阅读说明：本技术 一种微同轴射频传输线及其gsg转接口 (Micro-coaxial radio frequency transmission line and GSG (ground satellite System) adapter thereof ) 是由 裘进 张光瑞 杨云春 王志良 于 2021-07-19 设计创作，主要内容包括：本发明公开了一种微同轴射频传输线的地-信号-地GSG转接口,包括：外导体,所述外导体的内部包括空腔,所述外导体的底端设有第一地线连接端和第二地线连接端；内导体,悬空设置在所述空腔内；所述内导体包括信号线连接端,所述信号线连接端包括水平部和竖直部,所述水平部位于所述第一地线连接端与所述第二地线连接端之间,所述竖直部位于所述内导体和所述水平部之间；外导体覆盖部,与所述外导体一体成型,用于覆盖所述竖直部；上述GSG转接口通过增加外导体覆盖部包裹信号线连接端的弯折或拐角区域,从而减小GSG转接口处信号线的辐射损耗。(The invention discloses a ground-signal-ground GSG adapter of a micro-coaxial radio frequency transmission line, which comprises: the inner part of the outer conductor comprises a cavity, and the bottom end of the outer conductor is provided with a first ground wire connecting end and a second ground wire connecting end; the inner conductor is suspended in the cavity; the inner conductor comprises a signal line connecting end, the signal line connecting end comprises a horizontal part and a vertical part, the horizontal part is located between the first ground line connecting end and the second ground line connecting end, and the vertical part is located between the inner conductor and the horizontal part; an outer conductor covering portion integrally formed with the outer conductor for covering the vertical portion; the GSG adapter interface reduces the radiation loss of the signal line at the GSG adapter interface by increasing the bending or corner area of the outer conductor covering part for wrapping the signal line connecting end.)

1. A ground-signal-ground GSG interface for a micro-coaxial rf transmission line, said GSG interface comprising:

the inner part of the outer conductor comprises a cavity, and the bottom end of the outer conductor is provided with a first ground wire connecting end and a second ground wire connecting end;

the inner conductor is suspended in the cavity; the inner conductor comprises a signal line connecting end, the signal line connecting end comprises a horizontal part and a vertical part, the horizontal part is located between the first ground line connecting end and the second ground line connecting end, and the vertical part is located between the inner conductor and the horizontal part;

an outer conductor covering portion integrally formed with the outer conductor for covering the vertical portion.

2. The GSG adapter of claim 1 wherein said outer conductor cover has a thickness in the range of 5 μ ι η to 200 μ ι η.

3. The GSG adapter interface of claim 1, further comprising: and the supporting dielectric strip is erected in the cavity and used for supporting the inner conductor.

4. The GSG adapter of claim 1 wherein said outer conductor comprises a five layer copper structure, said outer conductor covering being integrally formed with a third layer copper structure, a fourth layer copper structure and a fifth layer copper structure.

5. The GSG adapter of claim 1, wherein said outer conductor comprises a eleven layer copper structure, said outer conductor covering being integrally formed with a fifth layer copper structure through an eleven layer copper structure.

6. A method for preparing a GSG switching interface of a micro-coaxial transmission line, which is used for obtaining the GSG switching interface as claimed in any one of claims 1 to 5, the method comprises the following steps:

obtaining a substrate;

and (3) photoetching: spin-coating photoresist on the substrate to obtain a sacrificial layer, and manufacturing a preset pattern on the sacrificial layer by a photoetching method to obtain a photoetching sacrificial layer;

a deposition step: depositing conductor metal on the sacrificial layer after photoetching by an electrochemical method to obtain a sacrificial layer comprising the conductor metal;

a planarization step: carrying out planarization treatment on the sacrificial layer comprising the conductor metal to obtain a planarized sacrificial layer;

repeating the photoetching step, the deposition step and the planarization step to obtain a laminated structure comprising an inner conductor, an outer conductor covering part and a plurality of sacrificial layers;

and releasing the multilayer sacrificial layer in the laminated structure to obtain the GSG adapter.

7. The method of claim 6, wherein the photolithography process is thick resist uv lithography.

8. The method according to claim 6, wherein the thickness of each layer of the conductive metal is 5 to 200 μm.

9. The method of claim 6, wherein the conductor metal is copper metal.

10. A micro-coaxial RF transmission line, wherein the GSG adaptor according to any claim 1-5 is used for the micro-coaxial RF transmission line.

Technical Field

The application relates to the technical field of radio frequency transmission, in particular to a micro-coaxial radio frequency transmission line and a GSG (ground satellite system) adapter thereof.

Background

The rectangular micro-coaxial transmission technology is a radio frequency transmission technology based on MEMS micro-machining process, and has the characteristics of ultra wide band, no dispersion, low loss, high power capacity, high isolation and the like due to the unique electromagnetic wave structure. The rectangular micro-coaxial transmission line can adopt a common electrical connection interface to realize the connection with a peripheral circuit. One common connection interface is a ground-signal-ground (GSG) interface for probe testing or gold wire bonding to connect chips, etc. The problems of the current micro-coaxial GSG adapter are as follows: there is a large radiation loss in the inner conductor at the turn-to-turn interface.

Disclosure of Invention

The invention provides a micro-coaxial radio frequency transmission line and a GSG (ground coupling generator) adapter thereof, which are used for solving or partially solving the technical problem that the GSG adapter of the existing micro-coaxial radio frequency transmission line has larger radiation loss.

In order to solve the above technical problem, the present invention provides a ground-signal-ground GSG adapter of a micro-coaxial rf transmission line, where the GSG adapter includes:

the inner part of the outer conductor comprises a cavity, and the bottom end of the outer conductor is provided with a first ground wire connecting end and a second ground wire connecting end;

the inner conductor is suspended in the cavity; the inner conductor comprises a signal line connecting end, the signal line connecting end comprises a horizontal part and a vertical part, the horizontal part is located between the first ground line connecting end and the second ground line connecting end, and the vertical part is located between the inner conductor and the horizontal part;

an outer conductor covering portion integrally formed with the outer conductor for covering the vertical portion.

Optionally, the thickness of the outer conductor covering part ranges from 5 μm to 200 μm.

Optionally, the GSG adapter further includes: and the supporting dielectric strip is erected in the cavity and used for supporting the inner conductor.

Optionally, the outer conductor includes five copper structures, and the outer conductor covering portion is integrally formed with the third copper structure, the fourth copper structure and the fifth copper structure.

Optionally, the outer conductor includes eleven layers of copper structures, and the outer conductor covering portion is integrally formed with the fifth layer of copper structure to the eleven layers of copper structure.

According to another alternative embodiment of the present invention, a method for manufacturing a GSG adapter of a micro-coaxial transmission line is provided, which is used to obtain the GSG adapter in the foregoing technical solution, and the method includes:

obtaining a substrate;

and (3) photoetching: spin-coating photoresist on the substrate to obtain a sacrificial layer, and manufacturing a preset pattern on the sacrificial layer by a photoetching method to obtain a photoetching sacrificial layer;

a deposition step: depositing conductor metal on the sacrificial layer after photoetching by an electrochemical method to obtain a sacrificial layer comprising the conductor metal;

a planarization step: carrying out planarization treatment on the sacrificial layer comprising the conductor metal to obtain a planarized sacrificial layer;

repeating the photoetching step, the deposition step and the planarization step to obtain a laminated structure comprising an inner conductor, an outer conductor covering part and a plurality of sacrificial layers;

and releasing the multilayer sacrificial layer in the laminated structure to obtain the GSG adapter.

Optionally, the photolithography method is thick photoresist ultraviolet lithography.

Optionally, the thickness of each layer of conductor metal is 5-200 μm.

Optionally, the conductor metal is copper metal.

According to still another alternative embodiment of the present invention, a micro-coaxial rf transmission line is provided, where the micro-coaxial rf transmission line adopts the GSG adapter in the foregoing technical solution.

Through one or more technical schemes of the invention, the invention has the following beneficial effects or advantages:

the invention provides a micro-coaxial radio-frequency transmission line and a GSG (ground satellite system) switching port thereof, which are based on a structure that a GSG is arranged on micro-coaxial bottom layer copper, and the radiation loss of a signal line at the GSG switching port is reduced by increasing a bending or corner area of a signal line connecting end wrapped by an outer conductor covering part.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

FIG. 1 shows a schematic view of a micro-coaxial structure according to the prior art;

fig. 2 illustrates a schematic diagram of a micro-coaxial GSG interface that does not include a cover, according to an embodiment of the present invention;

figure 3 shows a schematic diagram of a micro-coaxial GSG adapter interface comprising a cover according to one embodiment of the present invention;

fig. 4 is a schematic flow chart illustrating a method for manufacturing a GSG adapter for a micro-coaxial transmission line according to an embodiment of the present invention;

description of reference numerals:

1. an outer conductor; 11. a first ground wire connection end; 12. a second ground connection end; 13. an outer conductor covering section; 2. an inner conductor; 21. a signal line connection terminal; 211. a horizontal portion; 212. a vertical portion.

Detailed Description

In order to make the present application more clearly understood by those skilled in the art to which the present application pertains, the following detailed description of the present application is made with reference to the accompanying drawings by way of specific embodiments. Throughout the specification, unless otherwise specifically noted, terms used herein should be understood as having meanings as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. If there is a conflict, the present specification will control. Unless otherwise specifically stated, various apparatuses and the like used in the present invention are either commercially available or can be prepared by existing methods.

Generally speaking, a micro-coaxial transmission line has a structure as shown in fig. 1, including an outer conductor, and an inner conductor suspended within a cavity by the action of a dielectric strip. When the probe is connected with the micro-coaxial transmission line, the probe needs to be connected through a corresponding GSG adapter. Fig. 2 shows a micro-coaxial GSG interface, which is located on the bottom copper of the micro-coaxial, and since the signal line connection end is located at the bottom copper position and the inner conductor is located at the middle copper position of the micro-coaxial, the signal line connection end needs to be bent, which causes the signal transmission to have a corner, and thus, a large power radiation loss is generated.

In order to solve the problem of large radiation loss caused by bending of the signal connection line, according to an alternative embodiment, as shown in fig. 2 to 3, a GSG adapter structure is provided as follows:

the GSG adapter includes: the cable comprises an outer conductor 1, wherein the inner part of the outer conductor 1 comprises a cavity, and a first ground wire connecting end 11 and a second ground wire connecting end 12 are arranged at the bottom end of the outer conductor 1; the inner conductor 2 is suspended in the cavity; the inner conductor 2 includes a signal line connection end 21, the signal line connection end 21 includes a horizontal portion 211 and a vertical portion 212, the horizontal portion 211 is located between the first ground connection end 11 and the second ground connection end 12, and the vertical portion 212 is located between the inner conductor 2 and the horizontal portion 211; and an outer conductor covering portion 13 integrally formed with the outer conductor 1 for covering the vertical portion 212.

The improved principle of the scheme is as follows: based on the scheme that the GSG is disposed on the bottom layer copper, the bent or corner regions of the signal line connection terminals 21 are wrapped by the outer conductor covering parts 13, thereby suppressing radiation loss. In order to obtain a good radiation loss suppression effect, the optional coverage thickness range of the outer conductor covering part 13 is determined to be 5-200 microns through experiments; the coverage thickness is preferably in the range of 50 μm to 100 μm, and radiation loss can be suppressed well.

In order to avoid supporting the signal lines, the GSG adapter further comprises a supporting dielectric strip, which is erected in the cavity and is used for supporting the inner conductor 2.

Through simulation and experimental verification, an optional coverage area of the conductor covering part is determined: for a common semi-high copper-based micro-coaxial radio frequency transmission line with a five-layer copper structure, the outer conductor covering part 13 is an upper three-layer copper structure, namely, the covering part and a third layer copper structure, and a fourth layer copper structure and a fifth layer copper structure are integrally formed, so that a good effect of reducing radiation loss can be obtained. For the all-high copper-based micro-coaxial radio frequency transmission line with the eleven-layer copper structure, the outer conductor covering part 13 is integrally formed with the fifth-layer copper structure to the eleven-layer copper structure, and a good effect of reducing radiation loss can be obtained.

According to the same inventive concept of the previous embodiment, in yet another alternative embodiment, as shown in fig. 4, there is provided a manufacturing method for obtaining the GSG adapter in the previous embodiment, including:

s1: obtaining a substrate; optionally, the wafer may be a substrate, and sapphire, a semiconductor, or ceramic may also be used as a substrate;

s2: and (3) photoetching: spin-coating photoresist on the substrate to obtain a sacrificial layer, and manufacturing a preset pattern on the sacrificial layer by a photoetching method to obtain a photoetching sacrificial layer;

s3: a deposition step: depositing conductor metal on the sacrificial layer after photoetching by an electrochemical method to obtain a sacrificial layer comprising the conductor metal;

s4: a planarization step: carrying out planarization treatment on the sacrificial layer comprising the conductor metal to obtain a planarized sacrificial layer; alternatively, each sacrificial layer may be planarized using a grinding or polishing process;

s5: repeating the photoetching step, the deposition step and the planarization step to obtain a laminated structure comprising an inner conductor, an outer conductor covering part and a plurality of sacrificial layers;

s6: and releasing the multilayer sacrificial layer in the laminated structure to obtain the GSG adapter.

In order to remove the sacrificial layer better, release holes can be reserved around the laminated structure, so that the stripping solution and the photoresist can fully react.

Generally, the conductor metal is copper, so as to obtain an adapter of the copper-based micro-coaxial transmission line. Under other possible application scenes, the silver-based micro-coaxial transmission line can also be prepared by using metallic silver as deposited metal.

Optionally, the photolithography method adopted in the above scheme may be a thick photoresist ultraviolet photolithography method, and the corresponding photoresist may adopt SU-8 photoresist.

Alternatively, the thickness of the deposited conductor metal of each layer may range from 5 μm to 200 μm; the deposition thickness is preferably 50 μm to 100 μm.

Taking a copper-based micro-coaxial GSG adapter for preparing common five-layer copper as an example, the process comprises the following steps:

(1) taking a wafer as a substrate;

(2) depositing a first layer of copper on the wafer by a thick photoresist photoetching method, and then flattening;

(3) depositing a second layer of copper by a thick photoresist photoetching method, and then flattening;

(4) depositing and preparing a supporting layer, and forming a supporting strip by photoetching and etching methods;

(5) depositing a third layer of copper by a thick photoresist photoetching method, and then flattening;

(6) depositing a fourth layer of copper by a thick photoresist photoetching method, and then flattening;

(7) depositing fifth layer copper by thick photoresist photoetching, and then flattening;

(8) and removing the photoresist to form the GSG adapter with the micro coaxial structure.

Based on the same inventive concept of the foregoing embodiment, in yet another alternative embodiment, a micro-coaxial rf transmission line is provided, where the micro-coaxial rf transmission line employs the GSG adapter in the foregoing embodiment.

Through one or more embodiments of the present invention, the present invention has the following advantageous effects or advantages:

the invention provides a micro-coaxial radio-frequency transmission line and a GSG (ground satellite system) switching port thereof, which are based on a structure that a GSG is arranged on micro-coaxial bottom layer copper, and the radiation loss of a signal line at the GSG switching port is reduced by increasing a bending or corner area of a signal line connecting end wrapped by an outer conductor covering part.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.