阅读说明：本技术 半导体模块 (Semiconductor module ) 是由 家入义弥 神山悦宏 于 2018-06-08 设计创作，主要内容包括：本发明的半导体模块用于将直流转换为三相交流,并将该三相交流提供至三相电机从而进行驱动,第一至第三控制信号端子Q1G、Q2G、Q3G沿第一边B1延伸的方向并排配置,使得其各自的一端靠近基板B的第一边B1,第四至第六控制信号端子Q4G、Q5G、Q6G沿第二边B2延伸的方向并排配置,使得其各自的一端靠近基板B的第二边B2。(The semiconductor module of the present invention is configured to convert a direct current into a three-phase alternating current and supply the three-phase alternating current to a three-phase motor for driving, and the first to third control signal terminals Q1G, Q2G, Q3G are arranged side by side in a direction in which the first side B1 extends such that respective one ends thereof are close to the first side B1 of the substrate B, and the fourth to sixth control signal terminals Q4G, Q5G, Q6G are arranged side by side in a direction in which the second side B2 extends such that respective one ends thereof are close to the second side B2 of the substrate B.)

1. A semiconductor module that converts direct current into three-phase alternating current and supplies the three-phase alternating current to a three-phase motor to drive the motor, comprising:

a substrate;

a power supply wiring arranged along a first side on the substrate;

a power supply terminal connected to the power supply wiring;

a first ground wiring, a second ground wiring, and a third ground wiring arranged on the substrate along a second side opposite to the first side of the substrate;

a first ground terminal connected to the first ground wiring; a second ground terminal connected to the second ground wiring; a third ground terminal connected to the third ground wiring;

first to third motor terminals connected to coils of the three-phase motor, respectively;

first to third half-bridges each formed by connecting a high-side switch and a low-side switch in series between the power supply wiring and the first to third ground wirings, respectively, and having connection points of the high-side switch and the low-side switch connected to first to third motor terminals, respectively, and connected in parallel with each other; and

first to sixth control signal terminals to which control signals for controlling operations of the high-side switches and the low-side switches of the first to third half bridges are input,

the first to third control signal terminals are arranged side by side in a direction in which the first side extends such that one end thereof is close to the first side of the substrate,

the fourth to sixth control signal terminals are arranged side by side in a direction in which the second side extends such that one end thereof is close to the second side of the substrate.

2. The semiconductor module of claim 1, further comprising:

a first control bond wire connecting a control electrode of a first high-side switch of the first half-bridge to the first control signal terminal;

a second control bond wire connecting a control electrode of a second high-side switch of the second half-bridge to the second control signal terminal;

a third control bond wire connecting a control electrode of a third low-side switch of the third half-bridge to the third control signal terminal;

a fourth control bond wire connecting a control electrode of the first low-side switch of the first half-bridge to the fourth control signal terminal;

a fifth control bond wire connecting a control electrode of the second low-side switch of the second half-bridge to the fifth control signal terminal; and

and a sixth control bond wire connecting a control electrode of the third low-side switch of the third half-bridge to the sixth control signal terminal.

3. The semiconductor module according to claim 2, characterized in that:

wherein the fourth control bonding wire is wired to pass through the first ground wiring line,

the fifth control bonding wire is wired to pass through the second ground wiring,

the sixth control bonding wire is routed to pass through the third ground wiring line.

4. The semiconductor module according to claim 2, characterized in that:

wherein the first control signal terminal is connected between the power terminal and the first motor terminal,

the second control signal terminal is connected between the first motor terminal and the second motor terminal,

the third control signal terminal is connected between the second motor terminal and the third motor terminal.

5. The semiconductor module according to claim 4, wherein:

wherein the first ground wiring is connected to the second electrode of the first low-side switch through a bonding wire,

the second ground wiring is connected to a second electrode of the second low-side switch via a bonding wire,

the third ground wiring is connected to the second electrode of the third low-side switch through a bonding wire.

6. The semiconductor module of claim 4, further comprising:

a first dummy wiring for support provided at a first corner of the substrate where the first side and the third side intersect;

a second dummy wiring for support provided at a second corner of the substrate where the first side and the fourth side intersect;

a third supporting dummy line provided in a third corner portion of the substrate where the second side and the third side intersect; and

a fourth supporting dummy wiring provided at a fourth corner of the substrate where the second side and the fourth side intersect,

since the substrate is fixed by the support member at the time of wire bonding, the upper end surfaces of the first to fourth supporting dummy wirings can be fixed by the support member at the time of wire bonding.

7. The semiconductor module of claim 1, further comprising:

and a thermistor that is disposed on the substrate near a second edge of the substrate, is positioned between the first ground wiring and the second ground wiring, or is positioned between the second ground wiring and the third ground wiring, and detects a temperature.

8. The semiconductor module according to claim 1, characterized in that:

wherein each area of the first to third ground wirings is smaller than an area of the power supply wiring.

9. The semiconductor module according to claim 8, characterized in that:

wherein the power supply terminal is disposed so as to bypass the first support dummy wiring,

the third motor terminal is disposed so as to bypass the second supporting dummy wiring,

the first ground terminal is disposed so as to bypass the third supporting dummy wiring,

the third ground terminal is disposed so as to bypass the fourth supporting dummy wiring.

10. The semiconductor module according to claim 1, characterized in that:

wherein the first to third control signal terminals are arranged side by side in a direction in which the first side extends such that one end thereof is close to the first side of the substrate,

the fourth to sixth control signal terminals are arranged side by side in a direction in which the second side extends such that one end thereof is close to the second side of the substrate.

11. The semiconductor module according to claim 10, characterized in that:

wherein the first control signal terminal is arranged between the power supply terminal and the first motor terminal,

the second control signal terminal is arranged between the first motor terminal and the second motor terminal,

the third control signal terminal is configured between the second motor terminal and the third motor terminal.

12. The semiconductor module according to claim 11, characterized in that:

wherein the fourth control signal terminal is arranged between the first ground terminal and the second ground terminal,

the fifth and sixth control signal terminals are disposed between the second ground terminal and the third ground terminal.

13. The semiconductor module according to claim 12, characterized in that:

wherein the other ends of the first to third control signal terminals connected to the mounting substrate are arranged at: a position closer to the first edge of the substrate than the other end of the power supply terminal and the other ends of the first to third motor terminals connected to the mounting substrate,

the other ends of the fourth to sixth control signal terminals connected to the mounting substrate are disposed at: and a second side of the substrate closer to the first side than the other ends of the first to third ground terminals connected to the mounting substrate.

14. The semiconductor module according to claim 1, characterized in that:

wherein the first high-side switch of the first half-bridge is arranged on one end of the power supply wiring and the first electrode is electrically connected with the power supply wiring,

the third high side switch of the third half bridge is arranged on the other end of the power supply wiring and the first electrode is electrically connected with the power supply wiring,

the second high side switch of the second half bridge is arranged on the power supply wiring and the first electrode is electrically connected to the power supply wiring so as to be located between the first high side switch and the third high side switch.

15. The semiconductor module of claim 14, further comprising:

a first center wiring line which is arranged between the one end of the power supply wiring line and the first ground wiring line on an upper end surface of the substrate, on which the first low-side switch is arranged, and which is electrically connected to the other end of the first high-side switch and the first motor terminal;

a third center wiring line which is arranged between the other end of the power supply wiring line and the third ground wiring line on an upper end surface of the substrate, on which the third low-side switch is arranged, and which is electrically connected to the other end of the third high-side switch and the third motor terminal; and

and a second center wire that is disposed between the power supply wire and the second ground wire and between the first center wire and the third center wire on an upper end surface of the substrate, and the second low-side switch is disposed on the upper end surface and is electrically connected to the other end of the second high-side switch and the second motor terminal.

Technical Field

The present invention relates to a semiconductor module.

Background

Conventionally, as one of semiconductor devices, a semiconductor module has been widely known which converts dc power input from a dc power supply into ac power and outputs the ac power.

Such a semiconductor module is used to drive a three-phase motor by converting a dc voltage into a three-phase ac voltage, for example (patent No. 6062565).

In such a conventional semiconductor module (fig. 3 and 4), the high-side and low-side signal wirings are located on one side (power supply and ground side) of the package of the semiconductor module.

Therefore, the gate wiring at the low end becomes long, and in the example of fig. 3, two bonding wires are required for one signal wiring.

In particular, since the gate control signals of the high-side and low-side switches (MOS transistors) are wired differently, there is a problem that the signal transmission time differs between the high-side and low-side switches and the controllability of the switches is low.

Accordingly, an object of the present invention is to configure signal wiring for controlling a switch to be divided into a high side and a low side, and align wiring lengths of control signals for controlling the switch, thereby equalizing transmission time of signals and improving controllability of the switch.

Disclosure of Invention

A semiconductor module according to an aspect of the present invention is a semiconductor module for converting a direct current into a three-phase alternating current and supplying the three-phase alternating current to a three-phase motor to drive the three-phase motor, the semiconductor module including:

a substrate;

a power supply wiring arranged along a first side on the substrate;

a power supply terminal connected to the power supply wiring;

a first ground wiring, a second ground wiring, and a third ground wiring arranged on the substrate along a second side opposite to the first side of the substrate;

a first ground terminal connected to the first ground wiring; a second ground terminal connected to the second ground wiring; a third ground terminal connected to the third ground wiring;

first to third motor terminals connected to coils of the three-phase motor, respectively;

first to third half-bridges each formed by connecting a high-side switch and a low-side switch in series between the power supply wiring and the first to third ground wirings, respectively, and having connection points of the high-side switch and the low-side switch connected to first to third motor terminals, respectively, and connected in parallel with each other; and

first to sixth control signal terminals to which control signals for controlling operations of the high-side switches and the low-side switches of the first to third half bridges are input,

the first to third control signal terminals are arranged side by side in a direction in which the first side extends such that one end thereof is close to the first side of the substrate,

the fourth to sixth control signal terminals are arranged side by side in a direction in which the second side extends such that one end thereof is close to the second side of the substrate.

In the semiconductor module, the semiconductor module further includes:

a first control bond wire connecting a control electrode of a first high-side switch of the first half-bridge to the first control signal terminal;

a second control bond wire connecting a control electrode of a second high-side switch of the second half-bridge to the second control signal terminal;

a third control bond wire connecting a control electrode of a third low-side switch of the third half-bridge to the third control signal terminal;

a fourth control bond wire connecting a control electrode of the first low-side switch of the first half-bridge to the fourth control signal terminal;

a fifth control bond wire connecting a control electrode of the second low-side switch of the second half-bridge to the fifth control signal terminal; and

and a sixth control bond wire connecting a control electrode of the third low-side switch of the third half-bridge to the sixth control signal terminal.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the fourth control bonding wire is wired to pass over the first ground wiring line, the fifth control bonding wire is wired to pass over the second ground wiring line,

the sixth control bonding wire is routed to pass through the third ground wiring line.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the first control signal terminal is connected between the power terminal and the first motor terminal,

the second control signal terminal is connected between the first motor terminal and the second motor terminal,

the third control signal terminal is connected between the second motor terminal and the third motor terminal.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the first ground wiring is connected to the second electrode of the first low-side switch through a bonding wire,

the second ground wiring is connected to a second electrode of the second low-side switch via a bonding wire,

the third ground wiring is connected to the second electrode of the third low-side switch through a bonding wire.

In the semiconductor module, the semiconductor module further includes:

a first dummy (dummy) wiring provided at a first corner of the substrate where the first side and the third side intersect;

a second dummy wiring for support provided at a second corner of the substrate where the first side and the fourth side intersect;

a third supporting dummy line provided in a third corner portion of the substrate where the second side and the third side intersect; and

a fourth supporting dummy wiring provided at a fourth corner of the substrate where the second side and the fourth side intersect,

since the substrate is fixed by the support member at the time of wire bonding, the upper end surfaces of the first to fourth supporting dummy wirings can be fixed by the support member at the time of wire bonding.

In the semiconductor module, the semiconductor module further includes:

and a thermistor that is disposed on the substrate near a second edge of the substrate, is positioned between the first ground wiring and the second ground wiring, or is positioned between the second ground wiring and the third ground wiring, and detects a temperature.

In the semiconductor module, the semiconductor module is characterized in that:

wherein each area of the first to third ground wirings is smaller than an area of the power supply wiring.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the power supply terminal is disposed so as to bypass the first support dummy wiring,

the third motor terminal is disposed so as to bypass the second supporting dummy wiring,

the first ground terminal is disposed so as to bypass the third supporting dummy wiring,

the third ground terminal is disposed so as to bypass the fourth supporting dummy wiring.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the first to third control signal terminals are arranged side by side in a direction in which the first side extends such that one end thereof is close to the first side of the substrate,

the fourth to sixth control signal terminals are arranged side by side in a direction in which the second side extends such that one end thereof is close to the second side of the substrate.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the first control signal terminal is arranged between the power supply terminal and the first motor terminal,

the second control signal terminal is arranged between the first motor terminal and the second motor terminal,

the third control signal terminal is configured between the second motor terminal and the third motor terminal.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the fourth control signal terminal is arranged between the first ground terminal and the second ground terminal,

the fifth and sixth control signal terminals are disposed between the second ground terminal and the third ground terminal.

In the semiconductor module, the semiconductor module is characterized in that:

the other ends of the first to third control signal terminals connected to the mounting substrate are arranged at: a position closer to the first edge of the substrate than the other end of the power supply terminal and the other ends of the first to third motor terminals connected to the mounting substrate,

the other ends of the fourth to sixth control signal terminals connected to the mounting substrate are disposed at: and a second side of the substrate closer to the first side than the other ends of the first to third ground terminals connected to the mounting substrate.

In the semiconductor module, the semiconductor module is characterized in that:

wherein the first high-side switch of the first half-bridge is arranged on one end of the power supply wiring and the first electrode is electrically connected with the power supply wiring SX,

the third high side switch of the third half bridge is arranged on the other end of the power supply wiring and the first electrode is electrically connected with the power supply wiring,

the second high side switch of the second half bridge is arranged on the power supply wiring and the first electrode is electrically connected to the power supply wiring so as to be located between the first high side switch and the third high side switch.

In the semiconductor module, the semiconductor module further includes:

a first center wire which is arranged between the one end of the power supply wire SX and the first ground wire on the upper end surface of the substrate, on which the first low-side switch is arranged, and which is electrically connected to the other end of the first high-side switch and the first motor terminal;

a third center wiring line which is arranged between the other end of the power supply wiring line and the third ground wiring line on an upper end surface of the substrate, on which the third low-side switch is arranged, and which is electrically connected to the other end of the third high-side switch and the third motor terminal; and

and a second center wire that is disposed between the power supply wire and the second ground wire and between the first center wire and the third center wire on an upper end surface of the substrate, and the second low-side switch is disposed on the upper end surface and is electrically connected to the other end of the second high-side switch and the second motor terminal.

Effects of the invention

A semiconductor module according to an aspect of the present invention includes: a substrate; a power supply wiring arranged along a first side on the substrate; a power supply terminal connected to the power supply wiring; a first ground wiring, a second ground wiring, and a third ground wiring arranged on the substrate along a second side opposite to the first side of the substrate; a first ground terminal connected to the first ground wiring; a second ground terminal connected to the second ground wiring; a third ground terminal connected to the third ground wiring; first to third motor terminals connected to coils of the three-phase motor, respectively; first to third half-bridges each formed by connecting a high-side switch and a low-side switch in series between a power supply wiring and first to third ground wirings, respectively, and connecting points of the high-side switch and the low-side switch are connected to first to third motor terminals, respectively, and are connected in parallel with each other; and first to sixth control signal terminals to which control signals for controlling operations of the high-side switch and the low-side switch of the first to third half bridges are input.

The first to third control signal terminals are arranged side by side in a direction in which the first side extends so that one end thereof is close to the first side of the substrate, and the fourth to sixth control signal terminals are arranged side by side in a direction in which the second side extends so that one end thereof is close to the second side of the substrate.

Thus, according to the semiconductor module of the present invention, the signal wiring for controlling the switch is arranged so as to be divided into the high side and the low side, and the wiring lengths of the control signals for controlling the switch are aligned, so that the signal transmission time can be equalized and the controllability can be improved.

Drawings

Fig. 1 is a diagram showing an example of the structure of a semiconductor module 100 according to an embodiment.

Fig. 2 is a circuit diagram showing an example of the circuit configuration of the semiconductor module 100 shown in fig. 1.

Fig. 3 is a diagram showing an example of a structure of a conventional semiconductor module.

Fig. 4 is a circuit diagram showing an example of a circuit configuration of the conventional semiconductor module shown in fig. 3.

Detailed Description

Hereinafter, embodiments related to the present invention will be described based on the drawings.

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