阅读说明：本技术 用于将电磁波耦合输入到芯片中的设备 (Device for coupling electromagnetic waves into a chip ) 是由 U·肖尔茨 M·安贝格尔 于 2019-08-30 设计创作，主要内容包括：本发明涉及一种用于将电磁波耦合输入到芯片或类似物中的设备,所述设备包括用于容纳光源的腔和用于允许光源的光穿透的开口,所述开口与所述腔连接,其中,所述设备具有第一表面和与所述第一表面相对置的第二表面,其中,所述两个表面中的至少一个具有至少两个第一表面区段,所述至少两个第一表面区段以一倾斜角彼此倾斜地布置,其中,在所述腔的和/或所述开口的不同侧上第一表面与第二表面之间的距离不同,其中,在所述腔的和/或所述开口的不同侧上分别与所述腔/所述开口相邻的表面区域具有相同的倾斜角。(The invention relates to a device for coupling electromagnetic waves into a chip or the like, comprising a cavity for receiving a light source and an opening for allowing light of the light source to pass through, said opening being connected to the cavity, wherein the device has a first surface and a second surface opposite the first surface, wherein at least one of the two surfaces has at least two first surface sections which are arranged at an inclination to one another, wherein the distances between the first surface and the second surface are different on different sides of the cavity and/or of the opening, wherein the surface regions adjacent to the cavity/the opening, respectively, on different sides of the cavity and/or of the opening have the same inclination.)

1. A device (1) for coupling electromagnetic waves into a chip (9) or the like, comprising a cavity (3) for accommodating a light source (2) and an opening (4) for allowing light of the light source (2) to penetrate, which opening is connected to the cavity (3), wherein the device (1) has a first surface (6a, 7a) and a second surface (6b, 7b) opposite the first surface (6a, 7a), wherein at least one of the two surfaces (6a, 7a, 6b, 7b) has at least two first surface sections (6a, 7a, 6b, 7b) which are arranged obliquely to one another at an oblique angle (67a, 67b), wherein, on different sides (A, B) the distances (41, 42) between the upper first surfaces (6a, 7a) and the second surfaces (6B, 7B) are different, wherein the surface areas adjacent to the cavities/openings, respectively, on different sides (A, B) of the cavities (3) and/or of the openings (4) have the same inclination angle (67a, 67B).

2. The device according to claim 1, wherein the two adjacent surface areas (7b, 7b') form a common plane.

3. The device according to any one of claims 1 to 2, wherein the device (1) is made of ceramic, glass material, silicon and/or polymer.

4. A device as claimed in any one of claims 1 to 3, wherein the device (1) comprises at least one electrical contact (10, 11) for electrically contacting the light source (2).

5. The apparatus according to any one of claims 1 to 4, wherein the apparatus (1) comprises a beam shaping element (12).

6. The apparatus according to claim 5, wherein the beam shaping element (12) is arranged in a recess (5).

7. The device according to claim 6, wherein the recess (5) is connected with the opening (4).

8. The apparatus according to any one of claims 5 to 7, wherein the beam shaping element (12) is configured as a lens.

9. A method for manufacturing a device (1) for coupling electromagnetic waves into a chip (9), the method comprising the steps of:

-making (S1) a cavity (3) in the device (1) for accommodating a light source (2);

-making (S2) an opening (4) for allowing light to penetrate, said opening being connected to said cavity (3);

-manufacturing (S3) a first surface (6a, 7a) and a second surface (6B, 7B) opposite to the first surface, wherein at least one of the two surfaces (6a, 7a, 6B, 7B) is manufactured in a manner having at least two first surface sections (6a, 7a, 6B, 7B) arranged obliquely to each other with an inclination angle (67a, 67B) and with different distances (41, 42) between the first surface (6a, 7a) and the second surface (6B, 7B) on different sides (A, B) of the cavity (3) and/or of the opening (4), wherein surface areas (7B) adjacent to the cavity/the opening, respectively, on different sides (A, B) of the cavity (3) and/or of the opening (4) are manufactured with the same inclination angle (67a, 67B), 7 b').

10. Method according to claim 9, wherein the device (1) is manufactured by means of a molding method and/or a writing method, in particular photonic lithography.

11. Method according to one of claims 9 or 10, wherein a recess (5) is produced which is connected to the opening (4), wherein a beam shaping element (12) is arranged in the recess (5) by means of an adhesive or component shaping method, in particular by means of ablation, casting, printing and/or photolithography.

Technical Field

The invention relates to a device for coupling electromagnetic waves into a chip or the like.

The invention also relates to a method for producing a device or the like for coupling electromagnetic waves into a chip.

Background

It is known to couple light into a chip via an optical waveguide, wherein either so-called edge coupling, i.e. coupling light into the chip edge, or so-called grating coupling, i.e. coupling light into the chip surface from above via a grating coupler, can be used. In the case of edge coupling, a high degree of positional accuracy must be maintained in order to transmit maximum optical power into a Photonic Integrated Circuit (PIC). In the case of grating coupling, in addition to the transverse alignment of the optical waveguide, the optical waveguide must be oriented on the chip at a defined angle to the chip surface, for example at 8 ° to the normal of the chip, wherein an active alignment method is used here.

Edge emitters or vertical emitters, VCSELs, are known to be commonly used as light sources for light.

For coupling light into a grating coupler, it is known to use a so-called optical bench (optische Bank). The optical platform consists of a silicon intermediate element on which an edge emitter, a lens and a ball lens for deflecting the beam path of the light are arranged. The optical bench can be positioned on the PIC and connected by means of wire bonding in such a way that the light is directed onto the grating coupler and coupled there into the PIC. In the case of edge coupling, an edge emitter is used, which is arranged together with at least one lens precisely toward the chip edge of the PIC.

Disclosure of Invention

In one embodiment, the invention provides a device for coupling electromagnetic waves into a chip or the like, comprising a cavity for accommodating a light source, an opening for allowing light of the light source to pass through, the opening being connected to the cavity, wherein the device has a first surface and a second surface opposite the first surface, wherein at least one of the two surfaces has at least two first surface sections which are arranged obliquely to one another at an oblique angle, wherein the distances between the first surface and the second surface are different on different sides of the cavity and/or of the opening, wherein the surface regions adjacent to the cavity/the opening, respectively, on different sides of the cavity and/or of the opening have the same oblique angle.

In another embodiment, the invention provides a method for producing a device for coupling electromagnetic waves into a chip, comprising the following steps:

fabricating a cavity in the device for accommodating a light source;

making an opening for allowing light to penetrate, the opening being connected to the cavity;

producing a first surface and a second surface opposite the first surface, the first surface and the second surface having at least two first surface sections which are arranged obliquely to one another at an inclination angle and are arranged at different distances between the first surface and the second surface on different sides of the cavity and/or of the opening, wherein surface regions which are respectively adjacent to the cavity/the opening on different sides of the cavity and/or of the opening are produced at the same inclination angle.

In a further embodiment, the invention provides a chip with a device according to an embodiment of the invention.

One of the advantages achieved thereby is: a compact and cost-effective coupling-in device can be provided, which enables efficient coupling-in of light into a photonic integrated circuit. Another advantage is that high throughput speeds can be achieved when manufacturing the device. Furthermore, it is advantageous that simple assembly and, in particular, mass-adaptable production can be achieved.

In other words, a substantially wedge-shaped device is provided having two planes, which are arranged at a well-defined angle to each other. Here, the first plane may be used for handling equipment and mounting light sources. The second plane may be used to ensure a desired on-chip light angle of incidence in the mounting.

Additional features, advantages, and additional embodiments of the invention are described below or will become disclosed.

According to an advantageous embodiment, two adjacent surface regions form a common plane. In this way it is possible to provide flat bearing surfaces on both sides of the cavity and/or of the opening.

According to a further advantageous embodiment, the device is made of ceramic, glass material, silicon and/or polymer. This makes it possible to achieve simple production in a particularly flexible manner, which can be adapted to the desired accuracy of the coupling-in of light and of the fastening of the device to the respective chip or the like.

According to a further advantageous embodiment, the device comprises at least one electrical contact for electrically contacting the light source. In this way, the light source arranged in the cavity can be electrically switched on in a simple manner.

According to a further advantageous embodiment, the device comprises a beam shaping element. In this way, the light beam of the light source arranged in the cavity can be coupled into the photonic integrated circuit in a particularly efficient manner by means of the device.

According to a further advantageous embodiment, the beam shaping element is arranged in the recess. It is therefore possible to simply arrange the beam shaping elements in the device.

According to a further advantageous embodiment, the recess is connected to the opening. In this way, the light beam can pass directly from the cavity via the opening into the recess, in which recess, for example, a beam-shaping element for influencing the shape of the light beam of the light source arranged in the cavity is arranged.

According to a further advantageous embodiment, the beam shaping element is designed as a lens. This enables a simple and cost-effective beam shaping element.

According to an advantageous embodiment of the method, the device is produced by means of a molding method and/or a writing method, in particular by means of photonic lithography. This enables a flexible and at the same time cost-effective production of the device.

According to a further advantageous development of the method, a recess is produced which is connected to the opening, wherein the beam shaping element is arranged in the recess by means of an adhesive or component shaping method, in particular by means of ablation, casting, printing and/or lithography. The beam-shaping element can thus be provided in a flexible manner according to predeterminable conditions and in a simple and at the same time cost-effective manner.

Further important features and advantages of the invention result from the description of the embodiments, the figures and the associated diagrams according to the figures.

It is understood that the features mentioned above and those yet to be explained below can be used not only in the respectively specified combination but also in other combinations or individually without departing from the scope of the present invention.

Preferred embodiments and implementations of the present invention are illustrated in the drawings and will be set forth in greater detail in the description that follows, wherein like reference numerals refer to identical or similar or functionally identical components or elements.

Drawings

Here, in schematic form and in cross section:

FIG. 1 illustrates an apparatus according to an embodiment of the present invention;

FIG. 2 shows a chip with a device according to an embodiment of the invention;

fig. 3 shows the steps of a method according to an embodiment of the invention.

Detailed Description

An apparatus according to one embodiment of the invention is shown in schematic form and in cross-section in fig. 1.

A device 1 for coupling electromagnetic waves into a chip is shown in detail in fig. 1. The device 1 is constructed with a substantially rectangular cross-section and comprises a light source 2 arranged in a cavity 3, which light source can inject light 8 into the recess 5 via an opening 4. The cavity 3 is arranged here in the upper region of the device 1, while the recess 5 is arranged in the lower region of the device 1. The cross section of the recess 5, the opening 4 and the cavity 3 is substantially rectangular, but may also be round or the like, not shown here. The upper surface of the device 1 has the following course from left to right: on the left side a of the chamber 3, a surface region 7a is arranged which descends from left to right and which merges via a vertical offset into the horizontal region 6 a. In said area 6a cavity 3 is arranged. The optical axis 20 of the cavity is arranged perpendicular to the surface region 6 a. The surface region 6a extends further from left to right on the right side B of the chamber 3 and then transitions into a second surface region 7a' which descends from left to right at an angle 67a parallel to the first surface region 7 a.

The underside of the device 1 has the following surfaces: the surface runs from left to right in fig. 1 as follows: a surface region 7b, which is formed from left to right and in a partial region parallel to the first surface region 7a, extends on the left side a of the cavity 3 or of the recess 5, the course of said surface region 7b in the region of the opening 4 below the cavity 3 being interrupted by the substantially rectangular recess 5. The recess 5 is substantially U-shaped in cross section and has two vertical edge regions 5a on the left and right, which run parallel to the vertical edge regions of the cavity 3 and of the opening 4. In this case, the surface 5b of the recess 5 is oriented parallel to the planes 6a, 6 b. In this case, it is also possible to form one or more steps in the recess 5 or to form the recess in a funnel-like manner.

On the right side B of the cavity 3 or of the opening 4, a region 7B' is arranged, which is essentially the extension of the region 7B over the recess 5. The region 7b' is inclined at an angle 67b and merges into a surface region 6b, which surface region 6b is arranged parallel to the surface region 6a and extends over the upper side of the device 1. Thus, the two regions 7b, 7b' form substantially one plane. Here, the vertical extension (indicated with reference numeral 41) between the two regions 7a, 7B on the left side a of the device 1 is smaller than the vertical extension (indicated with reference numeral 42) on the right side B of the device 1. The light source 2 is further configured as a vertical emitter VCSEL. After mounting the device 1, the axis 21 of the light 8 incident on the photonic integrated circuit 9 is arranged obliquely with respect to the optical axis 20 of the cavity 3 and of the opening 4.

Fig. 2 shows a chip with a device according to an embodiment of the invention.

The chip 100 is shown in detail in fig. 2. The chip comprises a photonic integrated circuit 9 on which the device 1 according to fig. 1 is arranged. Furthermore, unlike the device 1 according to fig. 1, in the case of the device 1 according to fig. 2, the lens 12 is arranged in the recess 5. The device 1 is arranged here with two regions 7b, 7b' on the upper surface of the photonic integrated circuit 9 on the left or right side A, B of the device 1, respectively. Furthermore, for electrical contacting, the device 1, to be precise the light source 2, is connected to the photonic integrated circuit 9 via electrical contacts 10 and, if necessary, is contacted via further electrical contacts 11 on the surface of the device 1.

The device 1 is produced here from a freely deformable material, for example the device 1 from a ceramic or glass material which is produced in a shaping process or in a writing process in a power composite (nutzenverbond) manner.

Alternatively, the device 1 can also be produced from silicon, for example by means of laser material processing, or also from a molded polymer.

The plane or planes parallel to said plane provide a possibility to handle chips and individual devices 1 as in chip mounting known so far, that is to say, the marginal conditions of a standard mounting process applicable in batches. The other planes 7b, 7b' inclined at a defined angle to the first plane, which are arranged in particular opposite one another, adjust the precise angle for the coupling-in of the light 8.

Furthermore, it is conceivable to arrange one or more metal structures for electrically contacting the light source 2, in particular in the form of a laser chip. The one or more metal structures may be applied by means of a printing method or a writing method.

Furthermore, as shown in fig. 2, a lens 12 for beam path shaping of the light source 2 can also be arranged in the recess 5. The lens 12 can be bonded in the case of the production of a device 1 made of ceramic or silicon, or the lens 12 can be produced directly by means of a component molding method, in particular by ablation, casting, molding (Molden), printing, etc., or can be bonded subsequently, in the case of the production of a device 1 made of glass or plastic. The device 1 is put into use, for example, when a laser chip is mounted to a wafer or a laser chip is mounted to the PIC 9.

As already explained, the flat surfaces 7b, 7b' serve as storage, mounting or support surfaces for the processing device 1. Firstly, the device is present in an energy-efficient manner and is supported on a workpiece carrier in the orientation of the planes 6a, 6b, for example for mounting a VCSEL. In this case, the surface 5b of the recess 5 is oriented parallel to the planes 6a, 6 b.

After mounting the VCSEL2, the device 1 is separated, for example by means of a saw or by means of a laser separation method. After the separation, the operation of the device 1 is performed on the second pair of planes 7a, 7a ', 7b', which ensures a correct angular adjustment of the light beam 8 onto the PIC 9.

The device 1 may be bonded or soldered to the PIC 9. The electrical contacts 10, 11 are then wire bonded (drahtgebond), either with gold wires thermosonically bonded directly from the VCSEL2 to the PIC 9, i.e. the device 1 has no electrical structure, or gold wire bonds 11 can be bonded from the VCSEL2 to the device 1 and from the device 1 to the PIC 9. Alternatively, the VCSEL2 can also be bonded directly to the laser driver, for example in the form of a CMOS chip. Advantageously, thermosonic gold wire bonding or thermosonic copper wire bonding is used, since the bonding of the ball bond with respect to the inclined position is robust.

Fig. 3 shows the steps of a method according to an embodiment of the invention.

Fig. 3 shows a diagram for producing a device for coupling electromagnetic waves into a chip in detail.

Here, in a first step S1, a cavity is manufactured in the device for accommodating the light source.

Further, an opening for allowing light to penetrate is manufactured in the second step S2, the opening being connected to the cavity.

Furthermore, in a third step S3, a first surface and a second surface opposite the first surface are produced, wherein at least one of the two surfaces is produced with at least two first surface sections which are arranged at an inclination to one another and at different distances between the first surface and the second surface on different sides of the cavity and/or of the opening, wherein the surface regions respectively adjacent to the cavity/the opening on different sides of the cavity and/or of the opening are produced with the same inclination.

In summary, at least one of the embodiments of the invention has at least one of the following advantages:

simple manufacture;

cost-effective manufacture;

simple treatment of equipment;

efficient coupling-in is possible;

can be manufactured in batch.

Although the present invention has been described in accordance with the preferred embodiments, the present invention is not limited thereto but may be modified in various ways.