Flexible circuit board and display device
阅读说明：本技术 一种柔性电路板及显示装置 (Flexible circuit board and display device ) 是由 徐宁 于 2019-11-11 设计创作，主要内容包括：本发明实施例提供一种柔性电路板及显示装置,通过在柔性电路板的凹槽内形成功能层,利用该功能层作为对位标记,避免了丝印线本身的厚度容易造成丝印线周围区域的FPC与其他组件安装时的接触不良。所述柔性电路板设有至少一个标记区,所述标记区包括至少一个凹槽；所述凹槽内设有用填充物形成的功能层。(The embodiment of the invention provides a flexible circuit board and a display device, wherein a functional layer is formed in a groove of the flexible circuit board and is used as an alignment mark, so that poor contact between an FPC (flexible printed circuit) in the area around a silk-screen line and other components during installation due to the thickness of the silk-screen line is avoided. The flexible circuit board is provided with at least one marking area, and the marking area comprises at least one groove; and the functional layer formed by fillers is arranged in the groove.)
1. A flexible circuit board is characterized in that the flexible circuit board is provided with at least one marking area,
the marking zone comprises at least one groove;
and the functional layer formed by fillers is arranged in the groove.
2. The flexible circuit board of claim 1, wherein the groove has a depth H1 in a thickness direction of the flexible electric board, and the mark region has a thickness H2 in the thickness direction of the flexible electric board, wherein: h1 < H2.
3. The flexible circuit board of claim 2, wherein the functional layer has a thickness H3 in a direction away from the groove bottom, wherein: h3 is less than or equal to H1.
4. The flexible circuit board of claim 2,
the groove is long strip or the combination thereof.
5. The flexible circuit board of claim 1,
the filler is white ink or colored pigment.
6. A method of manufacturing a flexible circuit board as claimed in claim 1, comprising:
forming the groove in the marking area of the flexible circuit board;
and filling the filler into the groove to form the functional layer.
7. The method of manufacturing a flexible circuit board according to claim 6, wherein the step of filling the filler in the groove to form the functional layer comprises:
calculating the volume of the groove;
and filling white ink or color pigment which is less than or equal to the volume of the groove into the groove according to the volume of the groove.
8. The method of manufacturing a flexible circuit board according to claim 6,
the actual width of the groove along the first direction is W1, the design width is W2, wherein:
0.01mm≤(W2-W1)/2≤0.02mm；
the actual width of the groove in the second direction is W3, and W3 > W1, the first and second directions being perpendicular to each other.
9. The method of manufacturing a flexible circuit board according to claim 6, wherein the step of filling the filler in the groove to form the functional layer comprises:
and filling white ink or color pigment into the groove by using a screen printing mode, so that the thickness of the formed functional layer is less than or equal to the depth of the groove.
10. A display device characterized by comprising the flexible circuit board according to any one of claims 1 to 5.
Technical Field
The invention relates to the field of flexible circuit boards, in particular to a flexible circuit board and a display device.
Background
A Flexible Printed Circuit (FPC) is preferred because it has excellent characteristics such as light weight, thin thickness and free flexibility and folding property, and the FPC is formed by embedding a Circuit on a thin plastic sheet made of mylar or a support base material.
When the module assembly is installed on the FPC, a positioning mark is generally required to be designed on the FPC, and the positioning mark is used for installing the module assembly as a position reference standard, so that errors in the position of the installed module assembly are avoided. In the prior art, a mark line or a copper line is generally added to the FPC as an alignment mark.
If the marking line is used as the alignment mark, the deviation of the mounted module assembly is easily caused due to the manufacturing tolerance of the marking line; and because of the thickness of the marking line, when the FPC has higher requirements on the planeness, the FPC in the area around the marking line is easy to have poor contact with other components when the FPC is installed because of the thickness of the marking line.
If the copper wires are used as the alignment marks, the copper wires arranged on the FPC are not easy to see due to the fact that the color of the copper wires is close to that of the FPC, and therefore great difficulty is brought to alignment.
Disclosure of Invention
The embodiment of the invention provides a flexible circuit board and a display device, wherein a functional layer is formed in a groove of the flexible circuit board and is used as an alignment mark, so that poor contact between an FPC (flexible printed circuit) in the area around a silk-screen line and other components during installation due to the thickness of the silk-screen line is avoided.
In a first aspect, embodiments of the present invention provide a flexible circuit board, the flexible circuit board being provided with at least one marking area,
the marking zone comprises at least one groove;
and the functional layer formed by fillers is arranged in the groove.
Through the flexible circuit board, the functional layer is arranged in the groove of the mark area, so that the functional layer can be used as an alignment mark, and when the flexible circuit board around the functional layer is installed with other components, the flexible circuit board around the functional layer is completely contacted with other components. Therefore, poor contact between the flexible circuit board in the area around the alignment mark and other components during installation when the alignment mark is arranged on the flexible circuit board is avoided.
In an alternative implementation, the depth of the groove along the thickness direction of the flexible electric board is H1, and the thickness of the mark region along the thickness direction of the flexible electric board is H2, wherein: h1 < H2.
In an alternative implementation, the functional layer has a thickness H3 in a direction away from the groove bottom, wherein: h3 is less than or equal to H1.
In an alternative implementation, the grooves are elongated or a combination thereof.
In an alternative implementation, the filler is a white ink or a colored pigment.
In a second aspect, an embodiment of the present invention further provides a manufacturing method for forming a flexible circuit board as described in any optional implementation manner of the first aspect, where the method includes:
forming the groove in the marking area of the flexible circuit board;
and filling the filler into the groove to form the functional layer.
According to the flexible circuit board manufactured by the method, the functional layer is arranged in the groove of the mark area, so that the functional layer can be used as an alignment mark, and when the flexible circuit board around the functional layer is installed with other assemblies, the flexible circuit board around the functional layer is completely contacted with the other assemblies. Therefore, poor contact between the flexible circuit board in the area around the alignment mark and other components during installation when the alignment mark is arranged on the flexible circuit board is avoided.
In an alternative implementation, the filling the filler into the groove to form the functional layer includes:
calculating the volume of the groove;
and filling white ink or color pigment which is less than or equal to the volume of the groove into the groove according to the volume of the groove.
In an alternative implementation, the actual width of the groove along the first direction is W1, and the design width is W2, wherein:
0.01mm≤(W2-W1)/2≤0.02mm；
the actual width of the groove in the second direction is W3, and W3 > W1, the first and second directions being perpendicular to each other.
In an alternative implementation, the filling the filler into the groove to form the functional layer includes:
and filling white ink or color pigment into the groove by using a screen printing mode, so that the thickness of the formed functional layer is less than or equal to the depth of the groove.
In a third aspect, an embodiment of the present invention further provides a display device, including the flexible circuit board in any one of the optional implementation manners provided in the first aspect.
One or more technical solutions provided in the present application have at least the following technical effects or advantages:
the functional layer is arranged in the groove of the marking area of the flexible circuit board, so that the functional layer can be used as an alignment mark, and when the flexible circuit board around the functional layer is installed with other components, the flexible circuit board around the functional layer is completely contacted with other components. Therefore, poor contact between the flexible circuit board in the area around the alignment mark and other components during installation when the alignment mark is arranged on the flexible circuit board is avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another structure of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another structure of a flexible printed circuit board according to an embodiment of the invention;
FIG. 4 is a schematic diagram of another structure of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of another structure of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another structure of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 7 is a schematic flow chart illustrating a method of manufacturing a flexible circuit board according to an embodiment of the present invention;
FIG. 8 is a schematic flow chart illustrating a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention;
FIG. 9 is a schematic flow chart of a method for manufacturing a flexible circuit board according to an embodiment of the present invention;
FIG. 10 is a schematic flow chart illustrating a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention;
FIG. 11 is a schematic flow chart illustrating a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention;
FIG. 12 is a schematic flow chart illustrating a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention;
wherein:
1-a flexible circuit board; 2-a groove; 3-a label region; 4-a first metal conductive layer; 5-a support layer; 6-a second metal conductive layer; 7-a first adhesive layer; 8-a first insulating layer; 9-a functional layer; 10-a second insulating layer; 11-a second adhesive layer; 12-first via.
Detailed Description
The technical solutions of the embodiments of the present invention are described in detail with reference to the drawings and the specific embodiments, and it should be understood that the specific features of the embodiments and the embodiments of the present invention are detailed descriptions of the technical solutions of the embodiments of the present invention, and are not limited to the technical solutions of the embodiments of the present invention, and the technical features of the embodiments and the embodiments of the present invention may be combined with each other without conflict.
In order to avoid poor contact between the FPC around the silk-screen lines and other components when the FPC is mounted on the components, as shown in fig. 4, the
More specifically, as shown in fig. 4, the
It should be added that the first metal conductive layer and the second metal conductive layer can be made of copper foil, and can also be made of other conductive metals, such as aluminum and metal oxide. The first metal conductive layer and the second metal conductive layer may be formed by vacuum deposition, magnetron sputtering, lamination, or the like. Wherein, the supporting layer is made of polyimide or polyester film as a base material.
The
Through the
In an alternative implementation, in order to facilitate filling of the filler into the
In particular, as shown in fig. 6, the depth of the
With the flexible circuit board, when the depth of the
In an alternative embodiment, in order to further avoid poor contact between the flexible printed circuit board around the functional layer and other components during mounting, the
Through above-mentioned flexible circuit board, because of the functional layer has the filler of packing in the recess to form, and the functional layer is along deviating from the depth that the thickness that groove bottom was put is less than or equal to the recess, the functional layer does not stand out to the mark district of flexible circuit board outside, does not stand out to the flexible circuit board from the functional layer. Therefore, after the functional layer of the flexible circuit board is used as the alignment mark, the flexible circuit board in the area around the functional layer can be completely contacted with other components.
In an alternative implementation, as shown in fig. 1, the
Of course, the groove may be long, for example, when only one alignment mark line is required for a module mounted on the flexible circuit board. It should be noted that, when the module mounted on the flexible circuit board needs the angular alignment mark, the groove at least includes two strip-shaped grooves, as shown in fig. 2, the two strip-shaped grooves form a preset angle with each other, and the preset angle is set as required, for example, when the module is 60 ° from the horizontal direction, the angle between the two strip-shaped grooves can be set to 60 °, so as to facilitate the module mounting. As shown in fig. 3, in order to mount the reinforcing steel sheet, the connector patch or the conductive adhesive tape on the flexible circuit board, two elongated grooves may be combined into an L shape, and the two L-shaped grooves may be disposed at diagonal positions, so as to facilitate mounting of the reinforcing steel sheet, the connector patch or the conductive adhesive tape.
In an alternative embodiment, the filler is a white ink or a colored pigment in order to make it easier to see when the functional layer is used as a register mark.
Through above-mentioned flexible circuit board, when the filler is white printing ink or colored pigment, when the functional layer that the filler formed was as the alignment mark, easily by operating personnel or robot discernment to be convenient for operating personnel or robot utilize the functional layer as the alignment mark when, install the module on flexible circuit board.
In a second aspect, in order to form a flexible circuit board as in any one of the optional implementations of the first aspect, an embodiment of the present disclosure further provides a method for manufacturing a flexible circuit board, as shown in fig. 7, the method includes:
step 101: forming a groove in a marking area of the flexible circuit board;
step 102: and filling the filler into the groove to form the functional layer.
According to the flexible circuit board manufactured by the method, the functional layer is arranged in the groove of the mark area, so that the functional layer can be used as an alignment mark, and when the flexible circuit board around the functional layer is installed with other assemblies, the flexible circuit board around the functional layer is completely contacted with the other assemblies. Therefore, poor contact between the flexible circuit board in the area around the alignment mark and other components during installation when the alignment mark is arranged on the flexible circuit board is avoided.
Specifically, a groove is formed in the mark area on the flexible circuit board, and the groove can be formed in the following manner, in a first alternative implementation, as shown in fig. 8, step 101: forming a groove in a marking area of a flexible circuit board, comprising:
step 201: forming a first metal conductive layer on one side of the support layer;
step 202: and chemically etching the mark area of the first metal conducting layer to form a groove.
Specifically, a first metal conductive layer is disposed on one side of the supporting layer, and the first metal conductive layer may be made of copper foil, or may be made of other conductive metals, such as aluminum and metal oxide. It should be noted that, the first metal conductive layer is formed on one side of the supporting layer, and the first metal conductive layer may be formed by vacuum coating, magnetron sputtering, or lamination, for example, a lamination method is adopted in which a copper foil or other conductive metal is made into a metal conductive sheet and laminated on one side of the supporting layer. Wherein, the supporting layer is made of polyimide or polyester film as a base material.
It is also necessary to supplement that the mark area of the first metal conductive layer can be an area set by a user according to the needs.
In an alternative implementation, step 202: performing chemical etching on the mark region of the first metal conductive layer to form a groove, as shown in fig. 9, including:
step 301: covering a dry film on one surface of the first metal conducting layer, which is far away from the supporting layer;
step 302: a mask plate is arranged on a partial area on one surface of the dry film, which is far away from the supporting layer;
step 303: carrying out ultraviolet irradiation on the dry film provided with the mask plate, so that the dry film exposed in the area outside the mask plate is attached to the first metal conducting layer after a polymerization reaction is generated;
step 304: removing the mask plate on the dry film;
step 305: removing the dry film on the first metal conducting layer without generating a polymerization reaction area;
step 306: and placing the flexible circuit board, from which the dry film which does not generate the polymerization reaction is removed, into an acid solution, so that the acid solution chemically etches the first metal conductive layer exposed out of the dry film which generates the polymerization reaction to form a groove.
Specifically, cover the dry film on the one side that deviates from the supporting layer on first metal conducting layer, accessible film pressing machine presses the dry film and deviates from the one side of supporting layer on first metal conducting layer. It should be added that the dry film on the first metal conductive layer without generating the polymerization reaction region is removed, and the dry film on the first metal conductive layer without generating the polymerization reaction region can be etched away by placing the flexible circuit board into a developing solution.
It should be noted that, the widths of the mask in the first direction and the second direction in the above method are consistent with the designed widths of the grooves in the first direction and the second direction, and the shape of the mask in the above method is consistent with the designed shape of the grooves, so that when the subsequent flexible circuit board is put into an acidic solution after the dry film exposed to the region outside the mask generates polymerization reaction, the acidic solution only chemically reacts with the dry film of the region where no polymerization reaction occurs and the first metal conductive layer attached thereto, so that the sum of the widths of the formed grooves in the first direction and the second direction and the shape of the grooves conform to the grooves desired to be formed.
More specifically, in order to make the depth of the formed groove coincide with the depth of the designed groove, the depth of the formed groove may be made to coincide with the depth of the designed groove by controlling the chemical reaction time of the flexible circuit board in the acid solution, controlling the concentration of the acid solution, and the like.
It is also to be added that in an alternative implementation, as shown in fig. 1, the actual width of the groove in the first direction is W1, and the design width is W2, wherein:
0.01mm≤(W2-W1)/2≤0.02mm；
the actual width of the groove in the second direction is W3, and W3 > W1, the first and second directions being perpendicular to each other.
Specifically, if the designed width of the groove along the first direction is 0.24mm, and the actual width of the groove is 0.2mm, due to the influence of the processing tolerance when forming the groove, such as in the process of forming the groove by chemical etching, the processing tolerance of the single edge of the groove is 0.01mm to 0.02mm, further, due to the etching, the phenomenon of insufficient etching or short etching generally occurs, and therefore the tolerance is a negative value, and the width of the groove along the first direction after actual processing is 0.2mm to 0.22 mm. So that the actual width of the groove can be guaranteed to be 0.2mm to 0.22 mm. Tolerance compensation is adopted during design, etching omission or insufficient etching is avoided, and alignment deviation is generated in later alignment.
It should be further added that the first direction and the second direction are also perpendicular to the extending direction of the depth of the groove, respectively. The actual width W3 of the groove in the first direction is greater than the actual width W1 of the groove in the second direction, indicating that the sides of the groove in the first direction are the short sides of the groove and the sides of the groove in the second direction are the long sides of the groove.
And in order to facilitate the subsequent filling of the filler into the groove, step 305: the flexible printed circuit board with the mask removed is placed in an acid solution, so that the acid solution chemically etches a dry film which does not generate a polymerization reaction region and a first metal conducting layer which is attached to the dry film which does not generate the polymerization reaction region, a groove is formed, and as shown in fig. 9, the method further comprises the following steps:
step 401: removing a dry film which generates a polymerization reaction on the first metal conducting layer;
step 402: and washing the flexible circuit board with water, and drying the washed flexible circuit board.
Specifically, the flexible circuit board with the groove is placed in an alkaline solution, so that the alkaline solution etches the dry film on the first metal conducting layer, which generates a polymerization reaction, chemically, and the dry film on the first metal conducting layer is removed.
In an alternative implementation, as shown in fig. 9, step 201: forming a first metallic conductive layer on one side of the support layer and step 202: the method comprises the following steps of carrying out chemical etching on a mark region of a first metal conducting layer to form a groove, and further comprising the following steps:
step 501: forming a second metal conducting layer on one side, which is far away from the first metal conducting layer, of the supporting layer;
step 502: and a first insulating layer is bonded on one side of the second metal conducting layer, which is far away from the supporting layer.
Specifically, a second metal conductive layer is formed on the side of the support layer away from the first metal conductive layer, and the second metal conductive layer may be made of copper foil or other conductive metals, such as aluminum and metal oxide. It should be noted that, the second metal conductive layer may be formed by vacuum deposition, magnetron sputtering, or lamination, for example, a copper foil or other conductive metal is made into a metal conductive sheet and laminated on one side of the supporting layer by lamination.
In a second optional implementation manner, step 101: forming a groove in a mark region of a flexible circuit board, as shown in fig. 10, includes:
step 601: covering a mask plate in a partial area on one side of the supporting layer;
step 602: forming a first metal conducting layer in an area, which is exposed out of the mask plate, on one side of the supporting layer covering the mask plate;
step 603: removing the mask plate;
step 604: forming a second metal conducting layer on one side, which is far away from the first metal conducting layer, of the supporting layer;
step 605: and a first insulating layer is bonded on one side of the second metal conducting layer, which is far away from the supporting layer.
It should be noted that, because the first metal conductive layer is not formed in the region of the supporting layer that is shielded by the mask plate, when the first metal conductive layer is formed in the region of the supporting layer that is provided with the mask plate and is exposed outside the mask plate, the region that is shielded by the mask plate forms the groove.
By the method, the flexible circuit board is formed while the groove is formed, and the size of the formed groove is consistent with that of the mask plate, so that the width, the shape and the depth of the formed groove can be consistent with those of the designed groove by controlling the size of the mask plate.
In any of the above embodiments, the first metal conductive layer and the second metal conductive layer may be formed by vacuum deposition or magnetron sputtering.
In a third optional implementation manner, step 101: forming a groove in a mark region of a flexible circuit board, as shown in fig. 11, includes:
step 701: forming a first metal conductive layer on a portion of one side on the support layer;
step 702: forming a second metal conducting layer on one side, which is far away from the first metal conducting layer, of the supporting layer;
step 703: a first insulating layer is bonded on one side, which is far away from the supporting layer, of the second metal conducting layer;
step 704: etching a partial area on one side, which is far away from the supporting layer, of the first metal conducting layer in the direction of the first insulating layer by using a laser etching mode to form a groove;
specifically, the first metal conductive layer and the second metal conductive layer may be made of copper foil, or may be made of other conductive metals, such as aluminum and metal oxide. It should be noted that, the second metal conductive layer may be formed by vacuum deposition, magnetron sputtering, or lamination, for example, a copper foil or other conductive metal is made into a metal conductive sheet and laminated on one side of the supporting layer by lamination, so as to form the first metal conductive layer and the second metal conductive layer.
More specifically, for the convenience of processing, when laser etching is used in actual production, the depth direction of the groove formed in the first metal conductive layer is extended onto the first insulating layer, so that the depth of the new groove formed is extended from the side of the first metal conductive layer away from the support layer to the side of the first insulating layer close to the support layer. Note that the depth of the new groove extends from the depth of the groove formed in the first metal conductive layer to the side of the second metal conductive layer close to the support layer.
By the above method, in order to make the depth of the formed groove and the width of the groove in the first direction conform to the groove to be made as intended, the path of laser etching, the time of laser etching, and the power of the laser device can be adjusted.
In an alternative implementation, in step 403: washing the flexible circuit board with water, drying the washed flexible circuit board, and step 605: a first insulating layer is bonded to a side of the second metal conductive layer facing away from the support layer, as shown in fig. 9 and 10 and 11, and then:
step 801: and etching the bottom of the groove formed on the first metal conductive layer in the direction of the first insulating layer by using a laser etching mode to form a new groove, wherein the width of the new groove along the first direction and the second direction is respectively consistent with the width of the groove formed on the first metal conductive layer along the first direction and the second direction.
Specifically, for convenience of processing, when laser etching is used in actual production, the depth direction of the groove formed in the first metal conductive layer is extended onto the first insulating layer, so that the depth of the new groove formed is extended from the side of the first metal conductive layer away from the support layer to the side of the first insulating layer close to the support layer. Note that the depth of the new groove extends from the depth of the groove formed in the first metal conductive layer to the side of the second metal conductive layer close to the support layer.
In an alternative implementation, in step 403: washing the flexible circuit board with water, drying the washed flexible circuit board, and step 605: adhering a first insulating layer on the side of the second metal conductive layer away from the support layer, and step 704: etching is performed from a partial area of the side of the first metal conductive layer, which is away from the support layer, to the direction of the first insulating layer by using a laser etching method, so as to form a groove, as shown in fig. 9, fig. 10, and fig. 11, and then, the method further includes:
step 802: and a second insulating layer is bonded on one side of the first metal conducting layer, which deviates from the supporting layer, a first through hole penetrating through the groove is formed in the second insulating layer, and the length and the width of the first through hole are respectively consistent with those of the groove.
Specifically, after the second insulating layer provided with the first through hole is bonded on the first metal conducting layer, a new groove is formed after the first through hole is communicated with the groove.
In an alternative implementation, in order to form the functional layer with a thickness smaller than the depth of the groove, step 102: filling the groove with a filler to form a functional layer, as shown in fig. 12, includes:
step 901: calculating the volume of the groove;
step 902: and filling white ink or color pigment with volume less than or equal to that of the groove into the groove according to the volume of the groove.
By the above method, white ink or color pigment less than or equal to the volume of the groove is filled into the groove by calculating the volume of the groove. If the volume of the groove is calculated to be 0.5 cubic millimeter, filling the white ink or the color pigment with the volume of less than or equal to 0.5 cubic millimeter into the groove, so that the white ink or the color pigment flows in the groove after the white ink or the color pigment is filled into the groove, and the thickness of the functional layer formed by the white ink or the color pigment is less than or equal to the depth of the groove after the white ink or the color pigment is dried. Thus, in order that the thickness of the functional layer is less than or equal to the depth of the groove, the amount of white ink or color pigment filled into the groove can be controlled.
In an alternative implementation, step 102: filling the groove with filler to form a functional layer, comprising:
and filling white ink or color pigment into the groove by using a screen printing mode, so that the thickness of the formed functional layer is less than or equal to the depth of the groove.
Specifically, in the silk screen printing, a flowing solution is placed on a screen printing plate, the solution is scraped into through holes of the screen printing plate from the screen printing plate by a scraper, the solution flows into grooves from the through holes of the screen printing plate, and a functional layer is formed after the subsequent solution is dried. Therefore, in order to form the functional layer with a thickness less than or equal to the depth of the groove, the functional layer may be formed with a thickness less than or equal to the depth of the groove by controlling the number of screen printing, and the amount of white ink or color pigment used.
In a third aspect, an embodiment of the present invention further provides a display device, including the flexible circuit board in any one of the optional implementation manners provided in the first aspect.
One or more technical solutions provided in the present application have at least the following technical effects or advantages:
the functional layer manufactured by any optional embodiment is adopted, the tolerance of the functional layer along the first direction is completely determined by the tolerance of the formed groove, the flowing of the ink can be blocked in the groove, so that the screen printing precision of the ink or the colored pigment is further improved, the precision is improved to 0.02mm from the original 0.2mm, and meanwhile, the functional layer can be widely applied to various alignment marks due to the easy observation characteristic of the white ink or the colored pigment. And prior art preparation marking line is through the through-hole of screen printing plate with the filler blade coating that flows on flexible circuit board, and wherein preparation tolerance occasionally makes the through-hole of preparation screen printing plate, places the screen printing plate when treating silk screen printing position at flexible circuit, still has the risk of placing the deviation to adopt prior art's marking line to be used for installing the module, module off normal phenomenon is comparatively obvious.
The functional layer formed by any optional implementation mode of the invention has smaller tolerance, so that the functional layer formed by any optional implementation mode of the invention can avoid the deviation phenomenon of the module assembly after installation caused by the manufacturing tolerance of the marking line in the prior art.
And because the functional layer is arranged in the groove of the marking area of the flexible circuit board, the functional layer can be used as an alignment mark, and when the flexible circuit board around the functional layer is installed with other components, the flexible circuit board around the functional layer is completely contacted with other components. Therefore, poor contact between the flexible circuit board in the area around the alignment mark and other components during installation when the alignment mark is arranged on the flexible circuit board is avoided.
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