranged in the accommodating space of the shell, and the storage module is immersed in the working liquid.

15. The storage device with heat dissipation function as claimed in claim 14, wherein the storage device with heat dissipation function is a 2.5 inch hard disk, a 3.5 inch hard disk, an internal hard disk or a portable external hard disk.

16. The storage device with a heat dissipation function as claimed in claim 14, wherein the operating liquid is an insulating liquid.

Technical Field

The present invention relates to a storage device and a hard disk, and more particularly, to a storage device and a hard disk having a heat dissipation function.

Background

The operation efficiency of the storage device is closely related to the working temperature, and when the storage device is used for a long time in a high-efficiency state, the temperature of the storage device is increased, and further, the transmission speed is reduced. Therefore, the memory device will not continue to operate fully in a high performance state.

In the prior art, the temperature of the storage device is mostly reduced by using a fan or arranging a heat dissipation fin. However, the cooling efficiency of the storage device is still limited by using a fan or providing heat dissipation fins for heat dissipation. Therefore, how to improve the heat dissipation efficiency of the memory device to overcome the above-mentioned drawbacks has become one of the important issues to be solved by the industry.

Disclosure of Invention

The present invention is directed to a storage device and a hard disk having a heat dissipation function, which overcome the disadvantages of the related art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a hard disk with a heat dissipation function, including: the device comprises a shell, a storage module and working liquid. The shell comprises an accommodating space. The storage module is disposed in the accommodating space of the housing. The working liquid is disposed in the accommodating space of the housing, and the storage module is immersed in the working liquid so that heat generated by the storage module can be conducted to the housing by the working liquid.

Furthermore, the housing includes a main body and a cover disposed on the main body, and the main body and the cover can form the accommodating space therebetween.

Furthermore, the cover body comprises a groove body, and a transmission port of the storage module is arranged in the groove body.

Furthermore, the cover body further comprises a first cover plate and a second cover plate, the first cover plate comprises a slot, the second cover plate is arranged in the slot, and the second cover plate is provided with the slot body.

Furthermore, the hard disk with heat dissipation function further includes: and a transmission end of the transmission line passes through the groove body and is connected to the storage module.

Furthermore, the hard disk with heat dissipation function further includes: and the packaging body covers the transmission end of the transmission line and the groove body, so that the transmission line is arranged on the cover body part.

Further, the storage module includes a transfer port, the housing includes a slot, and the transfer port of the storage module is exposed through the slot of the housing.

Further, the transmission port is a connector conforming to SATA, mSATA, PCI-E, NVMe, M.2, M.3, ZIF, IDE, U.2, CF, CFast or type-C specification interface.

Furthermore, the memory module further comprises a circuit board coupled to the transmission port.

Furthermore, the hard disk with the heat dissipation function is a 2.5-inch hard disk, a 3.5-inch hard disk, an internal connection type hard disk or a portable external connection type hard disk.

Furthermore, the storage module is a specification interface of a solid state disk or a specification interface of a hard disk drive.

Further, the working liquid is an insulating liquid.

Still further, at least a portion of the storage module is disposed in the accommodating space of the housing.

In order to solve the above technical problem, another technical solution of the present invention is to provide a storage device with a heat dissipation function, including: the device comprises a shell, a storage module and working liquid. The shell comprises an accommodating space. The storage module is disposed in the accommodating space of the housing. The working liquid is disposed in the accommodating space of the housing, and the storage module is immersed in the working liquid.

Furthermore, the storage device with the heat dissipation function is a 2.5-inch hard disk, a 3.5-inch hard disk, an internal hard disk or a portable external hard disk.

Further, the working liquid is an insulating liquid.

One of the benefits of the storage device and the hard disk with the heat dissipation function provided by the embodiment of the invention is that the heat dissipation efficiency of the storage device or the hard disk can be improved by using the technical scheme that the working liquid is arranged in the accommodating space of the shell and the storage module is immersed in the working liquid.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

Fig. 1 is a schematic perspective view of a memory device with a heat dissipation function according to a first embodiment of the present invention.

Fig. 2 is an exploded perspective view of a memory device with heat dissipation function according to a first embodiment of the present invention.

Fig. 3 is a schematic perspective cross-sectional view of a storage device with a heat dissipation function according to a first embodiment of the invention.

Fig. 4 is a schematic view of a storage device with a heat dissipation function according to a first embodiment of the present invention in a use state.

Fig. 5 is a schematic view illustrating another usage state of the memory device with heat dissipation function according to the first embodiment of the present invention.

Fig. 6 is a schematic perspective view of a storage device with a heat dissipation function according to a second embodiment of the present invention.

Fig. 7 is an exploded perspective view of a storage device with heat dissipation function according to a second embodiment of the present invention.

Fig. 8 is a schematic perspective view of a storage device with a heat dissipation function according to a third embodiment of the present invention.

Fig. 9 is an exploded perspective view of a storage device with heat dissipation function according to a third embodiment of the present invention.

Fig. 10 is a schematic perspective view of a storage device with a heat dissipation function according to a fourth embodiment of the present invention.

Fig. 11 is an exploded perspective view of a storage device with heat dissipation function according to a fourth embodiment of the present invention.

Fig. 12 is a schematic perspective view of a storage device with a heat dissipation function according to a fifth embodiment of the present invention.

Fig. 13 is an exploded perspective view of a storage device with heat dissipation function according to a fifth embodiment of the present invention.

Fig. 14 is another exploded perspective view of a storage device with heat dissipation function according to a fifth embodiment of the present invention.

Detailed Description

The following description is provided for the embodiments of the "storage device and hard disk with heat dissipation function" disclosed in the present invention by specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure in the present specification. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not drawn to scale. The following embodiments will further explain the technical contents related to the present invention in detail, but the disclosure is not intended to limit the technical scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, etc., these elements or signals should not be limited by these terms. These terms are used to distinguish one element from another element, or from one signal to another signal. In addition, as used herein, the term "or" may include all combinations of any one or more of the associated listed items as appropriate.

First embodiment

First, referring to fig. 1 to 3, fig. 1 and 2 are a perspective assembly view and a perspective exploded view of a storage device with a heat dissipation function according to a first embodiment of the present invention, and fig. 3 is a perspective cross-sectional view of the storage device with a heat dissipation function according to the first embodiment of the present invention. The first embodiment of the present invention provides a storage device U with heat dissipation function, which includes a housing 1, a storage module 2, and a working fluid 3. It should be noted that the storage device U provided in the embodiment of the present invention may preferably be a hard disk, and more preferably may be a portable external hard disk. However, in other embodiments, the present invention may also be an internal hard disk, and the present invention is not limited thereto. In addition, it is worth to be noted that the storage device U with a heat dissipation function described below may be a hard disk U with a heat dissipation function.

As described above, referring back to fig. 1 to fig. 3, the housing 1 may include an accommodating space 10, and the storage module 2 may be disposed in the accommodating space 10 of the housing 1. In addition, the working liquid 3 may be disposed in the accommodating space 10 of the housing 1, and the storage module 2 is immersed in the working liquid 3, so that heat generated by the storage module 2 may be conducted from the working liquid 3 to the housing 1, thereby improving heat dissipation efficiency. In other words, according to the embodiment of the present invention, a circuit board 22 of the memory module 2 may be in direct contact with the working fluid 3. In addition, the working liquid 3 may be enclosed (or may be called sealed or sealed) in the accommodating space 10 of the housing 1, and the working liquid 3 is not in contact with the external environment. That is, the working liquid 3 is sealed in the accommodating space 10 of the casing 1 of the storage device (hard disk) U. In addition, in another embodiment (for example, the fourth embodiment), at least a part of the storage module 2 may be disposed in the accommodating space 10 of the housing 1. Thereby, it is possible to arrange only the hotter elements in the receiving space 10 of the housing 1 and to immerse the hotter elements in the working liquid 3. In other words, the present invention is not limited to whether the overall structure of the storage module 2 is completely submerged in the working liquid 3. For example, the main body 11 and the cover 12 of the housing 1 may be made of metal, nonmetal, or plastic, but the invention is not limited thereto.

As mentioned above, referring to fig. 2 again, for example, the storage module 2 may be a solid-state Drive (SSD) specification interface, however, in other embodiments, the storage module 2 may also be a Hard Disk Drive (HDD) interface (not shown), and the invention is not limited thereto. It should be noted that the storage module 2 in the drawings of the present invention is illustrated by using a specification interface of a solid state disk as an example. In addition, the memory module 2 may include a transmission port 21 and a circuit board 22, the circuit board 22 may be coupled to the transmission port 21, and the circuit board 22 may be provided with a plurality of chips 221. Further, the port 21 is a connector conforming to SATA, mSATA, PCI-E, NVMe, M.2, M.3, ZIF, IDE, U.2, CF, CFast or Type-C specification interface, for example. Therefore, the storage device U with a heat dissipation function provided by the embodiment of the present invention may be a 2.5-inch hard disk, a 3.5-inch hard disk, an internal hard disk, or a portable external hard disk.

Next, referring to fig. 1 again, and referring to fig. 4 and 5 together, fig. 4 and 5 are schematic views of a usage state of the storage device with a heat dissipation function according to the first embodiment of the present invention, respectively. Further, the housing 1 may include a slot 120, and the transfer port 21 of the storage module 2 may be disposed in the slot 120. The transmission port 21 of the storage module 2 can be exposed outside the accommodating space 10 of the housing 1 through the groove body 120 of the housing 1. Thereby, a transmission end 41 of a transmission line 4 can pass through the slot 120 and be connected to the transmission port 21 of the storage module 2. It should be noted that, although the Type-C standard interface is taken as an example for the transmission port 21 and the transmission end 41 of the transmission line 4 in the drawings, in other embodiments, the transmission port 21 and the transmission end 41 may be connectors of other standard interfaces, and the invention is not limited thereto.

Referring to fig. 2 and fig. 3 again, for example, according to an embodiment of the present invention, the housing 1 may include a main body 11 and a cover 12 disposed on the main body 11, and an accommodating space 10 may be formed between the main body 11 and the cover 12 to accommodate the circuit board 22 of the storage module 2 and the working liquid 3. In addition, the main body 11 may include a bottom plate 111 and a shell plate 112 connected to the bottom plate 111 and surrounding the bottom plate 111. The shell plate 112 may extend in a direction toward the lid portion 12 with respect to the bottom plate 111. Preferably, in the embodiment of the present invention, the bottom plate 111 and the shell plate 112 of the main body 11 may be integrally formed. Therefore, the main body 11 can form a cup-shaped structure to contain the working fluid 3, and the working fluid 3 can be prevented from leaking. In addition, preferably, the memory module 2 may be provided on the cover portion 12, and the cover portion 12 may be provided on the shell plate 112. For example, the memory module 2 can be locked on the cover 12 by a locking member (not shown), or fixed on the cover 12 by a locking member (not shown). Therefore, the cover 12 provided with the storage module 2 and the main body 11 provided with the working fluid 3 can be directly assembled with each other during assembly, and the storage device U with a heat dissipation function is formed. It should be noted, however, that the present invention is not limited to the form of how the storage module 2 is disposed in the housing 1.

As described above, referring back to fig. 1 and fig. 2, the cover 12 and the main body 11 can be coupled together by a locking member (not shown) to couple the cover 12 and the main body 11 together. In other embodiments, the cover 12 and the main body 11 may be coupled to each other in a snap-fit manner (or may be called as a snap-fit manner, not shown). In other embodiments, the cover 12 and the main body 11 may be bonded by gluing (e.g., glue or tape, not shown). The present invention is not limited to the manner of coupling the lid 12 and the main body 11, and the lid 12 and the main body 11 may be coupled to each other to prevent the working fluid 3 from leaking. Preferably, in one embodiment, a rubber gasket (not shown) may be further disposed between the cover 12 and the main body 11 to improve the sealing between the cover 12 and the main body 11, so as to prevent the working liquid 3 from leaking. It should be noted that, in one embodiment, the casing plate 112 of the main body 11 may have a guide rail (not shown) corresponding to the storage module 2, so that the storage module 2 can slide on the guide rail to facilitate assembling the cover 12 of the storage module 2 and the casing plate 112 of the main body 11 with the working fluid 3. It should be noted that, in the embodiment of the present invention, the cover 12 may further include a first cover 121 and a second cover 122, the first cover 121 may include a slot 1210, the second cover 122 may be disposed in the slot 1210, and the second cover 122 may have a slot 120. However, it should be noted that, in other embodiments, the first cover plate 121 and the second cover plate 122 may be integrally formed, and the invention is not limited thereto.

Referring to fig. 1 to 3 again, the working liquid 3 may be an insulating liquid or a dielectric liquid with a heat conducting effect, for example, a solution with a boiling point lower than 76 ℃, preferably a solution with a boiling point lower than 65 ℃. More specifically, a liquid containing a hydrofluoroether (hydrofluoroether) component may be used, for example, a mixture of pure compounds or azeotropes such as an electron-fluorinated liquid and a fluorine solution, wherein the mixture of pure compounds or azeotropes with a boiling point of 62 ℃, 55 ℃ or 48 ℃ is a material that can be used in the present invention, but the present invention is not limited to the above-mentioned examples. Further, in one embodiment, the working liquid 3 may be 3M^TMNovec^TMThe electronic engineering liquid of (1) can be, for example, the electronic engineering liquid 7100, the electronic engineering liquid 7200, the electronic engineering liquid 7300 or the electronic engineering liquid 7500, which is not limited thereto. Further, for example, the working liquid 3 may be 3M^TMFluorinert^TMElectronic Liquid, the invention is not limited thereto.

In view of the above, further, since the storage module 2 directly contacts the working fluid 3, the heat generated by the storage module 2 during operation is first conducted to the working fluid 3, and then conducted to the housing 1. It should be noted that, when the working liquid 3 is a low boiling point solution, the working liquid 3 is easily boiled by being heated. Therefore, the temperature of the working liquid 3 rises and reaches the boiling point, the working liquid 3 can utilize the received heat energy to carry out phase change, the liquid state is changed into the gaseous state, and a large amount of heat is consumed in the phase change process, so that the heat dissipation efficiency of the storage module 2 is improved. In addition, in the process of converting the working fluid 3 from the liquid state to the gas state, not only can the working fluid 3 generate convection in the accommodating space 10, but also the working fluid 3 which is converted from the liquid state to the gas state can form bubbles to disturb the working fluid 3, thereby generating a phenomenon called boiling.

As mentioned above, for example, the volume of the working liquid 3 may occupy 40% to 100% of the accommodating space 10 after the storage module 2 is disposed, but the invention is not limited thereto. It should be noted that, in one embodiment, when the material of the casing 1 is a colorless transparent body made of Polycarbonate (PC), a user can directly observe whether the working liquid 3 is boiling or not by naked eyes, so as to conveniently know the heat dissipation situation.

Second embodiment

First, referring to fig. 6 and 7, fig. 6 is a perspective assembly view of a storage device with a heat dissipation function according to a second embodiment of the present invention, and fig. 7 is a perspective exploded view of the storage device with a heat dissipation function according to the second embodiment of the present invention. As can be seen from a comparison between fig. 7 and fig. 2, the greatest difference between the second embodiment and the first embodiment is that: the storage device U with a heat dissipation function provided in the second embodiment may further include: a transmission line 4, and the transmission line 4 is disposed on the cover portion 12. It should be noted that the structures of the housing 1, the storage module 2 and the working fluid 3 are similar to those of the foregoing embodiments, and are not described herein again.

As shown in fig. 6 and 7, and also shown in fig. 4 and 5, for example, in the second embodiment, a transmission end 41 of the transmission line 4 can pass through the slot 120 and be connected to the storage module 2 as described in the previous embodiment. Then, the transmission end 41 of the transmission line 4 and the slot 120 may be further covered by a package 5, so that the transmission line 4 is disposed on the cover 12. Meanwhile, the sealing body 5 may further generate a sealing effect between the transmission end 41 and the groove 120. As described in the foregoing embodiment, the memory module 2 may be provided on the cover 12, but the present invention is not limited thereto.

It should be noted that, in one embodiment, the package 5 and the cover 12 may be made of the same material and integrally formed, such that the transmission end 41 of the transmission line 4 is disposed on the cover 12, and the transmission end 41 of the transmission line 4 and the transmission port 21 of the memory module 2 disposed on the cover 12 are connected to each other. Further, in another embodiment, the package 5 and the cover 12 may be the same component, such that the transmission end 41 of the transmission line 4 is disposed on the cover 12. It should be noted that the package 5 may be disposed only on the transmission end 41 and the slot 120, and does not cover the whole cover 12, and the invention is not limited thereto. Further, the cover 12 and the main body 11 may be fastened to each other as in the above embodiment, or may be bonded to each other by gluing. In other words, the lid 12 and the main body 11 can be joined to each other so as to prevent the working fluid 3 (not shown in fig. 6 and 7) from leaking. The present invention is not limited to the manner of coupling the lid 12 and the main body 11.

Third embodiment

First, referring to fig. 8 and 9, fig. 8 is a perspective assembly view of a storage device with a heat dissipation function according to a third embodiment of the present invention, and fig. 9 is a perspective exploded view of the storage device with a heat dissipation function according to the third embodiment of the present invention. As can be seen from the comparison between fig. 9 and fig. 2, the biggest difference between the third embodiment and the first embodiment is that the transmission port 21 of the memory module 2 of the memory device U with heat dissipation function provided by the third embodiment can be a PCI-E specification interface. The housing 1 is also arranged differently from the above-described embodiment. However, it should be noted that the memory module 2 and the working liquid 3 of the memory device U with heat dissipation function provided in the third embodiment are still similar to those of the previous embodiments, and are not described herein again.

As shown in fig. 8 and 9, the housing 1 may be composed of a main body 11 and a cover 12 according to the third embodiment, but compared with the previous embodiments, the main body 11 of the third embodiment may be composed of a first shell 113 and a second shell 114, and the first shell 113 and the second shell 114 may be combined by a fastener 6, but the invention is not limited thereto. It should be noted that a rubber gasket (not shown) may be further disposed between the first shell 113 and the second shell 114 to improve the tightness between the first shell 113 and the second shell 114. In addition, for the third embodiment, the cover portion 12 may be an adhesive for sealing the gap formed between the memory module 2 and the first shell 113 and the second shell 114, but the invention is not limited thereto. In other embodiments, the notch formed between the memory module 2 and the first and second shell plates 113 and 114 can be sealed by ultrasonic plastic welding (ultrasonic welding) to form the cover 12.

Fourth embodiment

First, referring to fig. 10 and 11, fig. 10 is a perspective assembly view of a storage device with a heat dissipation function according to a fourth embodiment of the present invention, and fig. 11 is a perspective exploded view of the storage device with a heat dissipation function according to the fourth embodiment of the present invention. As can be seen from a comparison between fig. 10 and fig. 8, the biggest difference between the fourth embodiment and the third embodiment is: the storage device U having a heat dissipation function provided in the fourth embodiment may dispose only a part of the storage module 2 in the accommodating space 10 of the housing 1. In other words, it is possible to arrange only the hotter elements in the housing space 10 of the casing 1, and to immerse the hotter elements in the working liquid 3. It should be noted that the memory module 2 and the working liquid 3 of the memory device U with a heat dissipation function provided in the fourth embodiment are similar to those of the previous embodiments, and are not described herein again.

In detail, referring to fig. 10 and 11 again, the circuit board 22 of a portion of the memory module 2, a chip 221 on the circuit board 22, and the working liquid 3 (not shown in fig. 10 and 11) may be disposed in the housing 1. In addition, compared to the third embodiment, the body 11 of the housing 1 in the fourth embodiment may be composed of a bottom plate 111 and a shell plate 112. In addition, the cover 12 of the housing 1 in the fourth embodiment may be a glue body as described in the third embodiment to seal the gap formed between the memory module 2 and the shell 112 of the main body 11, but the invention is not limited thereto. In other embodiments, the lid 12 may be formed by sealing the gap formed between the memory module 2 and the shell 112 of the main body 11 by Ultrasonic plastic Welding (Ultrasonic Welding).

Fifth embodiment

First, referring to fig. 12 to 14, fig. 12 is a perspective assembly view of a storage device with a heat dissipation function according to a fifth embodiment of the present invention, and fig. 13 and 14 are perspective exploded views of the storage device with a heat dissipation function according to the fifth embodiment of the present invention, respectively. As can be seen from a comparison between fig. 12 and fig. 10, the biggest difference between the fifth embodiment and the fourth embodiment is: the fifth embodiment provides a different arrangement of the housing 1 of the storage device U with a heat dissipation function. However, it should be noted that the memory module 2 and the working liquid 3 of the memory device U with heat dissipation function provided in the fifth embodiment are still similar to those of the previous embodiments, and are not described herein again.

As described above, referring to fig. 12 to 14 again, the housing 1 containing the working liquid 3 can be covered on a relatively easy-to-heat wafer 221 of the storage module 2, so that the relatively easy-to-heat wafer 221 is immersed in the working liquid 3. Thereby, the heat generated by the wafer 221 of the memory module 2 can be conducted from the working liquid 3 to the housing 1.