阅读说明：本技术 研磨系统 (Grinding system ) 是由 夏文羽 于 2019-12-10 设计创作，主要内容包括：本发明提供了一种研磨系统,述研磨系统包括：研磨垫、监控装置及基座,所述监控装置包括：相连的检测单元及报警单元,所述检测单元设置于所述研磨垫中且与所述研磨垫的用于研磨的第一表面具有间距,在所述研磨垫中增设所述检测单元,且使得所述检测单元与所述研磨垫的第一表面保持适当间距,当处于工作状态的研磨垫出现磨损或破洞缺陷时,所述研磨系统可以通过所述检测单元及时并有效地监控到研磨垫的磨损或破洞缺陷,使得存在磨损或破洞缺陷的研磨垫能够被及时更换掉,从而避免了批量生成的产品被异常研磨的情况,提高了批量产品的良率,变相地节省了原材料以及机台资源。(The present invention provides a grinding system comprising: grinding pad, monitoring device and base, monitoring device includes: the detection unit is arranged in the grinding pad and has a distance with the first surface of the grinding pad, the detection unit is additionally arranged in the grinding pad, the detection unit and the first surface of the grinding pad keep a proper distance, when the grinding pad in a working state has a wear or hole defect, the grinding system can timely and effectively monitor the wear or hole defect of the grinding pad through the detection unit, so that the grinding pad with the wear or hole defect can be timely replaced, the condition that products generated in batches are abnormally ground is avoided, the yield of products in batches is improved, and raw materials and machine table resources are saved in a phase-changing manner.)

1. A grinding system, comprising: grinding pad, monitoring device and base, monitoring device includes: the detection unit and the alarm unit are connected; the grinding pad is provided with a first surface and a second surface which are opposite, the first surface is used for grinding, the detection unit is arranged in the grinding pad and has a distance with the first surface, the second surface is attached to the surface of the base, and the alarm unit is arranged on the base.

2. The polishing system of claim 1, wherein the polishing pad is a circular polishing pad.

3. The polishing system of claim 2, wherein the first surface of the polishing pad has a plurality of concentric annular protrusions disposed around a center of the polishing pad, adjacent concentric annular protrusions forming grooves therebetween.

4. The polishing system of claim 3, wherein the detection unit is laid in the polishing pad in a radial direction of the polishing pad, or the detection unit is laid in the polishing pad in concentric rings centered on the center of the polishing pad.

5. The polishing system of claim 4, wherein the detection unit is spaced from the raised surface of the concentric ring by a distance of 25mils to 35 mils; the distance between the detection unit and the surface of the groove is 25-35 mils.

6. The polishing system of claim 4, wherein the detection unit includes a metal wire, and the alarm unit receives a first voltage signal fed back from the detection unit when the detection unit is operating normally; when the metal wire of the detection unit is broken, the alarm unit receives a second voltage signal fed back by the detection unit and gives an alarm.

7. The polishing system of claim 6, wherein the wire has a plurality of protrusions that are each positioned below and spaced from a surface of the concentric annular protrusions when the wire is laid in the polishing pad in a radial direction of the polishing pad.

8. The polishing system of claim 6, wherein the metal wire is disposed in concentric rings below the concentric ring protrusions and below the grooves, the metal wire being spaced apart from the surfaces of the concentric ring protrusions and the grooves by the same distance.

9. The polishing system of claim 3, wherein the concentric annular protrusions have a height of 10 μm to 20 μm and a width of 3mm to 5 mm.

10. The polishing system of claim 3, wherein the grooves have a width of 0.5mm to 1.5 mm.