阅读说明：本技术 抛光垫 (Polishing pad ) 是由 不公告发明人 于 2018-09-10 设计创作，主要内容包括：本公开提出一种抛光垫,具有抛光表面,抛光表面上设有多个研磨槽。定义一参考平面,参考平面垂直于研磨槽的延伸方向,研磨槽的槽腔在参考平面上的正投影呈倒梯形。本公开提出的抛光垫的研磨槽的槽口宽度大于槽底宽度,使得抛光过程中存在于研磨槽中的杂质较容易被去除,从而改善研磨缺陷。(The present disclosure provides a polishing pad having a polishing surface with a plurality of polishing grooves disposed thereon. A reference plane is defined, the reference plane is perpendicular to the extending direction of the grinding grooves, and the orthographic projection of the groove cavities of the grinding grooves on the reference plane is in an inverted trapezoid shape. The notch width of the grinding groove of the polishing pad provided by the disclosure is greater than the groove bottom width, so that impurities existing in the grinding groove in the polishing process are easily removed, and the grinding defect is improved.)

1. A polishing pad is provided with a polishing surface, a plurality of grinding grooves are arranged on the polishing surface, and the polishing pad is characterized in that a reference plane is defined, the reference plane is perpendicular to the extending direction of the grinding grooves, and the orthographic projection of the groove cavities of the grinding grooves on the reference plane is in an inverted trapezoid shape.

2. The polishing pad according to claim 1, wherein the inverted trapezoid has an upper base, a lower base and two waists corresponding to the grinding groove notch, the groove bottom and the two side groove walls, respectively, the upper base having a length greater than the lower base, the two waists having an equal length.

3. The polishing pad of claim 2, wherein the supplementary angle of the angle between the waist and the lower base is 60 ° to 75 °.

4. The polishing pad of claim 2, wherein the product of the height of the inverted trapezoid and the length of the lower base measured in milliinches is 550 to 650.

5. The polishing pad according to any one of claims 1 to 4, wherein the plurality of polishing grooves include a plurality of main polishing grooves and a plurality of sub-polishing grooves, the plurality of main polishing grooves are distributed in a grid pattern and define a plurality of rectangular areas distributed in an array, and at least one sub-polishing groove is disposed in each of the rectangular areas.

6. The polishing pad according to claim 5, wherein the plurality of main polishing grooves comprise:

the grinding device comprises a plurality of first main grinding grooves, a plurality of second main grinding grooves and a grinding device, wherein the first main grinding grooves extend along a first direction respectively, and are distributed in parallel at intervals in a second direction perpendicular to the first direction; and

and the plurality of second main grinding grooves extend along the second direction respectively, and are distributed in the first direction at intervals in parallel.

7. The polishing pad according to claim 5, wherein each of the sub-polishing grooves in the rectangular region extends in the first direction and is spaced apart in parallel in the second direction.

8. The polishing pad according to claim 5, wherein the sub-polishing grooves in the rectangular region include:

at least one first sub-grinding groove respectively extending along the first direction, and each first sub-grinding groove is distributed in parallel at intervals in the second direction; and

and the second sub-grinding grooves respectively extend along the second direction, and are distributed in the first direction at intervals.

9. The polishing pad according to any one of claims 1 to 4, wherein an orthographic projection locus of the polishing grooves on the polishing surface has a wave shape, and the wave-shaped orthographic projection locus conforms to a motion locus of a simple harmonic motion.

10. The polishing pad of claim 9, wherein the amplitude of the orthographic track of the abrasive grooves is between 80 mils and 140 mils.

11. The polishing pad of claim 9, wherein one period of oscillation of the orthographic projected trajectory of the polishing grooves corresponds to a length of 160 mils to 240 mils.

12. The polishing pad of claim 9, wherein the plurality of abrasive grooves comprises:

the grinding device comprises a plurality of first grinding grooves, a plurality of second grinding grooves and a grinding device, wherein the first grinding grooves extend along a first direction respectively, and are distributed in parallel at intervals in a second direction perpendicular to the first direction; and

and the second grinding grooves extend along the second direction respectively, and are distributed in the first direction at intervals in parallel.

13. The polishing pad of claim 9, wherein the plurality of abrasive grooves are radially distributed from a center of the polishing pad to an edge of the polishing pad.

14. The polishing pad according to any one of claims 1 to 4, wherein the groove depth of the polishing groove increases in a direction from a center position of the polishing pad to an edge position of the polishing pad.

15. The polishing pad according to claim 14, wherein a groove depth of a portion of the grinding groove located at a center position of the polishing pad is equal to 0.15 to 0.35 times a thickness of the polishing pad.

16. The polishing pad according to claim 14, wherein a groove depth of a portion of the grinding groove at a position of an edge of the polishing pad is equal to 0.4 to 0.6 times a thickness of the polishing pad.

17. The polishing pad according to claim 14, wherein the thickness of the polishing pad is 70 to 90 mils, and the groove depth of the portion of the abrasive grooves located at the center of the polishing pad is 40 to 45 mils.

18. The polishing pad according to claim 14, wherein the thickness of the polishing pad is 70 to 90 mils, and the groove depth of the portion of the abrasive grooves at the edge position of the polishing pad is 10 to 35 mils.

Technical Field

The disclosure relates to the technical field of chemical mechanical polishing equipment, in particular to a polishing pad.

Background

Polishing pads (pads) are used as an important consumable material for Polishing wafers in a Chemical Mechanical Polishing (CMP) process, and have a very high consumption rate. Each polishing pad directly affects the quality, polishing rate, uniformity, defect formation, etc. of the CMP process.

The design and manufacture of polishing pads are critical to groove texture (groove). The groove texture mainly comprises the functions of carrying grinding fluid (slurry), conveying grinding byproducts (byproducts) and grinding fragments (strips) and serving as a channel for dissipating heat. The groove pattern design of the conventional polishing pad mainly includes a grid pattern (X-Y), a Circular pattern (Circular), a Radial pattern (Radial), a Spiral pattern (Spiral), and the like, and further includes a combination of the above designs, such as a combination of a grid pattern and a Circular pattern (X-Y + Circular), and a combination of a Circular pattern and a Radial pattern (Circular + Radial).

	Circular	X-Y	X-Y+Circular	Circular+Radial
					Dispersion speed of polishing liquid	Slow	Fast-acting toy	Partial fast/partial slow	Partial fast/partial slow
Liquid holdup of Bow	Height of	Is low in	Is low in	Is low in
					Renewal rate of polishing slurry	Slowest speed	Fast-acting toy	Slow	Slow
Grinding fluid utilization rate	Height of	Is low in	Lowest level of	Extremely low
					Heat/debris removal	Slow	Fast-acting toy	Partial fast/partial slow	Partial fast/partial slow
Grinding and polishing quality	Is low in	Height of	Super high	Height of

TABLE 1 comparison table of design parameters of various grooves of polishing pad

However, as shown in Table 1, the various designs of groove patterns of the above-described conventional polishing pads have various degrees of defects. For example, referring to fig. 1 and 2, the grooves 110 of the conventional polishing pad 100 have a rectangular cross-section, which causes polishing by-products and polishing debris to easily remain in the grooves 110 during the polishing process, and since the widths of the notches 1101 and the groove bottoms 1102 of the rectangular grooves 110 are the same, the polishing by-products and the polishing debris are not easily removed as the slurry is renewed and the pad dresser is activated, thereby increasing polishing defects.

Disclosure of Invention

It is a primary object of the present disclosure to overcome at least one of the above-mentioned disadvantages of the prior art and to provide a polishing pad in which impurities in grooves are more easily removed.

In order to achieve the purpose, the following technical scheme is adopted in the disclosure:

according to one aspect of the present disclosure, a polishing pad is provided having a polishing surface with a plurality of abrasive grooves disposed thereon. Wherein, define a reference plane, the reference plane is perpendicular to the extending direction of grinding groove, the orthographic projection of the groove cavity of grinding groove on the reference plane is the trapezoidal of falling.

According to one embodiment of the present disclosure, the inverted trapezoid has an upper bottom, a lower bottom and two waists corresponding to the grinding groove notch, the groove bottom and the groove walls on both sides, respectively, the length of the upper bottom is greater than the lower bottom, and the lengths of the two waists are equal.

According to one embodiment of the present disclosure, the supplementary angle of the included angle between the waist and the lower bottom is 60 ° to 75 °.

According to one embodiment of the present disclosure, when the height value of the inverted trapezoid and the length value of the lower base are measured in milliinches, respectively, the product of the height value and the length value of the lower base is 550 to 650.

According to one embodiment of the present disclosure, the plurality of grinding grooves include a plurality of main grinding grooves and a plurality of sub-grinding grooves, the plurality of main grinding grooves are distributed in a grid shape and define a plurality of rectangular areas distributed in an array, and each of the rectangular areas is provided with at least one of the sub-grinding grooves.

According to one embodiment of the present disclosure, the plurality of main grinding grooves includes a plurality of first main grinding grooves and a plurality of second main grinding grooves. The plurality of first main grinding grooves extend along a first direction respectively, and are distributed in parallel at intervals in a second direction perpendicular to the first direction. The plurality of second main grinding grooves extend along the second direction respectively, and the plurality of second main grinding grooves are distributed in the first direction at intervals in parallel.

According to one embodiment of the present disclosure, each of the sub-grinding grooves in the rectangular region extends along the first direction and is spaced apart from each other in parallel in the second direction.

According to one embodiment of the present disclosure, the sub grinding grooves in the rectangular region include at least one first sub grinding groove and at least one second sub grinding groove. At least one first sub-grinding groove extends along the first direction respectively, and each first sub-grinding groove is distributed in parallel at intervals in the second direction. At least one second sub-grinding groove extends along the second direction respectively, and each second sub-grinding groove is distributed in parallel at intervals in the first direction.

According to one embodiment of the present disclosure, an orthographic projection locus of the grinding groove on the polishing surface is in a wave shape, and the wave-shaped orthographic projection locus conforms to a motion locus of a simple harmonic motion.

According to one embodiment of the present disclosure, the amplitude of the orthographic track of the grinding grooves is 80 mils to 140 mils.

According to one embodiment of the present disclosure, one period of vibration of the orthographic projection trajectory of the grinding groove corresponds to a length of 160 mils to 240 mils.

According to one embodiment of the present disclosure, the plurality of grinding grooves includes a plurality of first grinding grooves and a plurality of second grinding grooves. The plurality of first grinding grooves extend along a first direction respectively, and are distributed in parallel at intervals in a second direction perpendicular to the first direction. The plurality of second grinding grooves extend along the second direction respectively, and the plurality of second grinding grooves are distributed in the first direction at intervals in parallel.

According to one embodiment of the present disclosure, the plurality of grinding grooves are radially distributed from a central position of the polishing pad to an edge of the polishing pad.

According to one embodiment of the present disclosure, the groove depth of the grinding groove increases in a direction from the polishing pad center position to the polishing pad edge position.

According to one embodiment of the present disclosure, a groove depth of a portion of the grinding groove located at a center position of the polishing pad is equal to 0.15 to 0.35 times a thickness of the polishing pad.

According to one embodiment of the present disclosure, a groove depth of a portion of the grinding groove located at an edge of the polishing pad is equal to 0.4 to 0.6 times a thickness of the polishing pad.

According to one embodiment of the present disclosure, the thickness of the polishing pad is 70 mils to 90 mils, and the groove depth of the portion of the grinding groove located at the center of the polishing pad is 40 mils to 45 mils.

According to one embodiment of the present disclosure, the thickness of the polishing pad is 70 mils to 90 mils, and the groove depth of the portion of the grinding groove located at the edge of the polishing pad is 10 mils to 35 mils.

According to the technical scheme, the polishing pad provided by the disclosure has the advantages and positive effects that:

the polishing pad provided by the disclosure has the advantages that the orthographic projection of the groove cavity of the grinding groove arranged on the polishing surface of the polishing pad on the reference plane is in an inverted trapezoid shape. Therefore, the width of the notch of the grinding groove is larger than that of the groove bottom, so that impurities existing in the grinding groove in the polishing process are easily removed, and grinding defects are improved.

Drawings

Various objects, features and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments thereof, when considered in conjunction with the accompanying drawings. The drawings are merely exemplary illustrations of the disclosure and are not necessarily drawn to scale. In the drawings, like reference characters designate the same or similar parts throughout the different views. Wherein:

FIG. 1 shows a schematic cross-sectional view of a groove of a prior art polishing pad;

FIG. 2 is a schematic cross-sectional view of a groove of the polishing pad of FIG. 1 during processing;

FIG. 3 is a schematic cross-sectional view of an abrasive groove of a polishing pad according to an exemplary embodiment;

FIGS. 4 and 5 are schematic cross-sectional views of the grinding grooves of two types of polishing pads shown in FIG. 3, respectively;

FIG. 6 is a top view of a polishing pad according to another exemplary embodiment;

FIG. 7 is an enlarged view of the rectangular area of the polishing pad shown in FIG. 6 bounded by the primary grinding grooves;

FIG. 8 is a top view of a polishing pad according to yet another exemplary embodiment;

FIG. 9 is an enlarged view of the rectangular area of the polishing pad shown in FIG. 8 bounded by the primary grinding grooves;

FIG. 10 is a partial top view of an abrasive groove of a polishing pad according to yet another exemplary embodiment;

FIG. 11 is a schematic diagram of a simple harmonic motion profile corresponding to the polishing grooves of the polishing pad shown in FIG. 10;

FIGS. 12 to 14 are partial plan views of the grinding grooves of the three kinds of polishing pads shown in FIG. 10, respectively;

FIGS. 15 to 17 are top views of three types of polishing pads shown in FIG. 10, respectively;

FIG. 18 is a partial cross-sectional view of a polishing pad according to yet another exemplary embodiment.

The reference numerals are explained below:

100. a polishing pad;

110. a trench;

1101. a notch;

1102. the bottom of the tank;

200. a polishing pad;

201. polishing the surface;

202. a central position;

203. an edge position;

210. a grinding groove;

2101. a notch;

2102. the bottom of the tank;

2103. a trench wall;

2111. a first main grinding groove;

2112. a second main grinding groove;

2113. a rectangular area;

212. a sub-grinding groove;

2121. a first sub-grinding groove;

2122. a second sub-grinding groove;

300. mass points;

F. a direction of extension;

s. simple harmonic motion track;

β, angle compensation;

α.

Detailed Description

Exemplary embodiments that embody features and advantages of the present disclosure are described in detail below in the specification. It is to be understood that the disclosure is capable of various modifications in various embodiments without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

In the following description of various exemplary embodiments of the disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration various exemplary structures, systems, and steps in which aspects of the disclosure may be practiced. It is to be understood that other specific arrangements of parts, structures, example devices, systems, and steps may be utilized, and structural and functional modifications may be made without departing from the scope of the present disclosure. Moreover, although terms may be used in this specification to describe various example features and elements of the disclosure, these terms are used herein for convenience only, e.g., in accordance with the orientation of the examples described in the figures. Nothing in this specification should be construed as requiring a specific three dimensional orientation of structures in order to fall within the scope of this disclosure.