阅读说明：本技术 电容器装置 (Capacitor device ) 是由 佐野友久 原田大辅 荒木清道 今井洋平 広瀬健太郎 于 2019-09-11 设计创作，主要内容包括：一种电容器装置,用于在电源与包括电子和/或电气部件的目标部件之间输送电力,至少一个电容器容纳在电容器壳体中。从电容器壳体引出母线。母线将至少一个电容器电连接到目标部件。电容器壳体至少包括第一固定构件、第二固定构件和第三固定构件,用于将电容器壳体固定。第三固定构件定位成与将第一固定构件的第一基准点与第二固定构件的第二基准点之间连接的虚拟线分离,并且定位成比第一固定构件和第二固定构件更靠近目标部件。母线定位成比虚拟线更靠近第三固定构件。(A capacitor arrangement for transferring electrical power between a power source and a target component comprising electronic and/or electrical components, at least one capacitor being accommodated in a capacitor housing. Bus bars are led out from the capacitor case. The bus bar electrically connects the at least one capacitor to the target component. The capacitor case includes at least a first fixing member, a second fixing member, and a third fixing member for fixing the capacitor case. The third fixing member is positioned apart from a virtual line connecting between the first reference point of the first fixing member and the second reference point of the second fixing member, and is positioned closer to the target component than the first fixing member and the second fixing member. The bus bar is positioned closer to the third fixing member than the virtual line.)

1. A capacitor device for transferring power between a power source and a target component comprising electronic and/or electrical components, the capacitor device comprising:

at least one capacitor;

a capacitor case configured to house the at least one capacitor; and

a bus bar drawn from the capacitor case and configured to electrically connect the at least one capacitor to the target component,

wherein the content of the first and second substances,

the capacitor case includes at least a first fixing member, a second fixing member, and a third fixing member for fixing the capacitor case,

the third fixing member is positioned apart from a virtual line connecting between a first reference point of the first fixing member and a second reference point of the second fixing member, and is positioned closer to the target part than the first fixing member and the second fixing member,

the bus bar is positioned closer to the third fixing member than the virtual line.

2. The capacitor device of claim 1,

the capacitor case has a first region and a second region separated by the virtual line, the first region being closer to the third fixing member than the second region,

the bus bar is located in the first region.

3. The capacitor device according to claim 1 or 2,

the capacitor case has:

an enclosed space in which the at least one capacitor is housed; and

an end face that communicates with the closed space and that overlaps with the virtual line when viewed from a normal to the end face,

when a first additional virtual line and a second additional virtual line are provided to connect between the first reference point of the first fixing member and the reference point of the third fixing member and between the second reference point of the second fixing member and the reference point of the third fixing member, respectively, the virtual lines and the first and second additional virtual lines constitute a triangular region,

the end face of the capacitor case has a center of gravity,

the center of gravity of the end face of the capacitor case is located within the triangular region.

4. The capacitor device according to any one of claims 1 to 3,

the at least one capacitor includes at least a first capacitor and a second capacitor housed in the capacitor case,

a third capacitor is located between the first and second stationary members.

5. The capacitor device according to any one of claims 1 to 3,

the capacitor case is configured to have:

a predetermined longitudinal direction; and

a first end and a second end in the longitudinal direction,

the first and second fixing members are located at the respective first and second ends of the capacitor case.

6. The capacitor device of claim 3,

the capacitor case is configured to have:

a predetermined longitudinal direction; and

a first end and a second end in the longitudinal direction,

the first and second fixing members are located at the respective first and second ends of the capacitor case,

each of the first to third fixing members has a predetermined height in a direction perpendicular to the longitudinal direction and a normal line direction,

the third fixing member has a height higher than a height of each of the first and second fixing members.

Technical Field

The present invention relates to a capacitor device.

Background

A known capacitor device, for example, the capacitor device disclosed in japanese patent application laid-open No. 2014-45035, constitutes at least a part of a power converter that can be mounted in a vehicle such as an electric vehicle or a hybrid vehicle. Such a capacitor device includes a filter capacitor constituted by a plurality of capacitor elements, a smoothing capacitor constituted by a plurality of capacitor elements, and a capacitor case in which the filter capacitor and the smoothing capacitor are mounted.

Such a capacitor arrangement comprises busbars, i.e. capacitor terminals, for the filter capacitor and the smoothing capacitor. Each bus bar has opposite first and second ends, the first end of each bus bar being connected to a respective one of the filter capacitor and the smoothing capacitor, and the second end of each bus bar leading out of and extending from the capacitor case. The second end of the corresponding bus bar is electrically connected to the semiconductor module constituting the power converter.

The bus bars leading out of the capacitor case of the above known capacitor device are susceptible to load stress due to vibration. In particular, in the known capacitor device configured to integrate the capacitor and the bus bar with each other, since the size and weight of the capacitor device become large, the load stress exerted on the bus bar may become large.

From this point of view, it is desirable for designers of such capacitor devices to create a simpler, i.e., lower cost, structure of the capacitor device to improve the vibration resistance of the bus bar.

Disclosure of the inventionin order to solve such a need, an object of the present disclosure is to provide capacitor devices each capable of improving vibration resistance of a bus bar with a simpler structural idea.

According to an exemplary aspect of the present disclosure, a capacitor device for transferring electrical power between a power source and a target component comprising electronic and/or electrical components is provided. The capacitor device includes at least one capacitor, a capacitor case configured to house the at least one capacitor, and a bus bar drawn from the capacitor case and configured to electrically connect the at least one capacitor to a target component. The capacitor case includes at least a first fixing member, a second fixing member, and a third fixing member for fixing the capacitor case. The third fixing member is positioned apart from a virtual line connecting the first reference point of the first fixing member and the second reference point of the second fixing member, and is positioned closer to the target part than the first fixing member and the second fixing member. The bus bar is positioned closer to the third fixing member than the virtual line.

The third fixing member is positioned apart from a virtual line connecting reference points of the respective first and second fixing members, and is positioned closer to the target part than the first and second fixing members. Therefore, positioning the bus bar closer to the third fixing member than the virtual line enables the load stress received by the bus bar to be suppressed to a low level, resulting in the bus bar having improved vibration resistance.

Drawings

Other aspects of the disclosure will become apparent from the following description of embodiments, with reference to the accompanying drawings, in which:

fig. 1 is a cross-sectional view of a power converter according to a first embodiment of the present disclosure;

FIG. 2 is a circuit diagram of the power converter shown in FIG. 1;

FIG. 3 is an enlarged perspective view of the capacitor device shown in FIG. 1;

fig. 4 is a plan view of the capacitor device shown in fig. 3 as viewed from arrow IV;

fig. 5 is a plan view of the capacitor device shown in fig. 3 as viewed from arrow V;

fig. 6 is a plan view corresponding to fig. 5 and schematically showing a positional relationship between the primary fixing member and the secondary fixing member shown in fig. 5;

fig. 7 is a plan view of a capacitor device according to a second embodiment of the present disclosure, corresponding to fig. 6;

fig. 8 is a plan view of a capacitor device according to a third embodiment of the present disclosure, corresponding to fig. 6.

Detailed Description

A capacitor device as an embodiment of the present disclosure is described below with reference to the drawings. In the embodiments, similar or equivalent portions to which the same reference numerals are assigned between the embodiments are omitted or simplified to avoid redundant description.

First embodiment

Hereinafter, a power converter 1 is explained, the above power converter 1 including a capacitor device 10 according to a first embodiment of the present disclosure. The power converter 1 of the first embodiment is for installation in a vehicle, such as an electric vehicle or a hybrid vehicle. Specifically, the power converter 1 mounted in the vehicle functions as an inverter for converting input power supplied from a Direct Current (DC) power source into output Alternating Current (AC) power required to drive driving wheels of the vehicle.

Referring to fig. 1, a power converter 1 includes a semiconductor stacked unit, i.e., a semiconductor stacked assembly 3, a control circuit board 7, an inductor component 8, a power-on circuit 9, a capacitor device 10, a discharge resistance plate 24, and a case, i.e., a housing 2. These components 3, 7, 8, 10 and 24 are mounted, i.e. accommodated, in the housing 2. The housing 2 is made of, for example, a high heat dissipation material such as a metal material.

The semiconductor stack unit 3 includes a plurality of semiconductor modules 4 and a cooling mechanism CM including a set of cooling pipes 6, an introduction pipe 6a, and a discharge pipe 6 b. A plurality of semiconductor elements 5 are incorporated in each semiconductor module 4 (see fig. 2). The semiconductor module 4 includes a first semiconductor module 4A and a second semiconductor module 4B described later.

The semiconductor stack unit 3 is configured such that the semiconductor modules 4 and the cooling tubes 6 are alternately stacked in a predetermined first direction X to have a stacked structure. The cooling tubes 6 include end cooling tubes that respectively constitute both ends of the groups of cooling tubes 6 in the first direction X. That is, each semiconductor module 4 has opposite major sides in the first direction X, and each semiconductor module 4 is sandwiched from the corresponding major sides by two adjacent cooling tubes 6 respectively located in the vicinity of the major sides in the first direction X.

Each cooling tube 6 has a substantially rectangular plate-like shape, and a longitudinal length in the second direction Y is longer than a longitudinal length of each semiconductor module 4 in the second direction Y. Note that the first direction X and the second direction Y may define a third direction, which will be referred to as a height direction Z, perpendicular to the first direction X and the second direction Y. For example, the third direction Z has in particular a first and a second relative orientation. The first orientation corresponds to an upward direction and the second orientation corresponds to a downward direction.

The housing 2 has, for example, a substantially rectangular parallelepiped or square shape having opposite top and bottom walls 2a1 and 2a2 facing each other in the third direction Z and opposite side walls 2b1 and 2b2 facing each other in the second direction Y. The housing 2 also has opposite side walls, not shown, facing each other in the X direction.

Each cooling tube 6 has opposite first and second ends in its longitudinal direction, i.e., Y-direction; the first end of each cooling tube 6 is closer to the side wall 2b1 than the side wall 2b2, and the second end of each cooling tube 6 is closer to the side wall 2b2 than the side wall 2b 1.

The inlet pipe 6a is communicably connected to a first end of each cooling pipe 6, and the outlet pipe 6b is communicably connected to a second end of each cooling pipe 6.

When a predetermined refrigerant, i.e., coolant, is introduced into the introduction pipe 6a, the refrigerant flows into all the cooling pipes 6 from the first ends thereof and reaches the second ends of all the cooling pipes 6. Thereafter, the refrigerant flows through the discharge tube 6b to be discharged from the discharge tube 6 b. That is, the semiconductor module 4 is cooled by repeating the introduction of the coolant into the cooling pipe and the discharge of the coolant from the cooling pipe.

Each semiconductor module 4 includes a package (body) having a substantially rectangular parallelepiped shape with first and second opposite sides in the third direction Z. Each semiconductor module 4 includes a control terminal 4 a. Each control terminal 4a has a first end connected to a corresponding one of the semiconductor elements 5 mounted in a corresponding one of the semiconductor modules 4. Each control terminal 4a also has a second end opposite to the first end. The second end of each control terminal 4a is configured to protrude from the first side of the package to extend in an upward direction of the third direction Z.

Each semiconductor module 4 further includes a positive dc terminal 4b, a negative dc terminal 4b, and an ac terminal 4 d. Each of the positive dc terminal 4b, the negative dc terminal 4c, and the ac terminal 4d has a first end commonly connected to the semiconductor element 5 mounted in the corresponding semiconductor module 4. Each of the positive dc terminal 4b, the negative dc terminal 4c, and the ac terminal 4d has a second end opposite to the first end. A second end of each of the positive dc terminal 4b, the negative dc terminal 4c, and the ac terminal 4d is configured to protrude from the second side of the package to extend in a downward direction of the third direction Z.

The control circuit board 7 is positioned to face the first side of each semiconductor module 4, and the second ends of the respective control terminals 4a are connected to the control circuit board 7.

As described later, the control circuit board 7 controls the on/off switching operation of each semiconductor element 5, thereby converting the direct-current power input to the power converter 1 into alternating-current power. Freely available semiconductor switching elements, typically Insulated Gate Bipolar Transistors (IGBTs) or metal oxide semiconductor transistors (MOSFETs), may be used as each semiconductor element 5.

An inductor component 8, which will also be referred to as a reactor component 8, is located, for example, on the lower side of the semiconductor stacked unit 3 so as to face the semiconductor stacked unit 3 in the third direction Z. The inductor component 8 comprises a coil having opposite first and second ends.

The energizing circuit 9 is connected to a direct-current power supply, that is, a battery B having a positive terminal Ba and a negative terminal Bb (see fig. 2), the positive terminal Ba of the battery B is connected to a first end of the coil of the inductor component 8, and a second end of the coil of the inductor component 8 is connected to the first semiconductor module 4A. Battery B is mounted in the vehicle. When energized by the battery B through the energizing circuit 9, the coil of the inductor component 8 generates a magnetic flux. That is, the coil of the inductor member 8 is operable to convert the electric energy supplied from the battery B into magnetic energy.

The capacitor device 10 is configured to supply the direct-current power output from the battery B to the first semiconductor module 4A serving as an electronic and/or electrical component. The capacitor device 10 includes a filter capacitor 11 and a smoothing capacitor module 12M, and the smoothing capacitor module 12M includes a plurality of smoothing capacitors, specifically, two smoothing capacitors 12 connected in parallel to each other, for example. The capacitor device 10 also includes a capacitor housing 13. The same type of capacitor may be used for the respective capacitors 10 and 12. The capacitor device 10 is also referred to as a capacitor module or a capacitor assembly. Each capacitor 11 has opposite positive and negative electrodes.

The capacitor case 13 has a box shape with a bottom having a top opening surface 14a, a bottom 14b opposite to the top opening surface 14a, and a peripheral side wall 14c mounted on the bottom 14b to constitute a closed space 14 between the bottom and the peripheral side wall 14 a. For example, as shown in fig. 3, each of the top opening surface 14a and the bottom 14b has a substantially J-shape, so that the peripheral side wall 14c has a substantially J-shape in its cross section parallel to the bottom 14 b.

The capacitor device 10 includes a plurality of fixing members 16 such as brackets, each fixing member 16 having a thin plate-like shape. The fixing member 16 is attached to the side wall 14c of the capacitor case 13, so that the capacitor case 13 is fixedly mounted to the inner surface of the case 2 by the fixing member 16 such that the capacitor case 13 is located between the semiconductor stacked unit 3 and the side wall 2b2 of the case 2 in the second direction Y.

Each fixing member 16 has a through hole 16a into which a bolt member 19 serving as a fastening member described later is fitted, and the bolt members 18 are screw-fastened to respective predetermined portions of the case 2, thereby fastening the capacitor case 13 to the case 2.

That is, the capacitor case 3 is fixedly mounted to the case 2 at the fixing member 16. The capacitors 11 and 12 are mounted in the closed space 14 of the capacitor case 13, and the closed space 14 of the capacitor case 13 is filled with a resin filler such as a potting resin filler.

Specifically, the capacitor case 1 is disposed in the case 2 such that

(1) The top opening surface 14a of the capacitor case 13 faces the positive terminal 4b and the negative terminal 4c

(2) Inductor component 8 and bottom 14b of capacitor case 13 face side wall 2b2 of case 2

(3) The longitudinal direction of the substantially J-shaped capacitor case 13 matches the first direction X

Specifically, the substantially J-shaped capacitor case 13 includes a first case portion 13C1 having a substantially box-like shape, in which the smoothing capacitor 12 is mounted in the first case portion 13C 1. The first case portion 13C1 is positioned to face the positive terminal 4b and the negative terminal 4C so as to be closer to the bottom wall 2a2 than to the top wall 2a 1. The generally J-shaped capacitor housing 13 also includes a second housing portion 13C2 that communicatively extends from the first housing portion 13C1 to the top wall 2a1 of the housing 2. Each of the first housing portion 13C1 and the second housing portion 13C2 has a predetermined width in the third direction Z, and the width of the first housing portion 13C1 is longer than the width of the second housing portion 13C 2.

For example, as shown in fig. 3, the smoothing capacitor 12 is mounted in the first case portion 13C1, and the filter capacitor 11 is mounted in the second case portion 13C 2.

The capacitor device 10 includes a positive bus bar 17 and a negative bus bar 18, each of which is configured as a plate member.

The positive bus bar 17 has opposite first and second ends, the first end of the positive bus bar 17 being connected to the positive electrode of the corresponding capacitor 12. The second end of the positive bus bar 17 is drawn out from the resin filler filled in the first capacitor case 13C1 of the capacitor case 13 via the top opening surface 14a, and extends toward the positive dc terminal 4b in the second direction Y perpendicular to the top opening surface 14 a. The second end of the positive bus bar 17 is joined, e.g., welded, to the positive dc terminal 4 b.

Similarly, the negative bus bar 18 has opposite first and second ends, with the first end of the negative bus bar 18 being connected to the negative electrode of the corresponding capacitor 12. The second end of the negative bus bar 18 is drawn out from the resin filler filled in the first capacitor case 13C1 of the capacitor case 13 via the top opening surface 14a, and extends toward the negative dc terminal 4C in the second direction Y perpendicular to the top opening surface 14 a. The second end of the negative busbar 18 is joined, e.g., welded, to the negative dc terminal 4 c.

The discharge resistance plate 24 has a substantially rectangular plate-like shape, and includes a discharge resistance 25 for discharging the electric charge stored in the capacitor device 10. The discharge resistance plate 24 is electrically connected in parallel with each of the capacitors 11, 12, and is positioned so as not to coincide with a projection area of the capacitor case 13 on an X-Z plane perpendicular to the second direction Y.

Specifically, the side wall 14c of the capacitor case 13 has the first and second opposite side wall portions 14c1 and 14c2, and the side wall 14c is located in the case 2 such that the first side wall portion 14c1 faces the top wall 2a1 of the case 2 and the second side wall portion 14c2 faces the bottom wall 2a2 of the case 2. The first side wall portion 14c1 has a flat side wall portion extending in the first direction X.

The capacitor device 10 includes a board support member 15, the board support member 15 having, for example, a rectangular plate-like shape and extending from the first side wall portion 14c1 of the side wall 14 toward the top wall 2a1 of the case 2 in the Z direction. The discharge resistance plate 24 is mounted to the plate support member 15. This prevents thermal interference between the discharge resistor 25 serving as an electric heating element and the capacitors 11, 12.

Discharge resistance plate 24 is positioned to extend from first side wall portion 14c1 of side wall 14 toward top wall 2a1 of case 2 along top opening surface 14a of capacitor case 13. Since the capacitor case 13 is filled with the potting resin filler, the top opening surface 14a of the capacitor case 13 may also be referred to as a potting surface.

The capacitor device 10 includes a voltage detection terminal 26 for measuring a voltage across each of the filter capacitor 11 and the smoothing capacitor 12. Each voltage detection terminal 26 is configured to extend from the board support member 15 mounted to the first side wall portion 14c1 of the side wall 14 toward the control circuit board 7 in the third direction Z. That is, the voltage detection terminal 26 is configured to protrude from the first side wall portion 14c1 of the side wall 14 of the capacitor case 13 so as to be arranged between the discharge resistance plate 24 and the control circuit board 7. This configuration prevents the voltage detection terminal 26 from being adversely affected by electromagnetic noise waves generated from the capacitors 11 and 12.

The overall structure of the power converter 1 and the structure of each selected component of the power converter 1 are described in detail below.

As described above, the control circuit board 7 is configured to control the on/off switching operation of each semiconductor element 5, thereby converting the direct-current power output from the battery B and input to the power converter 1 into the alternating-current power.

For example, as shown in fig. 2, the number of the semiconductor modules 4 is set to eight, and each semiconductor module 4 includes:

(1) a first semiconductor element 5, the first semiconductor element 5 including an upper arm semiconductor switch such as an IGBT and a freewheel diode connected in anti-parallel therewith; and

(2) a second semiconductor element 5, the second semiconductor element 5 including a lower arm semiconductor switch such as an IGBT and a freewheel diode connected in anti-parallel therewith, the first semiconductor element 20 and the second semiconductor element 20 being connected in series with each other.

The eight semiconductor modules 4 include:

(1) a first group of semiconductor modules 4A, the first group of semiconductor modules 4A serving as a part of the booster 31 of the inverter circuit 30;

(2) a second group of semiconductor modules 4B, the second group of semiconductor modules 4B serving as a power converter 32 of the inverter circuit 30.

Specifically, the inductor section 8, the filter capacitor 11, and the semiconductor module 4A function as the booster 31.

That is, the control circuit board 7 is configured to control the on/off switching operation of each semiconductor switch included in the semiconductor module 4A, thereby enabling the booster 31 to boost the direct-current voltage across the battery B. The filter capacitor 11 is operative to cancel a noise current component included in a direct current based on a direct voltage input from the battery B via the pair of voltage input terminals 20. The smoothing capacitor 11 is electrically located upstream of the smoothing capacitor 12 with respect to the battery B.

The smoothing capacitor 12 and the semiconductor module 4B function as a power converter 32 of the inverter circuit 30.

The semiconductor modules 4B are also divided into a first group of semiconductor modules 4B for the first three-phase (U-phase, V-phase, and W-phase) alternating-current motor generator MG1 and a second group of semiconductor modules 4B for the second three-phase alternating-current motor generator MG 2. That is, the ac terminals 4d of the respective semiconductor modules 4B of the first group are connected to the first three-phase ac motor generator MG 1. Similarly, the alternating-current terminals 4d of the respective semiconductor modules 4B of the second group are connected to a second three-phase alternating-current motor generator MG 2.

That is, the control circuit board 7 is configured to control:

(1) an on/off switching operation of each semiconductor switch included in the first group of semiconductor modules 4B, thereby enabling the power converter 32 to convert the direct-current power, whose voltage has been raised, supplied from the booster 31 into alternating-current power, and to supply the alternating-current power to the first three-phase alternating-current motor generator MG 1;

(2) the on/off switching operation of each semiconductor switch included in the second group of semiconductor modules 4B enables the power converter 32 to convert the direct-current power, whose voltage has been raised, supplied from the booster 31 into alternating-current power, and supply the alternating-current power to the second three-phase alternating-current motor generator MG 2.

The vehicle travels by supplying ac power to each of the first three-phase ac motor generator MG1 and the second three-phase ac motor generator MG 2.

The smoothing capacitor 12 is operable to smooth the direct-current voltage boosted by the booster 31.

A discharge resistor 25 electrically connected in parallel with each of the capacitors 11 and 12 is operable to discharge the internal charge stored in each of the capacitors 11 and 12 when, for example, the power converter 1 is stopped.

Note that the number of components constituting the inverter circuit 30 and the arrangement of the components constituting the inverter circuit 30 may be changed as needed.

As shown in fig. 3, the J-shaped capacitor case 13 of the capacitor device 10 positioned such that the longitudinal direction matches the first direction X includes the smoothing capacitor 12 and the filter capacitor 11 mounted in alignment in the first direction X.

The pair of power input terminals 20 includes a positive terminal 20p and a negative terminal 20n, and the pair of power supply terminals 21 includes a positive terminal 21p and a negative terminal 21 n.

Specifically, the capacitor device 10 includes a positive bus bar 22 of a bent plate shape, the positive bus bar 22 being attached to the second case portion 13C2 of the capacitor case 13 and connected to the positive electrode of the filter capacitor 11. The positive bus bar 22 has opposite first and second ends 22a and 22b, and the first and second ends 22a and 22b serve as a positive terminal 20p of the pair of power input terminals 20 and a positive terminal 21p of the pair of power supply terminals 21, respectively.

Similarly, the capacitor device 10 includes a negative bus bar 23 of a bent plate shape, the negative bus bar 23 being mounted to the second case portion 13C2 of the capacitor case 13 and connected to the negative electrode of the filter capacitor 11. The negative bus bar 23 has opposite first and second ends 23a and 23b, and the first and second ends 23a and 23b serve as the negative terminals 20n and 21n of the pair of power input terminals 20 and 21, respectively. Specifically, the intermediate portion of the negative bus bar 21 between the first end 23a and the second end 23b is embedded in the potting resin filler filled in the second case portion 13C 2.

The positive terminal 20p and the negative terminal 20n of the pair of power input terminals 20 are connected to the respective positive terminal Ba and negative terminal Bb of the battery B, and are also connected to the respective positive terminal 21p and negative terminal 21n of the pair of power supply terminals 21.

A positive terminal 21p of the pair of power supply terminals 21 is connected to a first end of the coil of the inductor component 8, and a second end of the coil of the inductor component 8 is connected to a connection point between each of the upper arm switch and the lower arm switch of each first semiconductor module 4A. The negative terminal 21n of the pair of power supply terminals 21 is connected to the lower arm semiconductor switches of the respective first and second semiconductor modules 4A and 4B.

This structure allows the direct-current voltage across battery B to be input to smoothing capacitor 11, and the direct current based on the direct-current voltage to be input to the coil of inductor component 8.

The pair of power input terminals 20 and the pair of power supply terminals 21 are located closer to the filter capacitor 11 than the smoothing capacitor 12.

As shown in fig. 4 and 5, the capacitor device 10 includes a plurality of fixing members 16. Specifically, the plurality of fixing members 16 includes three fixing members 16A, 16B, and 16C. The fixing members 16A, 16B, and 16C are provided to the capacitor case 13 and fixedly attached to the case 2, thereby fixedly attaching the capacitor case 13 to the case 2.

Specifically, as shown in fig. 4 and 5, the bolt members 19 that have been fitted through the respective through holes 16a of the fixing member 16 are screw-fastened to the respective predetermined portions of the case 2, thereby fastening the capacitor case 13 to the case 2.

As shown in fig. 4 to 6, the fixing members 16A and 16B, which respectively serve as main fixing members, are respectively attached to the first longitudinal end E1 and the second longitudinal end E2 of the housing 13 in the first direction X, i.e., the longitudinal direction thereof. The remaining fixing member 16C serving as a sub-fixing member is mounted to the middle portion of the capacitor case 13, and is located between the main fixing members 16A and 16B.

The main fixing members 16A and 16B have substantially the same height in the third direction Z when viewed from the second direction Y which is the normal direction of the top opening surface 14A of the enclosed space 14. In contrast, the height of the secondary fixing member 16C in the third direction Z is different from the height of the primary fixing members 16A and 16B substantially equal to each other in the third direction Z.

In the third direction, i.e., the height direction Z, the sub fixing member 16C is positioned higher than the main fixing members 16A and 16B.

In particular, when a virtual line, i.e., an imaginary line L, is provided to connect between a reference point of the main fixing member 16A, e.g., a reference point of the center of the through hole 16A, and a reference point of the main fixing member 16B, e.g., the center of the through hole 16A, the sub-fixing member 16C is positioned apart from, i.e., offset from, the virtual line L and is positioned closer to the semiconductor module 4 than the main fixing members 16A and 16B. That is, the virtual line L extends in the first direction X.

That is, the top opening surface 14a overlaps the virtual line L when viewed from the normal line of the top opening surface 14a, i.e., the second direction Y.

Note that the width of the virtual line L in the third direction Z is set to be sufficiently smaller than the thickness of each of the fixing members 16A, 16B, 16C.

The positive bus bar 17 and the negative bus bar 18 are positioned closer to the secondary fixing member 16c than the virtual line L. That is, when the area of the capacitor case 13 is divided into the first area S and the second area SX with respect to the virtual line L as viewed from the second direction Y, the positive bus bar 17 and the negative bus bar 18 are positioned in the first area S in the capacitor case 13. Since the first region S is closer to the sub fixing member 16C than the second region SX, the first region S functions as an anti-vibration region S.

As described above, since the sub-fixing member 16C is positioned apart from the virtual line L connecting between the main fixing members 16A and 16B and is positioned closer to the semiconductor module 4 than the main fixing members 16A and 16B, the first region S, i.e., the vibration resistant region S is suitable for electrically connecting the bus bars 17 and 18 to the semiconductor module 4.

In addition, when the virtual line M is set to connect between the reference point of the main fixing member 16A and the reference point of the sub fixing member 16C, and the virtual line N is set to connect between the reference point of the main fixing member 16B and the reference point of the sub fixing member 16C, the three virtual lines L, M and N constitute a triangular region Sa surrounded by the three virtual lines L, M and N.

Since the triangular region Ss is arranged to be included in the first region S, i.e., the anti-vibration region S, has a stronger resistance to, i.e., is less subjected to, a load stress due to vibration.

The bus bars 17 and 18 are positioned to the capacitor case so as to be closer to the secondary fixing member 16C than the virtual line L, thereby suppressing the load stress received by the bus bars 17 and 18 to a low level, so that the bus bars 17 and 18 have improved vibration resistance.

Specifically, the bus bars 17 and 18 are positioned to the vibration resistant region S within the capacitor case 13, thereby suppressing the load stress received by the bus bars 17 and 18 to a low level, so that the bus bars 17 and 18 have improved vibration resistance.

In addition, the above-described configuration of the capacitor device 10 enables the load stress received by the bus bars 17 and 18 to be maintained at a low level even if the bus bars 17 and 18 are integrated with the capacitors 11, 12, resulting in the capacitor device 10 having a larger size and weight.

Specifically, the capacitor device 10 is designed based on a simpler structural idea, that is, the bus bars 17 and 18 are positioned to the area S defined by the three fixing members 16A, 16B, and 16C.

The capacitor device 10 has a more excellent structure in which the projection plane of the capacitor case 13, that is, the center of gravity G of the top opening surface 14a is positioned within the triangular region Sa when the projection plane of the capacitor case 13 on the X-Z plane perpendicular to the second direction Y is viewed from the second direction Y. Thus, this configuration makes the capacitor device 10 have a higher vibration suppression effect than another capacitor device in which the center of gravity of the projection plane is located outside the triangular region Sa. This therefore results in a further reduction of the load stress received by the busbars 17 and 18.

The position of the sub-fixing member 16C in the first direction X of the capacitor device 10 according to the first embodiment is between the position of the capacitor 11 in the first direction X and the position of the capacitor 12 in the first direction X, the capacitors 11 and 12 being adjacent to each other.

Second embodiment

A second embodiment of the present disclosure is described below with reference to fig. 7. The configuration and function of the capacitor device 110 according to the second embodiment are different from those of the capacitor device 10 according to the first embodiment mainly in the following points. Therefore, the following mainly describes the different points.

As shown in fig. 7, the main fixing members 16A, 16B, and 16C according to the second embodiment respectively have different heights in the third direction Z as viewed from the second direction Y. That is, the sub fixing member 16C is positioned higher than the main fixing member 16B in the height direction Z, and the main fixing member 16B is positioned higher than the main fixing member 16A in the height direction Z. This configuration makes the virtual line L inclined with respect to the first direction X.

Even if the virtual line L is inclined with respect to the first direction X, the bus bars 17 and 18 are positioned to the anti-vibration region S in the capacitor case 13, thereby suppressing the load stress received by the bus bars 17 and 18 to a low level, so that the bus bars 17 and 18 have improved anti-vibration properties. Thus, the second embodiment obtains the same effects as the first embodiment.

Third embodiment

Hereinafter, a third embodiment of the present disclosure is described with reference to fig. 8. The configuration and function of the capacitor device 210 according to the third embodiment are different from those of the capacitor device 10 according to the first embodiment mainly in the following points. Therefore, the following mainly describes the different points.

As shown in fig. 8, the capacitor device 10 includes a plurality of fixing members 16. Specifically, the plurality of fixing members 16 includes four fixing members 16A, 16B, 16C, and 16D. The fixing members 16A, 16B, 16C, and 16D are provided to the capacitor case 13 and fixedly attached to the case 2, thereby fixedly attaching the capacitor case 13 to the case 2.

As shown in fig. 8, the main fixing members 16A and 16B are mounted to the first and second longitudinal ends E1 and E2 of the housing 13, respectively, in the first direction X, i.e., the longitudinal direction thereof.

In contrast, the remaining fixing members 16C and 16D, which serve as the respective sub-fixing members, are mounted to the middle portion of the capacitor case 13, and are located between the main fixing members 16A and 16B.

The main fixing members 16A and 16B have substantially the same height in the third direction Z as viewed from the second direction Y. In contrast, the height of each of the sub-fixing members 16C and 16D in the third direction Z is higher than substantially the same height of the main fixing members 16A and 16B in the third direction Z.

Each of the sub-fixing members 16C and 16D is positioned apart from, i.e., offset from, the virtual line L and is positioned closer to the semiconductor module 4 than the main fixing members 16A and 16B. Specifically, the sub-fixing member 16C is positioned closer to the semiconductor module 4 than the sub-fixing member 16D.

Even if the number of fixing members is four, when the area of the capacitor case 13 is divided into the first area S and the second area SX with respect to the virtual line L as viewed from the second direction Y, the positive bus bar 17 and the negative bus bar 18 are positioned to the first area S in the capacitor case 13. In other words, the capacitor case 13 has a first region S and a second region SX separated by a virtual line L.

Since the first region S is closer to the selected sub fixing member 16C than the second region SX, the selected sub fixing member 16C is closer to the semiconductor module 4 than the sub fixing member 16D and the second region SX, and thus the first region S functions as a vibration resistant region S.

As described above, since the sub-fixing member 16C is positioned apart from the virtual line L connecting between the main fixing members 16A and 16B and is positioned closer to the semiconductor module 4 than the main fixing members 16A and 16B, the first region S, i.e., the vibration resistant region S is suitable for electrically connecting the bus bars 17 and 18 to the semiconductor module 4.

Thereby, the bus bars 17 and 18 are positioned to the vibration resistant region S within the capacitor case 13, whereby the load stress received by the bus bars 17 and 18 is suppressed to a low level, so that the bus bars 17 and 18 have improved vibration resistance. Thereby, the third embodiment obtains the same effects as the first embodiment.

As an additional variation of the third embodiment, the first and second main fixing members 16A and 16B may differ in height in the third direction Z. In addition, as another modification of the third embodiment, five or more fixing members may be provided to the capacitor case 13 and may be fixedly mounted to the case 2, so that the capacitor case 13 may be fixedly mounted to the case 2.

In each of the first to third embodiments, the center of gravity G of the projection plane of the capacitor case 13, i.e., the top opening surface 14a, of the corresponding one of the capacitor members 10, 110, 210 is located within the triangular region Sa, but may be located outside the triangular region Sa.

In each of the first to third embodiments, the capacitor device 10 is configured to supply the direct-current power output from the battery B to the semiconductor module 4 of the inverter circuit 30, but may be configured to transmit power between a power source and a target component including electronic and/or electrical components.

Although illustrative embodiments of the present disclosure have been described herein, those of ordinary skill in the art will appreciate based on the present disclosure that the present disclosure is not limited to the embodiments described herein, but includes any and all embodiments having modifications, omissions, combinations (e.g., of aspects across different embodiments), additions and/or substitutions. The limitations in the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the specification or during the prosecution of the application, which examples are to be construed as non-exclusive.