阅读说明：本技术 发光模块 (Light emitting module ) 是由 木原利彰 于 2019-09-03 设计创作，主要内容包括：本发明涉及一种发光模块。公开了一种发光模块,包括半导体发光元件、第一透镜、第二透镜和光纤插针。第一透镜准直从半导体发光元件输出的光。第二透镜是弯月形透镜,并将准直光会聚到光纤插针。第二透镜的光入射面具有其中曲率半径的增加率为零或更大的截面形状。第二透镜的光出射面包括第一区域和第二区域。第一区域具有截面形状,其中曲率半径的增加率的符号是正的。第二区域围绕第一区域并且具有截面形状,其中曲率半径的增加率的符号是负的。(The present invention relates to a light emitting module. A light emitting module is disclosed, which includes a semiconductor light emitting element, a first lens, a second lens, and an optical fiber stub. The first lens collimates light output from the semiconductor light emitting element. The second lens is a meniscus lens and focuses the collimated light to the fiber stub. The light incident surface of the second lens has a cross-sectional shape in which an increasing rate of a radius of curvature is zero or more. The light exit surface of the second lens includes a first region and a second region. The first region has a sectional shape in which the sign of the rate of increase in the radius of curvature is positive. The second region surrounds the first region and has a sectional shape in which a sign of a rate of increase of the radius of curvature is negative.)

1. A light emitting module comprising:

a semiconductor light emitting element;

a first lens optically coupled to the semiconductor light emitting element to collimate light output from the semiconductor light emitting element;

a second lens that is a meniscus lens optically coupled to the semiconductor light emitting element through the first lens to converge collimated light; and

a fiber stub optically coupled to the convergent light output from the second lens,

wherein the light incident surface of the second lens has a sectional shape in which an increasing rate of a radius of curvature with respect to a distance from an optical axis of the second lens is zero or more, and

wherein the light exit surface of the second lens includes:

a first region having a sectional shape in which a sign of a rate of increase of a radius of curvature with respect to a distance from the optical axis is positive, an

A second region surrounding the first region and having a sectional shape in which a sign of a rate of increase of a radius of curvature is negative with respect to a distance from the optical axis.

2. The lighting module of claim 1, further comprising:

a package accommodating therein the semiconductor light emitting element and the first lens, the package including an opening through which light output from the semiconductor light emitting element passes, and the second lens being attached to the opening.

3. The light emitting module of claim 1 or 2, wherein the back focal length of the second lens is 6mm or greater.

4. The lighting module of any one of claims 1 to 3, further comprising:

an optical member disposed between the second lens and the fiber stub.

5. The light emitting module according to any one of claims 1 to 4, wherein a magnification of a lens system including the first lens and the second lens is 5 times or more.

6. The light emitting module according to any one of claims 1 to 5, wherein the first region has a circular shape centered on the optical axis.

7. The light emitting module of claim 6, wherein the second region has a circular ring shape centered on the optical axis.

Technical Field

The present invention relates to a light emitting module.

Background

JP2001-281501a discloses a technique relating to a laser diode module and an assembling method thereof. The laser diode module described in this document comprises a laser diode assembly and a lens-fiber assembly fixed to each other. The laser diode assembly includes a carrier and a laser diode secured to the carrier. The laser diode is surrounded by a cover. The cover includes a laser beam transmission window. The lens-fiber assembly includes first and second bores in communication with each other. An aspherical lens is inserted and fixed to the first hole. A ferrule containing the optical fiber is pressed into the second bore. The aspheric lens focuses the light output from the laser diode toward the optical fiber.

Disclosure of Invention

The present disclosure provides a light emitting module. The light emitting module comprises a semiconductor light emitting element, a first lens, a second lens and an optical fiber inserting needle. The first lens is optically coupled to the semiconductor light emitting element to collimate light output from the semiconductor light emitting element. The second lens is a meniscus lens. The meniscus is optically coupled to the semiconductor light emitting element through a first lens to converge the collimated light. The fiber stub is optically coupled to the converging light output from the second lens. The light incident surface of the second lens has a cross-sectional shape in which a rate of increase of a radius of curvature with respect to a distance from an optical axis of the second lens is zero or more. The light exit surface of the second lens includes a first region and a second region. The first region has a cross-sectional shape in which the sign of the rate of increase of the radius of curvature with respect to the distance from the optical axis is positive. The second region surrounds the first region and has a sectional shape in which a sign of a rate of increase of the radius of curvature with respect to a distance from the optical axis is negative.

Drawings

The foregoing and other objects, aspects and advantages will be better understood from the following detailed description of embodiments of the disclosure with reference to the drawings, in which:

fig. 1 is a perspective view illustrating a bi-directional optical subassembly (BOSA) including a light emitting module according to an embodiment.

Fig. 2 is a perspective view showing an appearance of the light emitting module.

Fig. 3 is a perspective view showing the light emitting module with the cover removed.

Fig. 4 is a partially enlarged sectional view of an internal structure of the light emitting module;

fig. 5 is a perspective view illustrating a lens of the light emitting module;

fig. 6 is a sectional perspective view showing a lens.

Fig. 7 is a sectional view of a section of the light emitting module in the optical axis direction.

Fig. 8A is a front view showing a light incident surface of the condenser lens as viewed from the optical axis direction, and fig. 8B is a rear view showing a light exit surface of the condenser lens as viewed from the optical axis direction.

Fig. 9A and 9B are graphs showing one example of a relationship between a radius of curvature of a light incident surface and a distance from an optical axis of a light emitting module in a cross section including the optical axis;

fig. 10A and 10B are diagrams showing one example of a relationship between a radius of curvature of a light exit surface and a distance from an optical axis in a cross section including the optical axis;

fig. 11 is a graph showing the relationship between the wavefront aberration and the distance from the optical axis when decentering is in the range of-5 μm to +5 μm.

Fig. 12 is a graph showing the relationship between coma aberration and distance from the optical axis when decentering is in the range of-5 μm to +5 μm.

Fig. 13 is a graph showing a relationship of spherical aberration with distance from the optical axis when decentering is in the range of-5 μm to +5 μm.

Fig. 14A and 14B are diagrams conceptually showing a state where light passing through the condenser lens is divided into an inner beam and an outer beam; and

fig. 15 is a graph showing the relationship between the eccentricity of the condenser lens and the amount d η of reduction in optical coupling efficiency between the semiconductor laser chip and the optical fiber.

Detailed Description

[ problem to be solved by the present disclosure ]

As a light emitter in an optical communication system, a light emitting module including a semiconductor light emitting element such as a laser diode is used. For example, in the laser diode module described in JP2001-281501a, light emitted from a laser diode housed in a package including a stem and a lid is condensed by an aspherical lens located outside the package.

In such a light emitting module, it is important to improve the optical coupling efficiency between the semiconductor light emitting element and the optical fiber. When light emitted from the semiconductor light emitting element is guided to the optical fiber through the condenser lens, it is necessary to improve the relative positional accuracy by performing alignment among the semiconductor light emitting element, the condenser lens, and the optical fiber. Therefore, it is considered to use two lenses instead of the single condenser lens used in the module described in JP2001-281501 a. That is, the light output of the semiconductor light emitting element is collimated by the first lens, and the collimated light is converged to the optical fiber by the second lens. According to such a configuration, the optical coupling efficiency between the semiconductor light emitting element and the optical fiber can be improved by improving the alignment accuracy as compared with the case of using a single condensing lens.

When the first and second lenses are interposed between the semiconductor light emitting element and the optical fiber, there is a tendency that the distance between the second lens and the optical fiber (back focus) is shortened as compared with the case of using a single condenser lens. However, depending on the structure of the light emitting module, the distance between the second lens and the optical fiber needs to be extended. In this case, a meniscus lens may be used as the second lens. However, the positional deviation (axial deviation), that is, the eccentricity between the optical axis of the light incident surface of the meniscus lens and the optical axis of the light exit surface of the meniscus lens largely affects the optical coupling efficiency between the semiconductor light emitting element and the optical fiber. The decentering is caused by a relative positional shift between a mold forming a light incident surface of the meniscus lens and a mold forming a light exit surface thereof. Therefore, since the magnitude of eccentricity depends on the accuracy of the mold, there is a limit in suppressing the eccentricity.

[ advantageous effects of the present disclosure ]

According to the present disclosure, in a light emitting module that condenses light emitted from a semiconductor light emitting element by using a first lens and a second lens, a degree of decrease in optical coupling efficiency due to decentering of the second lens is reduced.

[ description of embodiments of the present disclosure ]

The contents of the embodiments of the present disclosure will be described. The light emitting module according to the embodiment includes a semiconductor light emitting element, a first lens, a second lens, and an optical fiber stub. The first lens is optically coupled to the semiconductor light emitting element to collimate light output from the semiconductor light emitting element. The second lens is a meniscus lens. The meniscus lens is optically coupled to the semiconductor light emitting element through the first lens to converge the collimated light. The fiber stub is optically coupled to the converging light output from the second lens. The light incident surface of the second lens has a cross-sectional shape in which a rate of increase of a radius of curvature with respect to a distance from an optical axis of the second lens is zero or more. The light exit surface of the second lens includes a first region and a second region. The first region has a cross-sectional shape in which the sign of the rate of increase of the radius of curvature with respect to the distance from the optical axis is positive. The second region surrounds the first region and has a sectional shape in which a sign of a rate of increase of the radius of curvature with respect to a distance from the optical axis is negative.

In the light emitting module, light output from the semiconductor light emitting element first reaches the first lens, and is output from the first lens as collimated light. Next, the collimated light reaches the second lens, and is converged by the second lens. Since the light emitting module includes the first and second lenses, alignment accuracy is high as compared with the case of including a single lens. Therefore, the optical coupling efficiency between the semiconductor light emitting element and the optical fiber can be improved. Further, since the second lens is a meniscus lens, the back focal length of the second lens can be extended.

Further, in the light emitting module, in the light incident surface of the second lens, an increasing rate of the radius of curvature with respect to a distance from the optical axis is zero or more. Further, in the light exit surface of the second lens, a sign of a rate of increase of the radius of curvature with respect to the distance from the optical axis is positive in a first region, and a sign of a rate of increase of the radius of curvature with respect to the distance from the optical axis is negative in a second region surrounding the first region. According to the experiment of the inventors, since the second lens as the meniscus lens has the above-described shape, the wavefront aberration and the coma aberration caused by decentering of the second lens can be reduced. Accordingly, the light emitting module can reduce a degree of reduction in light coupling efficiency due to decentering of the second lens.

The light emitting module may further include a package in which the semiconductor light emitting element and the first lens are accommodated. The package may include an opening through which light emitted from the semiconductor light emitting element passes. The second lens may be attached to the opening. Therefore, a small light emitting module can be provided.

In the light emitting module, a back focal length of the second lens may be 6mm or more. As described above, the light emitting module can achieve a long back focus.

The light emitting module may further include an optical member disposed between the second lens and the fiber stub.

In the light emitting module, the magnification of a lens system including the first lens and the second lens may be 5 times or more.

In the light emitting module, the first region may have a circular shape centered on the optical axis.

In the light emitting module, the second region may be in a circular ring shape centered on the optical axis.

[ detailed description of embodiments of the present disclosure ]

Detailed examples of a light emitting module according to an embodiment of the present disclosure will be described below with reference to the accompanying drawings. Furthermore, the present invention is not intended to be limited to the examples, shown by the claims, and includes meanings equivalent to the claims and all modifications within the scope. In the following description, the same reference numerals will be given to the same components in the description of the drawings, and redundant description thereof will be omitted.

Fig. 1 is a perspective view illustrating a bidirectional optical transmission/reception module, which is a Bidirectional Optical Subassembly (BOSA), including a light emitting module according to an embodiment. The optical transmission/reception module 1 functions as, for example, an optical transceiver such as a 10 gigabit ethernet passive optical network (10G-EPON), XG-PON, NG-PON2 and 25G-PON.

The light emitting/receiving module 1 includes a light emitting module 2, a light receiving module 3, a joint 4, and a sleeve 5. The joint 4 and the sleeve 5 have a cylindrical shape with a common central axis. One end of the sleeve 5 is fixed to one end of the joint 4 in the longitudinal direction. The optical fiber is inserted into the other end of the ferrule 5 together with a ferrule attached to the leading end portion of the optical fiber. The fiber stub OS is located inside the ferrule 5. The leading end of the optical fiber makes contact with one end of the optical fiber stub OS to be optically connected to the optical fiber stub OS.

The light emitting module 2 is fixed to the other end of the connector 4 and outputs transmitted light to a hole formed in the connector 4. The transmitted light passes through the hole formed in the splice 4 and reaches the other end of the fiber stub OS. The light emitting module 2 includes a package 10 and a semiconductor light emitting element. The package 10 includes a stem 11 and a lid 12. The semiconductor light emitting element is a laser diode located in the package 10. A plurality of pins 13 pass through the stem 11, and supply voltage and electrical transmission signals are supplied to the inside of the package 10 through the pins 13. The power supply voltage and the electrical transmission signal are used to drive the semiconductor light emitting element.

The light receiving module 3 is fixed to a side surface of the joint 4. The light receiving module 3 receives the received light output from the optical fiber and then passed through the hole formed in the joint 4. The light receiving module 3 includes a package 15 and a light receiving element. The package 15 includes a stem 16 and a cap 17. The light receiving element is a photodiode located in the package 15. A plurality of pins 18 pass through the rod 16. The bias voltage applied to the light receiving element is supplied to the inside of the package 15 through the pin 18. The electrical reception signal generated by the light receiving element is supplied to the outside of the package 15 through the pin 18.

The wavelength demultiplexing filter is located within the junction 4. The transmission light output from the light emitting module 2 passes through the wavelength demultiplexing filter and then enters the optical fiber stub OS. The received light emitted from the optical fiber through the optical fiber stub OS is reflected by the wavelength demultiplexing filter and then reaches the light receiving module 3. The isolator may be further disposed between the wavelength demultiplexing filter and the light emitting module 2.

In the present embodiment, the optical transmission/reception module 1 including both the light-emitting module 2 and the light-receiving module 3 has been exemplified, but the light-emitting module may be included in a light transmission module, which is a Transmitter Optical Subassembly (TOSA), including only the light-emitting module 2. Alternatively, the light emitting module may be included in an integrated light transmission module obtained by arranging a plurality of light emitting modules 2 having different wavelengths and integrating light beams having these wavelengths through optical components such as filters and mirrors.

Fig. 2 is a perspective view showing an appearance of the light emitting module 2. Fig. 3 is a perspective view showing the light emitting module 2, with the cover 12 removed from the light emitting module 2. Fig. 4 is a sectional view showing a partially enlarged internal structure of the light emitting module 2. In these figures, an XYZ orthogonal coordinate system is shown. The X-axis is along the optical axis of the light emitting module 2 and the central axis of the joint 4 and the sleeve 5 shown in fig. 1. Hereinafter, description will be made on the assumption that the Z-axis direction is the up-down direction and the Y-axis direction is the left-right direction.

As described above, the light emitting module 2 includes the package 10. The package 10 is a so-called CAN package and includes a stem 11 and a cap 12. Both the lever 11 and the cover 12 are formed of metal. The rod 11 and the cover 12 are joined to each other by resistance welding, and the space inside the package 10 is kept airtight. The stem 11 is formed in a substantially circular plate shape, and includes a main surface 11a facing the inner space of the package 10. A plurality of pins 13 pass through the rod 11 and serve as terminals for power supply, ground, input/output of electrical signals. The cap 12 has a substantially cylindrical shape and includes an end wall 14 formed in one axial end portion. A circular opening 14a is formed in the center of the end wall 14. A condenser lens 19 is attached in the opening 14 a. When the light emitting module is mounted on a small optical transceiver such as a small form-factor pluggable (SFP) or SFP +, the diameter (outer diameter size) of the package 10 may be 5.6mm, as an example.

The thermoelectric conversion element 21, the carrier 22, the sub-carrier 30, the semiconductor laser chip 40 as a semiconductor light emitting element, the monitor photodiode (monitor PD)50, and the lens 60 are accommodated in the package 10.

The thermoelectric conversion element 21 is, for example, a peltier element. The thermoelectric conversion element 21 is formed such that one surface is one of a heat absorbing surface or a heat dissipating surface in response to the direction of the supply current, and the other surface is the other of the heat absorbing surface or the heat dissipating surface. The thermoelectric conversion element 21 is located between a pair of plate-like bodies 23 and 24. The thermoelectric conversion element is located on the main surface 11a of the stem 11 on the plate-like body 23. These plate-like bodies 23 and 24 are made of, for example, AlN or Al₂O₃Is formed of the insulating material of (1). Since the thermoelectric conversion element 21 is located inside the package 10, the temperature of the semiconductor laser chip 40 is kept constant. Therefore, high-speed optical communication at 10Gbps or 25Gbps, for example, can be performed. The temperature of the semiconductor laser chip 40 is regulated over a wide temperature range, for example, from-40 ℃ to 80 ℃.

The sub-mount 30 is formed in a rectangular plate shape, and is formed of, for example, an insulating material, for example, a ceramic such as AlN. A semiconductor laser chip 40 emitting light in the optical axis direction (X-axis direction) is mounted on the upper surface (main surface) 31 of the sub-carrier 30. The semiconductor laser chip 40 has a monolithic structure in which a laser diode and an optical modulator are integrated on a common substrate. The sub-carrier 30 is provided with high-frequency wiring 42 by metallization. The high-frequency wiring 42 is electrically connected to a high-frequency wiring 45a formed on a ceramic substrate 45 provided on the main surface 11a of the stem 11 by metallization. For example, the high-frequency wiring 42 and the high-frequency wiring 45a may be connected to each other by an Au wire having a diameter of 25 μm. The impedance is 50 omega.

In the example shown in the figure, the thermistor 46 and the capacitor 47 are mounted on the upper surface of the sub-carrier 30. The thermistor 46 generates an electrical signal indicative of the temperature in the vicinity of the semiconductor laser chip 40. The electric signal is output to the outside of the light emitting module 2 through the pin 13. The thermoelectric conversion element 21 is controlled based on the electric signal. The capacitor 47 is connected between the reference potential line and a bias wiring connected to the laser diode of the semiconductor laser chip 40. A capacitor 47 is provided to stabilize the bias current supplied to the laser diode.

The carrier 22 is arranged on the plate-like body 24. The carrier 22 is formed of the same insulating material as that of the sub-carrier 30. As shown in fig. 4, the carrier 22 includes protrusions 22a formed on an upper surface thereof. That is, the carrier 22 includes upper surfaces 25 and 26 and a connecting surface 27 connecting the upper surfaces 25 and 26. The upper surface 26 is formed at a position lower than the upper surface 25. The distance between the optical axis S1 of the semiconductor laser chip 40 and the upper surface 26 is larger than the distance between the optical axis S1 and the upper surface 25. Both the upper surfaces 25 and 26 are formed as flat surfaces, and the connecting surface 27 extends in a direction perpendicular to the upper surfaces 25 and 26. Further, the boundary between the connecting surface 27 and the upper surface 26 may be smoothly curved. The sub-carrier 30 is mounted on the upper surface 25 of the carrier 22.

The monitor PD50 monitors the emitted light of the semiconductor laser chip 40. In the example shown in the drawing, the monitor PD50 is disposed behind the semiconductor laser chip 40 on the plate-like body 24. The monitor PD50 receives the rear surface light emitted from the rear side of the semiconductor laser chip 40 and generates an electric signal in response to the light intensity of the rear surface light. The electric signal is output to the outside of the light emitting module 2 through the pin 13. The light emission intensity of the laser diode of the semiconductor laser chip 40 is controlled based on the electric signal.

The lens 60 is secured to the upper surface 26 of the carrier 22 by an adhesive 75 and is optically coupled to the semiconductor laser chip 40. The emitted light La from the semiconductor laser chip 40 enters the lens 60. As an example, the lens 60 is a surface-mounted resin lens. The adhesive 75 of this embodiment is a resin adhesive cured by ultraviolet rays. The lens 60 is, for example, a collimator lens that collimates the emitted light La from the semiconductor laser chip 40.

Fig. 5 is a perspective view showing the lens 60. Fig. 6 is a sectional perspective view showing the lens 60. The lens 60 is formed in a substantially rectangular parallelepiped shape, and includes a lens main body 61, a flange 63, and a fixing portion 65. The lens body 61 is an aspherical lens and includes a light incident surface 61a and a light exit surface 61 b. Light emitted from the semiconductor laser chip 40 enters the light incident surface 61a, and light entering the light incident surface 61a is output from the light output surface 61 b. The light incident surface 61a and the light exit surface 61b are both curved surfaces. In the lens 60 of the example shown in the drawing, the curvature of the light incident surface 61a is larger than that of the light exit surface 61 b. That is, the radius of curvature of the light incident surface 61a is smaller than that of the light exit surface 61 b. This is because the distance between the light incident surface 61a and the light emitting end of the semiconductor laser chip 40 is narrow, and the light flux is collimated by the light exit surface 61 b. The fixed portion 65 is a portion fixed to the upper surface 26 of the carrier 22 by an adhesive 75. The fixing portion 65 is formed in at least a part of the periphery of the flange 63.

As an example, the outer dimension of the lens 60 may be 0.6mm square, 1mm square, 1.5mm square, or 0.6mm × 1.0mm rectangle, or the like, when viewed in the optical axis direction. The thickness of the lens 60 in the optical axis direction is about 0.5mm to 1mm, and is determined according to the design of the focal length. The size of the diameter of the collimated light emitted from the light emitting module 2 is, for example, about 0.5 mm.

Fig. 7 is a sectional view of the light emitting module 2 in a section taken in the optical axis direction. As described above, the light emitting module 2 further includes the condenser lens 19. The condenser lens 19 is a resin lens or a glass lens. The condenser lens 19 is optically coupled to the semiconductor laser chip 40 through a lens 60, and condenses collimated light emitted from the lens 60 to a focal point P. The converging light is optically coupled to a fiber stub OS located inside the ferrule 5 and optically coupled to the fiber by the fiber stub OS. The shape of the condenser lens 19 is, for example, a circular shape when viewed in the optical axis direction. The end wall 14 of the cover 12 is provided with a circular opening 14a, through which circular opening 14a light output from the semiconductor laser chip 40 passes. A condenser lens 19 is fitted to the opening 14a to be fixed to the end wall 14. The optical axis of the lens 60 matches the optical axis of the condenser lens 19.

As described above, the isolator and the wavelength demultiplexing filter are disposed between the light emitting module 2 and the focal point P. A lens barrel for guiding the received light to the light receiving module 3 may be disposed between the light emitting module 2 and the focal point P. For example, optical members such as an isolator, a wavelength demultiplexing filter, and a lens barrel may be provided between the condenser lens 19 and the fiber stub OS. Therefore, the distance L1 from the outer surface of the end wall 14 to the focal point P is set to 6mm or more, for example, 6.6 mm. A distance L2 (back focal length) from the light exit surface 19b of the condenser lens 19 to the focal point P is set to 6mm or more (e.g., 6.75 mm). The distance L3 from the main surface 11a of the stem 11 to the focal point P is set to 12mm or more (e.g., 12.2 mm).

The Numerical Aperture (NA) of the semiconductor laser chip 40 is, for example, 0.5, and the NA of the optical fiber stub OS provided in the ferrule 5 is, for example, 0.1. In order to achieve high optical coupling therebetween, the image magnification of the lens system including the lens 60 and the condenser lens 19 may be set to 5 times or more (e.g., 5.4 times). As an example, the focal length of the lens 60 is set to 0.65, and the focal length of the condenser lens 19 is set to 3.52.

When the distance L2 is 6mm or more, the distance is significantly longer than the typical distance of two lens systems (about 3 to 4 mm). Therefore, a meniscus lens is used as the condenser lens 19. The condenser lens 19 includes a light incident surface 19a and a light exit surface 19 b. The light incident surface 19a is a curved surface, and is recessed toward the light exit surface 19 b. The light exit surface 19b is a curved surface, and is convex toward the side opposite to the light incident surface 19 a. The curvature of the light exit surface 19b is larger than that of the light incident surface 19 a. Since the condenser lens 19 is a meniscus lens, a back focal length of, for example, 6mm or more can be set. Further, the side surface of the condenser lens 19 is provided with a step 19c, and the outer diameter of the condenser lens 19 on the light exit surface 19b side is larger than the outer diameter of the condenser lens 19 on the light incident surface 19a side. The step 19c contacts the step 14b formed on the inner surface of the opening 14a to determine the relative position of the condenser lens 19 with respect to the cover 12 in the optical axis direction.

Here, the detailed shape of the condenser lens 19 will be described. Fig. 8A is a front view of the light incident surface 19a viewed in the optical axis direction. As shown in fig. 8A, the light incident surface 19a includes a single area 19a1 (hatched portion in the drawing). The region 19a1 is a circular region, and the center matches the central axis (optical axis) S2 of the condenser lens 19. The range (effective lens diameter) where light enters the light incident surface 19a matches the region 19a 1. Fig. 8B is a rear view showing the light exit surface 19B viewed in the optical axis direction. As shown in fig. 8B, the light exit surface 19B includes a region 19B1 (first region) and a region 19B2 (second region). The region 19b1 is a circular region, and the center matches the central axis (optical axis) S2 of the condenser lens 19. The region 19b2 is a circular ring-shaped region surrounding the region 19b1, and the center matches the central axis (optical axis) S2 of the condenser lens 19. In this embodiment, the region 19b1 and the region 19b2 are adjacent to each other. The range of light output to the light exit surface 19b (effective lens diameter) matches the region obtained by combining the regions 19b1 and 19b 2.

A graph G11 shown in fig. 9A and a graph G13 shown in fig. 9B are graphs showing one example of the relationship between the distance from the optical axis S2 and the radius of curvature of the light incident surface 19A in a cross section including the optical axis S2. The horizontal axis indicates the coordinate position (unit: mm) in the direction orthogonal to the optical axis S2. The origin is the optical axis S2. The vertical axis of fig. 9A indicates the radius of curvature (unit: mm). The vertical axis of fig. 9B indicates the increasing and decreasing rates (unit:%) of the radius of curvature with respect to the lens center. For comparison, fig. 9A and 9B show graphs G12 and G14 of conventional light incident surfaces, respectively. The arrow a in the figure indicates the extent of the region 19a 1. In this example, the region 19a1 is set to a range of 0.40mm or less in distance from the optical axis. In the example and the comparative example, since the back focal length (distance L2) is 6.75mm and the focal length of the condenser lens 19 is 3.52mm, the radius of curvature of the light incident surface 19a on the optical axis S2 is set to 0.75mm, and the radius of curvature of the light exit surface 19b on the optical axis S2 is set to 1.1 mm.

As shown in graphs G11 and G13, the light incident surface 19a of the condenser lens 19 has a sectional shape in which the rate of increase of the radius of curvature with respect to the distance from the optical axis S2 is zero (0) or more in the entire range of the region 19a 1. Here, the "rate of increase in the radius of curvature" refers to a ratio (Δ R/Δ Y) between a minute increase Δ Y in the distance from the optical axis S2 and an increase Δ R in the radius of curvature. The light incident surface 19a of the present embodiment is a concave curved surface, but the sign of the curvature radius is defined as positive. The radius of curvature of the light incident surface 19a is smallest in the optical axis S2, and increases as the distance from the optical axis S2 increases. In an example, the radius of curvature is constant until the distance from the optical axis S2 exceeds the range of-0.15 mm to +0.15mm, and the radius of curvature gradually increases from a position at a distance of-0.15 mm or +0.15mm from the optical axis S2. In graphs G12 and G14 of the comparative example, the rate of increase in the radius of curvature with respect to the distance from the optical axis S2 is zero (0) or less. That is, the radius of curvature of the light incident surface is largest in the optical axis S2, and decreases as the distance from the optical axis S2 increases.

The graph G21 shown in fig. 10A and the graph G23 shown in fig. 10B are graphs showing one example of the relationship between the radius of curvature of the light exit surface 19B and the distance from the optical axis S2 in a section including the optical axis S2. The horizontal axis indicates a coordinate position (unit: mm) in a direction orthogonal to the optical axis S2. The origin indicates the optical axis S2. The vertical axis of fig. 10A indicates the radius of curvature (unit: mm). The vertical axis of fig. 10B indicates the increasing and decreasing rate (unit:%) of the radius of curvature with respect to the center of the lens. For comparison, fig. 10A and 10B show the patterns G22 and G24 of the conventional light exit surface, respectively. The arrow B1 in the figure indicates the extent of the region 19B 1. In this example, the region 19b1 is set to a range in which the distance from the optical axis S2 is in the range of-0.80 mm to +0.80 mm. The arrow B2 in the figure indicates the extent of the region 19B 2. In this example, the region 19b2 is provided in a range in which the distance from the optical axis S2 is in the range of +0.80 to +1.00mm and in a range in which the distance from the optical axis S2 is in the range of from-0.80 to-1.00 mm.

As shown in the graphs G21 and G23, the light exit surface 19b of the condenser lens 19 has a sectional shape in which the sign of the rate of increase of the radius of curvature with respect to the distance from the optical axis S2 is positive in the range of the region 19b 1. The light exit surface 19b has a sectional shape in which the sign of the rate of increase of the radius of curvature with respect to the distance from the optical axis S2 is negative in the range of the region 19b2 surrounding the region 19b 1. The rate of increase of the radius of curvature is defined as the light incident surface 19 a. The light exit surface 19b of this embodiment is a concave curved surface, but the sign of the radius of curvature is defined to be positive similarly to the light entrance surface 19 a. The radius of curvature of the region 19b1 is smallest in the optical axis S2 and increases with increasing distance from the optical axis S2. The radius of curvature of the region 19b2 is largest in the optical axis S2 and decreases with increasing distance from the optical axis S2. In graphs G22 and G24 of the comparative example, the signs of the rates of increase in the radii of curvature with respect to the distance from the optical axis S2 are positive in both regions 19b1 and 19b 2. That is, the radius of curvature of the light incident surface is smallest in the optical axis S2 and increases with increasing distance from the optical axis S2 regardless of the region. The inner diameter of the region 19b2 is, for example, 80% of the outer diameter of the region 19b 2.

The operation and effect obtained by the light emitting module 2 of the above embodiment will be described. In the light emitting module 2, light output from the semiconductor laser chip 40 first reaches the lens 60, and is output from the lens 60 as collimated light. Next, the collimated light reaches the condenser lens 19, and is condensed by the condenser lens 19. Since the light emitting module 2 includes two lens systems (including the lens 60 and the condenser lens 19), the alignment accuracy is high as compared with the case where a single lens is included. Therefore, the optical coupling efficiency between the semiconductor laser chip 40 and the optical fiber can be improved. Further, since the condenser lens 19 is a meniscus lens, the back focal length of the condenser lens 19 can be extended.

In the meniscus lens, positional deviation (axial deviation), that is, eccentricity between the optical axis of the light incident surface and the optical axis of the light exit surface affects the optical coupling efficiency between the semiconductor laser chip 40 and the optical fiber. In order to prevent the decrease in the optical coupling efficiency caused by decentering, in the present embodiment, the rate of increase in the radius of curvature with respect to the distance from the optical axis is zero (0) or more in the light incident surface 19A of the condenser lens 19 (see graphs G11 and G13 of fig. 9A and 9B). In addition, in the light exit surface 19B of the condenser lens 19, the sign of the rate of increase of the radius of curvature with respect to the distance from the optical axis is positive in the region 19B1, and the sign of the rate of increase of the radius of curvature with respect to the distance from the optical axis is negative in the region 19B2 surrounding the region 19B1 (see graphs G21 and G23 of fig. 10A and 10B).

In the examples and the comparative examples, it was investigated how the aberration of the condenser lens and the coupling efficiency between the semiconductor laser chip 40 and the optical fiber are different. In the example, a condenser lens 19 is used. The condenser lens 19 includes a light incident surface 19A and a light exit surface 19B, the light incident surface 19A having a shape shown in fig. 9A and 9B of graphs G11 and G13, and the light exit surface 19B having a shape shown in graphs G21 and G23 of fig. 10A and 10B. In the comparative example, a condenser lens is used. The condenser lens includes a light incident surface having a shape shown in fig. 9A and 9B of fig. G12 and G14, and a light exit surface having a shape shown in fig. 10A and 10B of fig. G22 and G24.

Fig. 11 is a graph showing the relationship between the wavefront aberration and the distance from the optical axis S2 when decentering is in the range of-5 μm to +5 μm. In fig. 11, a graph G31 indicates a wavefront aberration of the exemplary condenser lens 19. The graph G32 indicates the wavefront aberration of the condenser lens of the comparative example. As shown in fig. 11, the wavefront aberration of the condenser lens 19 of the example is significantly reduced as compared with that of the condenser lens of the comparative example. Specifically, a position at a distance of 0.15mm from the optical axis S2 is used as a branch point, and the difference in wavefront aberration between the example and the comparative example is the same up to 0.15mm, but increases with increasing distance from the optical axis S2 in a region exceeding 0.15 mm. For example, in the comparative example, when the distance from the optical axis S2 exceeds 0.30mm, the wavefront aberration exceeds 10m λ rms. In contrast, in the example, the wavefront aberration is suppressed to 7m λ rms or less regardless of the distance from the optical axis S2. Further, in a region at a distance of more than 0.30mm from the optical axis S2, the wavefront aberration of the example is improved by 5m λ rms or more with respect to the wavefront aberration of the comparative example.

Fig. 12 is a graph showing the relationship between coma aberration and the distance from the optical axis S2 when decentering is in the range of-5 μm to +5 μm. In fig. 12, a graph G41 indicates coma aberration of the exemplary condenser lens 19. The graph G42 indicates coma aberration of the condenser lens of the comparative example. As shown in fig. 12, the coma aberration of the condenser lens 19 of the example is significantly reduced as compared with that of the condenser lens of the comparative example. Specifically, a position at a distance of 0.10mm from the optical axis S2 serves as a branching point, and the coma aberration of the example is the same up to 0.10mm, but is stably reduced with respect to the coma aberration of the comparative example in a region exceeding 0.10 mm. For example, in the comparative example, when the distance from the optical axis S2 exceeds 0.15mm, coma aberration exceeds 10m λ rms. In contrast, in the example, the coma aberration is suppressed to 6m λ rms or less regardless of the distance from the optical axis S2. Further, in a region where the distance from the optical axis S2 exceeds 0.10mm, the coma aberration of the example is improved by 5m λ rms or more with respect to the coma aberration of the comparative example.

Fig. 13 is a graph showing the relationship between the spherical aberration and the distance from the optical axis S2 when decentering is in the range of-5 μm to +5 μm. In fig. 13, a graph G51 indicates the spherical aberration of the exemplary condenser lens 19. The graph G52 indicates the spherical aberration of the condenser lens of the comparative example. As shown in fig. 13, the spherical aberration of the condenser lens 19 of the example is significantly reduced as compared with that of the condenser lens of the comparative example. In particular, in a region at a distance of more than 0.30mm from the optical axis S2, the spherical aberration is substantially zero. Further, in a region where the distance from the optical axis S2 exceeds 0.10mm, the spherical aberration of the example is improved by 3.4m λ rms or more relative to the spherical aberration of the comparative example.

Fig. 14A and 14B are diagrams schematically showing a state where light passing through the condenser lens 19 is split into an inner beam BA and an outer beam BB. Table 1 below shows a relationship between the distance from the optical axis S2 and the ratio of the external light beam BB coupled to the optical fiber (the ratio of the amount of light incident on the optical fiber in the light beam BB passing through the condenser lens 19) in each of the example and the comparative example. The ratio at which the external light beam BB is coupled to the optical fiber is the ratio of the amount of light entering the optical fiber in the light beam BB passing through the condenser lens 19. That is, table 1 shows the extent to which light at the tail of collimated light (gaussian beam) contributes to coupling efficiency.

[ Table 1]

Distance from optical axis S2	Comparative example	Examples of the invention	Rate of improvement
				0.1μm	62.5％	62.6％	0.1％
0.15μm	47.1％	47.3％	0.4％
				0.20μm	31.5％	32.6％	3.4％
0.25μm	16.0％	16.9％	6.1％
				0.30μm	7.5％	8.9％	18.6％
0.35μm	0.0％	0.0％	0.0％

Fig. 15 is a graph showing a relationship between decentering of the condenser lens 19 and a reduction amount d η of optical coupling efficiency between the semiconductor laser chip 40 and the optical fiber, the horizontal axis indicates decentering of the condenser lens 19 (unit: μm), the vertical axis indicates a reduction amount d η (unit: dB) of optical coupling efficiency when the decentering is 0 μm, the graph G31 indicates an example, the graph G32 indicates a comparative example, referring to fig. 15, in the comparative example (graph G32), when the decentering is in a range of-5 μm to +5 μm, the reduction amount d η of optical coupling efficiency is about 0.2dB, on the contrary, in the example (graph G31), when the decentering is in a range of-5 μm to +5 μm, the reduction amount d η of optical coupling efficiency is reduced to 0.075 dB.

In this embodiment, the package 10 includes an opening 14a, and light output from the semiconductor laser chip 40 passes through the opening 14 a. A condenser lens 19 may be attached to the opening 14 a. Therefore, the light emitting module 2 can be provided small as compared with the case where the condenser lens 19 is located outside the package 10.

In this embodiment, the back focal length (distance L2) of the condenser lens 19 may be 6mm or more. As described above, the light emitting module 2 of this embodiment can realize a long back focus.

The light emitting module according to the present disclosure is not limited to the above-described embodiments, and may be modified into various other forms. For example, in the above-described embodiment, the case where the condenser lens 19 is attached to the end wall 14 of the package 10 has been exemplified, but the condenser lens 19 may be attached to a component other than the package 10. In this case, the condenser lens 19 may be disposed outside the package 10, or may be disposed inside the package 10.