阅读说明：本技术 液体喷射头和液体喷射头的制造方法
(Liquid ejecting head and method of manufacturing liquid ejecting head
) 是由 桥本雄介
真锅贵信
藤井谦儿 于 2019-09-03 设计创作，主要内容包括：本公开提供液体喷射头和液体喷射头的制造方法。该液体喷射头包括：基板,所述基板包括喷射口阵列,在所述喷射口阵列中排列有多个喷射口,每个喷射口均能够喷射液体；以及供给口,所述供给口与所述喷射口连通并通向与所述基板的正面相反的所述基板的背面,所述喷射口位于所述基板的正面上。所述供给口沿着所述喷射口阵列布置,所述供给口的行方向上的至少一个端部在与所述喷射口阵列的行方向相交的宽度方向上的开口宽度小于所述供给口的行方向上的中央部分在所述宽度方向上的开口宽度。(The present disclosure provides a liquid ejection head and a method of manufacturing the liquid ejection head. The liquid ejection head includes: a substrate including an ejection opening array in which a plurality of ejection openings each capable of ejecting a liquid are arranged; and a supply port communicating with the ejection port and opening to a back surface of the substrate opposite to a front surface of the substrate, the ejection port being located on the front surface of the substrate. The supply ports are arranged along the ejection port array, and an opening width of at least one end portion in a row direction of the supply ports in a width direction intersecting the row direction of the ejection port array is smaller than an opening width of a central portion in the width direction of the row direction of the supply ports.)
1. A liquid ejection head comprising:
a substrate including an ejection opening array in which a plurality of ejection openings each capable of ejecting a liquid are arranged; and a supply port communicating with the ejection port and opening to a back surface of the substrate opposite to a front surface of the substrate, the ejection port being located on the front surface of the substrate, wherein
The supply ports are arranged along the ejection port array, and
an opening width of at least one end portion in the row direction of the supply port in a width direction intersecting the row direction of the ejection port array is smaller than an opening width of a central portion in the row direction of the supply port in the width direction.
2. The liquid ejection head according to claim 1, wherein the liquid ejection head comprises a liquid ejection head body having a plurality of liquid ejection holes
X2 is not more than X1X 1/2,
wherein X1 denotes an opening width of a central portion of the supply port in the width direction, and X2 denotes an opening width of an end portion of the supply port in the width direction.
3. The liquid ejection head according to claim 1, wherein the liquid ejection head comprises a liquid ejection head body having a plurality of liquid ejection holes
Y2 is not more than Y1X 1/10,
wherein Y1 denotes a length of the supply port in the row direction, and Y2 denotes a length of a portion of the end portion in the row direction where an opening width in the width direction is smaller.
4. The liquid ejection head according to claim 1, wherein the liquid ejection head comprises a liquid ejection head body having a plurality of liquid ejection holes
The substrate is formed by joining a first member formed with the ejection port and a second member formed with the supply port.
5. The liquid ejection head according to claim 4, wherein the liquid ejection head
The supply port has different opening shapes on an engagement surface of the second member with the first member and on a surface of the second member opposite to the engagement surface.
6. The liquid ejection head according to claim 5, wherein the liquid ejection head
The supply ports located on the joining surface have a uniform opening width over the length of the line direction of the supply ports.
7. The liquid ejection head according to claim 6, wherein the liquid ejection head comprises a liquid ejection head body having a plurality of liquid ejection holes
The opening width of the supply port on the engagement surface is smaller than the opening width of at least one end portion in the row direction of the supply port on the surface opposite to the engagement surface.
8. The liquid ejection head according to claim 4, wherein the liquid ejection head
The supply ports have the same opening shape on an engagement surface of the second member with the first member and on a surface of the second member opposite to the engagement surface.
9. The liquid ejection head according to claim 1, wherein the liquid ejection head comprises a liquid ejection head body having a plurality of liquid ejection holes
The substrate is adhesively attached to a support member that supports the substrate.
10. The liquid ejection head according to claim 4, wherein the liquid ejection head
The second member is formed of silicon.
11. The liquid ejection head according to claim 9, wherein the liquid ejection head comprises a liquid ejection head body having a plurality of liquid ejection holes
The support member is formed of resin.
12. The liquid ejection head according to claim 5, wherein the liquid ejection head
The central portion of the supply port on the surface opposite to the engagement surface has a plurality of different opening widths in the width direction.
13. The liquid ejection head according to claim 12, wherein the liquid ejection head comprises a liquid ejection head
The supply port on the surface opposite to the engagement surface includes an opening having a first opening width at each end in the row direction of the supply port, and
at a central portion of the supply port on a surface opposite to the joining surface, an opening having a second opening width larger than the first opening width and an opening having the first opening width are alternately arranged.
14. The liquid ejection head according to claim 12, wherein the liquid ejection head comprises a liquid ejection head
The supply port on a surface opposite to the engagement surface has: an opening having a first opening width at each end in the row direction of the supply ports, an opening having a second opening width larger than the first opening width at each end in the row direction of the central portion, and an opening having a third opening width larger than the second opening width at the central portion except for each end of the central portion.
15. A method of manufacturing a liquid ejection head, the liquid ejection head comprising: a substrate including an ejection opening array in which a plurality of ejection openings each capable of ejecting a liquid are arranged; and a supply port communicating with the ejection port and opening to a back surface of the substrate opposite to a front surface of the substrate, the ejection port being located on the front surface of the substrate, the method comprising:
forming the supply ports, the supply ports being arranged along the ejection port array, an opening width of at least one end portion in a row direction of the supply ports in a width direction intersecting the row direction of the ejection port array being smaller than an opening width of a central portion in the row direction of the supply ports in the width direction.
Technical Field
The present invention relates to a liquid ejection head including ejection ports that eject liquid supplied from supply ports, and a manufacturing method of the liquid ejection head.
Background
An ejection port for ejecting liquid and a supply port, which is a through hole for supplying the liquid to the ejection port, are formed in a substrate for the liquid ejection head. The portion in which the supply port is formed is a silicon substrate. In recent years, there is a demand for reducing the size of a substrate to reduce the cost of equipment.
Japanese patent laid-open No. h10-181032 discloses a method of manufacturing an ink jet print head capable of forming an ink supply port, which is a through hole having a prescribed size, by using a sacrifice layer that can be selectively etched on a substrate material to prevent variation in the opening diameter of the ink supply port.
Disclosure of Invention
The liquid ejection head according to the present invention includes: a substrate including an ejection opening array in which a plurality of ejection openings each capable of ejecting a liquid are arranged; and a supply port communicating with the ejection port and opening to a back surface of the substrate opposite to a front surface of the substrate, the ejection port being located on the front surface of the substrate. The supply ports are arranged along the ejection port array, and an opening width of at least one end portion in a row direction of the supply ports in a width direction intersecting the row direction of the ejection port array is smaller than an opening width of a central portion in the row direction of the supply ports in the width direction.
Further features of the invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Drawings
Fig. 1 is a perspective view of a liquid ejection head;
fig. 2 is a perspective view of a printing element substrate;
fig. 3A is a cross-sectional view of a printing element substrate;
fig. 3B is a sectional view of the printing element substrate;
fig. 4A is a diagram showing the front surface of the printing element substrate;
fig. 4B is a diagram showing the back surface of the printing element substrate;
fig. 5 is a diagram showing a manufacturing process of a printing element substrate;
fig. 6A is a schematic perspective view of a liquid ejection head;
fig. 6B is a schematic perspective view of the liquid ejection head;
fig. 7 is a diagram showing the back surface of the printing element substrate;
fig. 8 is a diagram showing the back surface of the printing element substrate; and
fig. 9 is a diagram showing the back surface of the printing element substrate.
Detailed Description
In the case of reducing the substrate size, the thickness of the wall around the supply port in the silicon substrate is reduced, resulting in low rigidity of the silicon substrate. For example, a silicon substrate is bonded to a support member made of resin. Stress generated when the silicon substrate and the support member are joined sometimes causes cracks at corner portions at the opening end of the supply port. In the case of occurrence of cracks, desired ejection may not be performed.
To solve this problem, the present invention provides a highly reliable liquid ejection head in which cracks are prevented from occurring in a substrate, and a method of manufacturing the liquid ejection head.
(first embodiment)
A first embodiment of the present invention will be described below with reference to the drawings.
Fig. 1 is a perspective view of a liquid ejection head 1 to which the present embodiment can be applied. The liquid ejection head 1 includes a printing element substrate 2, an electric wiring board 3, and a support member 4. The printing element substrate 2 is supported by a support member 4, and is connected to the electric wiring board 3.
Fig. 2 is a perspective view of the printing element substrate 2. The printing element substrate 2 includes a silicon substrate 11 and an ejection port member 16. The ejection port member 16 has a plurality of ejection ports 19 capable of ejecting liquid and a flow path associated with each ejection port. The ejection ports 19 are arranged in rows. The silicon substrate 11 is formed of silicon, and the silicon substrate 11 has a supply port 18 which is a through hole leading to a back surface opposite to a front surface on which ejection ports 19 of the printing element substrate 2 are provided. The supply port 18 formed by etching communicates with the flow path of the ejection port member 16. The silicon substrate 11 has an energy generating element 12 formed in association with a flow path of the ejection orifice member 16. The energy generating elements 12 are located at positions facing the respective ejection ports 19. The energy generating elements 12 are arranged in rows, and two rows are located on both sides of the supply port 18, respectively. The supply port 18 is a through hole formed by etching the silicon substrate 11 made of single crystal silicon with the plane direction of [100 ].
The printing element substrate 2 has an ejection port surface 101, a back surface 102 opposite to the ejection port surface 101, and four side surfaces 21a and 21b on the sides of the ejection port surface 101. The side surface 21a is a side surface on the short side of the printing element substrate 2, and the side surface 21b is a side surface on the long side of the printing element substrate 2. Along at least one side (two sides in the present embodiment) of the joint surface between the silicon substrate 11 and the ejection port member 16, there are formed connection terminals 20 electrically connected to lead terminals 24 described later for receiving a drive signal and a drive power. The driving signal input to the connection terminal 20 drives the energy generating element 12. The liquid ejection head 1 performs printing by applying pressure generated by the energy generating elements 12 to ink (liquid) introduced into a flow path via the supply ports 18, thereby ejecting liquid droplets through the ejection ports 19 and causing the liquid droplets to adhere to a printing medium.
Fig. 3A is a cross-sectional view of the printing element substrate 2 taken along line Vb2e2-Vb2e2 in fig. 2; fig. 3B is a sectional view of the printing element substrate 2 taken along line Vb1e1-Vb1e1 in fig. 2. The supply port 18 provided in the printing element substrate 2 has a large opening width (as shown in fig. 3A) at a central portion of the back surface 102 of the printing element substrate 2 (in the width direction, the width direction is a direction intersecting the row direction of the ejection opening array), and has a small opening width (as shown in fig. 3B) at both end portions of the supply port 18. In other words, on the back surface 102 of the printing element substrate 2, the walls on both sides of the supply port 18 are thicker at the end portions than at the central portion. Note that a configuration is also possible in which at least one end portion of the supply port 18 has a smaller width than the central portion.
Fig. 4A is a diagram showing the front surface of the silicon substrate 11, which shows that the opening of the supply port 18 has a uniform opening width over the longitudinal length of the silicon substrate 11 (in the row direction of the ejection port array, here in the up-down direction in the drawing). The uniform opening width means that the opening widths are the same excluding the difference caused by the manufacturing error. Specifically, when the reference opening width is X, an opening width in a range of 95% or more and 105% or less of X is considered to be a uniform opening width with respect to the reference opening width. Fig. 4B is a diagram showing the back surface of the silicon substrate 11, which shows that the opening of the supply port 18 has a larger opening width at the central portion in the longitudinal direction of the silicon substrate 11 and smaller opening widths at both end portions in the longitudinal direction. As described above, the supply port 18 has different opening shapes on the front surface and the back surface of the silicon substrate 11.
Here, at the central portion in the longitudinal direction of the supply port 18 formed in the silicon substrate 11, the width dimension of the supply port 18 in the direction intersecting the longitudinal direction is denoted by X1. The width dimension of the opening formed in the periphery of the end portion of the ejection port array and narrower than the central portion in the longitudinal direction of the supply port 18 is denoted by X2. Here, the relationship between X1 and X2 that satisfies X2 ≦ X1 × 1/2 prevents cracks from being generated at the corner portion of the open end without lowering the ejection accuracy.
In addition, the dimension of the supply port 18 formed in the silicon substrate 11 in the longitudinal direction is denoted by Y1. A size in the longitudinal direction of an opening formed in the periphery of the end portion of the ejection port array and narrower than the central portion in the longitudinal direction of the supply port 18 is represented by Y2. Here, the relationship between Y1 and Y2 that satisfies Y2 ≦ Y1 × 1/10 prevents cracks from being generated at the corner portion of the open end without lowering the ejection accuracy. For example, the size of Y2 should preferably be less than or equal to 0.5 mm.
Fig. 5 is a diagram showing a manufacturing process of the printing element substrate 2. The method of manufacturing the printing element substrate 2 will be described in the order of processing. First, as shown in part (a) of fig. 5, a silicon substrate 11 in which the principal plane of the base material is [100] is prepared, a film 13 is formed in advance on the front surface (surface having the energy generating elements 12), and an unnecessary portion of the film 13 is removed by patterning. Note that the material of the film 13 is not limited to any specific material as long as patterning can be performed on the material.
The portions (b-1) to (e-1) of FIG. 5 are sectional views at positions corresponding to Vb1e1-Vb1e1 in FIG. 2; portions (b-2) to (e-2) of FIG. 5 are sectional views at positions corresponding to Vb2e2-Vb2e2 in FIG. 2. Next, a resin is applied to the front surface of the silicon substrate 11 shown in part (a) of fig. 5 by spin coating, direct coating, spray coating, or other methods, and a protective layer 14 having a desired pattern is formed, which serves as a contact layer on the front surface. Note that as a patterning method, a pattern may be formed by applying a resist, then forming a resist pattern by exposure and development, and etching the protective layer 14 using the resist as a mask, or direct patterning may be performed using a photosensitive material.
On the back surface of the silicon substrate 11, the protective layer 14 is patterned to form an etching pattern for an opening width that is smaller at the periphery of the end portion of the ejection opening array than at the central portion. As a method of forming the etching pattern, etching patterns having openings of different widths may be directly formed on the back surface by laser irradiation or drilling instead of using the protective layer 14. Next, a pilot hole 17 is formed in the silicon substrate 11. As a method of forming the pilot hole 17, laser irradiation, drilling, or other methods may be used. This process may be performed from the front surface or from the back surface of the silicon substrate 11. Pilot hole 17 may be a through hole or a non-through hole. In order to prevent damage to the film 13 and the protective layer 14 on the front surface, the process of forming the pilot hole 17 may be performed after the front surface is protected with cyclized rubber, adhesive tape, or the like.
Thereafter, as shown in parts (c-1) and (c-2) of fig. 5, the silicon substrate 11 is etched to form a through hole having an opening in the silicon substrate 11, the opening being narrower at the periphery of the end portion of the ejection opening array than at the central portion. The etching of the silicon substrate 11 may be wet etching using a liquid having a desired basicity, or may be dry etching using a gas having a desired ratio. Note that the etching treatment may be performed with the front surface of the silicon substrate 11 protected with cyclized rubber, tape, or the like.
Next, as shown in the portions (d-1) and (d-2) of FIG. 5, a resin layer 15 made of a photosensitive resin is formed. As a method of this process, after the hole filling material is put into the supply port 18, the photosensitive resin may be applied by spin coating, direct coating, spray coating, or other methods, or the resin layer 15 may be formed into a film, which may then be attached to the silicon substrate 11. After that, a desired flow path pattern is formed in the resin layer 15 by exposure and development.
Thereafter, as shown in parts (e-1) and (e-2) of fig. 5, a coating resin forming the ejection opening member 16 is applied onto the resin layer 15 by spin coating, direct coating, spray coating, or other methods. After that, a portion corresponding to the ejection openings 19 is removed by exposure and development to form the ejection opening member 16 having the ejection openings 19. Next, the protective layer 14 formed on the back surface is removed by dry etching. Further, in the case of using the hole filling material, after removing it, the silicon substrate 11 having the resin layer 15 and the ejection opening member 16 is immersed in a solvent capable of dissolving the resin layer 15 to remove the resin layer 15 from the silicon substrate 11. By this process, the silicon substrate 11 including the ejection port 19, the supply port 18, and the flow path (supply path) connecting the ejection port 19 and the supply port 18 can be obtained. Then, the silicon substrate 11 is cut and divided by a laser sorter, a cutting sorter, or the like to obtain the printing element substrate 2.
Fig. 6A, 6B are schematic perspective views of the liquid ejection head 1 of the present embodiment. Fig. 6A is an exploded perspective view of the liquid ejection head 1; fig. 6B is a perspective view of the liquid ejection head 1. The support member 4 has a recess in which a flow path 26 associated with the supply port of the printing element substrate 2 is provided. The electric wiring board 3 is provided in order to apply an electric signal to the surface of the support member 4 where the recess is formed to supply ink to the printing element substrate 2. The electric wiring board 3 has a device hole 23 in which the printing element substrate 2 is placed, and lead terminals 24 associated with the connection terminals 20 of the printing element substrate 2 are formed on both sides of the device hole 23. The lead terminal 24 forms an electrical connection portion (not shown) together with the connection terminal 20 formed along both sides of the ejection orifice surface 101. The electric wiring board 3 has an external signal input terminal 25 for receiving a driving signal and driving power from the inkjet printing apparatus.
As a forming method, the support member 4 may be formed of a resin material or an alumina material, or may be formed by sintering a powder material. Note that in the case of molding a resin material, a resin material containing a filler composed of glass or other material may be used to improve the shapeThe rigidity of (2). The material constituting the support member 4 may be a resin material such as modified PPE (polyphenylene ether), with Al2O3Are representative of ceramic materials or any other wide range of materials. The support member 4 has a printing liquid supply path for supplying a printing liquid. In the case where two or more printing liquids are used, it is preferable to form the partition wall so as to prevent each of the printing liquids from being mixed with each other.
Next, the adhesive 27 is applied to the concave portion of the support member 4 along the periphery of the opening of the flow path 26, and the printing element substrate 2 is bonded to the support member 4. As the application method, the adhesive 27 may be transferred with a transfer needle, or the adhesive 27 may be applied by drawing with a dispenser. By this process, the flow path 26 of the support member 4 and the supply port 18 of the printing element substrate 2 are connected. When the printing element substrate 2 is adhered to the support member 4, after the adhesive 27 is applied, the adhesive 27 should preferably be pressed with the back surface 102 of the printing element substrate 2. After that, the electric wiring board 3 is adhered to the main surface of the supporting member 4 with an adhesive (not shown). The adhesive used for these adhesion treatments should preferably be an adhesive having good ink resistance, and therefore, for example, a thermosetting adhesive containing an epoxy resin as a main component may be used.
Next, the space between the side surface 21a of the printing element substrate 2 and the wall of the recess is sealed with the sealing material 28. After that, the electrical connection portion is sealed with a sealing material 28. Next, the electrical connection portions between the connection terminals 20 of the printing element substrate 2 and the lead terminals 24 of the electric wiring board 3 (the upper portions of the lead terminals 24) are sealed, and the sealing material 28 is heated and cured.
As described above, in the supply port 18 of the printing element substrate 2, openings having an opening width smaller than that of the central portion in the longitudinal direction are provided at both end portions in the longitudinal direction. This configuration makes it possible to provide a liquid ejection head that suppresses a decrease in yield and a method of manufacturing the liquid ejection head.
(second embodiment)
A second embodiment of the present invention will be described below with reference to the drawings. Note that the basic configuration of the present embodiment is the same as that of the first embodiment, and therefore, only a unique configuration will be described hereinafter.
Fig. 7 is a diagram showing the back surface of the printing element substrate 30 of the present embodiment. The opening of the supply port 18 on the back surface of the printing element substrate 30 has a shape in which the opening width is smaller at both ends in the longitudinal direction, and a portion having a large opening width and a portion having a small opening width are alternately arranged between the both ends (at portions other than the both ends). Such a shape of the opening of the supply port 18 makes it possible to prevent cracks of the printing element substrate 2 from occurring at the corner portion of the opening end without lowering the ejection accuracy. Note that the supply port 18 may have a plurality of different opening widths in the width direction at portions other than both end portions.
(third embodiment)
A third embodiment of the present invention will be described below with reference to the drawings. Note that the basic configuration of the present embodiment is the same as that of the first embodiment, and therefore, only a unique configuration will be described hereinafter.
Fig. 8 is a diagram showing the back surface of the printing element substrate 40 of the present embodiment. The supply port 18 has a plurality of different opening widths at both ends in the longitudinal direction of the opening on the back surface of the printing element substrate 40, and the opening widths at both ends are smallest. The present embodiment has two different opening widths at both ends in the longitudinal direction. More specifically, the supply port 18 has openings with the smallest opening width at both ends in the longitudinal direction, the opening with the second smallest opening width is adjacent to the opening with the smallest opening width, and further, the opening with the largest opening width is adjacent to the opening with the second smallest opening width. Such a shape of the opening of the supply port 18 makes it possible to prevent cracks of the printing element substrate 2 from occurring at the corner portion of the opening end without lowering the ejection accuracy.
(fourth embodiment)
A fourth embodiment of the present invention will be described below with reference to the drawings. Note that the basic configuration of the present embodiment is the same as that of the first embodiment, and therefore, only a unique configuration will be described hereinafter.
Fig. 9 is a diagram showing the back surface of the printing element substrate 50 of the present embodiment. The openings of the supply ports 18 of the printing element substrate 50 have the same opening shape on the front surface and the back surface. More specifically, the opening on the front face of the supply port 18 also has a shape in which the opening width is smaller at both ends in the longitudinal direction. Such a shape of the opening of the supply port 18 makes it possible to prevent cracks of the printing element substrate 2 from occurring at the corner portion of the opening end without lowering the ejection accuracy. Note that even if there is a difference between the two opening shapes, these opening shapes are still considered to be the same opening shape if the difference is caused only by a manufacturing error.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
