阅读说明：本技术 一种适用于荧光色轮及光源密封腔体的散热装置 (Heat dissipation device suitable for fluorescent color wheel and light source sealed cavity ) 是由 朱文君 李龙 于 2019-12-18 设计创作，主要内容包括：本发明涉及一种适用于荧光色轮及光源密封腔体的散热装置,包括半导体制冷芯片、冷面鳍片、荧光色轮、光源密封腔体、导风装置和热面散热模组,半导体制冷芯片包括冷凝面和发热面,半导体制冷芯片的冷凝面与设置在光源密封腔体内部的冷面鳍片相接触设置,半导体制冷芯片的发热面与设置在光源密封腔体外部的热面散热模组相接触设置,荧光色轮和导风装置均设置在光源密封腔体的内部。本发明中半导体制冷芯片的冷凝面的温度可以精确控制在0.1℃内,可以根据不同需求,有效的控制荧光色轮和光源密封腔体的温度；可以对荧光色轮和光源密封腔体进行主动冷却,而非现有技术的将热量疏导。(The invention relates to a heat dissipation device suitable for a fluorescent color wheel and a light source sealed cavity, which comprises a semiconductor refrigeration chip, a cold surface fin, the fluorescent color wheel, the light source sealed cavity, an air guide device and a hot surface heat dissipation module, wherein the semiconductor refrigeration chip comprises a condensation surface and a heating surface, the condensation surface of the semiconductor refrigeration chip is arranged in contact with the cold surface fin arranged in the light source sealed cavity, the heating surface of the semiconductor refrigeration chip is arranged in contact with the hot surface heat dissipation module arranged outside the light source sealed cavity, and the fluorescent color wheel and the air guide device are both arranged in the light source sealed cavity. The temperature of the condensation surface of the semiconductor refrigeration chip can be accurately controlled within 0.1 ℃, and the temperatures of the fluorescent color wheel and the light source sealing cavity can be effectively controlled according to different requirements; the fluorescent color wheel and the light source sealed cavity can be actively cooled, but the heat is not conducted away in the prior art.)

1. A heat dissipation device suitable for a fluorescent color wheel and a light source sealing cavity is characterized by comprising a semiconductor refrigeration chip (1), a cold surface fin (2), a fluorescent color wheel (3), a light source sealing cavity (4), an air guide device (5) and a hot surface heat dissipation module (6), wherein an opening connecting end is arranged on one side of the light source sealing cavity (4), the semiconductor refrigeration chip (1) is arranged on the opening connecting end, the semiconductor refrigeration chip (1) comprises a condensation surface and a heating surface, the condensation surface of the semiconductor refrigeration chip (1) is in contact with the cold surface fin (2) arranged inside the light source sealing cavity (4), the heating surface of the semiconductor refrigeration chip (1) is in contact with the hot surface heat dissipation module (6) arranged outside the light source sealing cavity (4), and the fluorescent color wheel (3) and the air guide device (5) are both arranged inside the light source sealing cavity (4), the air guide device (5) and the cold face fins (2) are arranged in parallel along the horizontal direction, and the fluorescent color wheel (3) is arranged in the vertical direction of the air guide device (5) and the cold face fins (2).

2. The heat dissipation device for a fluorescent color wheel and a light source sealed cavity according to claim 1, wherein the outer surface of the cold-side fin (2) is provided with a nano carbon layer.

3. The heat dissipation device for a fluorescent color wheel and a light source sealed cavity as claimed in claim 1, wherein the air guiding device (5) is a fan.

4. The heat dissipation device for a fluorescent color wheel and a light source sealed cavity according to claim 1, wherein the light source sealed cavity (4) is a copper plate cavity.

5. The heat dissipation device for a fluorescent color wheel and a light source sealed cavity according to claim 1, wherein the hot-side heat dissipation module (6) is an air cooling module.

6. The heat dissipation device for a fluorescent color wheel and a light source sealed cavity according to claim 1, wherein the hot-side heat dissipation module (6) is a water cooling module.

Technical Field

The invention relates to the technical field related to heat dissipation of projector equipment, in particular to a heat dissipation device suitable for a fluorescent color wheel and a light source sealed cavity.

Background

The heat dissipation of the existing fluorescent color wheel (hereinafter referred to as color wheel) is a bottleneck in the industry. The light source system of the projector needs to be absolutely dustproof and has consideration of the space of the whole structure, and heat generated after the color wheel is excited can not be quickly and effectively discharged on the premise of limiting the space structure and being dustproof and airtight. The most intuitive problems that come with are: A. the color wheel fails at high temperature (the failure is two parts: 1. the color wheel breaks down the color wheel due to the temperature surge of a light spot excitation point, and 2. the service life of the motor oil in the color wheel is greatly shortened due to the change of the motor oil at high temperature). B. The heat of the color wheel cannot be removed, and the heat can be radiated into the whole space of the light source module, so that the air temperature in the whole closed space is increased rapidly, and the coating layer of the optical lens can be softened at high temperature, so that the lens fails (penetration and reflection failures). In addition, because the light path needs to be shortened as much as possible to reduce the overall size of the light source module, the color wheel is generally very close to the peripheral optical element, and thus the heat dissipation treatment is difficult to be carried out under the condition of narrow space layout.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a heat dissipation device suitable for a fluorescent color wheel and a light source sealed cavity.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a heat abstractor suitable for fluorescence colour wheel and light source seal chamber, including semiconductor refrigeration chip, cold face fin, fluorescence colour wheel, light source seal chamber, air ducting and hot face heat dissipation module, the opening link has been seted up to one side of light source seal chamber, be provided with semiconductor refrigeration chip on the opening link, semiconductor refrigeration chip includes condensation surface and heating surface, semiconductor refrigeration chip's condensation surface contacts the setting with the cold face fin that sets up at light source seal chamber inside, semiconductor refrigeration chip's the surface of generating heat contacts the setting with the hot face heat dissipation module that sets up at light source seal chamber outside, fluorescence colour wheel and air ducting all set up the inside at light source seal chamber, air ducting sets up side by side along the horizontal direction with cold face fin, fluorescence colour wheel sets up on the vertical direction of air ducting with cold face fin.

As a further improvement of the invention, the outer surface of the cold surface fin is provided with a nano carbon layer.

As a further improvement of the present invention, the air guiding device is a fan.

As a further improvement of the invention, the light source sealed cavity is a copper plate cavity.

As a further improvement of the invention, the hot-side heat dissipation module is an air cooling module.

As a further improvement of the invention, the hot-side heat dissipation module is a water cooling module.

By the scheme, the invention at least has the following advantages:

1. the heat dissipation way is as follows: the invention effectively combines three heat transfer ways of heat conduction, heat convection and heat radiation which complement each other;

2. heat dissipation speed: according to the invention, the air flow with the top cooled is directly blown onto the fluorescent color wheel through the fan, so that the heat of the fluorescent color wheel can be transferred to the heat dissipation module in a mode of combining heat convection and heat radiation at the first time without being accumulated on the fluorescent color wheel, and the heat dissipation module cools the heat at the first time and continuously cools the fluorescent color wheel and the light source sealing cavity.

3. The utilization rate of the space structure is as follows: the invention fully and effectively utilizes the redundant space in the structure, and cannot invisibly increase the volume of the space structure.

4. The nano carbon layer spraying technology adopted in the invention greatly enhances the heat radiation capability of the module.

5. The hot-surface heat dissipation module can be matched with an air cooling module or a water cooling module in the prior art, and can be switched at will under different space requirements.

6. The temperature of the condensation surface of the semiconductor refrigeration chip (TEC) can be accurately controlled within 0.1 ℃, and the temperature of the fluorescent color wheel and the temperature of the light source sealed cavity can be effectively controlled according to different requirements.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device suitable for a fluorescent color wheel and a light source sealed cavity according to the present invention.

In the drawings, the meanings of the reference numerals are as follows.

1 semiconductor refrigeration chip 2 cold side fin

3 fluorescent color wheel 4 light source seal cavity

5 air guide device 6 hot side heat radiation module

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.