Circuit board assembly and manufacturing method and application thereof
阅读说明：本技术 电路板组件及其制造方法和应用 (Circuit board assembly and manufacturing method and application thereof ) 是由 陈飞帆 曾俊杰 戴蓓蓓 王晓锋 于 2018-08-27 设计创作，主要内容包括：本发明提供了一电路板组件及其制造方法和应用,其中所述电路板组件的制造方法包括如下步骤：在一基板的一上表面形成一第一线路层；在至少部分所述第一线路层的一上表面形成一第一导电层；以及在所述第一线路层和所述第一导电层一体成型一第一绝缘部,其中所述第一导电层在高度方向贯通所述第一绝缘部。(The invention provides a circuit board assembly and a manufacturing method and application thereof, wherein the manufacturing method of the circuit board assembly comprises the following steps: forming a first circuit layer on an upper surface of a substrate; forming a first conductive layer on an upper surface of at least a part of the first circuit layer; and a first insulating part is integrally formed on the first circuit layer and the first conductive layer, wherein the first conductive layer penetrates through the first insulating part in the height direction.)
1. A method of manufacturing a circuit board assembly, comprising the steps of:
forming a first circuit layer on an upper surface of a substrate;
forming a conductive heat dissipation part by forming a first conductive layer on the upper side of the first circuit layer, wherein the first conductive layer is formed in a plurality of second forming channels, and the heat dissipation part is formed in at least one of the second forming channels, wherein the cross section of the first conductive layer part corresponding to the second forming channel forming the heat dissipation part is larger than the cross sections of the first conductive layer parts corresponding to the other second forming channels, wherein the heat dissipation part has a first surface and a second surface, wherein the first surface is exposed for supporting an electronic element, and the second surface can be exposed for dissipating heat; and
and a first insulating part is integrally formed on the first circuit layer and the first conductive layer, wherein at least the first conductive layer penetrates through the first insulating part in the height direction.
2. The method of manufacturing a circuit board assembly of claim 1, wherein the heat sink portion is formed over at least a portion of the first conductive layer and at least a portion of the first circuit layer.
3. The method of manufacturing a circuit board assembly of claim 2, wherein at least a portion of the first conductive layer is overlapped with at least a portion of the first circuit layer.
4. The manufacturing method according to any one of claims 1 to 3, wherein in the above method, further comprising a step of:
and removing the substrate to expose a lower surface of the first circuit layer.
5. The manufacturing method according to any one of claims 1 to 3, wherein in the above method, further comprising the steps of:
forming an isolation layer on an upper surface of the substrate;
forming a first bonding layer on an upper surface of the isolation layer; and
and forming the first circuit layer on an upper surface of the first bonding layer.
6. The manufacturing method according to claim 5, wherein in the above method, further comprising the steps of:
arranging a first dry film on the upper surface of the first bonding layer;
exposing a portion of the first dry film through a first mask;
removing the exposed first dry film to form at least one first molding channel between the unexposed first dry film; and
and forming the first circuit layer in the first forming channel.
7. The manufacturing method according to claim 6, wherein in the above method, further comprising the steps of:
disposing the second dry film on the upper surface of the first dry film and the upper surface of the first circuit layer;
exposing at least a portion of the second dry film through a second mask;
removing the exposed second dry film to form the second molding channel between the unexposed second dry film; and
forming the first conductive layer between the second forming channels.
8. The manufacturing method according to any one of claims 1 to 3, wherein in the above method, further comprising the steps of:
integrally forming the first insulating portion on the first circuit layer and the first conductive layer, wherein the first insulating portion covers an upper surface of the first conductive layer; and
and reducing the height of the first insulating layer until the upper surface of the first conductive layer is exposed.
9. The manufacturing method according to any one of claims 1 to 3, further comprising the steps of:
the heat dissipation part is formed in a mode that a second circuit layer is formed on the upper side of the first conductive layer, wherein the heat dissipation part is formed on at least part of the second circuit layer and at least part of the first conductive layer, the second circuit layer is formed in a plurality of third forming channels, at least part of the heat dissipation part is formed in at least one third forming channel, and the cross section of the part, corresponding to the third forming channel, of the heat dissipation part is larger than the cross section of the part, corresponding to the other third forming channels, of the second circuit layer.
10. The manufacturing method according to claim 9, wherein the heat dissipation portion is formed over at least part of the second wiring layer, at least part of the first conductive layer, and at least part of the first wiring layer.
11. The manufacturing method according to claim 10, wherein the first wiring layer, the first conductive layer, and the second wiring layer at least partially overlap each other.
12. The manufacturing method according to claim 9, wherein in the above method, further comprising the steps of:
forming a second bonding layer on at least a portion of said upper surface of said first conductive layer and at least a portion of said upper surface of said first insulating portion; and
forming the second circuit layer on an upper surface of the second bonding layer, wherein the second circuit layer is at least partially conductively connected to the first conductive layer.
13. The manufacturing method according to claim 9, further comprising the steps of:
forming the heat dissipation part in a manner of forming a second conductive layer on the upper side of the second circuit layer, wherein the second conductive layer is formed in a plurality of fourth forming channels, at least a part of the heat dissipation part is formed in at least one of the fourth forming channels, and the cross section of the part of the second conductive layer corresponding to the fourth forming channel forming the heat dissipation part is larger than the cross section of the part of the second conductive layer corresponding to the other fourth forming channels; and
and a second insulating part is integrally formed on the second circuit layer and the second conducting layer, wherein at least part of the second conducting layer penetrates through the second insulating part in the height direction.
14. The manufacturing method according to claim 13, wherein at least part of the first wiring layer, at least part of the first conductive layer, at least part of the second wiring layer, and at least part of the second conductive layer overlap with each other in a height direction, and the heat dissipation portion is formed in the portion of the first wiring layer, the first conductive layer, the second wiring layer, and the second conductive layer that overlap with each other.
15. The manufacturing method according to claim 13 or 14, further comprising the steps of:
the heat dissipation part is formed in a manner that at least a part of a third circuit layer is formed on an upper surface of the second conductive layer, wherein the heat dissipation part is formed on at least a part of the second conductive layer and at least a part of the third circuit layer, wherein the third circuit layer is formed in a plurality of fifth forming channels, at least a part of the heat dissipation part is formed in at least one of the fifth forming channels, and a cross section of the third circuit layer part corresponding to the fifth forming channel forming the heat dissipation part is larger than cross sections of the third circuit layer parts corresponding to other fifth forming channels.
16. The manufacturing method according to claim 15, wherein at least part of the first conductive layer, at least part of the second wiring layer, at least part of the second conductive layer, and at least part of the third wiring layer overlap with each other in a height direction.
17. The manufacturing method according to claim 15, further comprising the steps of:
forming a protective layer covering the third circuit layer and the second insulating layer; and
removing the protective layer after removing the substrate.
18. A circuit board assembly manufactured by a method of manufacturing as claimed in any one of claims 1 to 17.
19. The circuit board assembly according to claim 18, wherein a line width a and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:
a is more than or equal to 30 mu m and less than or equal to 150 mu m; and B is more than or equal to 30 mu m and less than or equal to 150 mu m.
20. A TOF module of making a video recording, its characterized in that includes:
the floodlight is used for emitting light to a shot object; and
a receiving unit, wherein the receiving unit is used for receiving a reflected light reflected by the subject and obtaining the depth information of the subject based on the information of the emitted light and the reflected light, wherein the floodlight comprises a light-emitting element and a circuit board assembly according to the manufacturing method of any one of the above claims 1 to 17, wherein the light-emitting element is conductively connected to the heat dissipation part of the circuit board assembly.
21. An electronic device, comprising:
an electronic device body and a camera module according to claim 20, wherein the camera module is disposed on the electronic device body.
22. The electronic device of claim 21, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled into a whole by the assembly, and the floodlight and the camera module are mounted together to the electronic device body.
23. A luminaire comprising:
a light emitting element;
a circuit board assembly manufactured by a manufacturing method according to any one of claims 1 to 17, and
a bracket, wherein the bracket forms an optical window, the light emitting element is conductively coupled to the circuit board assembly, and the bracket is coupled to the circuit board assembly.
24. A TOF module of making a video recording, its characterized in that includes:
the floodlight of claim 23; and
a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical path for light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.
25. An electronic device, comprising:
the floodlight of claim 23;
an electronic device body; and
a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the circuit board assembly of the floodlight is conductively connected to the main circuit board.
26. The electronic device of claim 25, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together to the electronic device body.
27. A luminaire comprising:
a light emitting element;
a circuit board assembly manufactured by a manufacturing method according to any one of the preceding claims 1 to 17;
a support, wherein said support forms an optical window, said light emitting element is conductively coupled to said circuit board assembly, said support is coupled to said circuit board assembly; and
a flexible wiring board, wherein said flexible wiring board is conductively connected to said circuit board assembly.
28. A TOF module of making a video recording, its characterized in that includes:
a floodlight according to claim 26; and
a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive component and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive component for photoelectric conversion, the photosensitive component is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.
29. A circuit board assembly, comprising a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat sink and at least two second forming positions, wherein the first conductive layer is formed on the first circuit layer, the first insulating layer is integrally formed on the first circuit layer and the first conductive layer, the first conductive layer is formed on the second forming positions, at least one of the second forming positions forms at least a part of the heat sink, the cross section of the first conductive layer portion corresponding to the second forming position forming the heat sink is larger than the cross sections of the first conductive layer portions corresponding to the other second forming positions, the heat sink has a first surface and a second surface, the first surface is exposed for supporting an electronic component, the second surface can be exposed for dissipating heat.
30. The circuit board assembly of claim 29, wherein the heat sink portion is formed over the first conductive layer and the first circuit layer.
31. The circuit board assembly of claim 29, wherein the circuit board assembly further comprises a second circuit layer formed on the first conductive layer and having at least two third molding locations, wherein at least one of the third molding locations forms at least a portion of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third molding location forming the heat sink portion is greater than the cross-section of the second circuit layer portion corresponding to the other third molding locations.
32. The circuit board assembly according to claim 31, wherein the heat dissipation portion is formed in the second wiring layer, the first conductive layer, and the first wiring layer portion which overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.
33. The circuit board assembly of claim 31, wherein the circuit board assembly further comprises a second conductive layer formed on the second circuit layer and having at least two fourth molding locations, wherein at least one of the fourth molding locations forms at least a portion of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth molding location forming the heat sink portion is greater than the cross-section of the portion of the second conductive layer corresponding to the other fourth molding locations.
34. The circuit board assembly according to claim 33, wherein the heat dissipation portion is formed at the first conductive layer, the second wiring layer, and the second conductive layer portion that overlap in a height direction.
35. The circuit board assembly of claim 33, wherein the circuit board assembly further comprises a third circuit layer and at least two fifth forming locations, wherein the third circuit layer is formed on the second conductive layer and formed at the fifth forming locations, at least one of the fifth forming locations forming at least part of the heat sink portion, wherein the cross section of the third circuit layer portion corresponding to the fifth forming locations forming the heat sink portion is larger than the cross sections of the third circuit layer portions corresponding to the other fifth forming locations.
36. The circuit board assembly according to claim 35, wherein the heat dissipation portion is formed at the locations of the first conductive layer, the second wiring layer, the second conductive layer, and the third wiring layer which overlap in a height direction.
37. A circuit board assembly according to any one of claims 29 to 36, wherein the circuit board assembly further has at least two first molding positions, wherein the first circuit layer is molded at the first molding positions, at least one of the first molding positions forming at least part of the heat sink portion, wherein the cross section of the first circuit layer portion corresponding to the first molding position forming the heat sink portion is larger than the cross section of the first circuit layer portion corresponding to the other first molding positions.
38. A circuit board assembly according to any of claims 29 to 36, wherein the circuit board assembly further comprises a second solder mask layer, wherein the second solder mask layer covers at least part of the second insulating portion.
39. The circuit board assembly of claim 38, wherein the circuit board assembly further comprises a first solder mask layer, wherein the first solder mask layer covers at least a portion of the first insulating portion.
40. A circuit board assembly according to any one of claims 29 to 36, wherein a line width a and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:
a is more than or equal to 30 mu m and less than or equal to 150 mu m; and B is more than or equal to 30 mu m and less than or equal to 150 mu m.
41. A TOF module of making a video recording, its characterized in that includes:
the floodlight is used for emitting light to a shot object; and
a receiving unit, wherein the receiving unit is used for receiving a reflected light reflected by the subject and obtaining the depth information of the subject based on the information of the emitted light and the reflected light, wherein the floodlight comprises a light-emitting element and a circuit board assembly according to any one of the above claims 28 to 39, wherein the light-emitting element is conductively connected to the heat dissipation part of the circuit board assembly. .
42. An electronic device, comprising:
an electronic device body and a TOF camera module according to claim 40 wherein the TOF camera module is mounted to the electronic device body.
43. The electronic device of claim 42, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled into a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.
44. A luminaire comprising:
a light emitting element;
a circuit board assembly according to any one of claims 29 to 40, and
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly.
45. A TOF module of making a video recording, its characterized in that includes:
a floodlight according to claim 43; and
a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical path for light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.
46. An electronic device, comprising:
a floodlight according to claim 43;
an electronic device body; and
a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the conductive part of the circuit board assembly of the floodlight is conductively connected to the main circuit board.
47. The electronic device of claim 45, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled into a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.
48. A luminaire comprising:
a light emitting element;
a circuit board assembly according to any one of claims 29 to 40;
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly; and
a flexible wiring board, wherein the flexible wiring board is conductively connected to the conductive portion of the circuit board assembly.
49. A TOF module of making a video recording, its characterized in that includes:
a floodlight according to claim 48; and
a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive element and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive element for photoelectric conversion, the photosensitive element is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board assembly and a manufacturing method and application thereof.
Background
With the development of the market, TOF camera modules are gradually applied to small mobile devices such as mobile phones, however, for TOF camera modules, the TOF camera modules include a light source unit and a receiving unit, wherein the light source unit can emit a large amount of heat when emitting light outwards, and when the heat is accumulated at the position of the light source unit, the working quality and the working efficiency of the light source unit are affected, so that the imaging accuracy of the whole TOF camera module is affected.
The light source unit generally includes a light emitting element and a circuit board, wherein the light emitting element is supported on the circuit board and dissipates heat through the circuit board. Common circuit boards in the market generally have common rigid-flex boards, but the heat dissipation performance of the common circuit boards is poor.
Further, the rigid-flex board has poor heat dissipation performance due to itself, and for the multilayer circuit board, the reduction of the thickness dimension of the whole circuit board is limited due to the existence of via holes (vias). The smaller the via size, the higher the overall process requirements and, thus, the higher the cost of the circuit board. That is, it is difficult for a general rigid-flex board to satisfy the current requirement of the electronic device for heat dissipation performance and the requirement of the electronic device for light weight and thin weight.
The existing ceramic substrate has good heat dissipation performance, but the cost is high, and the production capacity of the enterprise which is relevant to the existing ceramic substrate production capacity is limited, so that the large-scale market demand of the current mobile phone or other electronic equipment cannot be met.
Disclosure of Invention
An object of the present invention is to provide a circuit board assembly, a method for manufacturing the same and applications thereof, wherein the circuit board assembly can provide a better heat dissipation performance.
Another object of the present invention is to provide a circuit board assembly, a method of manufacturing the same, and applications thereof, wherein the circuit board assembly is capable of providing good heat dissipation performance while having good electrical conductivity.
Another object of the present invention is to provide a circuit board assembly, a method of manufacturing the same, and applications thereof, wherein the method of manufacturing the circuit board can facilitate the manufacture of the circuit board assembly which is miniaturized.
Another object of the present invention is to provide a circuit board assembly, a method for manufacturing the same and applications thereof, wherein the circuit board manufactured by the method has a better manufacturing accuracy.
Another object of the present invention is to provide a circuit board assembly, a method of manufacturing the same, and applications thereof, wherein the circuit board with better accuracy can reduce assembly tolerances in subsequent assembly processes.
Another object of the present invention is to provide a circuit board assembly, a method of manufacturing the same, and applications thereof, wherein the circuit board is manufactured at a low cost.
It is another object of the present invention to provide a circuit board assembly, method of manufacture and use thereof, wherein the circuit board assembly is a multi-layer structure, and no structural cooperation between the layers is required to reduce assembly tolerances.
Another object of the present invention is to provide a circuit board assembly, a method for manufacturing the same, and a use thereof, wherein no structural cooperation is required between the layers of the circuit board assembly, and no space is required for a connecting member, thereby facilitating miniaturization of the circuit board assembly.
Another object of the present invention is to provide a circuit board assembly, a method of manufacturing the same, and an application of the same, wherein the circuit board assembly does not require a step-by-step assembling and aligning for each layer during the manufacturing process, which is advantageous for improving the production efficiency.
It is a further object of the present invention to provide a circuit board assembly, a method of manufacturing the same and applications thereof, by which the flexibility of the structural design of the circuit board assembly can be improved.
Another object of the present invention is to provide a circuit board assembly, a method of manufacturing the same, and applications thereof, wherein the circuit board assembly has a better structural strength by the manufacturing method.
Another object of the present invention is to provide a circuit board assembly, a method for manufacturing the same, and applications thereof, wherein the circuit board assembly can be applied to a TOF camera module in which lightness and thinness are sought.
According to an aspect of the present invention, there is provided a method of manufacturing a circuit board assembly, comprising the steps of:
forming a first circuit layer on an upper surface of a substrate;
forming a conductive heat dissipation part by forming a first conductive layer on the upper side of the first circuit layer, wherein the first conductive layer is formed in a plurality of second forming channels, and the heat dissipation part is formed in at least one of the second forming channels, wherein the cross section of the first conductive layer part corresponding to the second forming channel forming the heat dissipation part is larger than the cross sections of the first conductive layer parts corresponding to the other second forming channels, wherein the heat dissipation part has a first surface and a second surface, wherein the first surface is exposed for supporting an electronic element, and the second surface can be exposed for dissipating heat; and
and a first insulating part is integrally formed on the first circuit layer and the first conductive layer, wherein at least the first conductive layer penetrates through the first insulating part in the height direction.
According to some embodiments of the invention, the heat dissipation portion is formed at least in part of the first conductive layer and at least in part of the first wiring layer.
According to some embodiments of the invention, at least a portion of the first conductive layer is overlapped with at least a portion of the first line layer.
According to some embodiments of the invention, in the above method, further comprising a step of:
and removing the substrate to expose a lower surface of the first circuit layer.
According to some embodiments of the invention, in the above method, further comprising the step of:
forming an isolation layer on an upper surface of the substrate;
forming a first bonding layer on an upper surface of the isolation layer; and
and forming the first circuit layer on an upper surface of the first bonding layer.
According to some embodiments of the invention, in the above method, further comprising the step of:
arranging a first dry film on the upper surface of the first bonding layer;
exposing a portion of the first dry film through a first mask;
removing the exposed first dry film to form at least one first molding channel between the unexposed first dry film; and
and forming the first circuit layer in the first forming channel.
According to some embodiments of the invention, in the above method, further comprising the step of:
disposing the second dry film on the upper surface of the first dry film and the upper surface of the first circuit layer;
exposing at least a portion of the second dry film through a second mask;
removing the exposed second dry film to form the second molding channel between the unexposed second dry film; and
forming the first conductive layer between the second forming channels.
According to some embodiments of the invention, in the above method, further comprising the step of:
integrally forming the first insulating portion on the first circuit layer and the first conductive layer, wherein the first insulating portion covers an upper surface of the first conductive layer; and
and reducing the height of the first insulating layer until the upper surface of the first conductive layer is exposed.
According to some embodiments of the invention, further comprising the steps of:
the heat dissipation part is formed in a mode that a second circuit layer is formed on the upper side of the first conductive layer, wherein the heat dissipation part is formed on at least part of the second circuit layer and at least part of the first conductive layer, the second circuit layer is formed in a plurality of third forming channels, at least part of the heat dissipation part is formed in at least one third forming channel, and the cross section of the part, corresponding to the third forming channel, of the heat dissipation part is larger than the cross section of the part, corresponding to the other third forming channels, of the second circuit layer.
According to some embodiments of the invention, the heat sink portion is formed over at least a portion of the second circuit layer, at least a portion of the first conductive layer, and at least a portion of the first circuit layer.
According to some embodiments of the invention, the first line layer, the first conductive layer and the second line layer at least partially overlap each other.
According to some embodiments of the invention, in the above method, further comprising the step of:
forming a second bonding layer on at least a portion of said upper surface of said first conductive layer and at least a portion of said upper surface of said first insulating portion; and
forming the second circuit layer on an upper surface of the second bonding layer, wherein the second circuit layer is at least partially conductively connected to the first conductive layer.
According to some embodiments of the invention, further comprising the steps of:
forming the heat dissipation part in a manner of forming a second conductive layer on the upper side of the second circuit layer, wherein the second conductive layer is formed in a plurality of fourth forming channels, at least a part of the heat dissipation part is formed in at least one of the fourth forming channels, and the cross section of the part of the second conductive layer corresponding to the fourth forming channel forming the heat dissipation part is larger than the cross section of the part of the second conductive layer corresponding to the other fourth forming channels; and
and a second insulating part is integrally formed on the second circuit layer and the second conducting layer, wherein at least part of the second conducting layer penetrates through the second insulating part in the height direction.
According to some embodiments of the present invention, at least a part of the first wiring layer, at least a part of the first conductive layer, at least a part of the second wiring layer, and at least a part of the second conductive layer overlap each other in a height direction, and the heat dissipation portion is formed in the portion of the first wiring layer, the first conductive layer, the second wiring layer, and the second conductive layer that overlap each other.
According to some embodiments of the invention, further comprising the steps of:
forming the heat sink portion by forming at least a portion of a third circuit layer on an upper surface of the second conductive layer, wherein the heat sink portion is formed on at least a portion of the second conductive layer and at least a portion of the third circuit layer, wherein the third circuit layer is formed with a plurality of fifth forming channels, and at least a portion of the heat sink portion is formed with at least one of the fifth forming channels, wherein a cross section of the third circuit layer portion corresponding to the fifth forming channels forming the heat sink portion is larger than cross sections of the third circuit layer portions corresponding to other fifth forming channels
According to some embodiments of the invention, at least a part of the first conductive layer, at least a part of the second wiring layer, at least a part of the second conductive layer, and at least a part of the third wiring layer overlap each other in a height direction.
According to some embodiments of the invention, further comprising the steps of:
forming a protective layer covering the third circuit layer and the second insulating layer; and
removing the protective layer after removing the substrate.
According to another aspect of the present invention, there is provided a circuit board assembly manufactured by a manufacturing method as described above.
According to some embodiments of the present invention, a line width a and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:
a is more than or equal to 30 mu m and less than or equal to 150 mu m; and B is more than or equal to 30 mu m and less than or equal to 150 mu m.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
the floodlight is used for emitting light to a shot object; and
a receiving unit, wherein the receiving unit is used for receiving a reflected light reflected by the photographed object, and obtaining the depth information of the photographed object based on the information of the transmitted light and the reflected light, wherein the floodlight comprises a light emitting element and a circuit board assembly according to the above manufacturing method, wherein the light emitting element is conductively connected to the heat dissipation part of the circuit board assembly.
According to another aspect of the present invention, there is provided an electronic device comprising:
the camera module comprises an electronic equipment body and the camera module, wherein the camera module is arranged on the electronic equipment body.
According to some embodiments of the invention, the electronic device comprises a camera module, a receiving unit and an assembly body, wherein the camera module is assembled into a whole by the assembly body, and the floodlight and the camera module are jointly mounted on the electronic device body.
According to another aspect of the present invention, there is provided a luminaire comprising:
a light emitting element;
a circuit board assembly manufactured by the above-described manufacturing method; and
a bracket, wherein the bracket forms an optical window, the light emitting element is conductively coupled to the circuit board assembly, and the bracket is coupled to the circuit board assembly.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
a floodlight according to the above; and
a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical path for light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.
According to another aspect of the present invention, there is provided an electronic device comprising:
a floodlight according to the above;
an electronic device body; and
a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the circuit board assembly of the floodlight is conductively connected to the main circuit board.
According to some embodiments of the invention, the electronic device comprises a camera module, a receiving unit and an assembly body, wherein the camera module is assembled into a whole by the assembly body, and the floodlight and the camera module are jointly mounted on the electronic device body.
According to another aspect of the present invention, there is provided a luminaire comprising:
a light emitting element;
a circuit board assembly manufactured by the above-described manufacturing method;
a support, wherein said support forms an optical window, said light emitting element is conductively coupled to said circuit board assembly, said support is coupled to said circuit board assembly; and
a flexible wiring board, wherein said flexible wiring board is conductively connected to said circuit board assembly.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
a floodlight according to the above; and
a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive component and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive component for photoelectric conversion, the photosensitive component is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.
According to another aspect of the present invention, there is provided a circuit board assembly including a first wiring layer, a first conductive layer, a first insulating layer, a conductive heat sink member and a heat sink member having at least two second forming positions, wherein the first conductive layer is formed on the first wiring layer, the first insulating layer is integrally formed on the first wiring layer and the first conductive layer, wherein the first conductive layer is formed at the second forming positions, and at least one of the second forming positions forms at least a part of the heat sink member, wherein a cross section of a portion of the first conductive layer corresponding to the second forming position forming the heat sink member is larger than cross sections of portions of the first conductive layer corresponding to other second forming positions, wherein the heat sink member has a first surface and a second surface, wherein the first surface is exposed, for supporting an electronic component, said second surface being capable of being exposed for dissipating heat.
According to some embodiments of the invention, the heat dissipation portion is formed at the first conductive layer and the first wiring layer.
According to some embodiments of the invention, the circuit board assembly further comprises a second circuit layer and at least two third forming positions, wherein the second circuit layer is formed on the upper side of the first conductive layer and is formed at the third forming positions, at least one of the third forming positions forms at least part of the heat dissipation part, and the cross section of the second circuit layer part corresponding to the third forming position forming the heat dissipation part is larger than the cross section of the second circuit layer part corresponding to the other third forming positions.
According to some embodiments of the present invention, the heat dissipation portion is formed on the second circuit layer, the first conductive layer, and the first circuit layer portion which overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.
According to some embodiments of the present invention, the circuit board assembly further includes a second conductive layer and at least two fourth forming positions, wherein the second conductive layer is formed on the upper side of the second circuit layer and formed at the fourth forming positions, and at least one of the fourth forming positions forms at least part of the heat dissipation portion, wherein the cross section of the portion of the second conductive layer corresponding to the fourth forming position forming the heat dissipation portion is larger than the cross sections of the portions of the second conductive layer corresponding to the other fourth forming positions.
According to some embodiments of the present invention, the heat dissipation portion is formed on the first conductive layer, the second wiring layer, and the second conductive layer portion which overlap in a height direction.
According to some embodiments of the present invention, the circuit board assembly further includes a third circuit layer and at least two fifth forming positions, wherein the third circuit layer is formed on the second conductive layer and formed at the fifth forming positions, and at least one of the fifth forming positions forms at least part of the heat sink portion, wherein the cross section of the third circuit layer portion corresponding to the fifth forming position forming the heat sink portion is larger than the cross sections of the third circuit layer portions corresponding to the other fifth forming positions.
According to some embodiments of the present invention, the heat dissipation portion is formed at the location of the first conductive layer, the second wiring layer, the second conductive layer, and the third wiring layer which overlap in the height direction.
According to some embodiments of the present invention, the circuit board assembly further has at least two first molding positions, wherein the first circuit layer is molded at the first molding positions, and at least one of the first molding positions forms at least a part of the heat dissipation portion, wherein a cross section of the first circuit layer portion corresponding to the first molding position where the heat dissipation portion is formed is larger than cross sections of the first circuit layer portions corresponding to other first molding positions.
According to some embodiments of the invention, the circuit board assembly further comprises a second solder mask layer, wherein the second solder mask layer covers at least a portion of the second insulating portion.
According to some embodiments of the invention, the circuit board assembly further comprises a first solder mask layer, wherein the first solder mask layer covers at least a portion of the first insulating portion.
According to some embodiments of the present invention, a line width a and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:
a is more than or equal to 30 mu m and less than or equal to 150 mu m; and B is more than or equal to 30 mu m and less than or equal to 150 mu m.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
the floodlight is used for emitting light to a shot object; and
a receiving unit, wherein the receiving unit is used for receiving a reflected light ray reflected by the photographed object, and obtaining the depth information of the photographed object based on the information of the transmitted light ray and the reflected light ray, wherein the floodlight comprises a light-emitting element and a circuit board assembly according to the above, wherein the light-emitting element is conductively connected to the heat dissipation part of the circuit board assembly. .
According to another aspect of the present invention, there is provided an electronic device comprising:
the TOF camera module is arranged on the electronic equipment body.
According to some embodiments of the invention, the electronic device comprises a camera module, a receiving unit and an assembly body, wherein the camera module is assembled into a whole by the assembly body, and the floodlight and the camera module are jointly mounted on the electronic device body.
According to another aspect of the present invention, there is provided a luminaire comprising:
a light emitting element;
a circuit board assembly according to the above, and
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
a floodlight according to the above; and
a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical path for light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.
According to another aspect of the present invention, there is provided an electronic device comprising:
a floodlight according to the above;
an electronic device body; and
a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the conductive part of the circuit board assembly of the floodlight is conductively connected to the main circuit board.
According to some embodiments of the invention, the electronic device comprises a camera module, a receiving unit and an assembly body, wherein the camera module is assembled into a whole by the assembly body, and the floodlight and the camera module are jointly mounted on the electronic device body.
According to another aspect of the present invention, there is provided a luminaire comprising:
a light emitting element;
a circuit board assembly according to the above;
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly; and
a flexible wiring board, wherein the flexible wiring board is conductively connected to the conductive portion of the circuit board assembly.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
a floodlight according to the above; and
a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive element and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive element for photoelectric conversion, the photosensitive element is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.
Drawings
Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to a preferred embodiment of the present invention.
Fig. 2A, fig. 2B, fig. 2C, fig. 2D, fig. 2E, fig. 2F, fig. 2G, fig. 2H, fig. 2I, fig. 2J, fig. 2K, fig. 2L, fig. 2M, fig. 2N, fig. 2O, fig. 2P, and fig. 2Q are schematic manufacturing process diagrams of a circuit board assembly according to a preferred embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a circuit board assembly according to a preferred embodiment of the invention.
FIG. 4 is a TOF camera module with the circuit board assembly according to a preferred embodiment of the present invention.
Fig. 5 is a schematic diagram of an electronic device with the TOF camera module according to a preferred embodiment of the invention.
Fig. 6A is a schematic view of a floodlight according to a preferred embodiment of the invention.
Fig. 6B is a schematic diagram of a floodlight according to a preferred embodiment of the invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Referring to fig. 1, there is shown a preferred embodiment of a circuit board assembly 1 according to the present invention.
In fig. 1, a multilayer circuit board assembly 1 is taken as an example, and it can be understood by those skilled in the art that the circuit board assembly 1 can be a single-layer board or a multilayer board. The circuit board assembly 1 has an upper surface, wherein the upper surface of the circuit board assembly 1 can be used for supporting at least one electronic component, and the electronic component can transmit an electrical signal through the circuit board assembly 1 and can also dissipate heat through the circuit board assembly 1, so as to prevent heat from accumulating in the electronic component and affecting the normal operation of the electronic component.
The circuit board assembly 1 has a good heat dissipation performance.
The circuit board assembly 1 includes at least a
The
The
The
In some examples of the present invention, the first surface of the
In other examples of the present invention, the first surface of the
In other examples of the present invention, the first surface of the
In other examples of the present invention, the first surface of the
Preferably, the
In this example, the circuit board assembly 1 includes a
It is understood that the first insulating
The
That is, the conductive portions of the
The
Further, at least a part of the upper surface of the first
The circuit board assembly 1 further includes the
In another aspect, the circuit board assembly 1 has at least two first forming positions, wherein the
Further, the circuit board assembly 1 has at least two second forming positions, wherein the first
Further, the cross sections of the portions of the first
On the other hand, the circuit board assembly 1 has at least two first positions, wherein the first positions are used for molding the first insulating
The first position penetrates the
Further, the circuit board assembly 1 may further include a
At least a portion of the
The
It is understood that, in some embodiments of the present invention, the
In other examples of the present invention, the
Preferably, the
Further, the circuit board assembly 1 further includes a second
The second insulating
A part of the second insulating
A portion of the second insulating
Further, at least a part of the upper surface of the second
Further, the circuit board assembly 1 has at least two fourth forming positions, wherein the second
Further, the cross sections of the portions of the
Preferably, the
On the other hand, the circuit board assembly 1 has at least two second positions for molding the first insulating
The second locations are separated by at least a portion of the
The first position and at least part of the second position coincide.
The
When the electronic component is supported on the upper surface of the
On the other hand, the circuit board assembly 1 has at least two third positions for molding the first insulating
The second molding positions are separated by at least a portion of the
The second position and at least part of the third position coincide.
Further, the circuit board assembly 1 may further include a
At least a portion of the
The circuit board assembly 1 has at least two fourth positions, wherein the fourth position provides a molding position, a portion of the fourth position is located on the
The second fourth locations are separated by at least a portion of the
The second position and at least part of the third position coincide.
The
On the other hand, the circuit board assembly 1 has at least two fifth forming positions, wherein the
In other words, the cross-sectional areas of the first molding position, the second molding position, the third molding position, the fourth molding position and the fifth molding position corresponding to the heat dissipation portion are larger than the cross-sectional areas of the other first molding position, the second molding position, the third molding position, the fourth molding position and the fifth molding position.
The electronic component has a front surface and a back surface, wherein the back surface of the electronic component is communicably connected to the upper surface of the
It is understood that the
Alternatively, the electronic element may be a light emitting element.
The first surface of the
Referring to fig. 2A to 2Q, a preferred embodiment of a method of manufacturing the circuit board assembly 1 according to the present invention is shown.
The circuit board assembly 1 manufactured by the manufacturing method not only has better heat dissipation performance and electrical conductivity, but also is suitable for manufacturing the miniaturized circuit board assembly 1. That is, with the circuit board assembly 1, it is suitable to manufacture the circuit board assembly 1 having a smaller size.
Further, the circuit board assembly 1 manufactured by the manufacturing method has a better manufacturing precision, which is beneficial to the performance of the circuit board assembly 1 on one hand and the reduction of assembly tolerance in subsequent assembly on the other hand.
It is more worth mentioning that when the circuit board assembly 1 is a multi-layer structure, no structural cooperation is required between layers to reduce assembly tolerance, and no space is required to be reserved for the connecting members between layers, thereby facilitating miniaturization of the circuit board assembly 1.
Furthermore, when the circuit board assembly 1 is a multi-layer structure, it is not necessary to gradually assemble and align each layer, which is beneficial to improving the production efficiency and the overall product yield.
Specifically, the manufacturing method of the circuit board assembly 1 includes the steps of:
(a) forming a
(b) forming a first
(c) a first insulating
It is understood that a portion of the first insulating
According to an embodiment of the present invention, further comprising a step (d):
the
At least part of the conductive portion of the circuit board assembly 1 can directly transmit heat from an electronic component attached to an upper surface of the circuit board assembly 1 to a lower surface of the circuit board assembly 1 in a height direction by means of heat conduction, and then dissipate the heat to the outside.
Referring to fig. 2A, in the step (a), the method further comprises the following steps:
forming an
forming a
the
The
The
The
Further, referring to fig. 2B, in the above method, the following steps are further included:
forming a first
exposing a portion of the first
removing the exposed first
the
It is understood that the first
The first molding passage 100 corresponds to the first molding position.
It is understood that the
Further, referring to fig. 2C and 2D, the first
The shape and structure of the first
The first
The second
Further, in the above manufacturing method, the method further includes the steps of:
disposing the second
exposing at least a portion of the second
removing the exposed second
the first
Preferably, the upper surface of the first
The second molding passage 200 corresponds to the second molding position.
Referring to fig. 2E and 2F, after forming the first
According to an embodiment of the present invention, wherein the step (c) further comprises the steps of:
integrally molding the insulating
the height of the first insulating
According to an embodiment of the present invention, wherein the step (c) further comprises the steps of:
the insulating
It is understood that the insulating
Further, in order to manufacture the circuit board assembly 1 having a plurality of layers of circuits, more circuits may be formed on the circuit board assembly 1 at present, and the heat dissipation of the whole circuit board assembly 1 may be ensured.
Referring to fig. 2G and 2H, a
The
The step of forming the
forming a third
exposing a portion of the third
removing the exposed third
the
It is understood that the third
The third molding passage 300 corresponds to the third molding position.
It is understood that the
That is, the first mentioned manufacturing method further includes a step, wherein the step is located after the step (c).
Forming a
the
Further, in the above method, at least a part of the upper surface of the
Referring to fig. 2I, fig. 2J, fig. 2K, and fig. 2L, according to some embodiments of the present invention, wherein in the above method, further comprising the steps of:
forming a second
a second insulating
It is understood that the fact that the second
According to some embodiments of the invention, wherein in the above method, further comprising the step of:
integrally molding the second insulating
the height of the second insulating
According to some embodiments of the invention, wherein in the above method, further comprising the step of:
the second insulating
The second
According to some embodiments of the invention, in the above manufacturing method, the method further comprises the following steps:
disposing a fourth dry film 440 on the upper surface of the unexposed third
exposing at least a portion of the fourth dry film 440 through the fourth mask;
removing the exposed fourth dry film 440 to form a fourth molding channel 400 between the unexposed fourth dry film 440; and
the second
The fourth forming tunnel 400 corresponds to the fourth forming position.
The shape and structure of the second
The second
The fourth dry film 440 may be implemented as a photoresist, and then a partial region of the photoresist is exposed through the fourth mask, and then the exposed fourth dry film 440 is removed by development to form the fourth molding passage 400 between the unexposed portions of the fourth dry film 440, and then the second
Preferably, the upper surface of the third
After the second
In some embodiments of the present invention, after removing the remaining third
Referring to fig. 2M, according to some embodiments of the present invention, the method further comprises the following steps:
providing a
a
It is understood that the
Further, referring to fig. 2N, in the above method, the following steps are further included:
disposing a fifth
exposing at least a portion of the fifth
removing the exposed fifth mask to form a fifth forming
the
In some embodiments of the present invention, it is understood that the fifth
The fifth forming
It is understood that the
With reference to fig. 2O, fig. 2P and fig. 2Q, further, in the above method, the following steps are included:
forming a protective layer 550 on the upper surface of the
removing the
removing the
removing the protective layer 550; and
the
In this way, a complete one of the circuit board assemblies 1 can be obtained.
According to some embodiments of the present invention, the
The electronic component may be placed on the upper surface of the
The
It is understood that the manner of removing the
According to some examples of the present invention, the protective layer 550 may not be formed on the upper surface of the
Further, according to some embodiments of the present invention, the manufacturing method may further include the steps of:
forming an upper solder resist
a lower solder resist
Further, according to some examples of the invention, the manufacturing method may further include the steps of:
performing a surface treatment on the exposed upper surface of the
the exposed lower surface of the
It will be understood by those skilled in the art that the number of layers of the circuit board assembly 1 illustrated herein is not intended to limit the present invention, and the circuit board assembly 1 may include one
According to some embodiments of the present invention, the line width a of the circuit board assembly 1 manufactured by the manufacturing method may be up to 30 μm to 150 μm, and the line pitch B may be up to 30 μm to 150 μm.
It is understood that the circuit board assembly 1 manufactured in this manner can ensure a certain processing accuracy in forming the layers, for example, the
Further, the connection of the layers in the circuit board assembly 1 does not need to use other connecting members, like in the conventional PCB, via holes need to be formed to facilitate the communication between the layers, and the circuit board assembly 1 provided by the present invention does not need to reserve space for the via holes, so as to facilitate the reduction of the size of the whole circuit board assembly 1.
Further, the layers of the circuit board assembly 1 do not need to be assembled step by step, so that the assembly tolerance between the circuit board assemblies 1 is reduced, for each layer of the circuit board assembly 1, the shape of the conductive part of each layer is controlled through the position of the forming channel, the manufacturing precision of the conductive part is high, and the assembly tolerance of the whole circuit board assembly 1 is reduced.
It is understood that the circuit board assembly 1 may be designed in different structures and layouts according to the requirements and sizes, and the circuit board assembly 1 may also be cut into small circuit board assemblies 1 to meet different requirements, or in this way, a plurality of circuit board assemblies 1 may be formed at a time.
According to another aspect of the present invention, a method of manufacturing a circuit board assembly includes the steps of:
forming at least two first forming spaces by overlapping the
at least a portion of the first molding space is filled to form the first insulating
It will be appreciated that the circuit board assembly 1 may also be applied to a structured light camera module.
Referring to fig. 3, there is shown another embodiment of the circuit board assembly 1 according to the present invention. The present embodiment is different from the above-described embodiments in that in the present embodiment, each of the wiring layers 10 is overlapped with the
In other words, the circuit board assembly 1 manufactured by the above-described manufacturing method, the
The
Further, for the whole circuit board assembly 1, the
Further, in the circuit board assembly 1 manufactured by the above manufacturing method, the first
Referring to FIG. 4, a preferred embodiment of a
The
The receiving
The receiving
The
In the present embodiment, the electronic component is implemented as a
The
The
The
Further, in some examples of the invention, the
It should be noted that the vcsel can normally operate only when the vcsel needs to be maintained within a specific temperature range, that is, the heat dissipation performance of the pcb is very important to the operating state of the vcsel. Since the
Further, a back surface of the vertical cavity surface emitter is a cathode, and a front surface of the vertical cavity surface emitter is an anode, when the vertical cavity surface emitter is respectively communicated with the
According to another aspect of the present invention, there is provided a heat dissipating method, comprising the steps of:
guiding heat generated by an electronic component to be transferred from a lower surface of the electronic component to an upper surface of a circuit board assembly 1;
directly thermally conducting the heat in a height direction of the circuit board assembly 1 to a lower surface of the circuit board assembly 1; and
dissipating heat outwards.
According to an embodiment of the present invention, in the above method, heat is transferred from a
According to an embodiment of the present invention, in the above method, heat is transferred from the upper surface of the circuit board assembly 1 to a lower surface of a
Referring to fig. 5, an
In other examples of the present invention, the
The
In other examples of the present invention, the
It is understood that the
Referring to fig. 6A, according to another aspect of the present invention, there is provided a
The
The receiving
The
Further, at least a part of the
The
Referring to fig. 6B, according to another aspect of the present invention, there is provided a
The
The receiving
The
The
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
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