阅读说明：本技术 配备环绕立体声元件且装有扬声器组件单元的包耳式头戴耳机 (Ear-covering type headphone equipped with surround sound component and equipped with speaker assembly unit ) 是由 穆罕默德·图恩·图尔古特 于 2020-03-05 设计创作，主要内容包括：本发明涉及具有扬声器组件单元(5)的头戴式耳机,所述扬声器组件单元(5)外设有声音发射装置,用于装配在所述包耳式头戴耳机内的耳部组件单元(1)中产生环绕立体声效果。当设有环绕立体声发射装置的扬声器组件单元(5)被用于耳部组件单元(1)中时,该头戴式耳机内部能够产生环绕立体声,并因此可以在该头戴式耳机中获得更高性能的声音。(The invention relates to a headset with a loudspeaker assembly unit (5), the loudspeaker assembly unit (5) being externally provided with sound emitting means for producing a surround sound effect in an ear assembly unit (1) fitted in the ear-worn headset. When a speaker assembly unit (5) provided with a surround sound emitting device is used in an ear assembly unit (1), surround sound can be generated inside the headphone, and thus higher performance sound can be obtained in the headphone.)

1. An ear-worn headphone comprising an ear unit (1) provided at opposite ends of an elastic headband (2) and a speaker unit (5) provided in the ear unit (1) for producing sound toward an ear cup (4), characterized in that the ear-worn headphone further comprises:

at least one loudspeaker assembly unit (5) on an ear cup (4) of an ear assembly unit (1), wherein the loudspeaker assembly unit has been provided with loudspeaker sound emission means (5.1) and the loudspeaker sound emission means are arranged on at least one peripheral area of each ear assembly unit (1), thereby enabling a user to experience a surround sound effect.

2. The over-the-ear headphone of claim 1, comprising:

at least one cylindrical loudspeaker module unit (5) is provided for each ear module unit (1), wherein a loudspeaker sound emission device (5.1) is arranged outside the side wall of the cylindrical loudspeaker module unit.

3. The over-the-ear headphone of claim 1, comprising:

at least one prismatic loudspeaker assembly unit (5) arranged at each ear assembly unit (1), wherein a loudspeaker sound emission device (5.1) is arranged outside a side wall of the prismatic loudspeaker assembly unit.

4. The over-the-ear headphone of claim 1, comprising:

at least one spherical loudspeaker assembly unit (5) provided at each ear assembly unit (1), wherein the spherical loudspeaker assembly unit (5) is externally provided with a loudspeaker sound emitter (5.1) covering the entire outer area of the cylindrical loudspeaker assembly unit.

5. The over-the-ear headphone of claim 1, comprising:

placing the opening (6) and/or the ear cup (4), wherein the ear cup (4) is completely or partially covered by an element facilitating sound reflection.

6. The over-the-ear headphone of claim 1, comprising:

a loudspeaker module unit (5) placed perpendicularly to the ground plane on the ear cup (4).

7. The over-the-ear headphone of claim 1, comprising:

a speaker assembly unit (5) mounted on the ear assembly unit (1) in a non-detachable manner.

8. A supra-aural headset according to any one of the preceding claims, comprising:

a placement opening (6) provided with a connection element, wherein the connection element is capable of data connection and of fixing the loudspeaker assembly unit (5) on the placement opening (6),

a loudspeaker assembly unit (5) provided with a connection element, wherein the connection element secures the loudspeaker assembly unit on the placement opening (6) and is capable of providing a data connection for the loudspeaker assembly unit.

9. The over-the-ear headphone of claim 8, comprising:

a USB connection element.

Technical Field

The present invention relates to an over-the-ear headphone assembly comprising a speaker assembly unit with a surround sound element for establishing surround sound in an ear assembly unit of the headphone.

The ear assembly unit uses a speaker equipped with a surround sound component, thereby generating a surround sound in the headphone and being capable of generating a high-performance sound in the headphone.

The headset is not only suitable for being worn on the ear by a user to listen independently, but also the placement surface of the loudspeaker in the headset is open, so that the sound heard by the user can enter the external environment. Thus, embodiments of the present invention may be used independently of a headset.

Background

Today, with the popularity and popularity of personal electronic devices, headsets used in conjunction with these devices are also emerging. While headphones are intended to allow users to enjoy a unique feast of hearing, they may also provide users with different playback styles.

In particular, earphones, known as over-the-ear headphones, which can be wrapped around and held over the ear, are provided with different sound units to provide different playback modes for the user.

For example, a center emitter, a sub emitter, a front emitter, and a surround stereo emitter are installed at a speaker portion of a headphone, so that a user experiences 5.1 surround stereo (multi-channel surround stereo effect). Through these components, the headset may enable the user to experience 5.1 surround sound.

However, this and some similar functions need to be accomplished by using a large number of different speaker assemblies and/or other components. 5.1 surround sound experience and similar sound effects are often intended to produce various surround sound effects on the user's ears. In the prior art, such sound effects can only be produced with at least two speaker module units or other modules.

It is contemplated that the size of the headset has been limited because each component added to the headset makes the headset larger. This will cause serious problems for the manufacturers of the headphones and the users of the headphones.

The main purpose of existing headphones is to produce sound at the ear of the headphone. It is generally considered that generating sound in other directions is not the original purpose and is therefore not necessary. On the other hand, if the sound is generated in a direction away from the ear, a different sound effect is produced. Therefore, since sound can be arbitrarily propagated in different directions, it is impossible for the current headphone system to want to simply generate sound effects.

Users today often want to buy only one set of headphones to achieve different uses. However, since different fields of use have different requirements on the characteristics of the headset, the existing headset does not perform satisfactorily under different performance requirements.

Thus, the user must purchase a variety of headsets for listening to music, watching movies, playing games, making phone calls (wired/wireless), and stage shows (stadium/DJ), respectively.

For example, a user who prefers music will want to have a headset with a powerful bass system, but another user who wants to watch a movie or play a game will likely need a headset with a more excellent 5.1 sound effect. In such a case, the user needs to purchase a plurality of headphones.

Similarly, when a user finds his headset frequency (hertz) or sound sensitivity (decibel) level insufficient, but he desires to have a headset with higher capacity requirements, he can only throw away the existing headset and buy a new headset.

If a user wants to purchase headphones with different sound characteristics, the increase in budget needs to be taken into account, since the technical characteristics of these headphones are enhanced and the costs thereof are relatively increased. Therefore, in view of this economic difference, consumers are most inclined to select a lower price headset. After use, if the user requests to use a higher quality headset, a new headset needs to be purchased and the existing headset is left unused.

Disclosure of Invention

The invention aims to provide an ear-wrapping type headset. By fitting the speaker assembly unit inside the headphone, a surround sound effect can be produced in the headphone. Wherein at least a part of the speaker unit units have speaker sound emission means thereon.

The speaker assembly unit also has a geometry thereon for mounting a surround speaker sound emitting device on the speaker assembly unit.

Thus, even if a separate speaker assembly unit is used for each ear assembly unit inside the headset, the surround sound effect can still be transmitted into the user's ear. In order to produce earphones capable of creating different levels of sound effects, the number or power of speaker assembly unit assemblies used in the ear assembly unit may be increased, thereby improving the performance of the system.

The headset of the present invention will reduce the cost of the headset and also make the headset less risky to malfunction when used, since only one speaker assembly unit is used when creating surround sound in the headset.

The headset of the invention can not only generate sound in the direction of the user's ears, but also emit sound in other directions. In this way, different sound effects may be delivered to the user's ear and sound may be transmitted in the headset.

Thus, placing different sound and sound effect devices in the opening of the same headset for different sound levels and sound effects requirements allows to produce a modular headset system with satisfactory sound and sound effects without the need to buy new headsets.

The headset is designed to be worn on the ear of a user so that the user may enjoy the hearing feast on his own. Further, the speaker placement opening of the headset may be opened, so that sounds from the environment in which the user is located may be heard by the user.

On the other hand, the speaker unit connected to the headphone can also be used to generate sound in the external environment. The speaker assembly unit can still be used externally without the headset.

Drawings

Fig. 1 shows a perspective view of a headset with a single speaker assembly unit;

fig. 2 shows a perspective view of a headset with three speaker assembly units;

fig. 3 shows a perspective view of a loudspeaker assembly unit with a cylindrical shape;

fig. 4 shows a perspective view of a loudspeaker assembly unit having a prism shape;

fig. 5 shows a perspective view of a headset with three circular placement openings.

Reference numerals

1. An ear assembly unit;

2. a headband;

3. an ear pad;

4. ear muffs;

5. a speaker unit,

5.1. a speaker sound emitting device;

6. the opening is placed.

Detailed Description

The ear-wrapping type headphone mainly comprises: ear component units (1) at both ends of an elastic headband (2), and a speaker component unit (5) which is located in the ear component unit (1) and can transmit sound to earmuffs (4). The headset may also be equipped with a transmission line or wireless connection component unit to communicate with the sound emitting device.

An ear pad (3) for sound insulation is provided on a portion around the ear unit (1). The ear pad (3) also allows the placement of the ear assembly unit (1) without harming the ear and other areas near the ear.

The headset of the invention comprises at least one loudspeaker assembly unit (5) provided with loudspeaker sound emitting means (5.1) which have at least one peripheral portion in each ear assembly unit (1) enabling a user to experience surround sound, wherein the loudspeaker assembly units are fitted to the ear cups (4) of the ear assembly units (1).

The loudspeaker assembly unit (5) can be mounted on the ear assembly unit (1) in a non-detachable manner.

The loudspeaker assembly unit (5) is designed in a geometry that facilitates the arrangement of peripheral loudspeaker sound emitting means (5.1) on the loudspeaker assembly unit. Due to the loudspeaker assembly unit, being designed prismatic, cylindrical or spherical, this allows the loudspeaker sound emitting means to be arranged on the periphery of the loudspeaker assembly unit. The above-described several geometric designs of these speaker assembly units are only exemplary.

The headset is provided with a loudspeaker sound emission device (5.1). In order that the headphone can deliver a surround sound effect to the ear of the user, the speaker sound emitting device is provided at least at a peripheral portion of the speaker assembly unit, and the speaker assembly unit is provided inside the headphone. According to other embodiments of the invention, the entire peripheral surface of the loudspeaker assembly unit (5) may be provided with a plurality of loudspeaker sound emitting means (5.1).

Fig. 3 is an exemplary view of a speaker module unit (5) designed in a cylindrical shape. As shown in fig. 3, peripherally arranged loudspeaker sound emitting means (5.1) are mounted on the side wall of the cylindrical loudspeaker assembly unit (5). Similarly, fig. 4 is an exemplary diagram of one speaker assembly unit (5). The loudspeaker module unit (5) is designed in a prism shape, so that a surround sound effect can be created.

The object of the loudspeaker assembly unit (5) according to the invention is to enable the ear assembly unit (1) to play sound not only in the direction of the user's ear, but also in other directions. Sounds emitted in other directions outside the user's ear may be directed to the user's ear after being reflected by other components of the headset. As sound propagates through the environment, sound effects are delivered to the user's ears, while effects of sound reflecting off walls are actually created inside the headset.

On the other hand, when each ear assembly unit (1) comprises at least one speaker assembly unit (5), and said speaker assembly unit (5) is provided with peripheral speaker sound emitting means (5.1), it is possible to deliver various sound effects to the user's ear. Such effects delivered to the user's ear include, for example, 5.1 surround stereo and other similar sound effects.

Fig. 1 shows a loudspeaker assembly unit that can be placed vertically in an ear cup (4). In different embodiments of the invention, the loudspeaker assembly unit (5) may be placed in the ear cup (4) in a horizontal, inclined, random, etc. orientation.

The loudspeaker assembly unit (5) may be designed in different geometries in order to create a surround stereo effect. According to a further embodiment of the invention, the loudspeaker assembly unit (5) provided with the loudspeaker sound emission device (5.1) externally can be designed as a sphere. Fig. 6 is an embodiment in which the speaker assembly unit (5) of the headphone is designed in a spherical shape.

The object of the described loudspeaker assembly unit (5) of the present invention is to create a surround sound effect. To this end, each loudspeaker assembly unit (5) can be provided with at least one loudspeaker sound emission device (5.1) outside thereof. The loudspeaker sound emitting arrangement (5.1) may be arranged in line on the outside thereof or may be designed to fit over the peripheral side of the entire loudspeaker assembly unit (5), as shown in fig. 3.

If the periphery of the loudspeaker assembly unit (5) is provided with loudspeaker sound emitting means (5.1), sound can be generated outwardly. Thus, when the speaker sound emitting means (5.1) is placed towards the placement opening, sound generated by the speaker sound emitting means (5.1) may be reflected into the ear of the user through the placement opening (6). For this purpose, the placement openings (6) and/or the ear cups (4) may be completely or partially covered by some means that facilitate sound reflection.

Since the speaker assembly unit (5) capable of emitting surround sound reflects emitted sound to the placement opening (6) and/or the ear muff (4), such sound will also be reflected to the user's ear. In this way, the surround sound effect can be transmitted into the user's ear. This reflex effect produced on the ear may give the user an experience as if he were in a concert hall.

According to another embodiment of the invention, the placement opening (6) is provided with a connecting component which enables both data connection and fixing of the loudspeaker assembly unit (5) on the placement opening (6). Further, in another embodiment of the present invention, the connection component is a USB connection.

In various embodiments of the present invention, various connection assemblies are intended to be included within the scope of the present invention. For example, in the case where a USB interface is provided in the placement opening (6), the speaker module unit (5) is provided with a USB connector into which the USB interface can be inserted for connection. Through the USB connection, the loudspeaker assembly unit (5) can receive data, and the loudspeaker assembly unit (5) can also be fixed on the placing opening (6). The headset according to the invention can be used by wearing the headset on the ear, while the ear assembly unit (1) or the loudspeaker assembly unit can be used as an external sound emitter by remaining open to emit sound to the environment in which the user is located.

In this case, the user can use the embodiment of the present invention as a headset, and on the other hand, the user can also use the embodiment as an external sound generator to emit sound to a specific environment.