阅读说明：本技术 显示装置和电子设备 (Display device and electronic apparatus ) 是由 三浦究 于 2020-03-04 设计创作，主要内容包括：显示装置(70)包括：像素阵列部,其中,布置了包括发光部(21)的像素；焊盘电极层(79),设置在形成有发光部(21)的基板(71)上的像素阵列部的外侧；以及吸热层(82),热耦合到焊盘电极层(79)。此外,电子设备包括具有上述构造的显示装置(70)。(A display device (70) includes: a pixel array section in which pixels including light emitting sections (21) are arranged; a pad electrode layer (79) provided outside the pixel array section on the substrate (71) on which the light emitting section (21) is formed; and a heat absorbing layer (82) thermally coupled to the pad electrode layer (79). Further, the electronic apparatus includes a display device (70) having the above-described configuration.)

1. A display device, comprising:

a pixel array section in which pixels each including a light emitting section are arranged;

a pad electrode layer disposed on a substrate outside the pixel array section, wherein a light emitting section is formed on the substrate; and

a heat sink layer thermally coupled to the pad electrode layer.

2. The display device according to claim 1, wherein

The heat absorbing layer has a function of increasing heat capacity of the pad electrode layer.

3. The display device according to claim 2, wherein

The heat absorbing layer includes a wiring layer formed as a layer under the pad electrode layer.

4. The display device according to claim 3,

the heat absorbing layer is disposed in an entire length direction of each pad of the pad electrode layer.

5. Display device according to claim 4, wherein

And a circuit wiring layer is arranged below the heat absorption layer.

6. The display device according to claim 3,

a wiring layer formed in the same layer as the heat absorbing layer is provided below the pixel array section.

7. The display device according to claim 1, wherein

The light emitting section includes an organic electroluminescent device.

8. The display device according to claim 7, wherein

The heat absorbing layer is made of the same material as that of an anode electrode of the organic electroluminescent device.

9. The display device according to claim 1, wherein

A circuit portion that drives the light emitting portion is formed on a semiconductor substrate.

10. An electronic apparatus including a display device, comprising:

a pixel array section in which pixels each including a light emitting section are arranged;

a pad electrode layer disposed on a substrate outside the pixel array section, wherein a light emitting section is formed on the substrate; and

a heat sink layer thermally coupled to the pad electrode layer.

Technical Field

The present disclosure relates to a display device and an electronic apparatus.

Background

In recent years, flat panel (flat panel) display devices have been the mainstream of display devices. As one of flat panel display apparatuses, there is a display apparatus including a so-called current-driven type electro-optical device (whose light emission luminance varies according to the value of a current flowing through the device) as a light emitting portion (light emitting element) of a pixel. Examples of the current-driven type electro-optical device may include an organic electroluminescence (hereinafter referred to as "EL") device that uses electroluminescence of an organic material and emits light when an electric field is applied to an organic thin film (for example, see patent document 1).

List of citations

Patent document

Patent document 1: japanese patent laid-open publication No. 2012-209018

Disclosure of Invention

Problems to be solved by the invention

Incidentally, the organic EL device is weak in heat resistance. Therefore, it is necessary to pay sufficient attention to heat in the manufacturing process of the organic EL display device. In particular, in a microdisplay having a semiconductor substrate as a substrate on which organic EL devices are formed and a driving circuit portion thereof, the panel size is small, and therefore, particularly in a mounting process requiring high temperature after EL processing, heat applied to a pad portion is propagated to the organic EL devices in a display region (pixel region), and deterioration of the organic EL devices due to thermal damage may deteriorate display quality. .

Accordingly, an object of the present disclosure is to provide a display apparatus capable of reducing thermal damage to a light emitting portion of an organic EL device or the like and suppressing deterioration of display quality due to the thermal damage, and an electronic device including the display apparatus.

Problem solving scheme

In order to achieve the above object, a display device of the present disclosure includes:

a pixel array section in which pixels each including a light emitting section are arranged;

a pad electrode layer provided outside the pixel array section on the substrate on which the light emitting section is formed; and

a heat sink layer thermally coupled to the pad electrode layer.

Further, the electronic apparatus of the present disclosure for achieving the above object includes the display device having the above configuration.

Drawings

Fig. 1 is a system configuration diagram showing an outline of a basic configuration of a display device to which the technique of the present disclosure is applied.

Fig. 2 is a circuit diagram showing a circuit configuration of a unit pixel (pixel circuit).

Fig. 3 is a sectional view showing a basic panel structure of a peripheral portion of a pixel array section in a display panel.

Fig. 4 is a sectional view showing a panel structure of a peripheral portion of a pixel array section in a display panel according to a first example.

Fig. 5 is a schematic perspective view showing a pad electrode layer and a heat absorbing layer in a panel structure according to a first example.

Fig. 6 is a sectional view showing a panel structure of a peripheral portion of a pixel array section in a display panel according to a second example.

Fig. 7 is a schematic perspective view showing a pad electrode layer and a heat absorbing layer in a panel structure according to a second example.

Fig. 8A is an appearance of a smartphone according to a first specific example of the electronic apparatus of the present disclosure viewed from the front side, and fig. 8B is an appearance of the smartphone viewed from the rear side.

Fig. 9 is an external view showing a head mounted display of a second specific example of an electronic apparatus according to the present disclosure.

Fig. 10A is a front view of a digital camera according to a third specific example of an electronic apparatus of the present disclosure, and fig. 10B is a rear view of the digital camera.

Detailed Description

Hereinafter, embodiments (hereinafter, referred to as "embodiments") for implementing the techniques of the present disclosure will be described in detail with reference to the accompanying drawings. The technique of the present disclosure is not limited to the embodiments, and various numerical values and materials in the embodiments are examples. In the following description, the same reference numerals are used for the same elements or elements having the same functions, and the description is not repeated. Note that the description will be given in the following order.

1. General description of display device and electronic apparatus of the present disclosure

2. Active matrix display device to which the disclosed technology is applied

2-1. System configuration

2-2. pixel circuit

2-3. basic panel structure

3. Embodiments of the present disclosure

3-1. first example (example in which a heat absorbing layer is provided so as to correspond to a portion in the length direction of each pad of the pad electrode layer)

3-2. second example (example in which a heat absorbing layer is provided over the entire length of each pad of the pad electrode layer)

4. Modified examples

5. Electronic device of the present disclosure

5-1. first concrete example (Smart phone example)

5-2. second concrete example (example of head mounted display)

5-3. third concrete example (digital camera example)

6. Possible configurations of the present disclosure

< general description of display device and electronic apparatus of the present disclosure >

In the display device and the electronic apparatus of the present disclosure, the heat absorbing layer may have a function of increasing a heat capacity of the pad electrode layer. Further, the heat sink layer may include a wiring layer formed as a layer under the pad electrode layer.

In the display device and the electronic apparatus of the present disclosure having the above-described preferred configurations, the heat absorbing layer may be provided on the entire region in the length direction of each pad of the pad electrode layer. Further, a wiring layer may be provided below the heat sink layer. In addition, a wiring layer formed in the same layer as the heat absorbing layer may be provided below the pixel array section.

Further, in the display device and the electronic apparatus of the present disclosure having the above-described preferred configurations, the light emitting portion may include an organic electroluminescent device (organic EL device). The heat absorbing layer may be made of the same material as that of the anode electrode of the organic electroluminescent device.

Further, in the display device and the electronic apparatus of the present disclosure having the above-described preferred configurations, the circuit portion that drives the light emitting portion may be formed on the semiconductor substrate.

In the display device and the electronic apparatus of the present disclosure having the above-described preferred configurations, the display device may have a configuration of an organic EL display device in which a plurality of sub-pixels include light emitting portions (light emitting elements) made of organic EL devices. That is, in the organic EL display apparatus, sub-pixels are formed by the respective organic EL devices. The organic EL device is a so-called current-driven type electro-optical device, and its light emission luminance varies depending on the value of a current flowing through the device.

The organic EL display device may be used as a monitoring device included in a personal computer, a video camera, or a digital camera, such as a television receiver, a mobile phone, a Personal Digital Assistant (PDA), or a game device. Alternatively, the organic EL display device may be applied to an Electronic Viewfinder (EVF) and a Head Mounted Display (HMD). Alternatively, other light emitting devices including a backlight device and a planar light source device for a liquid crystal display device may be exemplified.

In the organic EL device, the organic layer as the light emitting function layer includes a light emitting layer (for example, a light emitting layer made of an organic light emitting material). Specifically, for example, the organic layer may have a stacked structure such as a stacked structure of a hole transport layer, a light emitting layer, and an electron transport layer, a stacked structure of a hole transport layer and a light emitting layer (which may also serve as an electron transport layer), and a stacked structure of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. Further, in the case where these laminated structures and the like are provided as the series units, the organic layer may have a two-stage series structure in which the first series unit, the connection layer, and the second series unit are laminated, and may also have a three-stage series structure in which three or more series units are laminated. In these cases, by making the series units have different light emission colors such as red, green, and blue, an organic layer emitting white light as a whole can be obtained.

Examples of a method of forming the organic layer include a physical vapor deposition method (PVD method) such as a vacuum vapor deposition method; a printing method such as a screen printing method or an inkjet printing method; a laser transfer method of irradiating a laminated structure of a laser light absorption layer and an organic layer formed on a transfer substrate with laser light to separate the organic layer on the laser light absorption layer and transfer the organic layer; and various coating methods. For example, in the case of forming an organic layer based on a vacuum vapor deposition method, the organic layer can be obtained by using a so-called metal mask and depositing a material through an opening formed in the metal mask, and the organic layer can be formed over the entire surface without patterning.

< display device to which the technology of the present disclosure is applied >

The display device of the present disclosure is an active matrix display device in which a current flowing through an electro-optical device is controlled by an active element (e.g., an insulated gate field effect transistor) provided in the same pixel circuit as the electro-optical device. Typical examples of the insulated gate field effect transistor include a Metal Oxide Semiconductor (MOS) transistor and a Thin Film Transistor (TFT).

Here, the display apparatus of the present invention will be described taking as an example an active matrix organic EL display apparatus (including an organic EL device as an example of a current-driven electro-optical device as a light emitting section (light emitting element) of a pixel circuit). Hereinafter, the "pixel circuit" may be simply referred to as a "pixel".

[ System configuration ]

Fig. 1 is a system configuration diagram showing an outline of a basic configuration of an active matrix organic EL display device (which is a display device to which the technique of the present disclosure is applied).

As shown in fig. 1, an active matrix organic EL display apparatus 10 to which the technique of the present disclosure is applied includes a pixel array section 30 formed by two-dimensionally arranging a plurality of pixels 20 each including an organic EL device in a matrix form, and peripheral circuits (peripheral driving units) arranged in a peripheral region of the pixel array section 30.

The peripheral circuit of the pixel area includes, for example, the write scanning unit 40, the drive scanning unit 50, the signal output unit 60, and the like mounted on the display panel 70 which is the same display panel on which the pixel array section 30 is mounted, and the peripheral circuit drives each pixel 20 of the pixel array section 30. Note that the peripheral circuit may also have a configuration in which some or all of the write scanning unit 40, the drive scanning unit 50, and the signal output unit 60 are provided outside the display panel 70.

The organic EL display device 10 may support monochrome (black-and-white) display or may support color display. In the case where the organic EL display device 10 supports color display, one pixel (unit pixel/pixel) as a unit for forming a color image includes a plurality of sub-pixels (sub-pixels). At this time, each sub-pixel corresponds to the pixel 20 in fig. 1. More specifically, in a display device supporting color display, one pixel includes three sub-pixels, for example, a sub-pixel emitting red (R) light, a sub-pixel emitting green (G) light, and a sub-pixel emitting blue (B) light.

However, one pixel is not limited to a combination of sub-pixels of three primary colors of R, G, and B, and one pixel may include sub-pixels of three primary colors and pixels of one or more other colors. More specifically, for example, one pixel may additionally include a sub-pixel emitting white (W) light to improve brightness, or one pixel may include at least one sub-pixel emitting complementary color light to expand a color reproduction range.

In the pixel array section 30, for an array of m rows and n columns of pixels 20, scanning lines 31 (31)₁To 31_m) And a driving line 32 (32)₁To 32_m) Wiring is performed along the first direction (row direction/horizontal direction) of each pixel row. Further, for an array of m rows and n columns of pixels 20, signal lines 33 (33)₁To 33_n) Wiring along the second direction (column direction/vertical direction) of each pixel column.

Scanning line 31₁To 31_mTo the output terminals of the corresponding row of the write scan cells 40. Drive line 32₁To 32_mTo the output terminals of the corresponding row of the drive scan unit 50. Signal line 33₁To 33_nTo the output terminals of the corresponding column of the signal output unit 60.

The write scanning unit 40 includes a shift register circuit and the like. When writing the signal voltage of the video signal to each pixel 20 of the pixel array section 30, the write scanning unit 40 writes the write scanning signal WS (WS)₁To WS_m) Sequentially supplied to the scanning lines 31 (31)₁To 31_m) Each pixel 20 of the pixel array section 30 is scanned in units of rows, that is, so-called row-sequential scanning is performed.

The drive scanning unit 50 includes a shift register circuit and the like, similarly to the write scanning unit 40. The drive scanning unit 50 controls the light emission control signal DS (DS) by synchronizing with the line sequential scanning of the write scanning unit 40₁To DS_m) Is supplied to the drive line 32 (32)₁To 32_m) To control the light emission and non-light emission (light-off) of the pixel 20.

The signal output unit 60 outputs a signal voltage (hereinafter simply referred to as "signal voltage") V of a video signal based on luminance information supplied from a signal supply source (not shown)_sigOr selectively outputting the reference voltage V_ofs. Here, the reference voltage V_ofsIs a signal voltage V corresponding to the video signal_sigA voltage corresponding to a reference voltage (e.g., a voltage corresponding to a black level of the video signal) or a voltage close to the reference voltage. When performing the correction operation, the reference voltage V_ofsUsed as an initialization voltage.

Signal voltage V selectively output from signal output unit 60_sigReference voltage V_ofsThe pixel rows selected by the line-sequential scanning performed by the write scanning unit 40 are taken as units via the signal lines 33 (33)₁To 33_n) Each pixel 20 of the pixel array section 30 is written. That is, the signal output unit 60 adopts a driving method of line-sequential writing in which the signal voltage V is written in units of pixel rows (rows)_sig。

[ Pixel Circuit ]

Fig. 2 is a circuit diagram showing an example of a circuit configuration of a pixel (pixel circuit) in the active matrix organic EL display device 10. The light emitting portion of the pixel 20 includes an organic EL device 21. The organic EL device 21 is an exemplary current-driven type electro-optical device, and the light emission luminance thereof varies depending on the value of the current flowing through the device.

As shown in fig. 2, the pixel 20 includes an organic EL device 21 and a drive circuit (pixel drive circuit) that drives the organic EL device 21 by causing a current to flow through the organic EL device 21. In the organic EL device 21, the cathode electrode is connected to a common power supply line 34, which is commonly connected to all the pixels 20. In the figure, C_elIs an equivalent capacitor of the organic EL device 21.

The drive circuit for driving the organic EL device 21 includes a drive transistor 22, a sampling transistor 23, a light emission control transistor 24, a holding capacitor 25, and an auxiliary capacitor 26. It is assumed here that the organic EL device 21 and its driving circuit are not formed on an insulator such as glass but on a semiconductor such as silicon, and a P-channel transistor is used as the driving transistor 22.

Further, in this example, also as each of the sampling transistor 23 and the light emission controlling transistor 24, a P-channel transistor is used similarly to the driving transistor 22. Therefore, the driving transistor 22, the sampling transistor 23, and the light emission controlling transistor 24 each have four terminals of source/gate/drain/back gate instead of three terminals of source/gate/drain. Supply voltage V_ddIs applied to the back gate.

However, the sampling transistor 23 and the light emission controlling transistor 24 are not limited to P-channel transistors because they are switching transistors serving as switching elements. Therefore, each of the sampling transistor 23 and the light emission controlling transistor 24 may be an N-channel transistor, or a combination of a P-channel transistor and an N-channel transistor.

In the pixel 20 having the above configuration, the sampling transistor 23 passes the signal voltage V_sigSampling the signal voltage V of the video signal supplied from the signal output unit 60_sigThe data is written into the holding capacitor 25 through the signal line 33. The light emission control transistor 24 is connected to a power supply voltage V_ddAnd the source electrode of the drive transistor 22, andthe light control signal DS controls light emission and non-light emission of the organic EL device 21.

The holding capacitor 25 is connected between the gate and source of the drive transistor 22. The holding capacitor 25 holds the signal voltage V of the video signal written by sampling of the sampling transistor 23_sig. The drive transistor 22 drives the organic EL device 21 by causing a drive current corresponding to the holding voltage of the holding capacitor 25 to flow through the organic EL device 21.

An auxiliary capacitor 26 is connected between the source electrode of the drive transistor 22 and a node of a fixed potential (e.g., a power supply voltage V)_ddNode(s) of the network. The auxiliary capacitor 26 has a signal voltage V for suppressing writing of video signals_sigThe fluctuation of the source potential of the driving transistor 22, and the gate-source voltage V of the driving transistor 22_gsSet to the threshold voltage V of the drive transistor 22_thThe effect of (1).

[ basic Panel Structure ]

In the organic EL display device 10 having the above-described structure, as a substrate of the display panel 70 on which the pixel array section 30, the peripheral circuit thereof, and the like are formed, an insulating transparent substrate such as a glass substrate may be used, or a semiconductor substrate such as a silicon substrate may be used.

An organic EL display device using a semiconductor substrate such as a silicon substrate as a substrate of the display panel 70 is called a so-called micro display (small display), and is preferably used as an electronic viewfinder of a digital camera, a display unit of a head-mounted display, or the like.

Hereinafter, the structure of the display panel 70 (panel structure) will be described taking as an example the case of using a semiconductor substrate such as a silicon substrate as the substrate of the display panel 70. Fig. 3 shows a basic panel structure of a peripheral portion of the pixel array section 30 of the display panel 70.

Examples of the panel structure of the display panel 70 include a so-called top emission type panel structure in which light is taken out from the side opposite to the supporting substrate on which the organic EL device 21 is formed, and a so-called bottom emission type panel structure in which light is taken out from the supporting substrate side. The technique of the present disclosure can be applied to a panel structure of a top emission type panel structure or a bottom emission type panel structure, but the case of the top emission type is exemplified below.

The region on the support substrate 71 made of a semiconductor substrate includes: a region (pixel region) of the pixel array section 30, and a peripheral region located at a peripheral region (outer edge side/outer peripheral side) of the pixel array section 30, in which a plurality of pixels 20 are arranged in a matrix form. In the area of the pixel array section 30, a circuit section including the driving transistor 22, the sampling transistor 23, the light emission controlling transistor 24, the holding capacitor 25, and the auxiliary capacitor 26, and driving the organic EL device 21 is provided. In the peripheral area, peripheral circuit portions including the write scanning unit 40, the drive scanning unit 50, the signal output unit 60, and the like are provided. Then, a circuit layer (not shown) including these circuit portions is formed on the support substrate 71.

The display panel 70 has a laminated structure in which, for example, a wiring layer 72, an anode electrode 73, an organic layer 74, and a cathode electrode 75 are laminated on a circuit layer. Although not shown here, a protective layer, a filling layer (adhesive layer), and a black matrix layer are sequentially stacked on the cathode electrode 75. Note that a color filter is provided for each pixel in the same layer as the black matrix layer, and an opposing substrate is bonded on the color filter such that the opposing substrate seals the stacked structure.

Although not shown, the organic layer 74 has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in this order from the anode electrode 73 side. Here, a hole injection layer is provided to improve hole injection efficiency and prevent leakage. The hole transport layer serves to improve the hole transport efficiency to the light emitting layer. In the light emitting layer, when an electric field is applied, electrons and holes recombine to generate light. The electron transport layer serves to increase electron transport efficiency to the light emitting layer. The electron injection layer serves to improve electron injection efficiency. Among these layers, a layer other than the light-emitting layer may be provided as necessary.

The organic EL device 21 and the gap between the organic EL devices 21 are defined by a Pixel Defining Layer (PDL) 76. Then, the anode electrode 73 is made of a metal material obtained by laminating aluminum, Indium Tin Oxide (ITO), and silver, and is provided as a lower electrode (pixel electrode) of the organic EL device 21 for each pixel. The cathode electrode 75 is made of a light-transmitting material such as indium tin oxide, Indium Zinc Oxide (IZO), and zinc oxide (ZnO), and common is provided as an upper electrode (common electrode) of the organic EL device 21 for each pixel. A cathode ring 77 for applying a cathode potential to the cathode electrode 75 is provided below the outermost peripheral portion 75A of the cathode electrode 75.

A groove 78 is formed in the support substrate 71 at the outer peripheral portion of the substrate outside the region of the cathode ring 77 (cathode ring region). Then, a pad electrode layer 79 made of an Anisotropic Conductive Film (ACF) is formed in the groove 78. Under high-temperature and high-pressure conditions, a Flexible Printed Circuit (FPC)81 is pressure-bonded to the pad electrode layer 79 in the groove 78 via an Anisotropic Conductive Film (ACF) 80. In this crimping, time is a parameter in addition to temperature and pressure.

In the organic EL display apparatus 10 having the above-described configuration, the heat resistance of the organic EL device 21 is weak. Therefore, sufficient attention needs to be paid to heat in the manufacturing process of the organic EL display device 10. In particular, in the case where a semiconductor substrate is used as the support substrate 71 forming the organic EL device 21 and its driving circuit portion, the panel size is small. Therefore, in the mounting process requiring a high temperature after the EL process, specifically, in the process of crimping the flexible printed circuit 81 onto the pad electrode layer 79 in the groove 78 of the support substrate 71 under a high temperature and a high pressure, heat applied to the pad electrode layer 79 may propagate to the organic EL device 21 in the pixel region, and the deterioration of the organic EL device 21 due to thermal damage may deteriorate the display quality.

< embodiments of the present disclosure >

In the embodiment of the present disclosure, in order to reduce thermal damage to the organic EL device 21 and suppress deterioration of display quality due to the thermal damage, the organic EL display apparatus 10 (provided with the pad electrode layer 79 on the support substrate 71 outside the pixel array section 30, having a structure in which the heat absorbing layer 82 (refer to fig. 4) is thermally coupled to the pad electrode layer 79, the heat absorbing layer 82 has a function of increasing the heat capacity of the pad electrode layer 79.

By thermally coupling the heat absorbing layer 82 to the pad electrode layer 79 in this way, the heat capacity of the pad electrode layer 79 can be increased, so that when the flexible printed circuit 81 is crimped onto the pad electrode layer 79 at high temperature and high pressure, thermal damage to the organic EL device 21 can be reduced. Therefore, the degradation of display quality due to thermal damage to the organic EL device 21 can be suppressed.

Hereinafter, a panel structure according to a specific example of the present embodiment will be described, in which the heat absorbing layer 82 is thermally coupled to the pad electrode layer 79 to increase the heat capacity of the pad electrode layer 79.

[ first example ]

The first example is an example in which the heat absorbing layer 82 is provided corresponding to a part in the length direction of each pad of the pad electrode layer 79. Fig. 4 shows a schematic cross-sectional view of a panel structure of a peripheral portion of the pixel array section 30 in the display panel 70 according to the first example, and fig. 5 shows a schematic perspective view of the pad electrode layer 79 and the heat absorbing layer 82 in the panel structure according to the first example.

In the organic EL display apparatus 10 having the panel structure according to the first example, the pad electrode layer 79 is provided outside the pixel array section 30 on the support substrate 71. In the pad electrode layer 79, a plurality of pads 79 are arranged at a constant pitch, for example₁、79₂、79₃,.. is disposed in the groove 78 of the support base 71.

The panel structure according to the first example includes the heat absorbing layer 82 as a layer under the pad electrode layer 79. Then, the heat absorbing layer 82 is thermally coupled to the pad electrode layer 79 through the thermal coupling portion 83. As shown in FIG. 5, the heat sink 82 includes a plurality of pads 79₁、79₂、79₃,.. heat sink portions 82 arranged correspondingly and independent of each other₁、82₂、82₃，...。

Respective pads 79 corresponding to the pad electrode layer 79 in a state of being electrically separated from each other₁、79₂、79₃,.. A plurality of heat absorbing parts 82 are arranged at the part in the length direction₁、82₂、82₃,.... Then, a plurality of suctionsHot portion 82₁、82₂、82₃,. are thermally coupled to pads 79, respectively, by thermal coupling portions 83₁、79₂、79₃,. to add pads 79₁、79₂、79₃,..

In general, the heat capacity depends on the type and mass of the substance. Thus, by adding each heat sink portion 82 of the heat sink layer 82₁、82₂、82₃,.. for each pad 79 of the pad electrode layer 79₁、79₂、79₃,.. the heat capacity can be increased. In the panel structure according to the first example, the heat absorbing layer 82 is made of, for example, the same material (e.g., aluminum) as that of the anode electrode 73 of the organic EL device 21, and is formed as a wiring layer in the same layer as one of the plurality of wiring layers 72 in the pixel region. In other words, in the panel structure according to the first example, a wiring layer (in this example, the central one of the three wiring layers 72) formed in the same layer as the heat absorbing layer 82 is provided below the pixel array section 30.

According to the panel structure of the first example described above, in the step of crimping the flexible printed circuit 81 to the pad electrode layer 79 at high temperature and high pressure, the pad 79 thermally bonded to the pad electrode layer 79₁、79₂、79₃,.. for each heat sink portion 82 of the heat sink layer 82 of a respective one of₁、82₂、82₃,.. Therefore, thermal damage to the organic EL device 21 can be reduced, and thus deterioration of display quality due to thermal damage to the organic EL device 21 can be suppressed.

Further, in the panel structure according to the first example, a wiring layer (in this example, a wiring layer of one of the centers of the three wiring layers 72) formed in the same layer as the heat absorbing layer 82 is provided below the pixel array section 30, and this wiring layer can be used as a reinforcement of the cathode ring 77. This effect is provided similarly as in a second example described later.

[ second example ]

The second example is an example in which the heat absorbing layer 82 is provided in the entire length direction of each pad of the pad electrode layer 79. Fig. 6 shows a schematic cross-sectional view of a panel structure of a peripheral portion of the pixel array section 30 in the display panel 70 according to the second example, and fig. 7 shows a schematic perspective view of the pad electrode layer 79 and the heat absorbing layer 82 in the panel structure according to the second example.

In the panel structure according to the second example, each pad 79 in the pad electrode layer 79₁、79₂、79₃,.. is provided with a plurality of heat absorbing portions 82 of the heat absorbing layer 82 along the entire length thereof₁、82₂、82₃,., heat sink portion 82₁、82₂、82₃Is thermally coupled to the pad 79 by a plurality of thermal coupling portions 83 for respective pads₁、79₂、79₃，...。

Similar to the panel structure according to the first example, in the panel structure according to the second example, each heat sink portion 82 of the heat sink layer 82₁、82₂、82₃,.. is formed of the same material as the anode electrode 73 of the organic EL device 21, for example, aluminum, and is formed as a wiring layer in the same layer as one of the plurality of wiring layers 72 in the pixel region. Further, below the pad electrode layer 79 and below the heat absorbing layer 82, for example, a circuit wiring layer 84 of the same layer as the lowest wiring layer among the three wiring layers 72 in the pixel region is formed.

In the panel structure according to the second example described above, the corresponding pad 79 in the pad electrode layer 79₁、79₂、79₃,.. is disposed throughout the length of each heat sink portion 82 of the heat sink layer 82₁，82₂、82₃,.... Therefore, the panel structure according to the second example, as in the case of the panel structure according to the first example (wherein the heat absorbing portion 82₁、82₂、82₃,... arranged to correspond to the lengthwise portion), the heat absorption effect during crimping at high temperature and high pressure is greater. As a result, thermal damage to the organic EL device 21 can be reduced more reliably, and thus deterioration in display quality due to thermal damage can be suppressed more reliably.

Further, according to the panel structure of the second example, the corresponding pad 79 in the pad electrode layer 79₁、79₂、79₃,.. is disposed throughout the length of each heat sink portion 82 of the heat sink layer 82₁，82₂、82₃,.... Therefore, the mechanical strength of the pad electrode layer 79 on the lower side when pressure-bonded at high temperature and high pressure can be improved. Therefore, the circuit wiring layer 84 and another wiring layer may be arranged thereunder, and a circuit element such as a transistor, which is low in mechanical strength without the heat sink layer 82, may be arranged below the pad electrode layer 79.

< modified example >

Although the technique of the present disclosure has been described above based on the preferred embodiment, the technique of the present disclosure is not limited to this embodiment. The configuration and structure of the display device described in the above embodiments are examples, and may be changed as appropriate. For example, in the above-described embodiments, the technique of the present disclosure has been described taking an organic EL device (display panel) as an example, but the technique of the present disclosure may be applied to display apparatuses other than the organic EL device, specifically, all display apparatuses having a panel structure in which a pad electrode layer is provided outside a pixel array section.

In addition, in the above-described embodiments, the description has been made taking the display device using a semiconductor substrate such as a silicon substrate as a substrate of the display panel as an example, but the application of the technique of the present disclosure is not limited to this example, and the technique of the present disclosure can be applied to a display device in which an insulating transparent substrate such as a glass substrate is used.

< electronic apparatus of the present disclosure >

The display device of the present disclosure described above can be used in all fields as a display unit (display device) of an electronic apparatus, which displays a video signal input to the electronic apparatus or a video signal generated in the electronic apparatus as an image or a video. Examples of the electronic apparatus include a television set, a notebook personal computer, a digital camera, a mobile terminal device such as a mobile phone, and a head mounted display. However, the electronic device is not limited to these examples.

According to the technique of the present disclosure, in the crimping process at high temperature and high pressure, thermal damage to the light emitting portion (light emitting element) can be reduced, and deterioration in display quality due to the thermal damage can be suppressed, so that a high-quality display image can be provided. Then, by using the display device of the present disclosure as a display unit (display device) of an electronic apparatus in all fields, a high-quality display image can be provided.

Hereinafter, a smart phone, a head mounted display, and a digital camera will be described as specific examples of an electronic device using the display device of the present disclosure. However, the specific examples described herein are merely examples, and the electronic apparatus is not limited to these examples.

[ first specific example: examples of Smart phones

Fig. 8A shows an appearance of a smartphone according to a first specific example of the electronic apparatus of the present disclosure as viewed from the front, and fig. 8B shows an appearance as viewed from the back. The smartphone 100 according to this specific example includes a display unit 120 on the front side of the housing 110. Further, the smartphone 100 includes an imaging unit 130, for example, at an upper portion of the rear side of the housing 110.

In the smartphone 100 having the example of the mobile device configured as described above, the display device of the present disclosure may be used as the display unit 110. That is, the smartphone 100 according to the first specific example is manufactured by using the display device of the present disclosure as its display unit 120.

[ second specific example: examples of head-mounted displays

Fig. 9 shows an appearance of a head mounted display according to a second specific example of the electronic apparatus of the present disclosure.

The head mounted display 200 according to the second specific example has a see-through head mounted display configuration including a main body portion 201, an arm portion 202, and a lens barrel 203. The body portion 201 is connected to the arm portion 202 and the eyeglasses 210. Specifically, the end portion of the body portion 201 in the longitudinal direction is attached to the arm portion 202. One of the side surfaces of the main body 201 is connected to the eyeglasses 210 via a connecting member (not shown). Note that the body portion 201 may be directly attached to the head of the human body.

The main body portion 201 includes a control board for controlling the operations of the head mounted display 200 and the display unit. The arm portion 202 supports the lens barrel 203 with respect to the main body portion 201 by coupling the main body portion 201 and the lens barrel 203. Specifically, the arm portion 202 is coupled to an end of the main body portion 201 and an end of the lens barrel 203 to fix the lens barrel 203 with respect to the main body portion 201. Further, the arm portion 202 includes a signal line for transmitting data relating to the image supplied from the main body portion 201 to the lens barrel 203.

The lens barrel 203 projects image light provided from the main body portion 201 via the arm portion 202 to the eye of the user wearing the head-mounted display 200 via the lens 211 of the eyeglasses 210. In this head mounted display 200, the display device of the present disclosure can be used as a display unit accommodated in the main body portion 201. That is, the head mounted display 200 according to the second specific example is manufactured by using the display device of the present disclosure as its display unit.

[ third specific example: example of digital Camera

Fig. 10A and 10B show the appearance of a single-lens reflex digital camera of an interchangeable lens according to a third specific example of an electronic apparatus of the present disclosure. Fig. 10A is a front view of the digital camera, and fig. 10B is a rear view of the digital camera.

The lens-interchangeable single-lens reflex digital camera 300 includes, for example, an interchangeable imaging lens unit (interchangeable lens) 312 on the front right side of a camera body portion (camera body) 311, and a grip portion 313 for a photographer to hold the digital camera 300 on the front left side. Then, a monitor 314 is provided at the center of the back surface of the camera main body portion 311. A viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking at in the viewfinder 315, the photographer can determine the composition while visually recognizing the optical image of the subject guided by the imaging lens unit 312.

In the single-lens reflex digital camera 300 having the interchangeable lens constructed as described above, the display device of the present disclosure can be used as the viewfinder 315 thereof. That is, the interchangeable-lens single-lens reflex digital camera 300 according to the third specific example is manufactured by using the display device of the present disclosure as its viewfinder 315.

< possible configurations of the present disclosure >

Note that the present disclosure may also have the following configuration.

< A. display device >)

[ A-1] A display device comprising:

a pixel array section in which pixels each including a light emitting section are arranged;

a pad electrode layer provided outside the pixel array section on the substrate on which the light emitting section is formed; and

a heat sink layer thermally coupled to the pad electrode layer.

[ A-2] A display device according to the above [ A-1], wherein

The heat absorbing layer has a function of increasing the heat capacity of the pad electrode layer.

[ A-3] A display device according to the above [ A-2], wherein

The heat absorbing layer includes a wiring layer formed as a layer under the pad electrode layer.

[ A-4] A display device according to the above [ A-3], wherein

The heat absorbing layer is disposed in an entire length direction of each pad of the pad electrode layer.

[ A-5] A display device according to the above [ A-4], wherein

A circuit wiring layer is arranged below the heat absorption layer.

[ A-6] A display device according to the above [ A-3] or [ A-4], wherein

A wiring layer formed in the same layer as the heat absorbing layer is provided below the pixel array section.

[ A-7] the display device according to any one of [ A-1] to [ A-6] above, wherein

The light emitting section includes an organic electroluminescent device.

[ A-8] A display device according to the above [ A-7], wherein

The heat absorbing layer is made of the same material as that of the anode electrode of the organic electroluminescent device.

[ A-9] the display device according to any one of [ A-1] to [ A-8] above, wherein

A circuit portion for driving the light emitting portion is formed on the semiconductor substrate.

Electronic apparatus > < < B. >

[ B-1] an electronic apparatus including a display device, comprising:

a pixel array section in which pixels each including a light emitting section are arranged;

a pad electrode layer provided outside the pixel array section on the substrate on which the light emitting section is formed; and

a heat sink layer thermally coupled to the pad electrode layer.

[ B-2] the electronic device according to the above [ B-1], wherein

The heat absorbing layer has a function of increasing the heat capacity of the pad electrode layer.

[ B-3] the electronic device according to the above [ B-2], wherein

The heat absorbing layer includes a wiring layer formed as a layer under the pad electrode layer.

[ B-4] the electronic device according to the above [ B-3], wherein

The heat absorbing layer is disposed in an entire length direction of each pad of the pad electrode layer.

[ B-5] the electronic device according to the above [ B-4], wherein

A circuit wiring layer is arranged below the heat absorption layer.

[ B-6] the electronic device according to the above [ B-3] or [ B-4], wherein

A wiring layer formed in the same layer as the heat absorbing layer is provided below the pixel array section.

[ B-7] the electronic device according to any one of [ B-1] to [ B-6] above, wherein

The light emitting section includes an organic electroluminescent device.

[ B-8] the electronic device according to the above [ B-7], wherein

The heat absorbing layer is made of the same material as that of the anode electrode of the organic electroluminescent device.

[ B-9] the electronic device according to any one of [ B-1] to [ B-8] above, wherein

A circuit portion for driving the light emitting portion is formed on the semiconductor substrate.

REFERENCE SIGNS LIST

10 organic EL display apparatus 20 pixel 21 organic EL device

22 drive transistor 23 sampling transistor 24 light emission control transistor

25 hold capacitor 26 auxiliary capacitor 30 pixel array section

31₁To 31_mScanning line 32₁To 32_mDriving wire

33₁To 33_nSignal line 40 write scanning unit

50 drive scanning unit 60 signal output unit

70 display panel 71 supporting substrate (semiconductor substrate)

72 wiring layer 73 anode electrode

74 organic layer 75 cathode electrode

76 Pixel Definition Layer (PDL) 77 cathode ring

78 recess 79 pad electrode layer

80 Anisotropic Conductive Film (ACF) 81 Flexible printed Circuit Board (FPC)

82 heat sink layer 83 thermally couples portions 84 of the circuit wiring layers.